JPS6344294B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves transporting and positioning a semiconductor component having a gate-shaped cross-sectional shape from a predetermined supply position to a working position of a bonding device, and then fixing the semiconductor component to perform bonding work. The present invention relates to a semiconductor component transfer and positioning device that simultaneously transfers semiconductor components that have completed bonding to a predetermined discharge position.

Conventionally, semiconductor components having a gate-shaped cross section have been transferred by transferring them to a special transfer jig such as a carrier, and a suction device has been used to fix the components. However, using a transfer jig requires additional work, and fixing with a suction device lacks reliability.

The present invention has been made in view of the drawbacks of the prior art described above, and is a semiconductor device that reliably transfers semiconductor components without using a special transfer jig and securely fixes the semiconductor components using a mechanical fixing device. The object of the present invention is to provide a parts transfer and positioning device.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 1 is a front view of a semiconductor component transfer and positioning device that is an embodiment of the present invention, FIG. 2 is a side sectional view of the portion indicated by arrow A-A in FIG. 1, and FIG. 3 is the same as shown in FIG. 1. Plan view of the device, Figure 4 is shown by arrow B-B in Figure 2.
5 is a plan sectional view of the portion indicated by arrow C--C in FIG. 1, FIG. 6 is a sectional plan view of the portion indicated by arrow D--D in FIG. 2, and FIG. is the second
8 is a detailed view of the feeding claw portion of the device shown in FIG. 1, where a is a front sectional view, b is a plan view, c is a side view, and FIG. The figures are detailed views of the semiconductor component fixing device of the device shown in FIG. 1, in which a is a front view, b is a plan view, c is a side sectional view, and FIGS. 10a to 10e are explanations of the operation of the device shown in FIG. 1. FIG. 2 is a plan view and a front view of

In Figures 1, 2, and 3, 1 is the main body;
2 is a unit frame attached to the main body 1, and 3 is a drive shaft rotatably supported by the main body 1 via a bearing, which includes a pin drive cam 4, a presser foot vertical movement cam 5, and a signal cam for stopping one rotation. 6. Timing cam 7
A rotating plate 8 is fixed to each of the shaft ends.
Reference numeral 9 denotes an arm swingably supported by a fulcrum shaft 10 fixed to the main body 1, and a groove 9 formed in the center of the arm.
A rotary outer ring rotatable bearing 1 provided on a rotary plate 8
1 is engaged. The bearing 11 is slidable in the groove 9a, and the rotation of the rotary plate 8 causes the arm 9 to perform a reciprocating rocking motion. Reference numeral 12 denotes a slide block which is slidably and swingably straddled over a guide shaft 13 which is arranged and fixed above the drive shaft 3 in a direction perpendicular to the drive shaft 3 on the unit frame 2. 14 is a block fixed to the slide block 12 and has a bearing 15 attached to the tip; this bearing 15 is attached to the block 14.
The spring hook 16 attached to the arm 9 and the spring hook 17 attached to the arm 9 are biased by a spring 18 and pressed into contact with the tip of the arm 9, and as the arm 9 swings back and forth, The slide block 12 performs reciprocating linear motion along the guide shaft 13. 19 is a block fixed to the slide block 12 and equipped with bearings 22a and 22b fitted to an eccentric shaft 20 and a fixed shaft 21 implanted at the tip, respectively; 23 is a guide shaft arranged parallel to the guide shaft 13; The shaft is supported by arms 24 and 25 supported by the shaft 13, and bearings 22a and 22b slidably sandwich the shaft 23.

In FIGS. 3 and 6, 30 is a connecting arm that is fixed to the shaft 23 and has one end connected to a rotatable joint 31, and 32 is a connecting rod that has the joint 31 fixed to one end and the joint 33 fixed to the other end. It is. 34 is a fulcrum shaft 35 fixed to the unit frame 2
The cam lever is swingably supported by the cam lever, and its tip is connected to the joint 33. A cam follower 36 is provided at the center of the cam lever 34, and is pressed into contact with the pin drive cam 4 by a coil spring 38 hooked between the tip of the cam lever 34 and a spring hook 37 implanted in the unit frame 2. Therefore, when the pin drive cam 4 rotates due to the rotation of the drive shaft 3, the cam follower 36 moves up and down due to its contour shape, and the cam lever 34 swings. As a result, the connecting arm 30 is raised and lowered via the joint 33, the connecting rod 32, and the joint 31, and the shaft 23 is moved in an arc around the guide shaft 13, and the bearing 22 is moved up and down.
The slide block 12 is similarly swung relative to the shaft 13 via a and 22b.

