JPH0136706B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic wire bonding apparatus for fixing and bonding a sample by vacuum suction.

For example, in the case of a can type or a deal-in-package (DIP) in which the sample is placed on a carrier and transported to the bonding position,
As shown in Publication No. 87336, in order to separate the sample from the carrier, the sample fixing table rises to lift the sample, fixes the sample by vacuum suction, and the tool moves vertically and in the XY direction to attach the wire to the sample. After bonding, the sample fixing table is lowered and the sample is placed on the carrier again.

By the way, since the above method is a thermocompression bonding method,
The sample fixing table may simply be moved up and down, but in the case of the ultrasonic method and the ultrasonic thermocompression bonding method, the sample fixing table must be rotated in addition to the vertical movement. For this reason, it has been difficult to apply the method of bonding by fixing the sample by vacuum suction to the ultrasonic method.

The present invention was made against this background.
An object of the present invention is to provide an ultrasonic wire bonding device that can vertically move and rotate a sample fixing table that fixes a sample by vacuum suction, and that is capable of ultrasonic wire bonding.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.
Fig. 1 is a vertical cross-sectional view showing one embodiment of the present invention;
The figure is a plan view of FIG. 1. Sample 1 is carrier 2
The bonding device is placed on the substrate and transported to the bonding position by a transport means (not shown). A sample fixing table 10 in which a suction hole 10a for adsorbing the sample 1 is formed is arranged below the bonding position.
A buffer member 11 made of a soft material such as a rubber material is adhesively fixed to the upper surface of the holder so that the sample 1 comes into close contact with the sample 1 when the sample is adsorbed. The sample fixing table 10 is fixed to the upper part of a rotating shaft 12, and the rotating shaft 12 is rotatably supported by a main body 13 via a bearing 14. Further, the lower end of the rotating shaft 12 is connected to an output shaft 15a of a motor 15 fixed to the main body 13 via a coupling 16. In addition, a motor 15 is attached to the rotating shaft 12.
Detection plate 1 for determining the timing of one rotation stop of
7 is fixed, and a detector 18 is arranged corresponding to this detection plate 17. The detector 18 is fixed to a holder 19 fixed to the main body 13. Furthermore, a bushing 20 is rotatably inserted into the rotating shaft 12 between the sample fixing table 10 and the detection plate 17, and washers 21 are interposed on the upper and lower surfaces of the bushing 20 to reduce friction of the rotating shaft 12. has been done. Further, a groove 20a for vacuum suction is provided on the inner circumference of the bush 20.
A through hole 12a is provided in the rotating shaft 12 so as to communicate with the rotary shaft 12. The bush 20 also has the groove 2.
A pipe 22 is fixed from the outside so as to communicate with Oa, and the pipe 22 is connected to a vacuum pump (not shown) via a hose 23. The pipe 22 is a U-shaped groove 19a formed in the upper part of the holder 19.
The bushing 20 is fitted into the bushing 20 to prevent it from rotating.

The main body 13 is attached to a frame 31 via a slider 30 so as to be vertically slidable, and the frame 31 is fixed to a base 33 via a sub-base 32. The main body 13 also has an arm 35 to which a cam follower 34 is rotatably attached to one end.
is fixed, and a long escape hole 31a is formed in the frame 31 so that the arm 35 can move up and down. The cam follower 34 is provided so as to be in contact with a vertical cam 37 fixed to a camshaft 36 driven by a motor (not shown). and,
Spring hook 38 provided on main body 13 and frame 3
A tension spring 40 is applied to a spring hook 39 fixed to the upper surface of the main body 13, and the main body 13 is urged upward.
The cam follower 34 is in pressure contact with the vertical cam 37.

Next, the operation of this device having such a configuration will be explained. When the sample 1 is sent to the bonding position by a sample feeding mechanism (not shown), the camshaft 36 rotates, and the lower portion 37a of the vertical cam 37 comes into contact with the cam follower 34. As a result, the main body 13 moves upward with the arm 35 due to the biasing force of the tension spring 40, and the buffer member 11 provided on the upper surface of the sample fixing table 10 comes into contact with the back surface of the sample 1 and lifts it up. The raised position of the sample fixing table 10 where the sample fixing table 10 contacts the sample 1 is detected by a detector (not shown), and the vacuum pressure of the vacuum pump is detected by the hose 23, the pipe 22, the groove 20a, the through hole 12a, and the suction hole 10a.
The sample 1 is adsorbed onto the sample fixing table 10 through the sample fixing table 10.

In this state, the motor 15 is rotated by a timing switch (not shown). The rotation of the output shaft 15a of the motor 15 is transmitted to the sample fixing table 10 via the coupling 16 and the rotating shaft 12. As a result, the two bonding points on the sample 1 are rotated so as to coincide with the ultrasonic oscillation direction, and a tool (not shown) is driven in the XY direction and moved up and down to perform wire bonding on the sample 1. After the bonding is completed, the sample fixing table 10 is lowered by the reverse operation to the above, and the motor 15 is rotated until the detector 18 detects the origin position of the detection plate 17, and the motor 15 returns to the origin.

In this way, the sample fixing table 10 is directly connected to the motor 15 via the rotating shaft 12, and the motor 15 is configured to be movable up and down together with the sample fixing table 10, so that the sample 1 can be vacuum-suctioned by the sample fixing table 10. Wire bonding can be performed using ultrasonic waves.

As is clear from the above description, according to the present invention, ultrasonic wire bonding can be performed with the sample separated from the carrier and fixed by vacuum suction.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention, and FIG. 2 is a plan view of FIG. 1. 1... Sample, 10... Sample fixing table, 12... Rotating shaft,
13...Body, 15...Motor, 20...Button, 2
2...pipe, 23...hose, 30...slider,
35...Arm, 37...Upper and lower cam.

Claims (1)

[Claims] 1. A main body that is movable up and down, a rotating shaft that is rotatably supported by the main body, a sample fixing table that is fixed to the top of the rotating shaft and fixes the sample by vacuum suction, and a sample fixing table that is attached to the main body. An ultrasonic wire bonding apparatus comprising: a motor having an output shaft directly connected to a lower end of the rotating shaft; a vertical movement drive means for vertically moving the main body; and a vacuum means for supplying vacuum pressure to the sample fixing table.