JPS627265B2 - - Google Patents
Info
- Publication number
- JPS627265B2 JPS627265B2 JP53114988A JP11498878A JPS627265B2 JP S627265 B2 JPS627265 B2 JP S627265B2 JP 53114988 A JP53114988 A JP 53114988A JP 11498878 A JP11498878 A JP 11498878A JP S627265 B2 JPS627265 B2 JP S627265B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- sputtering
- rotating body
- mixed gas
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5853—Oxidation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing Of Electric Cables (AREA)
- Physical Vapour Deposition (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
<産業上の利用分野>
本発明はスパツタリングによる酸化インジウム
導電膜の製造方法に関し、例えば液晶表示装置用
透明電極基板に用いられるものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing an indium oxide conductive film by sputtering, and is used, for example, in a transparent electrode substrate for a liquid crystal display device.
<従来の技術>
特開昭56−7867号公報には、不活性ガスと酸素
の混合ガス雰囲気内で、インジウム−スズ合金よ
り成るターゲツトを陰極として、スパツタリング
により、ガラス基板上に半透明導電膜を形成させ
る技術が開示されている。<Prior art> JP-A-56-7867 discloses that a translucent conductive film is formed on a glass substrate by sputtering using a target made of an indium-tin alloy as a cathode in a mixed gas atmosphere of inert gas and oxygen. A technique for forming a is disclosed.
特公昭52−27165号公報には、In2O3とSnO2を
蒸発源としてガラス基板上には被覆を真空蒸着法
により形成させたのち、酸素雰囲気中、例えば空
気中にて300℃〜600℃の温度で焼成することによ
り透過率の高い(77〜85%)導電膜が得られる技
術が開示されている。 Japanese Patent Publication No. 52-27165 discloses that after a coating is formed on a glass substrate by vacuum evaporation using In 2 O 3 and SnO 2 as evaporation sources, the coating is heated at 300°C to 600°C in an oxygen atmosphere, for example, in air. A technique is disclosed in which a conductive film with high transmittance (77 to 85%) can be obtained by firing at a temperature of .degree.
また、特公昭48−55267号公報には、プラスチ
ツクス表面に酸化インジウムを高真空で蒸着形成
したのち、酸化雰囲気中で例えば250℃の温度で
酸化処理することにより透過度88%の導電膜を得
たことが開示されている。 Furthermore, in Japanese Patent Publication No. 48-55267, a conductive film with a transmittance of 88% is formed by depositing indium oxide on the surface of plastic in a high vacuum and then oxidizing it in an oxidizing atmosphere at a temperature of, for example, 250°C. What was obtained is disclosed.
このように、ガラス基板上にインジウム−スズ
合金で導電膜を形成したのち、この膜の光透過度
を高めるために酸素雰囲気中で焼成処理をするこ
とが知られている。しかし、上記した透明又は半
透明導電膜の製造技術は、被覆される基板をター
ゲツト又は蒸発源と対向させた状態で真空室内に
固定保持して膜形成するものであつて量産には適
用できない。 It is known that after a conductive film is formed on a glass substrate using an indium-tin alloy, a firing treatment is performed in an oxygen atmosphere in order to increase the light transmittance of the film. However, the above-described manufacturing technology for transparent or semi-transparent conductive films involves forming a film by fixing the substrate to be coated in a vacuum chamber while facing a target or evaporation source, and cannot be applied to mass production.
これに対し出願人は、ベルジヤ型真空室の側壁
にスパツタリング用ターゲツトを配設し、その内
側に被覆すべきガラス基板等の多数枚を全体とし
て円筒型に配列保持し、これを連続的に回転させ
る方法を発明し、量産用設備として実施してい
る。 In response, the applicant installed a sputtering target on the side wall of a bell gear vacuum chamber, arranged and held a large number of glass substrates to be coated inside the sputtering target in a cylindrical shape as a whole, and continuously rotated the sputtering target. We have invented a method to do this and are implementing it as mass production equipment.
