JPS6366901B2 - - Google Patents
Info
- Publication number
- JPS6366901B2 JPS6366901B2 JP61129821A JP12982186A JPS6366901B2 JP S6366901 B2 JPS6366901 B2 JP S6366901B2 JP 61129821 A JP61129821 A JP 61129821A JP 12982186 A JP12982186 A JP 12982186A JP S6366901 B2 JPS6366901 B2 JP S6366901B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- aluminum
- processing equipment
- jig
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
〔概要〕
本発明は薄膜処理設備の表面に付着する薄膜物
質の除去を容易に行うために、まずアルミニウム
を付着させ、この上に付着した積層薄膜のピンホ
ールを通して下地のアルミニウム薄膜をアルカリ
溶液により溶解し、積層薄膜全体を剥離洗浄する
ようにしたものである。[Detailed Description of the Invention] [Summary] In order to facilitate the removal of thin film substances adhering to the surface of thin film processing equipment, the present invention first attaches aluminum, and then passes through pinholes in the laminated thin film attached to the base layer to remove aluminum. The aluminum thin film is dissolved in an alkaline solution, and the entire laminated thin film is peeled off and cleaned.
本発明は薄膜処理に使用する処理設備の表面に
付着した薄膜を容易に除去する方法に関する。
The present invention relates to a method for easily removing a thin film attached to the surface of processing equipment used for thin film processing.
薄膜処理設備には真空蒸着装置、イオンプレー
テイング、スパツタリング装置等が知られてい
る。これらの装置はいずれも真空乃至低圧条件下
で薄膜材料となる金属等の蒸気あるいはイオンを
発生させ、これを処理対象物の表面に凝縮させる
ことにより薄い金属等の被膜を形成させるもので
ある。
Vacuum deposition equipment, ion plating equipment, sputtering equipment, etc. are known as thin film processing equipment. All of these devices generate vapor or ions of metal, etc., which will become a thin film material under vacuum or low pressure conditions, and form a thin film of metal, etc. by condensing the vapor or ions on the surface of the object to be treated.
薄膜の材料としては、例えば二酸化珪素、クロ
ーム、銅、アルミニウム等が用いられるが、処理
対象物に各種の薄膜物質を付着させる際に、処理
対象物以外の処理設備の表面、すなわち治具の外
面および装置の内壁（真空容器の内面等）にも薄
膜物質が付着し、それが原因で薄膜処理設備内の
真空度が低下し、その結果処理対象物の薄膜品質
を低下させる。その対策として付着した積層薄膜
の定期的除去が重要な作業となつている。 For example, silicon dioxide, chromium, copper, aluminum, etc. are used as the material for the thin film, but when attaching various thin film substances to the object to be processed, the surface of the processing equipment other than the object to be processed, that is, the outer surface of the jig. The thin film substance also adheres to the inner wall of the apparatus (such as the inner surface of the vacuum container), which causes the degree of vacuum in the thin film processing equipment to decrease, resulting in a decrease in the quality of the thin film of the object to be processed. As a countermeasure to this problem, periodic removal of the adhered laminated thin film has become an important task.
第２図は従来の除去方法を説明するための要部
断面図である。図において、１は治具または真空
容器等の装置内壁であつて、前記処理設備の表面
を具体的に示し、これらは一体的構成の場合と分
離可能の構成の場合もある。２は前記治具の表面
または真空容器の内壁に付着した多層の薄膜層、
３はサンドペーパ、砥石等を示す。 FIG. 2 is a sectional view of a main part for explaining a conventional removal method. In the figure, reference numeral 1 denotes the inner wall of a device such as a jig or a vacuum container, which specifically indicates the surface of the processing equipment, and these may be of an integral construction or of a separable construction. 2 is a multilayer thin film layer attached to the surface of the jig or the inner wall of the vacuum container;
3 indicates sandpaper, grindstone, etc.
このように治具１の表面および装置内壁１に付
着した薄膜層２はサンドペーパ、砥石等３を用い
て丹念にこすり落としていた。 The thin film layer 2 adhering to the surface of the jig 1 and the inner wall 1 of the apparatus in this manner was carefully scraped off using sandpaper, a grindstone, or the like 3.
上記従来の除去方法によれば、多大の作業時間
が必要であるうえに、治具表面および装置内壁ま
で損傷する欠点がある。
According to the above-mentioned conventional removal method, a large amount of working time is required, and the jig surface and the inner wall of the apparatus are also damaged.
