JPS6320650B2 - - Google Patents
Info
- Publication number
- JPS6320650B2 JPS6320650B2 JP58159649A JP15964983A JPS6320650B2 JP S6320650 B2 JPS6320650 B2 JP S6320650B2 JP 58159649 A JP58159649 A JP 58159649A JP 15964983 A JP15964983 A JP 15964983A JP S6320650 B2 JPS6320650 B2 JP S6320650B2
- Authority
- JP
- Japan
- Prior art keywords
- blade
- lead
- leads
- cutting
- lower blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 3
- 235000014676 Phragmites communis Nutrition 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shearing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 この発明は電子部品リード切断方法に関する。[Detailed description of the invention] The present invention relates to a method for cutting electronic component leads.
コンデンサ、抵抗或いは各半導体装置のような
電子部品をプリント基板に装填するとき、電子部
品のリードを、プリント基板に設けた装填孔に挿
込み、その裏面から突抜けた足の部分を適当な長
さに切断し、そのあと半田等によつて固定するよ
うにしている。 When loading electronic components such as capacitors, resistors, or various semiconductor devices onto a printed circuit board, insert the leads of the electronic components into the mounting holes provided on the printed circuit board, and cut the legs that protrude from the back side to an appropriate length. After that, they are fixed with solder or the like.
第１図〜第３図は従来のリードの切断方法を示
し、１は電子部品、２は複数のリード、３はプリ
ント基板等の基板、４は基板３に設けられたリー
ド挿通孔の装填孔、５はカツタで上刃６と下刃７
とにより構成されてあり、各刃にはリード２のそ
れぞれが貫通する孔状の刃部８，９を備えてい
る。電子部品１のリード２は装填孔４のそれぞれ
に挿通される。そして抜き出たリード２は各刃
６，７の各刃部８，９に挿通される。このときの
状態を示したのが第２図である。そして基板３及
び上刃６を固定したまま、下刃７を矢印方向に移
動させる。するとリード２の足は上刃６と下刃７
との摺接により切断される。このとき第３図に示
すように、リード２は刃部８内において下刃７の
移動方向に沿つてく字状に屈曲する。 1 to 3 show a conventional lead cutting method, in which 1 is an electronic component, 2 is a plurality of leads, 3 is a board such as a printed circuit board, and 4 is a loading hole for a lead insertion hole provided in the board 3. , 5 is a cutter with upper blade 6 and lower blade 7
Each blade has hole-shaped blade portions 8 and 9 through which each lead 2 passes. The leads 2 of the electronic component 1 are inserted into each of the loading holes 4. The extracted lead 2 is then inserted into each of the blade portions 8 and 9 of each of the blades 6 and 7. FIG. 2 shows the state at this time. Then, the lower blade 7 is moved in the direction of the arrow while the substrate 3 and the upper blade 6 are kept fixed. Then, the legs of lead 2 are upper blade 6 and lower blade 7.
It is cut by sliding contact with. At this time, as shown in FIG. 3, the lead 2 is bent into a dogleg shape within the blade portion 8 along the moving direction of the lower blade 7.
ところでこのように切断したとき、リード２が
屈曲しているので、リード２はこれが真直な場合
よりも抜けにくくなり、したがつて簡単に電子部
品１が基板３から離脱しないようになつて都合が
よいが、しかし図示の状態から理解されるように
各リード２はいずれも同じ方向に屈曲しているの
で、その屈曲方向に沿つて上方に引上げたとする
と、簡単に装填孔４から抜け出てしまうことがあ
る。このような抜け出しは、リードを半田で固定
するまではできる限り阻止することが望ましいこ
とはいうまでもない。 By the way, when the leads 2 are cut in this way, since they are bent, the leads 2 are more difficult to come off than if they were straight, and therefore the electronic component 1 is not easily separated from the board 3, which is convenient. However, as can be understood from the illustrated state, each lead 2 is bent in the same direction, so if you pull it upward along the bending direction, it will easily come out of the loading hole 4. There is. Needless to say, it is desirable to prevent such slippage as much as possible until the leads are fixed with solder.
この発明はリードが基板から簡単には抜け出な
いような形状に切断することを目的とする。 The purpose of this invention is to cut the leads into a shape that prevents them from easily coming out of the board.
