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JPS6227934B2 - - Google Patents
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JPS6227934B2 - - Google Patents

Info

Publication number
JPS6227934B2
JPS6227934B2 JP12743378A JP12743378A JPS6227934B2 JP S6227934 B2 JPS6227934 B2 JP S6227934B2 JP 12743378 A JP12743378 A JP 12743378A JP 12743378 A JP12743378 A JP 12743378A JP S6227934 B2 JPS6227934 B2 JP S6227934B2
Authority
JP
Japan
Prior art keywords
copper
silver
electrode
layer
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12743378A
Other languages
Japanese (ja)
Other versions
JPS5558930A (en
Inventor
Shigeaki Sekiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP12743378A priority Critical patent/JPS5558930A/en
Publication of JPS5558930A publication Critical patent/JPS5558930A/en
Publication of JPS6227934B2 publication Critical patent/JPS6227934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H1/00Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
    • B23H1/04Electrodes specially adapted therefor or their manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Description

【発明の詳細な説明】 本発明は放電加工の電極材料に係り、さらに詳
しくは導電層をもつ粉末治金法によつて焼結・溶
浸して形成する複合電極材料の製造方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrode material for electric discharge machining, and more particularly to a method for manufacturing a composite electrode material having a conductive layer formed by sintering and infiltration using a powder metallurgy method.

放電加工は非切削加工であるため焼入鋼、ダイ
ヤモンドなどの高硬度、強じん材料でも容易に加
工できるほか、複雑な形状の加工もでき、かつ加
工時に働く力が小さく、熱影響も小さく、加工精
度が高い、自動化しやすく経済的であるなどの利
点がある。しかし一方加工速度が遅い、電極の消
耗がある、被加工物と電極のギヤツプを精密に制
御する必要があるなどの欠点がある。放電加工で
は短いアーク放電によつて被加工物に溶融、蒸発
が行われ、電極に対応した形状が形成される一
方、電極側にもこれと似た現象が起り消耗量は少
ないが電極の消耗となる。電極材料の材質、放電
エネルギーの大小によつても電極の消耗度は異な
る。
Electrical discharge machining is a non-cutting process, so it can easily process hard and strong materials such as hardened steel and diamonds, and it can also process complex shapes.The force applied during machining is small, and the thermal effect is small. It has advantages such as high processing accuracy, easy automation, and economical. However, it has drawbacks such as slow processing speed, electrode wear, and the need to precisely control the gap between the workpiece and the electrode. In electric discharge machining, the workpiece is melted and evaporated by a short arc discharge, forming a shape that corresponds to the electrode, but a similar phenomenon occurs on the electrode side, and the amount of wear is small, but the electrode wears out. becomes. The degree of electrode wear varies depending on the material of the electrode material and the magnitude of the discharge energy.

従来は電極材料として銅、アルミニウム、タン
グステン、モリブデンなどの純金属、軟鋼、銅合
金、焼結合金、グラフアイトなどが用いられてい
るが、それぞれ一長一短がある。たとえば銅、ア
ルミニウムなどを用いたときは導電率が高く電極
の形状の加工も容易であるが、消耗が激しく、そ
のため深穴加工では寸法の変化を生じ、加工途中
での電極の取替えを要することもある。グラフア
イトも加工しやすく消耗も比較的少ないが、じん
性に欠けるので、欠損しやすく電極の取替えを要
する場合がある。一方銅―タングステン、銀―タ
ングステンなどの焼結合金は消耗は少ないが、導
電率が低くアーク放電初期の喰いつき、なじみが
悪いため加工速度が遅い欠点がある。しかし金型
に寸法精度の高い深い形状を刻み込む場合には、
銅―タングステンなどの焼結体を用い、所定の形
状の電極に仕上げ、放電加工機に取り付けるため
に被加工物に接する面と反対側に硬鋼などの一般
金属体よりなるシヤンク材を銀ろう付けして使用
していた。
Conventionally, pure metals such as copper, aluminum, tungsten, and molybdenum, mild steel, copper alloys, sintered alloys, and graphite have been used as electrode materials, but each has advantages and disadvantages. For example, when copper, aluminum, etc. are used, the conductivity is high and it is easy to process the shape of the electrode, but it is subject to heavy wear, resulting in dimensional changes when drilling deep holes, requiring the electrode to be replaced during processing. There is also. Graphite is also easy to process and has relatively little wear and tear, but it lacks toughness and is prone to breakage, which may require electrode replacement. On the other hand, sintered alloys such as copper-tungsten and silver-tungsten have low wear, but have the drawbacks of low conductivity, biting in the early stages of arc discharge, and poor fitting, resulting in slow machining speed. However, when carving a deep shape with high dimensional accuracy into a mold,
A sintered body such as copper-tungsten is used to finish the electrode into a specified shape, and a shank material made of a general metal body such as hard steel is soldered with silver on the opposite side to the side that contacts the workpiece in order to attach it to the electrical discharge machine. I was using it with it attached.

