JPS6346150B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Technical Field> The present invention relates to a method for etching a multilayer metal plate, and in particular allows fine etching even when etching a fine pattern.

<Background of the Invention> For example, when manufacturing a hybrid IC of a coil, a multilayer film is produced by depositing a second metal layer made of nichrome on a glass substrate, and then depositing and plating a first metal layer made of gold or copper on top of that. Use a metal plate. Then, a resist film is applied to the first layer metal side of this multilayer film metal plate, a glass plate with a coil pattern drawn is placed on top of the resist film, exposed to light, and developed to form the first layer metal and the resist film. Remove the resist film in areas where the second layer metal is to be etched. Next, this multilayer metal plate is immersed in a solution for etching the first layer metal to etch the first layer metal, and after removing the etching solution for the first layer metal by washing with water, etc., it is dried and the etched state is visually observed. The inspection will be carried out by Then, the second layer metal was immersed in an etching solution and the second layer metal was etched to manufacture a coil hybrid IC.

In this case, the coil pattern spacing is approximately 100μ
Since the pattern is extremely narrow (m), after the first layer metal is etched, it is dried and then visually inspected. This has the disadvantage that the second layer metal is not etched sufficiently because the etching solution is prevented from coming into contact with the second layer metal.

In order to eliminate the above-mentioned drawbacks, spray-type wet etching and ion etching are available, but each method has the disadvantage that the equipment is expensive.

<Objective of the Invention> The present invention enables fine etching of a multilayer metal plate by an inexpensive method.

<Summary of the Invention> The method for etching a multilayer metal plate according to the present invention involves etching the first layer metal, drying it, visually inspecting it, and then using an ultrasonic cleaner to etch the etching layer between the fine patterns of the first layer metal. The second layer metal is etched by removing air.

<Embodiments of the Invention> FIG. 2 shows a hybrid IC of a coil to which the present invention is applied. Figure 2A is its top view,
Figure B is a cross-sectional view. This is manufactured by depositing nichrome 12, which is a second layer metal, on a glass substrate 11, and then depositing and plating gold 13, which is a first layer metal, on top of that, and then etching it.

FIG. 1 shows a flowchart of the manufacturing method. First, glass substrate 11, nichrome 12, gold 1
A resist film is applied to the gold side of the multilayer metal plate consisting of three layers in step 3. Next, a glass plate with a coil pattern drawn thereon is placed, exposed to light, and developed to remove the resist film in the area where the gold and nichrome are to be etched. Next, this plate is immersed in a gold etching solution to perform gold etching. After finishing gold etching, the gold etching solution is removed by washing with water or the like. After that, it is dried and the condition of the gold etching is inspected. The spacing between the patterns is very narrow, approximately 100 μm, so when the pattern is immersed in a nichrome etching solution after drying, the air between the patterns cannot be removed, and the nichrome in those areas is not etched sufficiently. Therefore, the air between the gold patterns is removed by ultrasonic cleaning. Next, immerse it in nichrome etching solution and perform nichrome etching. Finally, after removing the nichrome etching solution by washing with water or the like, the resist film coated on top of the gold is removed to complete the manufacturing process.

After the gold etching was completed, the multilayer metal plate was washed with water, dried and visually inspected, and then immersed in diluted nichrome etching solution and ultrasonically cleaned to remove the air between the patterns. may be performed at the same time.

After completing the gold etching as described above, drying it, and inspecting the etched state of the gold, the air existing between the gold patterns is removed by ultrasonic cleaning, and the nichrome is etched, improving the yield of hybrid ICs. can be done.

<Effects of the Invention> As explained above, the method for etching a multilayer metal plate according to the present invention first etches a multilayer metal plate in which a second layer metal and a first layer metal are sequentially deposited and plated on a substrate. The first layer metal is etched by immersing it in an etching solution for the first layer metal, and after drying and inspecting the etching state, it is ultrasonically cleaned and then immersed in the etching solution for the second layer metal to etch the second layer metal. As a result, the second layer metal can also be etched uniformly, and the yield of hybrid ICs can be improved.

[Brief explanation of drawings]

FIG. 1 is a flowchart showing a method of etching a multilayer metal plate according to the present invention, FIG. 2A is a top view of a hybrid IC of a coil to which the present invention is applied, and FIG. 2B is a sectional view thereof. 11: Glass substrate, 12: Nichrome, 13:
Money.

Claims (1)

[Claims] 1. In a multilayer metal plate in which a second layer metal and a first layer metal are sequentially deposited and plated on a substrate, and a resist film is applied thereon in a shape in which the second layer metal and the first layer metal are to be etched. , the multilayer metal plate is immersed in the etching solution for the first layer metal to etch the first layer metal, dried to inspect the etched state of the first layer metal, and then ultrasonically cleaned, and then A method for etching a multilayer metal plate, characterized in that the second layer metal is etched by immersing the multilayer metal plate in the etching solution for the second metal layer.