<発明が解決しようとする問題点>
本発明品が使用される液晶表示装置用透明電極
及びそのリード線は、通常はフオトエツチング法
によりパターン形成される。このパターン形成作
業は透明導電膜のユーザにおいて行われることが
多い。従つて、空気中における焼成工程をパター
ン形成後にユーザ側で行う場合、焼成温度、焼成
時間等の焼成条件に合わせたスパツタリングを行
うことが好ましく、さらに、その焼成条件の範囲
が広い方が好ましいが、従来はそれを満足させる
ことは殆んど不可能であり、通常は膜メーカが一
方的に指定した条件で焼成処理が行われていた。<Problems to be Solved by the Invention> Transparent electrodes for liquid crystal display devices and their lead wires in which the product of the present invention is used are usually patterned by photoetching. This pattern forming work is often performed by the user of the transparent conductive film. Therefore, when the user performs the firing process in air after pattern formation, it is preferable to perform sputtering in accordance with the firing conditions such as firing temperature and firing time, and it is more preferable that the range of firing conditions is wide. Conventionally, it has been almost impossible to satisfy this requirement, and the firing process is usually performed under conditions unilaterally specified by the membrane manufacturer.
また、透明導電膜の厚さが1000Åないし2000Å
と比較的厚いときは、空気中における焼成工程に
おいて膜の下層部まで充分酸化させることが難か
しく、比較的低温度、又は比較的短時間では充分
な透過度が得られないという問題があつた。 In addition, the thickness of the transparent conductive film is 1000 Å to 2000 Å.
When the membrane is relatively thick, it is difficult to sufficiently oxidize the lower layer of the membrane during the baking process in air, and there is a problem that sufficient permeability cannot be obtained at a relatively low temperature or in a relatively short time. .
そこで本発明の目的は、所望の光透過度を得る
に要する焼成温度及び焼成時間の幅が広く、その
ため、電極パターンを製造する膜ユーザの多様な
要求に対応しうる、スパツタリングによる酸化イ
ンジウム導電膜の製造方法を提供することであ
る。 Therefore, an object of the present invention is to provide an indium oxide conductive film formed by sputtering, which has a wide range of firing temperature and firing time required to obtain a desired light transmittance, and can therefore meet the various demands of film users who manufacture electrode patterns. An object of the present invention is to provide a method for manufacturing.
<問題点を解決するための手段>
この目的を達成するための本発明方法は、ベル
ジヤ型容器の側壁の一部分に設けられたインジウ
ム−スズ合金より成るターゲツトと、上記容器の
側壁の内側を回転する回転体と、上記容器内を真
空に排気する真空手段と、上記容器内へ不活性ガ
スと酸素の混合ガスを導入するガス雰囲気形成手
段と、上記回転体を回転駆動する動力手段を有す
るスパツタリング装置を用い、導電膜を形成すべ
き被覆体を上記回転体に取り付け、上記真空手段
により容器内が所定の真空度に維持されかつ上記
混合ガスが導入された雰囲気中で、上記回転体を
回転させることにより、上記被覆体表面が上記タ
ーゲツトと対向したときに間欠的にスパツタリン
グが行われ、かつ被覆体の回転中の位置にかかわ
りなく連続的に上記混合ガス雰囲気に曝されなが
ら膜が形成されてゆくことにより特徴づけられ
る。<Means for Solving the Problems> The method of the present invention for achieving this object includes a target made of an indium-tin alloy provided on a part of the side wall of a bell gear type container, and a target made of an indium-tin alloy that is rotated inside the side wall of the container. A sputtering ring comprising a rotating body, a vacuum means for evacuating the inside of the container, a gas atmosphere forming means for introducing a mixed gas of an inert gas and oxygen into the container, and a power means for rotationally driving the rotating body. Using a device, a coating on which a conductive film is to be formed is attached to the rotating body, and the rotating body is rotated in an atmosphere in which the interior of the container is maintained at a predetermined degree of vacuum by the vacuum means and the mixed gas is introduced. By doing so, sputtering is performed intermittently when the surface of the coating faces the target, and a film is formed while being continuously exposed to the mixed gas atmosphere regardless of the position of the coating during rotation. It is characterized by
<作用>
本発明の製造方法によれば、回転体の一つの被
覆体に注目すると、第3図に示すように、1回転
ごとに間欠的にスパツタリングを受けることにな
り、酸素雰囲気中でスパツタリングを受ける時間
と、スパツタリングを受けずに酸素雰囲気中に曝
される時間とが交互に繰り返されながら膜が形成
されてゆくから、膜中の酸素含有量が多くなり、
焼成工程における焼成温度が下限が低くなり、或
いは焼成時間が短縮される。また、間欠的にスパ
ツタリングを受けるため1000Å〜2000Åの薄膜を
10分〜20分間の比較的長時間をかけて形成してゆ
くことが可能となり、雰囲気の制御が容易にな
り、制御精度も向上する。<Function> According to the manufacturing method of the present invention, when focusing on one coating of a rotating body, as shown in FIG. As the film is formed by alternating the time during which it is subjected to sputtering and the time when it is exposed to an oxygen atmosphere without being sputtered, the oxygen content in the film increases.
