JPS6364259B2 - - Google Patents
Info
- Publication number
- JPS6364259B2 JPS6364259B2 JP7404682A JP7404682A JPS6364259B2 JP S6364259 B2 JPS6364259 B2 JP S6364259B2 JP 7404682 A JP7404682 A JP 7404682A JP 7404682 A JP7404682 A JP 7404682A JP S6364259 B2 JPS6364259 B2 JP S6364259B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sand
- coated sand
- acid
- unsaturated polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004576 sand Substances 0.000 claims description 62
- 229920006305 unsaturated polyester Polymers 0.000 claims description 20
- 239000011342 resin composition Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 12
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 11
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000000737 periodic effect Effects 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 5
- 150000005846 sugar alcohols Polymers 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000002685 polymerization catalyst Substances 0.000 claims description 4
- 150000007519 polyprotic acids Polymers 0.000 claims description 4
- 150000007513 acids Chemical class 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 67
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 239000005011 phenolic resin Substances 0.000 description 13
- 239000004645 polyester resin Substances 0.000 description 13
- 229920001225 polyester resin Polymers 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 10
- 238000005266 casting Methods 0.000 description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000004641 Diallyl-phthalate Substances 0.000 description 5
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 235000013772 propylene glycol Nutrition 0.000 description 4
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 3
- 239000008116 calcium stearate Substances 0.000 description 3
- 235000013539 calcium stearate Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical class CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- BMFMTNROJASFBW-UHFFFAOYSA-N 2-(furan-2-ylmethylsulfinyl)acetic acid Chemical compound OC(=O)CS(=O)CC1=CC=CO1 BMFMTNROJASFBW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- TURITJIWSQEMDB-UHFFFAOYSA-N 2-methyl-n-[(2-methylprop-2-enoylamino)methyl]prop-2-enamide Chemical compound CC(=C)C(=O)NCNC(=O)C(C)=C TURITJIWSQEMDB-UHFFFAOYSA-N 0.000 description 1
- VTWDKFNVVLAELH-UHFFFAOYSA-N 2-methylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=CC1=O VTWDKFNVVLAELH-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NBICYCZLCAMSBG-UHFFFAOYSA-L [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O NBICYCZLCAMSBG-UHFFFAOYSA-L 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- LIQDVINWFSWENU-UHFFFAOYSA-K aluminum;prop-2-enoate Chemical compound [Al+3].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C LIQDVINWFSWENU-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- OAKHANKSRIPFCE-UHFFFAOYSA-L calcium;2-methylprop-2-enoate Chemical compound [Ca+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O OAKHANKSRIPFCE-UHFFFAOYSA-L 0.000 description 1
- TXTCTCUXLQYGLA-UHFFFAOYSA-L calcium;prop-2-enoate Chemical compound [Ca+2].[O-]C(=O)C=C.[O-]C(=O)C=C TXTCTCUXLQYGLA-UHFFFAOYSA-L 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- -1 hexahydro-4,7-methanoindene (hydroxylated dicyclopentadiene Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012263 liquid product Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000010112 shell-mould casting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- ABMSPIUYLYKRLM-UHFFFAOYSA-N styrene hydrobromide Chemical compound Br.C=CC1=CC=CC=C1 ABMSPIUYLYKRLM-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- XKMZOFXGLBYJLS-UHFFFAOYSA-L zinc;prop-2-enoate Chemical compound [Zn+2].[O-]C(=O)C=C.[O-]C(=O)C=C XKMZOFXGLBYJLS-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/2266—Polyesters; Polycarbonates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mold Materials And Core Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
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The present invention relates to a resin composition for bonding foundry sand grains. Currently, the shell molding method is the mainstream method for manufacturing casting cores and complex molds, and phenolic resin is generally used as the resin for binding sand grains. When the casting temperature is as high as 1300°C to 1400°C, such as in cast iron castings, the disintegration properties of phenol resin coated sand are good, but when the casting temperature is as low as 650°C to 750°C, as in aluminum castings, it is moderate. In the thick part of the inner core, after casting, the phenolic resin hardens due to the heat of the molten metal, increasing its strength, and even in the thin part of the core, when wrapped in molten metal, the core becomes oxygen-free, so benzene rings mainly form. is carbonized and the sand grains or the sand grains and the aluminum alloy casting are bonded together, so the strength hardly decreases and the collapsibility is very poor. Therefore, aluminum alloy castings that use phenol resin coated sand as cores of complex shapes are usually sand-baked at 400â to 500â for 4 to 10 hours before breaking down using a knockout machine. The reality is that they are improving their sexuality. Recently, attention has been drawn to the low thermal decomposition temperature of unsaturated polyester, and polyester resin coated sand, which improves the above-mentioned drawbacks of phenol resin coated sand and uses unsaturated polyester resin as the resin for binding sand grains, has been introduced for use in aluminum alloy casting. (Japanese Unexamined Patent Application Publication No. 1983-80234,
162622, etc.). However, although the current polyester range coated sand can improve the disadvantage of poor disintegration properties of phenol resin coated sand, it also has the disadvantage of poor mold formability compared to phenol resin coated sand. There is. In other words, using a blow-in shell mold making machine.