ろう付けした電極材ではろう接による接合強度
が必ずしも十分でなく、接合面積の広い場合や接
合部に外力のかかる場合には放電加工中に、ろう
材と焼結材とのなじみの不十分さによる微小な空
隙の存在による局部放電等を生じ、接合部がはく
離脱落するという欠点もあつた。
Brazed electrode materials do not necessarily have sufficient joint strength due to brazing, and when the joint area is large or external force is applied to the joint, insufficient compatibility between the brazing material and the sintered material may occur during electrical discharge machining. Another disadvantage was that the presence of minute voids caused local discharges and the like, causing the joints to peel off and fall off.

本発明は前記の加工速度は遅いが電極の消耗が
少なく寸法精度の高い点を考え、、銅―タングス
テンのごとき焼結体を用い、特に加工開始時の喰
いつきを改善することによる加工速度の増大と簡
単な工程によりシヤンク部分をも強固に一体化で
きる電極材料を高融点金属焼結体を主体として形
成する製造方法を提供することを目的とする。
The present invention uses a sintered body such as copper-tungsten and improves the machining speed by improving the biting especially at the start of machining, considering the fact that the machining speed is slow but the electrode wear is low and the dimensional accuracy is high. It is an object of the present invention to provide a manufacturing method for forming an electrode material mainly made of a high-melting point metal sintered body, which can firmly integrate even the shank portion through an increase in size and a simple process.

高融点金属焼結体の加工速度の遅いのと銅又は
銀の加工速度の速いのを組み合せることにより加
工速度の増大を計るため銅層又は銀層を被加工物
面に設置するのであるが、被加工物に刻み込む形
状に応じ導電層である銅層又は銀層は1mm以下の
薄い層でもよい。この場合にはめつきなどの表面
処理方法により導電層を設けることができる。本
発明は電極材料の電極面に、良導電層を設けるこ
と、および、溶浸と同時に電極材にシヤンク材を
接合し一体化することを特徴とするものである。
即ち本願発明は、本願特許とほぼ同日の本出願人
の出願である特願昭53―121556号(特開昭55―
48537以下「甲発明」と称す。)の製法に関する発
明である。
In order to increase the processing speed by combining the slow processing speed of high melting point metal sintered bodies with the fast processing speed of copper or silver, a copper layer or a silver layer is placed on the surface of the workpiece. Depending on the shape to be carved into the workpiece, the conductive layer, such as a copper layer or a silver layer, may be a thin layer of 1 mm or less. In this case, the conductive layer can be provided by a surface treatment method such as plating. The present invention is characterized in that a highly conductive layer is provided on the electrode surface of the electrode material, and that a shank material is joined and integrated with the electrode material at the same time as infiltration.
That is, the present invention is based on Japanese Patent Application No. 53-121556 (Japanese Unexamined Patent Publication No. 1983-12155), which was filed by the present applicant on almost the same day as the present patent.
48537 hereinafter referred to as "A Invention". ) is an invention related to a manufacturing method.

具体的には、甲発明において電極面に銅層又は
銀層を接合するが、この接合としてめつき又は蒸
着を利用工夫したものである。これにより比較的
薄くて広い層(例えば0.5〜1mm程度の厚さ)を
簡便に接合できるという特徴を得ることができる
のである。
Specifically, in the invention A, a copper layer or a silver layer is bonded to the electrode surface, and this bonding is devised by using plating or vapor deposition. This makes it possible to easily bond relatively thin and wide layers (eg, about 0.5 to 1 mm thick).

