JPS6336129B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for removing a deposited film on a metallized film or the like.

A capacitor using a metallized film in which the vapor deposited film is divided at right angles to the length of the plastic film generates smoke when dielectric breakdown occurs by releasing the divided electrode at the dielectric breakdown part from the divided electrode group. This is a capacitor that has features that prevent it from igniting. Therefore, it is very important to accurately divide the deposited film perpendicular to the length of the film, that is, to remove the deposited film.

Hereinafter, the portions that are not deposited and the portions from which the deposited film has been removed will be referred to as non-deposited portions.

Conventionally, as methods for forming non-vapor deposited areas, a masking method in which a mask is applied to the non-vapor deposited areas on the surface of a film during vapor deposition, and an oil method in which oil is applied to the non-vapor deposited areas have been generally used. However, while both of these methods are suitable for forming straight non-deposited areas along the length of the film, such as the margins of metallized films, they are suitable for forming non-deposited areas along the lateral direction of the film. Alternatively, it is very difficult to form a non-deposited part with a complicated shape.

The present invention is a method in which a voltage is applied between two electrodes in contact with a vapor deposited film, and only the vapor deposited metal on the electrode part is scattered by electric energy at the contact part between the vapor deposited film and the electrode.This method is different from the conventional masking method. It is easy to form non-deposited parts in the lateral direction of the film, which was difficult with methods such as the method, and by using an electrode with a large contact area with the deposited film and an electrode with a small contact area with the deposited film, it is possible to In the method of scattering only the vapor-deposited metal at the contact portion with the vapor-deposited film, the latter scatters the vapor-deposited metal in accordance with the shape of the electrode, making it possible to form non-vapor-deposited portions with complex shapes.

FIG. 1 is a schematic diagram of a system according to an embodiment of the present invention for forming a non-deposited part on a deposited film. In the figure, 1 is a metalized film roll, 2 is a metalized film, and 3 is a deposited film. 4 is a roller-shaped electrode with a large contact area, 4 is an electrode with a small contact area with the vapor deposited film, 5 is a roller-shaped base electrode that makes a plurality of electrodes 4 have the same potential, and 6 is a base electrode 5 and a metallized film 2. 7 is a roller, and 8 is an axial roller of the metallized film roll 1. In this configuration, when a voltage is applied between electrode 3 and electrode 4,
Since the electrode 3 and the metallized film 2 are in contact over a wide area, there is no concentration of current and the deposited film is not scattered, but since the electrode 4 and the metallized film 2 are in contact over a narrow area, there is no concentration of current. , the current density increases and the deposited film scatters.

FIG. 2 is a perspective view of the portion of the mother electrode 5 in FIG. 1, that is, the roller.

Next, using the roller shown in Fig. 2 with the configuration shown in Fig. 1,
An example in which a metallized film was actually processed will be described. In order to form non-evaporated areas of 1 mm width at 20 mm intervals on an aluminum single-sided metallized polyethylene terephthalate film with a surface resistance of 3 Ω/□, a thickness of 7.5 μ, a film width of 32 mm, and a margin width of 3 mm, as shown in Figure 2. The distance between the electrodes 4 on the roller is
A copper rod with a radius of 0.5 mm was used as the electrode 4, the power supply voltage was 50 VDC, and the film feeding speed was 10 m/min. As a result, a desired divided vapor deposited film as shown in FIG. 3 could be obtained. In FIG. 3, 9 is a divided vapor deposited film, 1
0 is the non-deposited part from which the deposited film has been removed, 11 is the margin part of the pre-existing metallized film, 12
is the plastic film that serves as the substrate. As can be seen from the results of this example, according to the present invention, a desired non-evaporated portion can be formed by appropriately determining the position and shape of an electrode that has a small contact area with the deposited film. can. Further, non-evaporated portions can be formed not only in the direction perpendicular to the length direction of the film as in this embodiment, but also in the direction parallel to the length direction of the film and in the diagonal direction.

Note that the contact area of an electrode with a large contact area with the vapor deposited film is, at any given moment, the contact area with the vapor deposited film of an electrode with a small contact area with the vapor deposited film.
If it is at least twice as large, it is possible to reduce the scattering of the vapor deposited film at the contact portion of the electrode with the vapor deposited film, which has a large contact area with the vapor deposited film, and a preferable process can be performed.

In this example, a single-sided metallized film has been explained, but the same applies to a double-sided metalized film, and even if the surface resistance of the deposited film, the film width, the contact area with the deposited film, etc. change, the power supply voltage can be adjusted. This can be dealt with by adjusting the film feed speed.

According to the method for removing a vapor deposited film of the present invention as described above, it is easy to form a desired non-evaporated part, and it is ideal for, for example, manufacturing capacitors that use split electrodes to prevent smoke and ignition. The value is very great.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of an embodiment of a system for forming a non-vaporized part by the method of removing a deposited film of the present invention, FIG. 2 is a perspective view of a roller including an electrode with a small contact area with a deposited film, and FIG. The figure is a plan view of a metallized film processed according to the present invention. 2... Metalized film, 3... Roller-shaped electrode with a large contact area with the vapor deposited film, 4... Electrode with a small contact area with the vapor deposited film, 9... Divided vapor deposited film, 10... Vapor deposited film non-deposited part from which 12
...Plastic film.

Claims (1)

[Claims] 1 Vapor deposition characterized by applying a voltage between an electrode that has a large contact area with the vapor deposited film and an electrode that has a small contact area with the vapor deposited film to scatter only the vapor deposited metal in the contact area between the latter electrode and the vapor deposited film. Membrane removal method.