本発明は上記従来の欠点に鑑みて創作されたも
ので、薄膜の除去作業の効率化が可能となる除去
方法の提供を目的とする。 The present invention was created in view of the above-mentioned conventional drawbacks, and an object of the present invention is to provide a removal method that makes it possible to improve the efficiency of thin film removal work.
本発明の薄膜処理設備の付着物除去方法は第１
図に示すように、アルミニウムの薄膜４をあらか
じめ前記治具１の表面および装置内壁１に付着さ
せておき、処理対象物の薄膜処理後に当該治具１
装置内壁１をアルカリ溶液６に浸漬してから洗浄
し、前記アルミニウム薄膜４上に付着した薄膜２
をアルミニウム薄膜４と共に剥離することを特徴
とする。
The method for removing deposits in thin film processing equipment of the present invention is the first method.
As shown in the figure, a thin aluminum film 4 is attached in advance to the surface of the jig 1 and the inner wall 1 of the apparatus, and after the thin film treatment of the object is performed, the jig 1 is
The inner wall 1 of the device is immersed in an alkaline solution 6 and then washed, and the thin film 2 attached to the aluminum thin film 4 is removed.
It is characterized in that it is peeled off together with the aluminum thin film 4.
治具１の表面および装置内壁１にアルミニウム
薄膜４の下地を形成しておけば、その上に付着し
た薄膜層２はアルカリ溶液（例えば温苛性ソーダ
溶液）６に浸漬することにより、薄膜層自体に形
成されたピンホール７を介して当該アルカリ溶液
が下地のアルミニウム薄膜４に浸入してそれを溶
解するため、この後洗浄すればアルミニウム薄膜
と共に付着薄膜層２を剥離することができる。
If a base of the aluminum thin film 4 is formed on the surface of the jig 1 and the inner wall 1 of the device, the thin film layer 2 adhered thereon can be immersed in an alkaline solution (for example, a warm caustic soda solution) 6, so that the thin film layer itself is Since the alkaline solution infiltrates the underlying aluminum thin film 4 and dissolves it through the pinhole 7 formed, the attached thin film layer 2 can be peeled off together with the aluminum thin film by subsequent cleaning.
以下本発明の実施例を図面によつて詳述する。
なお、構成、動作の説明を理解し易くするために
第２図との同一部分には同一符号を付してその重
複説明を省略する。
Embodiments of the present invention will be described in detail below with reference to the drawings.
In order to make the explanation of the configuration and operation easier to understand, the same parts as those in FIG.
第１図は本発明の一実施例による薄膜層除去方
法を説明するための模式的な要部断面図を示す。
図において、４はアルミニウム薄膜であつて治具
１の表面および装置内壁１の使用開始前に形成し
たものである。このアルミニウム薄膜４が形成さ
れた治具、装置１を使用して薄膜処理を行うと、
処理対象物に各種の薄膜物質が付着すると同時
に、当該治具、装置１にあらかじめ形成したアル
ミニウム薄膜４上にも薄膜物質２が付着する。 FIG. 1 shows a schematic cross-sectional view of essential parts for explaining a method for removing a thin film layer according to an embodiment of the present invention.
In the figure, reference numeral 4 denotes an aluminum thin film that is formed on the surface of the jig 1 and the inner wall 1 of the apparatus before it is used. When thin film processing is performed using the jig and apparatus 1 on which this aluminum thin film 4 is formed,
At the same time that various thin film substances adhere to the object to be processed, the thin film substance 2 also adheres to the aluminum thin film 4 previously formed on the jig and apparatus 1.
この付着した薄膜層２の厚み、または薄膜処理
の延べ時間等を基準に除去に必要な洗浄サイクル
を決定し、前記薄膜が付着した治具、装置１を容
器５に満たしたアルカリ溶液（例えば温苛性ソー
ダ溶液）６に浸漬する。すると、薄膜層２自体に
自然形成されたピンホール７を介してアルカリ溶
液６が浸入しアルミニウム薄膜４を溶解する。 The cleaning cycle required for removal is determined based on the thickness of the thin film layer 2 that has adhered or the total time of thin film processing, etc., and the jig and apparatus 1 to which the thin film has adhered are cleaned using an alkaline solution (e.g., warm water) filled in the container 5. Soak in caustic soda solution) 6. Then, the alkaline solution 6 enters through pinholes 7 naturally formed in the thin film layer 2 itself and dissolves the aluminum thin film 4.