In FIGS. 1 and 8, reference numeral 40 includes a first feed claw 42 fixed to the tip via a plate 41, and a second feed claw 43 fixed behind the first feed claw 42, which can be adjusted vertically and horizontally. The first sliding body is connected to the slide block 12 by a plate 44, and 45 is a guide plate attached to the plate 41. The second sliding body 46 slides smoothly along a guide path 45a formed in the guide plate 45. do. A positioning pawl 47 is fixed to the front end of the second sliding body 46 in such a manner that it usually overlaps with the first feeding pawl 42 .
On the other hand, a bearing shaft 48 is installed downward at the rear end of the second sliding body 46, and a bearing 49 is attached to the lower end of the bearing shaft 48. Reference numeral 50 denotes a tension coil spring that is coupled to a spring hook 51 embedded in the guide plate 45 and the bearing shaft 48, and is used to constantly move the second sliding body 46 toward its front end (towards the right in the figure).
is energized. A stopper 52 is fixed to the plate 41 and prevents the second sliding body 46 from protruding forward due to the biasing force of the tension coil spring 50.
The second sliding member 46 is locked at a position where the first feed pawl 42 and the positioning pawl 47 normally completely overlap. 5
A stopper member 3 is provided opposite the bearing 49 and is adjustable and fixed to the unit frame 2.

Next, in FIGS. 1, 5, and 7, reference numeral 60 denotes a connecting arm fixed to a shaft 62 rotatably supported by a bush 61 fitted in the unit frame 2;
63 is a joint connected to the tip of the connecting arm 60, 64 is a connecting rod with a joint 63 fixed to one end and a joint 65 fixed to the other end, 66 is a cam lever supported swingably on the fulcrum shaft 35, and the tip is a joint. It is connected to 65. 67 is cam lever 6
A cam follower provided at the center of the presser foot vertical movement cam 5 is pressed into contact with the presser foot vertical movement cam 5 by a coil spring 68 hooked between the tip of a cam lever 66 and a spring hook 37 implanted in the unit frame 2. Therefore, when the presser foot vertical movement cam 5 rotates due to the rotation of the drive shaft 3, the cam follower 67 moves up and down due to its contour shape, and the cam lever 66 swings. By this,
The connecting arm 60 is made to swing together with the shaft 62 via the joint 65, the connecting rod 64, and the joint 63. A presser arm 70 having a hemispherical pin 69 driven into its tip is fixed to the shaft 62, and the presser arm 70 swings as the shaft 62 moves.

Further, in FIG. 4, 71 and 72 are proximity switches fixed to a mounting plate 73 fixed to the unit frame 2, and are arranged corresponding to the one-rotation stop signal cam 6 and the timing cam 7, respectively.

Next, referring to FIG. 9, the semiconductor holding device will be explained. The semiconductor holding device is located at the front end of the semiconductor component supply inclined linear running path shown at 80 in FIG.
It is provided at the bonding work position indicated by 1, and is used to hold down semiconductor components for bonding work. Also, 8 in Figures 1 and 3.
2 is a semiconductor component discharge path that is arranged adjacent to the work position 81 and on an extension of the straight path 80.

Now, the semiconductor holding device has the following structure. That is, 90 is a block attached to a rotary drive device (not shown), and the bush 9 is coaxially arranged.
1,92. 93 is Butsuyu 91,9
2, a lifting shaft 94 is a swinging lever which is supported by a pin 95 fixed to the block 90, and has one end in contact with the lifting shaft 93 and the other end in contact with the pin 69 of the presser arm 70. That's what happens. 9
Reference numeral 6 denotes a rotation stopper that is implanted in the lifting shaft 93 and engages with the engagement plate 97 to prevent rotation of the lifting shaft 93; 98 is a piece fixed to the lifting shaft 93; is engaged with a tension coil spring 99. Reference numeral 100 is a compression coil spring provided between the bush 91 and the piece 98 to constantly press and bias the elevating shaft 93 downward. 101 is block 90
Rails 102 and 103 are mounted on the rails 102 and 103, which are placed on the extension of the straight running path 80 and guide the semiconductor components, and pins 104 are fixed to the upper end of the lifting shaft 93 to position the semiconductor components. This is a presser arm equipped with leaf springs 105 and 106 for reliably holding down a semiconductor component 110 having a cross-sectional shape of .

