JPS6311658B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a glass mask used for contact printing, and particularly to a contact type glass mask suitable as a photomask for semiconductor manufacturing.

[Background of the Invention] Close-contact glass masks are often used in manufacturing semiconductor devices such as transistors, ICs, LSIs, and VLSIs. In this case, in order to bring the mask and wafer into close contact, as shown in FIG. 3 side (vacuum contact method), or a method of fixing the glass mask 1 and pushing up the wafer chuck 3 to press the wafer 3 against the glass mask 1 (press method).

By the way, in the case of the former vacuum contact method, the glass mask 1 is deformed by vacuuming the region 5 and comes into close contact with the wafer 3, but this deformation microscopically becomes as shown in FIG. 3 or 4. . That is, if the distance between the glass mask 1 and the wafer 3 in the state shown in FIG. 2 is large, there will be poor adhesion around the wafer as shown in FIG. 3, while if the distance between the mask 1 and the wafer 2 is small, As shown in FIG. 4, poor adhesion occurs near the center of the wafer. Furthermore, in the case of the latter press method, poor adhesion similarly occurs due to the amount of pushing up of the wafer chuck 4, the parallelism error between the mask 1 and the wafer 3, and the like. Such poor adhesion causes variations in pattern line width, and this tendency becomes particularly noticeable when the wafer size is 5 inches or more. Furthermore, the deformation of the glass mask 1 also causes a dimensional error, so-called pattern shift, between the mask 1 and the wafer 3.

Therefore, if conventional glass masks are used, it is necessary to take into account the above-mentioned variation in pattern line width and pattern shift when designing semiconductor devices, which reduces the size of semiconductor devices and increases the integration density of ICs, etc. This has become a major obstacle to raising the bar.

[Object of the Invention] The present invention aims to eliminate the above-mentioned drawbacks, to provide a close-contact type glass mask that is less deformed during close contact, has better adhesion, and is capable of finer patterning. purpose.

[Description of Examples] Examples of the present invention will be described below with reference to the drawings.
Note that parts common or corresponding to those of the conventional example are represented by the same reference numerals.

FIG. 1 shows a state in which a glass mask according to an embodiment of the present invention is mounted in a vacuum contact type semiconductor manufacturing apparatus. The glass mask 1 shown in the same figure is different from the ones shown in FIGS. 2 to 4 in that the glass mask main body 11 is configured to be smaller than the opening of the mask holding base 2, and its peripheral part is surrounded by a support member 12 that is easily deformable. It is a feature.

The support member 12 is preferably made of rubber such as rubber or polyurethane, or resin.

In FIG. 1, when performing contact baking, when the area 5 is evacuated, a force is exerted on the glass mask body 11 due to atmospheric pressure to move it closer to the wafer 3 side. However, in this case, since the support member 12 is elastically deformed, the glass mask main body 11 is brought into close contact with the wafer 3 without being deformed.

In addition, when the glass mask 1 shown in FIG. 1 is used in a press-type semiconductor manufacturing apparatus to perform contact baking, the wafer chuck 4 is pushed up from below, so that
Although the glass mask 1 deforms in the opposite direction to that shown in FIGS. 2 to 4, even in this case, the elastic deformation of the support member 12 prevents deformation of the glass mask body 11 and allows it to be brought into close contact with the wafer 3.

[Modified Example of Embodiment] In the above-described embodiment, the glass mask main body 11 is configured to be smaller than the opening of the mask holding base 2, but the supporting member 12 can be attached while maintaining the conventional shape. The glass mask main body 11 and the wafer 3 may be brought into close contact by deforming the support member 12 in the thickness direction. Furthermore, in the above description, the entire periphery of the glass mask body 11 is surrounded by the support member 12 in order to ensure airtightness for use in a vacuum contact type semiconductor manufacturing apparatus. In the case of a glass mask, the support members 12 may be attached in an amount and position that is sufficient to maintain the posture of the glass mask before and after the wafer chuck is pushed up. For example, support members with a length of several to several tens of millimeters may be installed at approximately equal intervals around the periphery. It is also possible to install more than one.

[Effects of the Invention] As described above, according to the present invention, with a simple structure in which an easily deformable support member is attached to the periphery of the glass mask main body, deformation of the glass mask main body can be prevented and pattern line width variations on the wafer can be reduced. and pattern deviations can be suppressed. Furthermore, this allows finer patterning.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a glass mask according to an embodiment of the present invention mounted in a vacuum contact type semiconductor manufacturing equipment and brought into close contact with a wafer. FIGS. 3 and 4 are cross-sectional views of the contact type semiconductor manufacturing apparatus, respectively, showing the state in which the glass mask is brought into close contact with the wafer in the apparatus of FIG. 2. DESCRIPTION OF SYMBOLS 1... Glass mask, 2... Mask holding stand, 3... Wafer, 4... Wafer chuck, 5... Vacuum area, 1
1...Glass mask body, 12...Supporting member.

Claims (1)

[Scope of Claims] 1. A glass mask used for contact printing, in which an easily deformable support member is attached to the periphery of the glass mask body, and the glass mask body is supported through this support member during use. A close-contact glass mask that is characterized by: 2. The supporting member surrounds the periphery of the glass mask main body, and the supporting member is used as an airtight seal when vacuum adsorbing is performed between the glass mask main body and the photoreceptor. A close-contact glass mask as described in Scope 1. 3. The close-contact type glass mask according to claim 1, wherein the support member is made of rubber or elastically deformable resin.