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JPH0216040B2 - - Google Patents
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JPH0216040B2 - - Google Patents

Info

Publication number
JPH0216040B2
JPH0216040B2 JP58227754A JP22775483A JPH0216040B2 JP H0216040 B2 JPH0216040 B2 JP H0216040B2 JP 58227754 A JP58227754 A JP 58227754A JP 22775483 A JP22775483 A JP 22775483A JP H0216040 B2 JPH0216040 B2 JP H0216040B2
Authority
JP
Japan
Prior art keywords
blade
lead
leads
cutting
lower blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58227754A
Other languages
Japanese (ja)
Other versions
JPS60119800A (en
Inventor
Hiromitsu Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiji National Industrial Co Ltd
Original Assignee
Meiji National Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiji National Industrial Co Ltd filed Critical Meiji National Industrial Co Ltd
Priority to JP58227754A priority Critical patent/JPS60119800A/en
Publication of JPS60119800A publication Critical patent/JPS60119800A/en
Publication of JPH0216040B2 publication Critical patent/JPH0216040B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Shearing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 この発明は電子部品リード切断方法に関する。[Detailed description of the invention] The present invention relates to a method for cutting electronic component leads.

コンデンサ、抵抗或いは各半導体装置のような
電子部品をプリント基板に装填するとき、電子部
品のリードを、プリント基板に設けた装填孔に挿
込み、その裏面から突抜けた足の部分を適当な長
さに切断し、そのあと半田等によつて固定するよ
うにしている。
When loading electronic components such as capacitors, resistors, or various semiconductor devices onto a printed circuit board, insert the leads of the electronic components into the mounting holes provided on the printed circuit board, and cut the legs that protrude from the back side to an appropriate length. After that, they are fixed with solder or the like.

第1図〜第3図は従来のリードの切断方法を示
し、1は電子部品、2は複数のリード、3はプリ
ント基板等の基板、4は基板3に設けられたリー
ド挿通用の装填孔、5はカツタで上刃6と下刃7
とにより構成されてあり、各刃には貫通する刃部
8,9を備えている。電子部品1のリード2は装
填孔4のそれぞれに挿通される。そして抜き出た
リード2は各刃6,7の各刃部8,9に挿通され
る。このときの状態を示したのが第2図である。
そして基板3及び上刃6を固定したまま、下刃7
を矢印方向に移動させる。するとリード2の足は
上刃6と下刃7との摺接により切断される。この
とき第3図に示すように、リード2は刃部8内に
おいて下刃7の移動方向に沿つてく字状に屈曲す
る。
Figures 1 to 3 show a conventional lead cutting method, in which 1 is an electronic component, 2 is a plurality of leads, 3 is a board such as a printed circuit board, and 4 is a loading hole provided in the board 3 for inserting the leads. , 5 is a cutter with upper blade 6 and lower blade 7
Each blade is provided with penetrating blade portions 8 and 9. The leads 2 of the electronic component 1 are inserted into each of the loading holes 4. The extracted lead 2 is then inserted into each of the blade portions 8 and 9 of each of the blades 6 and 7. FIG. 2 shows the state at this time.
Then, with the board 3 and the upper blade 6 fixed, the lower blade 7
move in the direction of the arrow. Then, the legs of the lead 2 are cut by the sliding contact between the upper blade 6 and the lower blade 7. At this time, as shown in FIG. 3, the lead 2 is bent in a dogleg shape within the blade portion 8 along the moving direction of the lower blade 7.

ところでこのように切断したとき、リード2が
屈曲しているので、リード2はこれが真直な場合
よりも抜けにくくなり、したがつて簡単に電子部
品1が基板3から離脱しないようになつて都合が
よいが、しかし図示の状態から理解されるように
各リード2はいずれも同じ方向に屈曲しているの
で、その屈曲方向に沿つて上方に引上げたとする
と、簡単に装填孔4から抜け出てしまうことがあ
る。このような抜け出しは、リードを半田で固定
するまではできる限り阻止することが望ましいこ
とはいうまでもない。
By the way, when the leads 2 are cut in this way, since they are bent, the leads 2 are more difficult to come off than if they were straight, and therefore the electronic component 1 is not easily separated from the board 3, which is convenient. However, as can be understood from the illustrated state, each lead 2 is bent in the same direction, so if you pull it upward along the bending direction, it will easily come out of the loading hole 4. There is. Needless to say, it is desirable to prevent such slippage as much as possible until the leads are fixed with solder.

この発明はリードが基板から簡単には抜け出な
いような形状に切断することを目的とする。
The purpose of this invention is to cut the leads into a shape that prevents them from easily coming out of the board.

この発明は各リードのうちの少くとも2本のリ
ードを互いに反対方向に屈曲させながら切断する
ことを特徴とする。
The present invention is characterized in that at least two of each lead are cut while being bent in opposite directions.