本発明は高融点金属として平均粒径3μのタン
グステン又はモリブデン粉末に酸化トリウム
(ThO2)、酸化ジルコニウム(ZrO2)の平均粒径
3μの粉末の1種又は2種を1〜10重量%添加し
てよく混合し、該混合粉体を電極形状に金型を用
いて成形圧1〜4t/cm2にて成形する。成形後水素
雰囲気中にて1000゜〜1300℃にて30分〜3時間焼
結し、タングステン又はモリブデンを主体とした
スケルトン(焼成品)を作る。酸化トリウム、酸
化ジルコニウムの添加は加工速度改良のためであ
る。次に該スケルトンに溶浸材として銅又は銀を
溶浸すると同時にシヤンク材を接合する。このた
め予めシヤンク材に使用する一般金属体を所定の
形状に加工しておき接合面を清浄化し、接合材を
塗布する。接合材としては通常銀を40〜60重量
%、コバルト、ニツケルの1種又は2種を計60〜
40重量%をよく混合して用いる。この混合粉は細
かい方が分散がよく好ましい。なお混合粉量は
0.1〜0.2g/cm2程度でよく、該混合粉はそのまま
の状態で使用してもよくあるいは水、アルコール
等でペースト状にして用いてもよく、又メツシユ
プレートでもよい。この様に合金成分,粉末の大
きさ及び粉末量を規定することにより接合強度を
向上させることができる。
The present invention adds 1 to 10% by weight of one or both of thorium oxide (ThO 2 ) and zirconium oxide (ZrO 2 ) powders with an average particle size of 3μ to tungsten or molybdenum powder with an average particle size of 3μ as a high melting point metal. The mixed powder is then molded into an electrode shape using a mold at a molding pressure of 1 to 4 t/cm 2 . After forming, it is sintered in a hydrogen atmosphere at 1000° to 1300°C for 30 minutes to 3 hours to create a skeleton (fired product) mainly made of tungsten or molybdenum. The purpose of adding thorium oxide and zirconium oxide is to improve processing speed. Next, the skeleton is infiltrated with copper or silver as an infiltrant, and at the same time a shank material is joined. For this purpose, a general metal body to be used as a shank material is processed into a predetermined shape in advance, the bonding surfaces are cleaned, and a bonding material is applied. The bonding material is usually 40 to 60% by weight of silver and one or both of cobalt and nickel for a total of 60 to 60% by weight.
Mix well and use 40% by weight. The finer the powder mixture is, the better the dispersion becomes. The amount of mixed powder is
The amount may be about 0.1 to 0.2 g/cm 2 , and the mixed powder may be used as it is, or may be made into a paste with water, alcohol, etc., or may be used in a mesh plate. By regulating the alloy components, powder size, and powder amount in this way, the bonding strength can be improved.

前記スケルトンを電極寸法に適応するグラフア
イト容器底部に置き、その上部に接合材を介して
シヤンク材を電極材の形状と一致するごとく積載
し、グラフアイト容器とスケルトン、シヤンク材
との隙間に溶浸材をつめる。溶浸材としては銅又
は銀を用いるが、その形状は粉末でも塊状でもよ
いが、小片にして用いる。溶浸材の量はスケルト
ン中にしみ込ませる所要量と接合材を溶解し合金
属とする量でよいがグラフアイト容器とスケルト
ン、シヤンク材との隙間があるので、これを考え
多少多く秤量添加する。次いで連続水素炉にこの
グラフアイト容器を装入して、溶浸条件として
1300゜〜1000℃で30分〜3時間で炉を通過させ
る。この溶浸により銅又は銀が20〜35重量%含ま
れ、かつスケルトン中に均一に分布するとともに
タングステン又はモリブデンのスケルトン中の空
隙はなくなり、銅又は銀―タングステン又はモリ
ブデン焼結体となるとともに、溶浸材の一部は接
合材を溶解し接合層を形成する。
The skeleton is placed on the bottom of a graphite container that matches the electrode dimensions, and a shank material is placed on top of it via a bonding material so that it matches the shape of the electrode material, and the shank material is melted into the gap between the graphite container, the skeleton, and the shank material. Fill with soaking material. Copper or silver is used as the infiltration material, and it may be in the form of a powder or a lump, but it is used in the form of small pieces. The amount of infiltration material may be the required amount to soak into the skeleton and the amount to melt the bonding material to form a composite metal, but there is a gap between the graphite container, skeleton, and shank material, so take this into consideration and add a slightly larger amount by weight. . Next, this graphite container was charged into a continuous hydrogen furnace, and the infiltration conditions were
Pass through the furnace at 1300° to 1000°C for 30 minutes to 3 hours. Through this infiltration, 20 to 35% by weight of copper or silver is uniformly distributed in the skeleton, and there are no voids in the tungsten or molybdenum skeleton, resulting in a copper or silver-tungsten or molybdenum sintered body. A portion of the infiltration material dissolves the bonding material and forms a bonding layer.

