JPS6333301B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and particularly to a semiconductor device having a plurality of pieces of product management information.

Recently, the demand for custom LSIs has been increasing, and we are entering an era of low-volume, high-productivity LSIs where only a few hundred, tens, or even a few pieces per product type are needed, and no more than that. In such a situation, it is expected that a considerable amount of man-hours, manpower, and space will be required if product management continues to be managed in the same manner as the current general-purpose mass production.

Currently, in low-volume, high-mix production, the master slicing method and PLA (Programmable logic array) method are used to respond to low-volume, high-mix production by simply changing the wiring etc. from the same substrate (wafer). Although it is possible to use a mass production method up to the manufacturing process, it is not possible to do so after the wiring process, and it is expected that thousands of products will be produced from a single base. In this case, it is necessary to manage everything from a few items to several hundred items of one type on the same production line. As the number of products increases, starting from wafer testing after wiring, packaging process, stamping process, reliability testing, etc., it is expected that there will be more manual intervention, more slip processing, and a rapid increase in man-hours. Furthermore, if products are passed down the production line in units of several by hand, there will be many errors due to misreading of product types. In addition, the number of bonding butts (or number of pins on the package)
If Manter Slices and PLA of different sizes had to be run on the same production line, the number of man-hours and manpower involved would be enormous. Well then,
Turnaround required for custom LSI
Short time and low costs, on the other hand, become longer and more expensive, making it impossible to smoothly produce a wide variety of products in small quantities.

The present invention is a semiconductor device for eliminating the confusion that occurs when a mixture of master slices and PLA with different numbers of bonding pads are run on the same manufacturing line as described above.

A feature of the present invention is that the product name, serial number, test program name, etc. are recognized from multiple signals of each bonding pad of the pellet of the semiconductor device or each pin of the package. This is a semiconductor device with a built-in product management function that helps automate the testing process and further automate the assembly of equipment using the semiconductor device.

More specifically, this invention uses signals from each bonding pad or package pin on the pellet of a semiconductor device to identify the product name, serial number, etc.
In semiconductor devices that have a built-in function related to product management that allows you to know the test program name, etc., there is multiple product management that has a switch function between each bonding pad (or pin) and each connected internal circuit. This is a semiconductor device that contains an information circuit and multiple switch control lines that control it.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a portion of an IC pellet that is an embodiment of the present invention. In this pellet, bonding pads 1, 2, 3 and internal circuits 16, 17,
Circuits 10, 11, 12, 13, 14, 15 that have both product management information and switches built in between them and 18
will be established. Furthermore, a switch circuit 7 for switching internal circuits 16, 17, 18 and a product management information circuit,
8 and 9 are provided. The above circuits 10 to 15 have built-in switch functions that switch connections between circuits that have logic signals of "1" or "0" or a certain voltage level as product management information, and adjacent circuits. . A plurality of these product management information circuits are prepared for one internal circuit, and are controlled by a plurality of control lines. For example, in FIG. 1, for the internal circuit 16, the product management information circuits 10, 1
1 and a switch circuit 7 are prepared, and each circuit 7,
Control lines 4, 5, 6 are connected to 10, 11.
By applying signals to these control lines, the bonding pads (or pins of the package) are put into the product management information signal mode or into the internal circuit signal mode. Internal circuits 17 and 18 are also connected to product management information circuits 12, 13, and 1.
4 and 15 are prepared as switch circuits and 8 and 9 are prepared, and these circuits 8, 12, 13 and 9, 1
Control lines 4, 5, and 6 are connected to 4 and 15, respectively, and have the same functions as those described for 16 above.

FIG. 2 is an example of displaying the product number, test program number, and wafer number using the circuit shown in FIG. Each of the bonding pads 21 to 40 is set to a product management information signal mode by a switch circuit, and a logic signal of "1" or "0" is output. 42 in Figure 2 is the product name “D7891 (16
In this case, the 21st pin is logic "1", the 22nd pin is logic "1", the 23rd pin is logic "0", and the 24th pin is logic "1", and these are converted to hexadecimal display. Then, it becomes "D", and if you read pins 25 to 40 one after another in the same way, you can read the product name "D7891".Also, by changing the signal applied to the control line, you can read the product name on the same bonding pad. In Fig. 2, 43 indicates that the test program number "AA029" is output, and 44 indicates that the wafer number "CB031" is output. In this way, if you want to output a large amount of product management information to a limited number of bonding parts or only to a limited number of pins, you can output a large amount of information by creating multiple product management information circuits and correspondingly multiple control lines. can be incorporated.

FIG. 3 shows the product management information circuits connected in parallel, whereas the adjacent product management information circuits in FIG. 1 are connected in series. Note that the logic information of the product management information circuit is formed in the wiring process of the semiconductor manufacturing process.

The effects of this invention include the following.

(1) Even if a wide variety of products are run in small quantities on the same production line,
It becomes easier to set up automated lines using management information.

(2) Even with a limited number of bonding parts, the amount of information can be increased by increasing the number of product management information circuits and control lines.

(3) Since management information is provided for each pellet, even if a variety of products are produced on a single wafer, wafers and pellets can be managed simply by adding a program without making any special changes to the wafer prober.

(4) Since each package cage has electrical management information, there is no need to prepare a special warehouse location (or warehouse location) for each product. At some point, you can put them in groups and put them through a sorting machine to pick out the items you need.

(5) Since management information is now displayed on the bonding pad, testers can be converted into low-volume, high-mix testers by simply changing the program of the conventional machine (adding an automatic test program selection routine).

(6) Direct lithography using an electron beam lithography system has poor throughput, but by lithography of multiple types on a single wafer, it is possible to overcome this problem by using a pellet-based management system.

(7) Since each pellet (or package) has electrical management information, the tester's detection function and test program automatic selection routine can be integrated into a unit, and the same unit can be used to automate a conveyance line for small-lot, high-mix products. It can be done cheaply.

(8) Effects of the Invention By using the unit of (7) by an assembler user, the number of assembly steps can be greatly reduced.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing one embodiment of the present invention, and FIG. 2 is a diagram showing the product number, test and
FIG. 6 is a diagram showing an example of displaying a program number and a wafer number. FIG. 3 is a diagram showing another embodiment of the present invention. In FIG. 1, 1-3...Bonding pad, 4-6...Switch control line, 7-9...Switch circuit between internal circuit and product information circuit, 10-
15...Product information circuit with built-in switch, 16-1
8...internal circuit, 19... pellet. Second
In the figure, 21 to 40... bonding pad, 41... pellet, 42... product name "D7891" in hexadecimal, 43... test program number "AA029" in hexadecimal, 44... wafer number This is the hexadecimal representation of “CB031”. In FIG. 3, 51 to 53... bonding parts,
54-56...Switch control line, 57-65...
Product information circuit with built-in switch, 66-68...internal circuit, 69...pellet.

Claims (1)

[Claims] 1 Connecting the bonding pad on the pellet of the semiconductor device or the pin of the package to the bonding pad on the pellet of the semiconductor device or the pin of the package.
A plurality of product management information circuits having a switch function and a plurality of switch control lines for controlling them are built in between each internal circuit provided in the pellet connected to the part or pin. Semiconductor equipment.