この発明の実施例を第4図以降の各図によつて
説明する。なお第1図〜第3図と同じ符号を附し
た部分は同一又は対応する部分を示す。この発明
において使用するカツタ5の上刃の装填孔4は、
矢印で示すせん断方向に沿つて、少なくとも2個
設けてある。また下刃7はその各刃部9A,9B
を方形状とし、しかもせん断方向に対して少なく
とも2個設けるとともに、そのせん断方向に対し
て傾斜させてある。そしてこの場合各刃部9A,
9Bの、直線状とされた斜辺部(刃先)9a,9
bは、互いに平行にならないようにしてあり、図
の例はせん断方向に沿う線Lに対して直角の線を
対称線として、互いに対称となるように傾斜させ
てある。そして前記線Lは、両リード2を結ぶ線
に沿うように、たとえば互いに平行するように設
定されてある。
Embodiments of the present invention will be described with reference to FIG. 4 and subsequent figures. Note that parts given the same reference numerals as in FIGS. 1 to 3 indicate the same or corresponding parts. The loading hole 4 of the upper blade of the cutter 5 used in this invention is as follows:
At least two are provided along the shearing direction indicated by the arrow. In addition, the lower blade 7 has its respective blade portions 9A and 9B.
are rectangular in shape, at least two are provided in the shearing direction, and are inclined with respect to the shearing direction. In this case, each blade part 9A,
9B, the linear oblique side (cutting edge) 9a, 9
b are made not to be parallel to each other, and in the example shown in the figure, they are tilted so as to be symmetrical with respect to a line perpendicular to a line L along the shearing direction. The lines L are set along a line connecting both leads 2, for example, parallel to each other.

リード2の切断は従来と同じく、リード2を基
板3の装填孔4に挿通する。そしてこれから抜き
出た各リード2を更に上刃6の刃部8及び下刃7
の刃部9A,9Bに挿通する。そして下刃7を矢
印方向すなわちせん断方向に移動させる。第5図
はこのときの切断の過程を順次示したもので、A
は当初の状態を示し、ここから下刃7が矢印方向
に移動すると、Bのようにリード2は刃部9Aの
奥側の斜辺部9aに及び刃部9Bの奥側の斜辺部
9bに接する。更に下刃7が移動するとリード2
は斜辺部9a,9bに沿つて摺接しようとする。
そして更に下刃7が移動すればリード2の足は両
刃部8,9A,9Bによつて切断される。このと
き刃部9Aに挿通されたリード2については下刃
7の移動方向をP1、斜辺部9aの傾斜方向をP2
とすれば両方向P1,P2の合成方向P3に向う方向
にリード2は屈曲されながら切断されていく。同
じように刃部9Bに挿通されたリード2について
も、斜辺部9bの傾斜方向をP2′とすれば、両方
向P1,P2′の合成方向P3′に向う方向にリード2は
屈曲されながら切断されていく。
The lead 2 is cut by inserting the lead 2 into the loading hole 4 of the board 3 in the same way as in the conventional method. Then, each lead 2 extracted from this is further inserted into the blade part 8 of the upper blade 6 and the lower blade 7.
Insert into the blade portions 9A and 9B. Then, the lower blade 7 is moved in the direction of the arrow, that is, in the shearing direction. Figure 5 sequentially shows the cutting process at this time.
indicates the initial state, and when the lower blade 7 moves in the direction of the arrow from here, the lead 2 contacts the rear oblique side 9a of the blade portion 9A and the rear oblique side 9b of the blade portion 9B, as shown in B. . When the lower blade 7 moves further, the lead 2
tend to come into sliding contact along the oblique sides 9a and 9b.
When the lower blade 7 moves further, the legs of the lead 2 are cut by the double blade parts 8, 9A, and 9B. At this time, regarding the lead 2 inserted into the blade part 9A, the moving direction of the lower blade 7 is P1 , and the inclination direction of the oblique side part 9a is P2 .
If so, the lead 2 is bent and cut in the direction toward the composite direction P 3 of both directions P 1 and P 2 . Similarly, regarding the lead 2 inserted through the blade portion 9B, if the inclination direction of the hypotenuse portion 9b is P 2 ′, the lead 2 is bent in the direction toward the composite direction P 3 ′ of both directions P 1 and P 2 ′. It is cut off while being cut off.

そして両刃部9の斜辺部9a,9bは互いに反
対方向に傾斜しているので、したがつて両リード
2は互いに反対方向にく字状に屈曲する(第6図
参照)。そのため電子部品1を基板3から引抜こ
うとする力が働いても、少くとも一方のリードが
装填孔4に引掛るようになり、したがつて簡単に
は引出すことができないようになる。
Since the oblique sides 9a and 9b of the double-edged portion 9 are inclined in opposite directions, both leads 2 are bent in a dogleg shape in opposite directions (see FIG. 6). Therefore, even if a force is applied to pull out the electronic component 1 from the board 3, at least one lead will be caught in the loading hole 4, and therefore it will not be possible to pull it out easily.