さらに銅又は銀―タングステン又はモリブデン
焼結材およびシヤンク材外周に付着した溶浸材を
除去したのち、焼結体の被加工物に接する面(以
下電極面という)を脱脂洗浄ののち所定の銅めつ
き液又は銀めつき液を用いて電解めつきする。こ
の場合焼結体側面へのめつき層は不要であるの
で、めつき液に侵されない有機物の絶縁膜を予め
作つて置く。めつき液としては生成するめつき層
と焼結体との密着性、めつき層の充実度、めつき
液管理、作業時間などを考えて使用する。電気め
つきのほか化学めつき、真空蒸着なども利用でき
るが、後二者ではその生成皮膜が薄いので特殊の
場合しか利用できない。電気めつきとしては通常
の硫酸銅めつき、ピロりん酸銅めつき、シアン化
銅めつき、シアン化銀めつき、硝酸銀めつきなど
が使用できる。
Furthermore, after removing the infiltration material adhering to the copper or silver-tungsten or molybdenum sintered material and the outer periphery of the shank material, the surface of the sintered body that contacts the workpiece (hereinafter referred to as the electrode surface) is degreased and cleaned, and then the specified copper Electroplating is performed using a plating solution or a silver plating solution. In this case, since a plating layer on the side surface of the sintered body is not required, an organic insulating film that is not eroded by the plating solution is formed in advance. When using a plating solution, consider the adhesion between the plating layer to be generated and the sintered body, the degree of completeness of the plating layer, plating solution management, working time, etc. In addition to electroplating, chemical plating and vacuum deposition can also be used, but the latter two produce thin films and can only be used in special cases. As the electroplating, ordinary copper sulfate plating, copper pyrophosphate plating, copper cyanide plating, silver cyanide plating, silver nitrate plating, etc. can be used.

本発明の製造方法により放電加工用の電極材と
して電極面から、銅層、銅―タングステン又は銅
―モリブデン焼結体、接合層、シヤンク材あるい
は銀層、銀―タングステン又は銀―モリブデン焼
結体、接合層、シヤンク材よりなる4層構造複合
電極材が得られる。本発明の製造方法により被加
工物に接する電極面に銅層又は銀層を設けること
により放電加工の開始時に銅又は銀の高導電率層
にてアーク放電を行なうことによりスムースな放
電となり加工速度を増し、該層消失後も銅又は銀
―タングステン又はモリブデン焼結体の電極形状
が被加工物の融解面と対応するため、アーク放電
がスムースに進行し、電極の消耗も少なく精密な
寸法を被加工物に形成させることができ、全体と
して加工速度が増大するのである。又本発明のご
とく接合材を用いシヤンク材を溶浸工程で一体接
合することにより、ろう付け工程を省略できるほ
か強度も上昇しシヤンク材より電極材のはく離脱
落もなくなり前記複合体による加工速度の増大、
シヤンク材の一体化により品質、安全、生産性な
どの面ですぐれた効果がある。なお電極材料のシ
ヤンク接合面に、電極面の形成とともに銅層又は
銀層を設けておけば、シヤンク材をはんだ接合す
ることができ、作業能率の点で好ましい場合があ
る。
The manufacturing method of the present invention can be used as an electrode material for electrical discharge machining from the electrode surface, including a copper layer, a copper-tungsten or copper-molybdenum sintered body, a bonding layer, a shank material or a silver layer, and a silver-tungsten or silver-molybdenum sintered body. A four-layer composite electrode material consisting of , a bonding layer, and a shank material is obtained. By providing a copper layer or a silver layer on the electrode surface in contact with the workpiece according to the manufacturing method of the present invention, arc discharge is performed at the high conductivity layer of copper or silver at the start of electrical discharge machining, resulting in smooth discharge and machining speed. Even after the layer disappears, the electrode shape of the copper or silver-tungsten or molybdenum sintered body corresponds to the melting surface of the workpiece, so arc discharge progresses smoothly and electrode wear is minimal, allowing precise dimensions to be formed. They can be formed on the workpiece, increasing the overall processing speed. In addition, by integrally joining the shank material using the bonding material in the infiltration process as in the present invention, the brazing process can be omitted, the strength is increased, and the electrode material does not peel off or fall from the shank material, and the processing speed using the composite material can be reduced. increase,
Integration of shank materials has excellent effects in terms of quality, safety, productivity, etc. Note that if a copper layer or a silver layer is provided on the shank joint surface of the electrode material at the same time as the electrode surface is formed, the shank material can be soldered and joined, which may be preferable in terms of work efficiency.