The operation of such a semiconductor component transfer and positioning device will be explained with reference to the following FIGS. 10a to 10e.
The semiconductor components 110 shown in FIG. 11 are slid and fed one by one to the front end of the inclined straight running path 80 by their own weight by an escapement device of a supply unit (not shown) (FIG. 11a). Thereafter, the drive shaft 3 is rotated by a motor (not shown), the slide block 12 is oscillated by the pin drive cam 4, and at the same time the first sliding body 40 is oscillated to
The feed pawl 42, the second feed pawl 43, and the positioning pawl 47 are advanced in the direction of the straight running path 80. At the same time, the presser arm 70 is lowered by the presser vertical movement cam 5 to swing the swing lever 94, and the sliding shaft 93 is raised to open the presser arms 102 and 103 upward, thereby removing the semiconductor component 110 that has already been pressed and fixed. (Figure 11b). When the drive shaft 3 continues to rotate further, the rotation of the rotary plate 8 causes the slide block 12 to be sent forward along the guide shaft 13.
As a result, the second feed pawl 43 provided on the first sliding body 40 engages with the rear end of the semiconductor component 110 and moves it from the supply position 80 to the bonding work position 81.
At the same time, the first feed claw 42 completes bonding and transfers the presser arms 102, 103.
engages the rear end of the unfixed semiconductor component 110 and begins to transfer it from the bonding work position 81 to the discharge position 82. and second sliding body 4
Bearing 4 at the tip of bearing shaft 48 fixed to 6
9 hits the stopper member 53 and the second sliding body 46
stops sliding, and the positioning claw 4 fixed thereto
7 also stops its movement. On the other hand, the first sliding body 40 is continuously fed with the rotation of the fixed plate 8, and the second feeding claw 43 and the first feeding claw 42 are respectively moved to the semiconductor component 110.
(Fig. 11c). Then, the second feeding claw 43 transports the semiconductor component 110 until it comes into contact with the positioning claw 47 which is already stopped and waiting at a predetermined position. The semiconductor component 110 is the second
When the presser arm 70 is sandwiched between the feed claw 43 and the positioning claw 47, the presser arm 70 is raised by the presser foot vertical movement cam 5, and the lifting shaft 93 is lowered to lower the presser arm 10.
2 and 103 press down the semiconductor component 110 by the biasing force of the compression coil spring 100. At this time, the pin 104 is inserted into the positioning hole of the semiconductor component 110, and the semiconductor component 110 is accurately positioned and fixed. On the other hand, the first feed claw 42 transfers the preceding semiconductor component 110 to the ejection position 82 (FIG. 11d). Next, the second feed pawl 43, the first feed pawl 42, and the positioning pawl 47 are moved by the pin drive cam 4 again.
The rotating plate 8 rotates in reverse and retreats to a position where there is no interference with the semiconductor component 110 (FIG. 11e).
The slide block 12 is moved backward by the rotation of
The state returns to the state shown in FIG. 11a. And at this time,
The one-rotation stop signal cam 6 operates the proximity switch 71 to stop the motor (not shown) and the drive shaft 3. Thereafter, by repeating the above-described series of operations, the semiconductor component 110 can be reliably transferred and positioned.

As is clear from the above description, according to the present invention, there is no need for special transfer jigs such as carriers, which were conventionally used for transfer, and suction devices used for fixing semiconductor components, and A semiconductor component transfer and positioning device useful for full automation of bonders, etc. can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a front view of a semiconductor component transfer and positioning device which is an embodiment of the present invention, and FIG. 2 is an arrow A in FIG. 1.
3 is a plan view of the device shown in FIG. 1, FIG. 4 is a sectional plan view of the portion shown by arrow B-B in FIG. 2, and FIG. Arrow C in the diagram
- A plan sectional view of the part indicated by C, FIG. 6 is a sectional view of the part indicated by arrow D-D in FIG. 2, FIG. 7 is a sectional view of the part indicated by arrow E-E in FIG. The figure is the first
9 is a detailed view of the feeding claw portion of the device shown in the figure, a is a front sectional view, b is a plan view, c is a side view, and FIG.
A detailed view of the semiconductor component fixing device of the device shown in the figure.
a is a front view, b is a plan view, c is a side sectional view, 10th
Figures a to e are a plan view and a front view for explaining the operation of the device shown in Figure 1, and Figure 11 is a perspective view of a semiconductor component. 40...First sliding body, 43...Second feed claw, 4
2...First feed claw, 46...Second sliding body, 47...
...Positioning claw, 48...Bearing shaft, 49...
Bearing, 50... tension coil spring, 53... stopper member.

Claims (1)

[Claims] 1. In an apparatus in which a supply position, a work position, and a discharge position are sequentially arranged on a straight track, and the semiconductor parts are positioned for transfer from the supply position to the work position, and at the same time, the semiconductor parts are also transferred from the work position to the discharge position. , a first reciprocating motion along the straight running path and swingable in a direction perpendicular to the direction of the reciprocating motion;
A sliding body, a first feeding claw fixed to the front end of the first sliding body, and a second feeding claw fixed to the rear of the feeding claw.
a feeding pawl, a second sliding body that is slidable on a guide path provided at the front part of the first sliding body, a positioning pawl fixed to the front end of the second sliding body, and a second sliding body that moves the second sliding body to the second sliding body. an elastic member that always biases the first sliding body forward; an engaging member provided on the second sliding body; A semiconductor component transfer and positioning device comprising: a stopper member that independently locks a second sliding body with respect to the first sliding body.