この発明は各リードのうちの少くとも２本のリ
ードが互いに異なる方向に屈曲しながら切断する
ことを特徴とする。 This invention is characterized in that at least two of the leads are cut while being bent in different directions.
この発明の実施例を第４図以降の各図によつて
説明する。なお第１図〜第３図と同じ符号を附し
た部分は同一又は対応する部分を示す。この発明
において使用するカツタ５の上刃６は従来のもの
と大差はないが、下刃７はその各刃部８を方形状
の孔とするなどして、切断に供する刃先を直線状
とし、しかもこの刃先を、切断のための下刃７の
せん断方向（矢印方向）を中心にして左右対称に
反対方向に傾斜させてある。そしてこの場合各刃
部９は互いに平行にならないようにしてある。図
の例はせん断方向に沿う線を対称線として互いに
対称とするように傾斜させてある。 Embodiments of the present invention will be described with reference to FIG. 4 and subsequent figures. Note that parts given the same reference numerals as in FIGS. 1 to 3 indicate the same or corresponding parts. The upper blade 6 of the cutter 5 used in this invention is not much different from the conventional one, but the lower blade 7 has each blade part 8 with a rectangular hole, so that the cutting edge used for cutting is straight. Moreover, this cutting edge is symmetrically inclined in opposite directions with respect to the shearing direction (arrow direction) of the lower blade 7 for cutting. In this case, the blade portions 9 are not parallel to each other. The example shown in the figure is tilted so as to be symmetrical with respect to the line of symmetry along the shear direction.
リード２の切断は従来と同じく、リード２を基
板３の装填孔４に挿通する。そしてこれから抜き
出たリード２を更に上刃６の刃部８及び下刃７の
刃部９に挿通する。そして下刃７を矢印方向に移
動させる。第５図はこのときの切断の過程を順次
示したもので、ａは当初の状態を示し、ここから
下刃７が矢印方向に移動すると、ｂのようにリー
ド２は刃部９の奥側の直線状の刃先９ａに接す
る。更に下刃７が移動するとリード２は刃先９ａ
に沿つて摺接しようとする。そして更に下刃７が
移動すればｃに示すようにリードの足は両刃部
８，９によつて切断される。このとき下刃７の移
動方向をP1、刃先９ａの傾斜方向をP2とすれば
両方向P1，P2の合成方向P3に向う方向にリード
２は屈曲されながら切断されていく。 The lead 2 is cut by inserting the lead 2 into the loading hole 4 of the board 3 in the same way as in the conventional method. Then, the lead 2 extracted from this is further inserted into the blade part 8 of the upper blade 6 and the blade part 9 of the lower blade 7. Then, the lower blade 7 is moved in the direction of the arrow. FIG. 5 sequentially shows the cutting process at this time, where a shows the initial state, and when the lower blade 7 moves in the direction of the arrow from here, the lead 2 moves toward the back of the blade part 9 as shown in b. is in contact with the linear cutting edge 9a. When the lower blade 7 moves further, the lead 2 moves to the cutting edge 9a.
Attempt to make sliding contact along the If the lower blade 7 moves further, the legs of the reed are cut by the double blade parts 8 and 9 as shown in c. At this time, assuming that the moving direction of the lower blade 7 is P 1 and the inclination direction of the cutting edge 9a is P 2 , the lead 2 is bent and cut in a direction toward a composite direction P 3 of both directions P 1 and P 2.
そして両刃部９の刃先９ａは互いに異なる方向
に傾斜しているので、したがつて両リード２は互
いに異なる方向にく字状に屈曲する（第６図参
照）。そのため電子部品１を基板３から引抜こう
とする力が働いても、少なくと一方のリードが装
填孔４に引掛るようになり、したがつて簡単には
引出すことができないようになる。 Since the cutting edges 9a of the double-edged portions 9 are inclined in different directions, both leads 2 are bent in a dogleg shape in different directions (see FIG. 6). Therefore, even if a force is exerted to pull out the electronic component 1 from the board 3, at least one lead will be caught in the loading hole 4, and therefore it will not be possible to pull it out easily.