以下本発明の実施例を述べる。 Examples of the present invention will be described below.

実施例 1 平均粒径3μのタングステン粉末95重量%に平
均粒径3μの酸化トリウム5重量%を添加してよ
く混合し、直径20mm、高さ20mmの円柱状金型に入
れ成形圧4t/cm2にて成形する。成形後水素雰囲気
中にて1000℃、1時間焼結しタングステンスケル
トンを作る。一方シヤンク材として硬鋼
(S45C)を放電加工機の電極取付部に取付けうる
よう所定の寸法に機械加工し、その電極面との接
合面を脱脂清浄し、銀とコバルトとを60:40の割
合で混合した混合粉をアルコールにてペースト状
とし塗布する。以下第1図aの断面図、bの平面
図を用いてこの工程を説明する。第1図aでグラ
フアイト容器15の底部中央にタングステンスケ
ルトン11を置き、接合材12を介してシヤンク
材13を積載し、グラフアイト容器15との隙間
にスケルトンへしみ込ませる量と接合材を溶解し
合金となし接合層を形成する量に多少余剰量を考
え溶浸材14として銅粉をつめる。次いで連続水
素炉にこのグラフアイト容器15を装入して、溶
浸条件として1200℃、30分で炉を通過させ、溶浸
材をとかしてスケルトン中に均一にしみ込ませる
と同時に接合層を形成する。溶浸後過剰に付着し
た溶浸材を除去すれば、第2図aの断面図、bの
平面図のごとく電極面より銅―タングステン焼結
体21、接合層22、シヤンク材23と連続した
3層構造複合電極素材がえられる。
Example 1 5% by weight of thorium oxide with an average particle size of 3μ was added to 95% by weight of tungsten powder with an average particle size of 3μ, mixed well, and placed in a cylindrical mold with a diameter of 20mm and a height of 20mm under a molding pressure of 4t/cm. Mold in step 2 . After molding, it is sintered at 1000℃ for 1 hour in a hydrogen atmosphere to create a tungsten skeleton. On the other hand, hard steel (S45C) is machined as a shank material to the specified dimensions so that it can be attached to the electrode mounting part of an electrical discharge machine, and the surface that connects to the electrode is degreased and cleaned, and a 60:40 ratio of silver and cobalt is used. Make the mixed powder into a paste with alcohol and apply. This process will be explained below using the cross-sectional view of FIG. 1a and the plan view of FIG. 1b. In FIG. 1a, the tungsten skeleton 11 is placed at the center of the bottom of the graphite container 15, the shank material 13 is loaded through the bonding material 12, and the amount of the bonding material that is soaked into the skeleton and the bonding material is dissolved in the gap between the graphite container 15 and the graphite container 15. Copper powder is added as the infiltrant material 14, taking into consideration the amount that is slightly surplus to the amount required to form the alloy and the bonding layer. Next, this graphite container 15 is placed in a continuous hydrogen furnace and passed through the furnace at 1200°C for 30 minutes as infiltration conditions to melt the infiltrant and uniformly soak it into the skeleton, while at the same time forming a bonding layer. do. After the infiltration, if the excessively adhered infiltrant is removed, the copper-tungsten sintered body 21, the bonding layer 22, and the shank material 23 are continuous from the electrode surface as shown in the cross-sectional view of FIG. 2a and the plan view of FIG. 2b. A three-layer composite electrode material can be obtained.