なおリードを3本以上備えた電子部品について
は、そのうちの2本についてこの発明にしたがつ
て切断すればよく、残りのリードについては従来
と同じ形状の刃部で切断するようにすればよい。
或いは残りのリードについても前記した2本と同
じようにそれぞれ屈曲方向が異なるように切断す
るようにしてもよいこともちろんである。そのた
めには残りのリードについてこれを切断する刃部
を、異なる角度で傾斜させておけばよい。
For electronic components having three or more leads, two of them may be cut according to the present invention, and the remaining leads may be cut with a blade portion having the same shape as the conventional one.
Alternatively, it goes without saying that the remaining leads may be cut in different bending directions in the same way as the two leads described above. For this purpose, the blade portion for cutting the remaining leads may be inclined at different angles.

以上詳述したようにこの発明によれば、電子部
品の少くとも2本のリードを、基板に挿通した状
態でこれより抜き出た部分から互いに反対方向に
屈曲させて切断するようにしたので、その切断後
において、リードは基板の装填孔に引掛つて抜け
にくくなり、これにより基板からの離脱を確実に
防止できるといつた効果を奏する。
As detailed above, according to the present invention, at least two leads of an electronic component are inserted into the board and then cut from the parts that are pulled out from the board by bending them in opposite directions. After cutting, the lead is caught in the loading hole of the board and becomes difficult to come out, thereby achieving the effect that separation from the board can be reliably prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来方法の実施状況を示す斜視図、第
2図はその断面図、第3図は切断後の断面図、第
4図はこの発明の実施例方法を説明するための分
解斜視図、第5図は動作説明図、第6図は切断後
の断面図である。 1……電子部品、2……リード、3……基板、
4……装填孔、5……カツタ、6……上刃、7…
…下刃、8……刃部、9A,9B……刃部。
Fig. 1 is a perspective view showing the implementation status of the conventional method, Fig. 2 is a sectional view thereof, Fig. 3 is a sectional view after cutting, and Fig. 4 is an exploded perspective view for explaining the embodiment method of the present invention. , FIG. 5 is an explanatory diagram of the operation, and FIG. 6 is a sectional view after cutting. 1...electronic component, 2...lead, 3...board,
4... Loading hole, 5... Katsuta, 6... Upper blade, 7...
...lower blade, 8...blade section, 9A, 9B...blade section.

Claims (1)

【特許請求の範囲】[Claims] 1 上刃及び下刃を備えたカツタによつて、基板
の装填孔に表面から挿通された電子部品の少なく
とも2本のリードの足を前記基板の裏面で切断す
る方法において、前記上刃には前記各リードが挿
通される少なくとも2個の孔状の刃部を、リード
切断のための前記下刃のせん断方向に沿つて設
け、また前記下刃には前記上刃の刃部を通過して
きた前記リードが挿通される少なくとも2個の孔
状の刃部を、前記せん断方向に沿つて設けるとと
もに、この下刃の刃部の刃先を直線状とし、かつ
その刃先を、前記せん断方向に沿う線に対して直
角となる線を対称線として互いに対称となるよう
に傾斜せしめておき、前記上刃を固定した状態で
前記下刃を前記せん断方向に沿つて移動させて、
前記上刃の刃部と前記下刃の刃部の刃先によつて
前記リードの足を切断してなる電子部品リード切
断方法。
1. A method of cutting at least two lead legs of an electronic component inserted from the front side into a loading hole of a board using a cutter having an upper blade and a lower blade, on the back side of the board, wherein the upper blade has a At least two hole-shaped blade portions through which the leads are inserted are provided along the shearing direction of the lower blade for cutting the leads, and the lower blade has holes that have passed through the blade portion of the upper blade. At least two hole-shaped blade portions through which the leads are inserted are provided along the shearing direction, and the cutting edge of the lower blade portion is formed into a straight line, and the cutting edge is formed into a line along the shearing direction. The lower blade is moved along the shearing direction with the upper blade fixed, and the lower blade is moved along the shearing direction with the upper blade fixed.
An electronic component lead cutting method comprising cutting the legs of the lead using the cutting edge of the upper blade and the lower blade.
JP58227754A 1983-11-30 1983-11-30 Method of cutting lead of electronic part Granted JPS60119800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58227754A JPS60119800A (en) 1983-11-30 1983-11-30 Method of cutting lead of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58227754A JPS60119800A (en) 1983-11-30 1983-11-30 Method of cutting lead of electronic part

Publications (2)

Publication Number Publication Date
JPS60119800A JPS60119800A (en) 1985-06-27
JPH0216040B2 true JPH0216040B2 (en) 1990-04-13

Family

ID=16865849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58227754A Granted JPS60119800A (en) 1983-11-30 1983-11-30 Method of cutting lead of electronic part

Country Status (1)

Country Link
JP (1) JPS60119800A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0526866Y2 (en) * 1985-08-02 1993-07-07

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320650A (en) * 1986-07-15 1988-01-28 Nec Corp Tss command batch job processing system

Also Published As

Publication number Publication date
JPS60119800A (en) 1985-06-27

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