When filling a mold heated to 280°C to 300°C with resin-coated sand to form a shell core, there was a problem of clogging of the mold making machine magazine and the resulting decrease in filling performance, which made it necessary to replace the existing mold making machine. The practical application of polyester resin coated sand has been delayed because it cannot be used as is. This clogging of the mold making machine magazine is related to the fusion point, which is one of the characteristics required of resin coated sand. Since the temperature of the mold used to form cores and molds is high at 280â to 300â, the temperature of the mold making machine magazine usually rises to about 70â to 90â while continuously molding cores and molds. If the melting point is low, the resin for binding sand grains will melt in the magazine of the mold-making machine, and the sand will become clogged due to adhesion to the magazine or blocking of the resin-coated sand. The problem is that while the commonly used phenol resin coated sand has a melting point of 90 to 115°C, the melting point of the current polyester resin coated sand is as low as 85°C or less. Therefore, in order to improve the mold formability of polyester resin coated sand, the melting point should be set at 90°C, which is the same as that of phenol resin coated sand.
It is necessary to increase this to a higher level. In view of the drawbacks of such polyester resin coated sand, the present inventors have conducted extensive research to develop a polyester resin coated sand with a melting point of 90°C or higher, and as a result, they have found that it is competitive with phenolic resin in terms of melting point and strength. We have now discovered a resin composition for binding wet foundry sand. In the present invention, mono(dihydrodicyclopentadienyl) maleate represented by formula (1) is reacted with a polyhydric alcohol, and if necessary, a saturated polybasic acid and/or an α,β-unsaturated dibasic acid. A self-polymerizable unsaturated polyester polymerization catalyst having a softening point of 50°C or higher obtained by the ring-and-ball method (JIS K2207) and an oxide of a metal belonging to, or group of the periodic table of elements. This invention relates to a resin composition for bonding foundry sand grains. According to the resin composition for bonding foundry sand grains according to the present invention, there is no decrease in strength seen in molds obtained using conventional polyester resin coated sand, and polyester resin coated molds with a melting point of 90°C or higher are produced. Sand can be obtained, and mold forming properties equivalent to those of phenol resin coated sand can be obtained. In the present invention, polyhydric alcohol is added to mono(dihydrodicyclopentadienyl) maleate, and if necessary, saturated polybasic acid and/or α, β
- A self-polymerizable unsaturated polyester obtained by reacting an unsaturated dibasic acid is used. The conventional unsaturated polyester obtained by reacting an acid component containing an α,β-unsaturated dibasic acid with a polyhydric alcohol component has poor self-polymerizability, so it contains only one polyester in the molecule. It has been necessary to use one or more of the above unsaturated monomers or prepolymers having unsaturated bonds. The unsaturated monomers or prepolymers include liquid substances such as styrene, divinylbenzene, vinyltoluene, diallyl phthalate, diallyl phthalate prepolymers,
There are products such as triacrylic formal and triallyl isocyanurate that are solid at room temperature, but when liquid products are used, the softening point of unsaturated polyester resin drops significantly, and when polyester resin coated sand is made, the melting point is lower. The disadvantage is that it is low. Further, if a solid material is used, the effect on the fusion point is relatively small, but it has the disadvantage that it is generally expensive and lacks versatility. On the other hand, the mono(dihydrodicyclopentadienyl)maleate represented by the above formula (1) used in the present invention is added to an alcohol, and if necessary, a saturated polybasic acid and/or an α,β-unsaturated dibasic acid. Unsaturated polyester obtained by reacting with an acid has self-polymerizability, so it does not necessarily contain 1 in the molecule.