次に焼結体21の電極面となる面を除き電極材
外周をクリヤを塗布し絶縁膜形成後、電極面をバ
フ研摩、脱脂清浄化し硫酸銅めつき浴に入れ、電
極材を陰極、銅板を陽極として電極面への銅めつ
きを行なう。めつき浴は硫酸銅(CuSO4
5H2O)210g/、硫酸50g/、塩素イオン50
mg/、チオ尿素0.01g/、デキストリン0.01
g/よりなり、陰極電流密度5A/dm2、浴温
度30℃で20分めつきした。これにより電極面に約
0.7mm厚さの銅めつき層(第2図aの24)が得
られた。銅めつき後必要部分をバフ研摩により所
定の寸法とする。なおめ4き電着防止のクリヤは
必要に応じ除去する。本発明の方法により第2図
aに示すごとく電極面より純銅層24、銅―タン
グステン焼結体21、接合層22、シヤンク材2
3の4層構造複合電極材が得られる。なお電極材
料全面にめつきをあらかじめ施こした後、機械加
工して所定の形状としてもよい。
Next, a clear coat is applied to the outer circumference of the electrode material except for the surface that will become the electrode surface of the sintered body 21, and after forming an insulating film, the electrode surface is buffed, degreased and cleaned, and placed in a copper sulfate plating bath, and the electrode material is used as a cathode and a copper plate. Copper plating is performed on the electrode surface using the electrode as an anode. The plating bath is copper sulfate ( CuSO4 .
5H 2 O) 210g/, sulfuric acid 50g/, chlorine ion 50
mg/, thiourea 0.01g/, dextrin 0.01
plating at a cathode current density of 5 A/dm 2 and a bath temperature of 30° C. for 20 minutes. This will cause the electrode surface to
A copper plating layer (24 in Figure 2a) with a thickness of 0.7 mm was obtained. After copper plating, the required parts are buffed to the specified dimensions. Note that the clear coat to prevent electrodeposition is removed as necessary. By the method of the present invention, as shown in FIG.
A four-layer composite electrode material of No. 3 is obtained. Note that the entire surface of the electrode material may be plated in advance and then machined into a predetermined shape.

実施例 2 実施例1と同様な原料を使用し第3図bの平面
図に示すごときE形金型に入れ成形圧4t/cm2にて
成形し、成形後水素雰囲気中にて1000℃、30分焼
結しタングステンスケルトンを作る。一方シヤン
ク材として硬鋼(S45C)を放電加工機の電極取
付部に取付けうるよう所定の寸法に機械加工し、
その電極面との接合面を脱脂清浄し、銀とコバル
トとを60:40の割合で混合した混合粉をアルコー
ルにてペースト状とし塗布し、実施例1の場合と
同様にして電極面よりE形の銅―タングステン焼
結体31、接合層32、シヤンク材33と連続し
た3層構造複合電極素材がえられる。
Example 2 Using the same raw material as in Example 1, it was placed in an E-shaped mold as shown in the plan view of Figure 3b and molded at a molding pressure of 4t/cm 2 .After molding, it was heated at 1000°C in a hydrogen atmosphere. Sinter for 30 minutes to create a tungsten skeleton. On the other hand, we machined hard steel (S45C) as a shank material to the specified dimensions so that it could be attached to the electrode attachment part of the electrical discharge machine.
The joint surface with the electrode surface was degreased and cleaned, and a mixed powder of silver and cobalt mixed at a ratio of 60:40 was made into a paste with alcohol and applied. A composite electrode material having a three-layer structure including a shaped copper-tungsten sintered body 31, a bonding layer 32, and a shank material 33 is obtained.