The lower limit of the firing temperature in the firing process is lowered, or the firing time is shortened. In addition, since it is subject to intermittent sputtering, thin films of 1000 Å to 2000 Å are
It becomes possible to form the film over a relatively long time of 10 to 20 minutes, making it easier to control the atmosphere and improving control accuracy.
<実施例>
第1図に、本発明の実施例に使用する装置の一
例を示す。<Example> FIG. 1 shows an example of an apparatus used in an example of the present invention.
基台1上に、着脱自在のベルジヤ型容器2を装
着して真空室を構成し、その排気孔3は真空ポン
プ等の排気系に連通し、ガス導入孔4は減圧弁を
介してガスボンベ等に連通している。基台1上に
は、内側に歯が刻設された環体5が、ボールベア
リング6を介して回動自在に設けられており、こ
の環体の歯と噛み合う歯車7がモータ8により回
転駆動去れる。環体5の上には、第2図に斜視図
で示すように、篭形の回転体9を固着し、その側
面の全周にわたつて適宜に被覆体ボルダ10を吊
り下げ、これに被覆体を取り付ける。容器2の側
壁にはターゲツト11を取り付けると共にその背
後にマグネトロン型マグネツト12を配設してス
パツタリングに磁気を重畳させる。直流電源13
の陰極を上記ターゲツト11に接続し、陽極を容
器2に接続し、容器2、回転体9を介して被覆体
との間に陽極回路を形成させる。このようなター
ゲツト11及びマグネツト12を容器2の側壁の
複数個所に配設することができる。 A removable bell gear type container 2 is mounted on a base 1 to form a vacuum chamber, the exhaust hole 3 of which is connected to an exhaust system such as a vacuum pump, and the gas introduction hole 4 is connected to a gas cylinder, etc. via a pressure reducing valve. is connected to. On the base 1, a ring body 5 with teeth carved inside is rotatably provided via a ball bearing 6, and a gear 7 that meshes with the teeth of this ring body is rotationally driven by a motor 8. I can leave. As shown in the perspective view in FIG. 2, a cage-shaped rotating body 9 is fixed onto the ring body 5, and a covering boulder 10 is appropriately suspended over the entire circumference of the side surface of the rotating body 9. Attach the body. A target 11 is attached to the side wall of the container 2, and a magnetron type magnet 12 is arranged behind the target 11 to superimpose magnetism on sputtering. DC power supply 13
The cathode of is connected to the target 11, the anode is connected to the container 2, and an anode circuit is formed between the container 2 and the coating via the rotating body 9. Such targets 11 and magnets 12 can be arranged at a plurality of locations on the side wall of the container 2.
この装置を使用するときは、容器2内を真空に
排気すると同時にガス導入孔4から制御された混
合ガスを導入して容器内を所定の雰囲気に調整
し、モータ8により回転体9を回転させ、ターゲ
ツトと被覆体間に直流電圧を印加してスパツタリ
ングを行う。 When using this device, the inside of the container 2 is evacuated, a controlled mixed gas is introduced from the gas introduction hole 4 at the same time to adjust the inside of the container to a predetermined atmosphere, and the rotating body 9 is rotated by the motor 8. , sputtering is performed by applying a DC voltage between the target and the coating.
第4図は、本発明方法により製造された膜の構
造を模式的に示している。回転中の一つの被覆体
は第3図に示したように回転周期ごとに間欠的に
スパツタリングを受けるがスパツタリングを受け
ない時間中も継続して混合ガス雰囲気中に曝され
るから、酸素をより多く含んだ層14とそうでな
い層15とが交互に形成されていく。 FIG. 4 schematically shows the structure of a membrane produced by the method of the present invention. As shown in Fig. 3, a rotating sheath is sputtered intermittently during each rotation cycle, but even during the period when it is not sputtered, it is continuously exposed to a mixed gas atmosphere, which increases the oxygen content. Layers 14 containing a large amount and layers 15 containing a large amount are alternately formed.