なおリードを３本以上備えた電子部品について
は、そのうちの２本についてこの発明にしたがつ
て切断すればよく、残りのリードについては従来
と同じ形状の刃部で切断するようにすればよい。
或いは残りのリードについても前記した２本と同
じようにそれぞれ屈曲方向が異なるように切断す
るようにしてもよいこともちろんである。そのた
めには残りのリードについてこれを切断する刃部
を、異なる角度で傾斜させておけばよい。 For electronic components having three or more leads, two of them may be cut according to the present invention, and the remaining leads may be cut with a blade portion having the same shape as the conventional one.
Alternatively, it goes without saying that the remaining leads may be cut in different bending directions in the same way as the two leads described above. For this purpose, the blade portion for cutting the remaining leads may be inclined at different angles.
以上詳述したようにこの発明によれば、電子部
品の少くとも２本のリードを、基板に挿通した状
態でこれより抜き出た部分から互いに異なる方向
に屈曲させて切断するようにしたので、その切断
後において、リードは基板の装填孔に引掛つて抜
けにくくなり、これにより基板からの離脱を確実
に防止できるといつた効果を奏する。 As described in detail above, according to the present invention, at least two leads of an electronic component are inserted into the board and then bent in different directions from the part where they are pulled out from the board to be cut. After cutting, the lead is caught in the loading hole of the board and becomes difficult to come out, thereby achieving the effect that separation from the board can be reliably prevented.
第１図は従来方法の実施状況を示す斜視図、第
２図はその断面図、第３図は切断後の断面図、第
４図はこの発明の実施例方法を説明するための分
解斜視図、第５図は動作説明図、第６図は切断後
の断面図である。
１…電子部品、２…リード、３…基板、４…装
填孔、５…カツタ、６…上刃、７…下刃、８…刃
部、９…刃部。
Fig. 1 is a perspective view showing the implementation status of the conventional method, Fig. 2 is a sectional view thereof, Fig. 3 is a sectional view after cutting, and Fig. 4 is an exploded perspective view for explaining the embodiment method of the present invention. , FIG. 5 is an explanatory diagram of the operation, and FIG. 6 is a sectional view after cutting. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Lead, 3... Board, 4... Loading hole, 5... Cutter, 6... Upper blade, 7... Lower blade, 8... Blade part, 9... Blade part.
Claims (1)
の装填孔に表面から挿通された電子部品の少なく
とも２本のリードの足を前記基板の裏面で切断す
る方法において、前記上刃に前記各リードが挿通
される少なくとも２箇の孔状の刃部を設け、また
前記下刃には前記上刃の刃部を通過してきた前記
各リードが挿通される少なくとも２箇の孔状の刃
部を設けるとともに、この下刃の刃部の刃先を直
線状とし、かつその刃先を、リード切断のための
前記下刃のせん断方向に沿う線を中心にして左右
互いに反対方向に傾斜せしめておき、前記上刃を
固定した状態で前記下刃を前記せん断方向に沿つ
て移動させて、前記上刃の刃部と前記下刃の刃部
の刃先とによつて前記リードの足を切断してなる
電子部品リード切断方法。1. A method of cutting at least two lead legs of an electronic component inserted from the front side into a loading hole of a board using a cutter having an upper blade and a lower blade, on the back side of the board. At least two hole-shaped blade portions are provided through which each lead is inserted, and the lower blade has at least two hole-shaped blade portions through which each of the leads that have passed through the blade portion of the upper blade is inserted. is provided, and the cutting edge of the blade portion of the lower blade is linear, and the cutting edge is inclined in opposite directions on the left and right with respect to a line along the shearing direction of the lower blade for cutting the lead, The lower blade is moved along the shearing direction with the upper blade fixed, and the legs of the reed are cut by the cutting edge of the upper blade and the lower blade. How to cut electronic component leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58159649A JPS6052214A (en) | 1983-08-31 | 1983-08-31 | Electronic parts lead cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58159649A JPS6052214A (en) | 1983-08-31 | 1983-08-31 | Electronic parts lead cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6052214A JPS6052214A (en) | 1985-03-25 |
| JPS6320650B2 true JPS6320650B2 (en) | 1988-04-28 |
Family
ID=15698321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58159649A Granted JPS6052214A (en) | 1983-08-31 | 1983-08-31 | Electronic parts lead cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6052214A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104841814A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | A cutting device |
-
1983
- 1983-08-31 JP JP58159649A patent/JPS6052214A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6052214A (en) | 1985-03-25 |
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