There is no need to blend an unsaturated monomer or prepolymer having more than 1 unsaturated bond, and the disadvantages seen in conventional general unsaturated polyester resins are eliminated by blending unsaturated monomers or prepolymers. Improved. In the present invention, in the periodic table of elements,
, or oxides of metals belonging to the group. The melting point of resin-coated sand is naturally influenced by the softening point of the resin used to bind the sand grains. Therefore, in order to increase the melting point of polyester resin coated sand, it is considered to increase the softening point of the unsaturated polyester which is the resin for binding sand grains. However, the softening point of unsaturated polyester is 20°C higher than the softening point determined by the ring and ball method.
Since it has a wide softening temperature range, starting to soften at ~30â lower temperature, in order to raise the melting point of polyester resin coated sand to over 90â, the softening point of unsaturated polyester must be 120â.
In this case, the following problems arise and it is difficult to put it into practical use. 1. A mold formed using resin-coated sand using a resin composition containing an unsaturated polyester with a softening point of 120° C. or higher as the resin for binding sand grains has low strength. 2. In order to raise the softening point of unsaturated polyester to 120°C or higher, it is necessary to increase the degree of condensation.
During synthesis, there is a high probability of gelation and it is difficult to supply it in a stable state. However, by blending oxides of metals belonging to groups , , or groups of the periodic table of elements, it is not necessary to raise the softening point of unsaturated polyester to 120°C or higher, and the fusion point can be improved at the same time without reducing strength. becomes possible. Mono(dihydrodicyclopentadienyl)maleate used in the present invention is, for example, 5- or 6-hydroxy-3a,4,5,6,7,7a-
It can be obtained by a ring-opening esterification reaction between hexahydro-4,7-methanoindene (hydroxylated dicyclopentadiene) and maleic anhydride, an addition reaction between dicyclopentadiene and maleic acid, and the like. This compound is already known and can be produced by a known production method. Note that during these reactions, di(dihydrodicyclopentadienyl) maleate shown in formula (2) may be partially produced, but the presence of this di(dihydrodicyclopentadienyl) maleate is It does not affect the effectiveness of the product in any way. Examples of polyhydric alcohols include propylene glycol, dipropylene glycol, 1,2-propanediol, ethylene glycol, diethylene glycol, 1,3-butanediol, neopentyl glycol, 1,6-hexanediol, hydrogenated bisphenol A, and glycerin. , trimethylolpropane, pentaerythritol, etc. are used,
A monohydric alcohol may be used in combination if necessary. As the α,β-unsaturated dibasic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic acid, chloromaleic acid, etc. are used.