次にこのようなスパツタリング装置を用いた本
発明の実施例を説明する。 Next, an embodiment of the present invention using such a sputtering device will be described.
ターゲツト材料としてインジウム80%、スズ20
%モル比の合金を用い、容器内にアルゴン95%、
酸素5%体積比の混合ガスを導入し、到達真空度
1×10-4Toor、ガス圧力1×10-3Torrの雰囲気
に調整した。ターゲツトと被覆体間の最短距離を
20cmにして両極間に600Vを直流電圧を印加し、
25mA/cm2の電流を通電した。その結果、膜厚
500Åの酸化インジウムを主体とした光透過率30
%以下の半透明導電膜が得られた。 80% indium, 20% tin as target material
% molar ratio of the alloy, 95% argon in the container,
A mixed gas containing 5% oxygen by volume was introduced, and the atmosphere was adjusted to an ultimate vacuum of 1×10 −4 Torr and a gas pressure of 1×10 −3 Torr. The shortest distance between the target and the covering
20cm and apply 600V DC voltage between the two poles,
A current of 25 mA/cm 2 was applied. As a result, the film thickness
Light transmittance 30 based on 500Å indium oxide
A translucent conductive film of less than % was obtained.
これを、350℃の温度で5分間熱処理したとこ
ろ、抵抗800Ω/cm2、光透過率83%(550nm波長
の分光光度計による)透明導電膜が得られた。 When this was heat-treated at a temperature of 350° C. for 5 minutes, a transparent conductive film with a resistance of 800 Ω/cm 2 and a light transmittance of 83% (as measured by a spectrophotometer at a wavelength of 550 nm) was obtained.
<発明の効果>
本発明によれば、インジウム−スズ合金より成
るターゲツトをベルジヤ型真空の側壁の一部分に
配設し、その内側に被覆体を連続的に回転させな
がら不活性ガスと酸素ガスの混合ガス雰囲気内で
被覆体表面にスパツタリングによる膜を形成させ
る装置を使用し、酸素を含む混合ガス雰囲気中に
被覆体表面を連続的に曝しながら1回転中に1度
だけ間欠的にスパツタリングを行うようにしたの
で、真空室から取り出された後の焼成工程におけ
る焼成温度が低温側へ拡大され、或いは焼成時間
が短縮化の方へ拡大された。また、間欠的スパツ
タリングのために膜形成時間が拡大され、従つ
て、膜形成開始時から終了時の間に混合ガス雰囲
気を変化させるなどの制御が容易になつた。<Effects of the Invention> According to the present invention, a target made of an indium-tin alloy is disposed on a part of the side wall of a bell gear vacuum, and an inert gas and an oxygen gas are injected inside the target while continuously rotating a coating. Using a device that forms a film by sputtering on the surface of the coating in a mixed gas atmosphere, sputtering is performed intermittently only once per rotation while continuously exposing the surface of the coating to the mixed gas atmosphere containing oxygen. As a result, the firing temperature in the firing process after being taken out from the vacuum chamber can be increased to a lower temperature, or the firing time can be shortened. In addition, intermittent sputtering extends the film formation time, making it easier to control the mixed gas atmosphere from the start to the end of film formation.
第1図は本発明方法の実施に使用される装置の
一例を示す縦断面図である。第2図は第1図の回
転体及び被覆体ホルダ10の斜視図である。第3
図は本発明方法の作用説明図、第4図は本発明方
法により製造された膜の構造を模式的に示す図で
ある。
1……基台、2……ベルジヤ型容器、3……排
気口、4……混合ガス導入口、6……ボールベア
リング、8……モータ、9……回転体、10……
被覆体ホルダ、11……ターゲツト。
FIG. 1 is a longitudinal sectional view showing an example of an apparatus used to carry out the method of the present invention. FIG. 2 is a perspective view of the rotating body and cover holder 10 of FIG. 1. Third
The figure is an explanatory diagram of the operation of the method of the present invention, and FIG. 4 is a diagram schematically showing the structure of a film produced by the method of the present invention. DESCRIPTION OF SYMBOLS 1...Base, 2...Belgear type container, 3...Exhaust port, 4...Mixed gas inlet, 6...Ball bearing, 8...Motor, 9...Rotating body, 10...