次に焼結体31の電極面となる面を除き電極材
外周をクリヤを塗布し絶縁膜を形成後電極面をバ
フ研摩、脱脂清浄化し、硝酸銀めつき浴に入れ、
電極材を陰極、銀板を陽極として電極面へ銀めつ
きを行なう。めつき浴は硝酸銀50g/、炭酸ナ
トリウム50g/、硝酸ナトリウム60g/、シ
アン化カリウム50g/よりなり、陰極電流密度
1.5A/dm2、浴温度20℃で20分めつきした。これ
により約0.5mm厚さの銀めつき層(第3図a,b
の34)が得られた。銀めつき後必要部分をバフ
研摩により所定の寸法とする。なおめつき電着防
止のクリヤは必要に応じ除去する。本発明の方法
により第3図aに示すごとく電極面より純銀層3
4、銅―タングステン焼結体31、接合層32、
シヤンク材33の4層構造複合電極材が得られ
る。
Next, a clear coat is applied to the outer periphery of the electrode material except for the surface that will become the electrode surface of the sintered body 31, and after forming an insulating film, the electrode surface is buffed, degreased and cleaned, and placed in a silver nitrate plating bath.
Silver plating is performed on the electrode surface using the electrode material as a cathode and the silver plate as an anode. The plating bath consists of silver nitrate 50g/, sodium carbonate 50g/, sodium nitrate 60g/, potassium cyanide 50g/, and the cathode current density
Plating was carried out for 20 minutes at 1.5 A/dm 2 and a bath temperature of 20°C. This results in a silver plating layer approximately 0.5 mm thick (Fig. 3 a, b).
34) was obtained. After silver plating, the required areas are buffed to the desired dimensions. The clear coat to prevent eyelid electrodeposition should be removed if necessary. By the method of the present invention, a pure silver layer 3 is formed from the electrode surface as shown in FIG. 3a.
4, copper-tungsten sintered body 31, bonding layer 32,
A four-layer composite electrode material of the shank material 33 is obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明方法の一実施例の工程を示す
図、第2図は本発明方法の一実施例を示す図、第
3図も本発明方法の一実施例を示す図である。 11…タングステンスケルトン、12…接合
材、13,23,33…シヤンク材、14…溶浸
材(銅)、15…グラフアイト容器、21,31
…銅―タングステン焼結体、22,32…接合
層、24…銅めつき層、34…銀めつき層。
FIG. 1 is a diagram showing the steps of an embodiment of the method of the present invention, FIG. 2 is a diagram showing an embodiment of the method of the present invention, and FIG. 3 is a diagram showing an embodiment of the method of the present invention. 11... Tungsten skeleton, 12... Bonding material, 13, 23, 33... Shank material, 14... Infiltration material (copper), 15... Graphite container, 21, 31
...Copper-tungsten sintered body, 22, 32...Joining layer, 24...Copper plating layer, 34...Silver plating layer.

Claims (1)

【特許請求の範囲】[Claims] 1 高融点金属のタングステン又はモリブデンに
銅又は銀を溶浸してなる放電加工用電極材料の製
造方法において、溶浸時に銀を40〜60重量%、コ
バルト、ニツケルの1種又は2種を計60〜40重量
%でなる接合材を介し、鉄系金属体を所定面に接
合する工程と、溶浸後電極面に厚さが0.5〜1mm
の銅又は銀をめつき又は蒸着により形成させる工
程を有することを特徴とする銅又は銀―タングス
テン又はモリブデン層状複合放電加工用電極材の
製造方法。
1. In a method for manufacturing an electrode material for electrical discharge machining by infiltrating high melting point metal tungsten or molybdenum with copper or silver, a total of 60% of silver and one or two of cobalt and nickel are added during infiltration. A process of bonding a ferrous metal body to a predetermined surface via a bonding material consisting of ~40% by weight, and a process of bonding the electrode surface to a thickness of 0.5 to 1 mm after infiltration.
1. A method for producing a copper or silver-tungsten or molybdenum layered composite electrode material for electrical discharge machining, comprising the step of forming copper or silver by plating or vapor deposition.
JP12743378A 1978-10-18 1978-10-18 Manufacturing method of electrode material for electrical discharge machining Granted JPS5558930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12743378A JPS5558930A (en) 1978-10-18 1978-10-18 Manufacturing method of electrode material for electrical discharge machining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12743378A JPS5558930A (en) 1978-10-18 1978-10-18 Manufacturing method of electrode material for electrical discharge machining

Publications (2)

Publication Number Publication Date
JPS5558930A JPS5558930A (en) 1980-05-02
JPS6227934B2 true JPS6227934B2 (en) 1987-06-17

Family

ID=14959829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12743378A Granted JPS5558930A (en) 1978-10-18 1978-10-18 Manufacturing method of electrode material for electrical discharge machining

Country Status (1)

Country Link
JP (1) JPS5558930A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2553996B2 (en) * 1992-09-04 1996-11-13 大阪府 Method of manufacturing electrode for electric discharge machining by infiltration method

Also Published As

Publication number Publication date
JPS5558930A (en) 1980-05-02

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