Saturated dibasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, tetrahydrophthalic anhydride, adipic acid, sebacic acid, etc. If necessary, monovalent acids such as benzoic acid may be used in combination. Good too. The unsaturated polyester used in the present invention has a softening point of 50°C or higher as measured by the ring and ball method, but is preferably in the range of 80°C to 110°C. If the softening point is less than 80°C, the amount of metal oxide added will increase, and if it exceeds 110°C, the strength of the mold will tend to decrease. The above-mentioned self-polymerizable unsaturated polyester having a softening point of 50° C. or higher by the ring-and-ball method used in the present invention is produced by blending the above-mentioned materials by a known method. The polymerization catalyst used in the present invention is preferably an organic peroxide, such as dicumyl peroxide, benzoyl peroxide, tertiary butyl perbenzoate, tertiary butyl perbenzoate, cumene hydroperoxide, 1,3
-Bis(tertiarybutylperoxy)-3,
3,5-trimethylcyclohexane, 2,5-dimethyl-(2,5-dibenzoylperoxy)hexane, 2,2-bis-(4,4-di-tertiarybutylperoxycyclohexyl)propane,
2,5-dimethyl-2,5-di(tertiarybutylperoxy)-hexyne-3,n-butyl-
4,4-bis-(tertiarybutylperoxy)
Valerate, lauroyl peroxide, cyclohexanone peroxide, etc. are used. The amount of organic peroxide blended is preferably in the range of 0.5 parts by weight to 20 parts by weight, particularly 1 part by weight to 100 parts by weight of the above unsaturated polyester, in view of the softening properties of the resin.
A range of 10 parts by weight is preferred. These polymerization catalysts may be used alone or in combination of two or more. As metal oxides, in the periodic table of elements,
, or oxides of metals belonging to the group
Especially considering the price and the effect on the melting point of resin coated sand, magnesium oxide,
Zinc oxide and calcium oxide are useful. The amount of the metal oxide added varies depending on the type of metal oxide and the softening point of the unsaturated polyester, but is preferably used within the range of 0.5 parts by weight to 30 parts by weight per 100 parts by weight of the unsaturated polyester.
For example, magnesium oxide is used in a range of 0.5 to 20 parts by weight, and zinc oxide is used in a range of 2 to 20 parts by weight. The metal oxides may be used alone or in combination of two or more. The resin composition for binding foundry sand grains according to the present invention contains a lubricant, a curing accelerator, a polymerization inhibitor, a filler, a silane coupling agent, and one or more polymerizable double bonds in one molecule, as necessary. Unsaturated monomers or prepolymers, etc. may also be included. As the lubricant, calcium stearate, zinc stearate, methylolamide, bisamide, etc. are used. As curing accelerators, naphthenic acid metal salts such as cobalt naphthenate, octene salt metal salts such as cobalt octenoate, amines, etc. are used, and as polymerization inhibitors, hydroquinone, parabenzoquinone, 2,5-diphenyl para Benzoquinone, turpenzoquinone, monotertiary butylhydroquinone, etc. are used. As the filler, calcium carbonate, barium sulfate, aluminum hydroxide, clay, silica, talc, etc. are used. Examples of silane coupling agents include vinyltriethoxysilane, vinyl-tris-(β-methoxyethoxy)silane, γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, vinyl Trichlorosilane or the like is used. Examples of unsaturated monomers or prepolymers having one or more polymerizable double bonds in one molecule include styrene, chlorostyrene, divinylbenzene, diallyl phthalate, diallyl phthalate prepolymer, methyl methacrylate, acrylic acid, Vinyl acetate, acrylamide, phenylmaleimide, maleimide, styrene bromide, triallylisocyanurate, triallylisocyanurate prepolymer, N-methylacrylamide, N,N'-dimethylacrylamide, N-methylmethacrylamide, N,N' -dimethyl methacrylamide, N,
N'-methylenebisacrylamide, N,N'-methylenebismethacrylamide, zinc acrylate,
Calcium acrylate, aluminum acrylate, zinc methacrylate, calcium methacrylate, acrylic acid or methacrylic acid adducts of epoxy resins, and the like are used. When the resin composition for bonding foundry sand grains according to the present invention is actually used, each component may be mixed in advance, or each component may be added and mixed at the time of preparing resin-coated sand. Resin-coated sand is prepared by the semi-hot method, in which sand grains are coated with a resin using a solution of the resin composition dissolved in a suitable solvent, such as acetone, methyl ethyl ketone, toluene, benzene, or xylene, and then the solvent is evaporated and dried. This is done using a solvent-based hot melt method. Examples of the present invention will be described below. Parts are by weight. Example 1 4 moles of mono(dihydrodicyclopentadienyl) maleate, 1 mole of isophthalic acid, 2 moles of glycerin, and 1 mole of propylene glycol were reacted by heating at 200°C in a nitrogen gas stream to obtain a softening point of 90°C and an acid value.