Covering body holder, 11...Target.
Claims (1)
インジウム−スズ合金より成るターゲツトと、上
記容器の側壁の内側を回転する回転体と、上記容
器内を真空に排気する真空手段と、上記容器内へ
不活性ガスと酸素の混合ガスを導入するガス雰囲
気形成手段と、上記回転体を回転駆動する動力手
段を有するスパツタリング装置を用い、 導電膜を形成すべき被覆体を上記回転体に取り
付け、上記真空手段により容器内が所定の真空度
に維持されかつ上記混合ガスが導入された雰囲気
中で、上記回転体を回転させることにより、 上記被覆体表面が上記ターゲツトと対向したと
きに間欠的にスパツタリングが行われ、かつ被覆
体の回転中の位置にかかわりなく連続的に上記混
合ガス雰囲気に曝されながら膜が形成されてゆく
ことを特徴とする、スパツタリングによる酸化イ
ンジウム導電膜の製造方法。[Claims] 1. A target made of an indium-tin alloy provided on a part of the side wall of a bell gear type container, a rotating body rotating inside the side wall of the container, and a vacuum means for evacuating the inside of the container. The coating on which the conductive film is to be formed is rotated using a sputtering device having a gas atmosphere forming means for introducing a mixed gas of an inert gas and oxygen into the container, and a power means for rotationally driving the rotating body. When the surface of the coating faces the target by rotating the rotating body in an atmosphere in which the inside of the container is maintained at a predetermined degree of vacuum by the vacuum means and the mixed gas is introduced. A method of forming an indium oxide conductive film by sputtering, characterized in that sputtering is performed intermittently, and the film is formed while being continuously exposed to the mixed gas atmosphere regardless of the position of the coating during rotation. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11498878A JPS5541959A (en) | 1978-09-18 | 1978-09-18 | Production of indium oxide transparent conductive film through sputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11498878A JPS5541959A (en) | 1978-09-18 | 1978-09-18 | Production of indium oxide transparent conductive film through sputtering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5541959A JPS5541959A (en) | 1980-03-25 |
| JPS627265B2 true JPS627265B2 (en) | 1987-02-16 |
Family
ID=14651550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11498878A Granted JPS5541959A (en) | 1978-09-18 | 1978-09-18 | Production of indium oxide transparent conductive film through sputtering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5541959A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130303A (en) * | 1981-02-03 | 1982-08-12 | Sharp Kk | Method of producing transparent conductive film |
| JPS57161727A (en) * | 1981-03-30 | 1982-10-05 | Ricoh Co Ltd | Manufacture of electrochromatic film |
| US4512864A (en) * | 1983-11-30 | 1985-04-23 | Ppg Industries, Inc. | Low resistance indium oxide films |
| DE4427581A1 (en) * | 1994-08-04 | 1996-02-08 | Leybold Ag | Process for applying a transparent metal oxide layer to a film |
| US7837843B2 (en) * | 2005-07-12 | 2010-11-23 | Praxair S.T. Technology, Inc. | Fixture for use in a coating operation |
| CN101496117B (en) * | 2006-07-28 | 2012-04-18 | 株式会社爱发科 | Method for forming transparent conductive film |
| US20110194181A1 (en) * | 2008-10-17 | 2011-08-11 | Ulvac, Inc. | Film forming method for antireflection film, antireflection film, and film forming device |
| KR101603303B1 (en) * | 2008-10-31 | 2016-03-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Conductive oxynitride and method for manufacturing conductive oxynitride film |
| JP2011066070A (en) * | 2009-09-15 | 2011-03-31 | Idemitsu Kosan Co Ltd | Polycrystalline thin film, deposition method of the same, and thin film transistor |
| RU2637044C2 (en) * | 2016-04-15 | 2017-11-29 | Закрытое Акционерное Общество "Светлана - Оптоэлектроника" | Method of producing coating based on indium and tin oxide |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137667B2 (en) * | 1971-11-13 | 1976-10-16 | ||
| JPS5024173A (en) * | 1973-07-06 | 1975-03-15 | ||
| US4015724A (en) * | 1975-08-21 | 1977-04-05 | Paper Converting Machine Company | Method and apparatus for handling substacks of business forms to develop balanced stacks |
-
1978
- 1978-09-18 JP JP11498878A patent/JPS5541959A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5541959A (en) | 1980-03-25 |
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