JPS6347145B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding tool used in a bonding process for connecting internal elements and external leads with wires in the manufacturing process of semiconductor devices.

Generally, thin aluminum wires are sometimes used to connect internal elements and external leads of semiconductor devices.
Since the bonding tool used at this time (usually called a wedge) uses ultrasonic vibration, it has a shape having a wire passage 2 at its tip, as shown in FIG. 1, for the wire to pass through.

The wire passage 2 has a circular cross-sectional shape as shown in FIG. Further, the diameter of the circular passage is approximately 1.6 to 2 times the diameter of the wire 3 used.

Conventionally, with this type of bonding tool 1, when the bonding tool 1 moves to the second bonding position after the first bonding, a load is applied to the wire 3 used because the diameter of the wire passage 2 is small. There are problems such as wire breakage, damage, and defects in the shape of the bonding wire loop.

On the other hand, in order to solve this problem, the wire passage 2
If the diameter of the bonding tool 1 is increased, a problem arises in that the position of the wire 3 directly under the bonding tool 1 becomes unstable.

An object of the present invention is to provide a bonding tool in which no load is applied to the wire during such bonding, and the position of the wire directly under the bonding tool remains unchanged.

In order to achieve this object, the present invention is characterized in that the wire passage has a non-circular cross-section, for example an elliptical shape, to reduce the load on the wire.

Embodiments of the present invention will be described below based on the drawings.

FIG. 2 shows an embodiment of the present invention, and in the lower part of the bonding tool 1 using ultrasonic vibration, there is a wire passage 2A through which the wire 3 is passed.
It extends from the wire entrance on the right side as seen in the lower left direction to the lower surface of the notch of the bonding tool 1.

In this embodiment, the cross-sectional shape of the wire passage 2A is an ellipse as shown in FIGS. greater than (D>d)
It's summery.

Therefore, according to this embodiment, when the wire 3 is pulled out as the bonding tool 1 moves to the second bonding position after the first bonding, the wire 3 is pulled out because the diameter D in the longitudinal direction of the wire passage 2A is large. Wire 3 without being squeezed
The load on the system is reduced. Further, if the diameter d of one passage is set to a normal level, the position of the wire 3 directly under the bonding tool 1 is also determined, and the conventional problem is solved.

Note that the present invention does not limit the cross section of the wire passage to an ellipse as in the above embodiments. Further, the non-circular cross-sectional portion of the wire passage 2A is not limited, and the non-circular cross-sectional portion may be the entire length of the wire passage 2A, or may extend upward from the bottom side of the bonding tool 1. It may be halfway, or it may be halfway downward from the wire entrance on the upper end side of the wire passage 2A.

Furthermore, the entire length or only a portion of the center line of the wire passage 2A may be a downwardly convex curve.

As described above, according to the present invention, it is possible to significantly reduce the load on the wire, and it is possible to prevent wire breakage, damage, or wire loop shape defects.

[Brief explanation of drawings]

Figure 1 shows the structure of a conventional bonding tool, in which a is a side sectional view of the bonding tool, b is a bottom view, and c is an A-A
FIG. 2 shows an embodiment of the bonding tool according to the present invention; FIG. 2 shows a cross-sectional view of the bonding tool, FIG. FIG. 3 is a diagram showing a cross section of the wire passage taken in the direction of arrow B. FIG. 1... Bonding tool (wedge), 2
A...Wire passage, 3...Wire.

Claims (1)

[Claims] 1. A bonding tool having a wire passage through which a bonding wire is passed, wherein a cross-sectional shape of a part of the wire passage cut in a direction perpendicular to the direction of extension of the wire is non-circular. A bonding tool characterized by: 2. The bonding tool according to claim 1, wherein the longitudinal direction of the non-circular cross section of the wire passage is the same as the tension direction of the wire. 3. The bonding tool according to claim 2, wherein the wire passage has an elliptical cross-sectional shape. 4. The bonding tool according to claim 1, wherein the non-circular cross-sectional portion of the wire passage is from the bottom side of the bonding tool to halfway upward. 5. The bonding tool according to claim 1, wherein the non-circular cross-sectional portion of the wire passage extends halfway down from the wire entrance on the upper end side. 6. The bonding tool according to claim 1, wherein the center line of the wire passage is a downwardly convex curve. 7. The bonding tool according to claim 1, wherein a portion of the center line of the wire passage is a downwardly convex curve.