この結果、付着した薄膜層２は治具１の表面お
よび装置内壁１から剥離され、次工程の洗浄によ
りアルミニウム薄膜４と同時に除去される。 As a result, the attached thin film layer 2 is peeled off from the surface of the jig 1 and the inner wall 1 of the device, and is removed simultaneously with the aluminum thin film 4 in the next cleaning process.
以上詳細に説明したように本発明の薄膜処理設
備の付着物除去方法によれば、治具の表面および
装置内壁を傷つけることなく、容易に付着した薄
膜層の剥離洗浄が可能となり、薄膜除去作業の効
率化を図ることができる。
As explained in detail above, according to the method for removing deposits from thin film processing equipment of the present invention, it is possible to easily peel off and clean the deposited thin film layer without damaging the surface of the jig or the inner wall of the device, and the thin film removal process can be performed easily. It is possible to improve efficiency.
第１図は本発明の薄膜層除去方法を説明するた
めの模式的な要部断面図、第２図は従来の薄膜層
除去方法の説明図を示す。
図において、１は薄膜処理用の治具および装置
内壁、２は付着薄膜、４はアルミニウム薄膜、５
は容器、６はアルカリ溶液をそれぞれ示す。
FIG. 1 is a schematic cross-sectional view of essential parts for explaining the thin film layer removing method of the present invention, and FIG. 2 is an explanatory diagram of the conventional thin film layer removing method. In the figure, 1 is a jig for thin film processing and the inner wall of the device, 2 is a deposited thin film, 4 is an aluminum thin film, and 5 is an aluminum thin film.
6 indicates a container, and 6 indicates an alkaline solution.
Claims (1)
した薄膜２を除去するための方法であつて、 アルミニウム薄膜４をあらかじめ前記処理設備
の表面１に形成しておき、このアルミニウム薄膜
４が形成された前記処理設備の表面１を薄膜処理
後、アルカリ溶液６に浸漬することにより該アル
ミニウム薄膜４を溶解し、さらに洗滌を行うこと
により前記溶解したアルミニウム薄膜４をそれの
表面に付着した前記薄膜２と共に除去することを
特徴とする薄膜処理設備の付着物除去方法。[Claims] 1. A method for removing a thin film 2 attached to a surface 1 of processing equipment used for thin film processing, which comprises forming an aluminum thin film 4 on the surface 1 of the processing equipment in advance, and After the surface 1 of the processing equipment on which the aluminum thin film 4 has been formed is subjected to the thin film treatment, the aluminum thin film 4 is dissolved by immersing it in an alkaline solution 6, and the melted aluminum thin film 4 is removed from the surface by further washing. A method for removing deposits from thin film processing equipment, characterized in that the deposits are removed along with the thin film 2 deposited on the thin film processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12982186A JPS62287063A (en) | 1986-06-03 | 1986-06-03 | Method for removing matter sticking to thin film treating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12982186A JPS62287063A (en) | 1986-06-03 | 1986-06-03 | Method for removing matter sticking to thin film treating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62287063A JPS62287063A (en) | 1987-12-12 |
| JPS6366901B2 true JPS6366901B2 (en) | 1988-12-22 |
Family
ID=15019054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12982186A Granted JPS62287063A (en) | 1986-06-03 | 1986-06-03 | Method for removing matter sticking to thin film treating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62287063A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004065654A1 (en) * | 2003-01-23 | 2004-08-05 | Ulvac, Inc. | Component for film forming device and method of washing the component |
| JP2007277687A (en) * | 2006-04-11 | 2007-10-25 | Tosoh Corp | Composition for removing sprayed film and removal method using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2511833C (en) | 2003-02-19 | 2012-03-20 | Ulvac, Inc. | Components for a film-forming device and method for cleaning the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55154570A (en) * | 1979-05-18 | 1980-12-02 | Nec Corp | Protecting method for vacuum deposition apparatus mechanism parts |
-
1986
- 1986-06-03 JP JP12982186A patent/JPS62287063A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004065654A1 (en) * | 2003-01-23 | 2004-08-05 | Ulvac, Inc. | Component for film forming device and method of washing the component |
| US7436068B2 (en) | 2003-01-23 | 2008-10-14 | Ulvac, Inc. | Components for film forming device |
| JP2007277687A (en) * | 2006-04-11 | 2007-10-25 | Tosoh Corp | Composition for removing sprayed film and removal method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62287063A (en) | 1987-12-12 |
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