50 self-polymerizable unsaturated polyester (A) was obtained. For 100 parts of this self-polymerizable unsaturated polyester (A), 15 parts of zinc oxide, 2 parts of dicumyl peroxide,
0.24 kg of a resin composition prepared by adding and mixing 1 part of tertiary butyl perbenzoate and 3.5 parts of calcium stearate was mixed with 8 kg of silica sand preheated to 160°C for 5 minutes using a speed mixer manufactured by Enshu Tekko Co., Ltd. NSC-1. A resin coated sand whose surface was uniformly coated with the resin composition was obtained. About this resin coated sand JACT
The fusion point was measured based on the resin-coated sand standard test method of the Casting Technology Promotion Association, and the room temperature bending strength (flexural strength) was measured based on JIS K6910. The results are shown in Table 1. Comparative Example 1 4 mol of maleic anhydride, 1 mol of isophthalic acid,
An unsaturated polyester (B) having a softening point of 90°C and an acid value of 55 was obtained by heating and reacting 2 moles of glycerin and 2.5 moles of propylene glycol at 200°C in a nitrogen gas stream.
To 100 parts of this unsaturated polyester (B), 20 parts of diallyl phthalate, 15 parts of diaphragm oxide, 2 parts of dicumyl peroxide, 1 part of tertiary butyl perbenzoate, and 3.5 parts of calcium stearate were added and mixed. Silica sand preheated to 160â8
By stirring with a speed mixer for 5 minutes with Kg, resin coated sand in which the sand surface was uniformly coated with the resin composition was obtained. The melting point and room temperature bending strength of this resin coated sand were measured in the same manner as in Example 1, and the results are shown in Table 1. Comparative Example 2 A resin coated sand was obtained in the same manner as in Example 1 except that zinc oxide as a metal oxide was removed from the resin composition of Example 1. The melting point and room temperature bending strength of the resin coated sand were measured in the same manner as in Example 1, and the results are shown in Table 1.
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èŠãšããªãã[Table] As is clear from Table 1, the resin coated sand using the resin composition for bonding foundry sand grains according to the present invention has a higher strength than the mold obtained using the conventional polyester resin coated sand. It is possible to obtain a polyester resin-coated sand with a melting point of 90°C or higher without any decrease in temperature, and to provide mold formability equivalent to that of phenol resin-coated sand. Further, the preparation of resin-coated sand using the resin composition for binding foundry sand grains according to the present invention may be the same as when using a phenolic resin composition, and no modification of equipment is required.
Claims (1)
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ç©ã嫿ããŠãªãé³ç©ç ç²çµåçšæš¹èçµæç©ã [Scope of Claims] 1 Mono(dihydrodicyclopentadienyl)maleate represented by formula (1), polyhydric alcohol, and if necessary further saturated polybasic acid and/or α,β-
Self-polymerizable unsaturated polyesters with a softening point of 50°C or higher obtained by the ring-and-ball method obtained by reacting unsaturated dibasic acids, polymerization catalysts, and oxides of metals belonging to groups , , or of the periodic table of elements. A resin composition for binding foundry sand grains, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7404682A JPS58192648A (en) | 1982-04-30 | 1982-04-30 | Resin composition for binding molding sand grains |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7404682A JPS58192648A (en) | 1982-04-30 | 1982-04-30 | Resin composition for binding molding sand grains |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58192648A JPS58192648A (en) | 1983-11-10 |
| JPS6364259B2 true JPS6364259B2 (en) | 1988-12-12 |
Family
ID=13535838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7404682A Granted JPS58192648A (en) | 1982-04-30 | 1982-04-30 | Resin composition for binding molding sand grains |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58192648A (en) |
-
1982
- 1982-04-30 JP JP7404682A patent/JPS58192648A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58192648A (en) | 1983-11-10 |
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