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JPH0139966B2 - - Google Patents
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JPH0139966B2 - - Google Patents

Info

Publication number
JPH0139966B2
JPH0139966B2 JP54501016A JP50101679A JPH0139966B2 JP H0139966 B2 JPH0139966 B2 JP H0139966B2 JP 54501016 A JP54501016 A JP 54501016A JP 50101679 A JP50101679 A JP 50101679A JP H0139966 B2 JPH0139966 B2 JP H0139966B2
Authority
JP
Japan
Prior art keywords
diamond
mold
contact
alloy
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54501016A
Other languages
Japanese (ja)
Other versions
JPS56500371A (en
Inventor
Anatorii Petorobitsuchi Gurigorefu
Sara Kaimofuna Rifushitsu
Paberu Paburobitsuchi Shamaefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INSUCHI GEOROGII YAKUTSUKOGO FUIRIARA ESU OO EE ENU SSSR
Original Assignee
INSUCHI GEOROGII YAKUTSUKOGO FUIRIARA ESU OO EE ENU SSSR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INSUCHI GEOROGII YAKUTSUKOGO FUIRIARA ESU OO EE ENU SSSR filed Critical INSUCHI GEOROGII YAKUTSUKOGO FUIRIARA ESU OO EE ENU SSSR
Publication of JPS56500371A publication Critical patent/JPS56500371A/ja
Publication of JPH0139966B2 publication Critical patent/JPH0139966B2/ja
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/166Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs using heat

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Carbon And Carbon Compounds (AREA)

Description

請求の範囲 1 ダイヤモンドの処理方法であつて、 ダイヤモンドを、ダイヤモンド炭素を溶かす金
属又はそれらの合金で造られる型と接触させ; 該ダイヤモンドとこれと接触した型とを、600
〜1800℃の温度範囲内でかつ該ダイヤモンドと該
型の各々の温度が同一である温度で、 (i)真空下で加熱させ、(ii)不活性ガス雰囲気中で
加熱させ、又は(iii)空気、水素、水蒸気、二酸化炭
素又はそれらの混合物から成る群から選ばれるガ
スであつて、該温度で該ダイヤモンド自体とは反
応しないが、該金属又は合金中に溶解してくるダ
イヤモンド炭素と反応する該ガスの雰囲気中で加
熱させ; これにより、該ダイヤモンドと接触する該型が
それと接触したダイヤモンド炭素を溶解し、該ダ
イヤモンドの外観を変化させることを含んでな
る、前記方法。
Claim 1: A method for treating diamond, comprising: bringing the diamond into contact with a mold made of a metal or an alloy thereof that melts diamond carbon;
(i) heated under vacuum, (ii) heated in an inert gas atmosphere, or (iii) within a temperature range of ~1800°C and at which the respective temperatures of the diamond and the mold are the same. a gas selected from the group consisting of air, hydrogen, water vapor, carbon dioxide, or mixtures thereof, which does not react with the diamond itself at the temperature, but reacts with the diamond carbon dissolved in the metal or alloy; heating in an atmosphere of said gas, whereby said mold in contact with said diamond dissolves diamond carbon in contact therewith and changes the appearance of said diamond.

2 前記型が鉄、ニツケル、コバルト、クロムも
しくは白金、又はそれらの合金から造られてい
る、請求の範囲第1項記載の方法。
2. The method of claim 1, wherein the mold is made of iron, nickel, cobalt, chromium or platinum, or alloys thereof.

技術分野 本発明は、単結晶ダイヤモンド工具および宝石
類の製造において使用できるダイヤモンドの処理
方法に関する。
TECHNICAL FIELD The present invention relates to a method for processing diamond that can be used in the manufacture of single crystal diamond tools and jewelry.

背景技術 高速回転もしくは振動金属工作機械(切削、研
削、中ぐり)の表面にデポジユトされたダイヤモ
ンド粉末によるダイヤモンドの機械的処理方法、
並びにレーザー、電子もしくはイオンビーム(切
削および、主に中ぐり)による処理方法も公知で
ある。高温度での酸素噴射を用いてダイヤモンド
結晶中に孔を形成する方法は公知である(P.N.
Kiseleva、工業用ダイヤモンド(ロシア語)、
M.,Nedra出版社、1964年、24〜55頁;Zh.
Bonrua、ダイヤモンド切削(ロシア語、「産業界
における合成ダイヤモンド」、Kiev,Naukova
Dumka出版社、1974年、60〜65頁)。
BACKGROUND TECHNOLOGY A method for the mechanical treatment of diamond with diamond powder deposited on the surface of a high-speed rotating or vibrating metal machine tool (cutting, grinding, boring);
Processing methods using laser, electron or ion beams (cutting and mainly boring) are also known. Methods of forming pores in diamond crystals using oxygen injection at high temperatures are known (PN
Kiseleva, industrial diamonds (Russian),
M., Nedra Publishers, 1964, pp. 24-55; Zh.
Bonrua, Diamond Cutting (Russian, "Synthetic Diamonds in Industry", Kiev, Naukova
Dumka Publishing House, 1974, pp. 60-65).

ダイヤモンドを、酸素雰囲気600℃で型と接触
させてダイヤモンドを処理する方法も公知であ
る。ダイヤモンドを、酸素中の加熱型と接触させ
て加熱ダイヤモンドの焼失部分により処理する。
It is also known to treat diamond by contacting it with a mold in an oxygen atmosphere at 600°C. The diamond is treated by burning off the heated diamond by contacting it with a heated mold in oxygen.

型は、白金、セラミツク又は酸素雰囲気中所望
温度に加熱するのに耐えるような物質から製造さ
れる(ドイツ特許第1013540号、Cl.67a,21)。
The mold is manufactured from platinum, ceramic or other materials that withstand heating to the desired temperature in an oxygen atmosphere (German Patent No. 1013540, Cl. 67a, 21).

従来方法によれば、ダイヤモンドおよび型は
種々の温度に加熱されるべきでありかつ互いに移
動せられるべきであり、従つてダイヤモンド処理
にあたつて複雑化を招いている。公知の方法によ
る処理中、溶かされるべきダイヤモンドの最も加
熱された部分に加えて、隣接したわずかに低く加
熱された部分の溶解は避けがたく、このことはダ
イヤモンド処理における精度を低下せしめること
となる。
According to conventional methods, the diamond and mold must be heated to different temperatures and moved relative to each other, thus creating complications in diamond processing. During processing according to the known method, in addition to the most heated part of the diamond to be melted, it is inevitable that adjacent slightly less heated parts will melt, which leads to a reduction in precision in diamond processing. .

発明の開示 本発明は、ダイヤモンドの処理方法において、
精度を高めかつより簡易な製造技術を可能にす
る、ダイヤモンドおよび型の接触条件を提供する
ことをその目的とする。
DISCLOSURE OF THE INVENTION The present invention provides a method for treating diamond, comprising:
The objective is to provide diamond and mold contact conditions that increase precision and enable simpler manufacturing techniques.

この目的は、以下の如き方法で達成せられる。 This objective is achieved in the following way.

すなわち、このダイヤモンドの処理方法は、ダ
イヤモンドを、ダイヤモンド炭素を溶かす金属又
はそれらの合金で造られる型と接触させ; 該ダイヤモンドとこれと接触した型とを、600
〜1800℃の温度範囲内でかつ該ダイヤモンドと該
型の各々の温度が同一である温度で、 (i)真空下で加熱させ、(ii)不活性ガス雰囲気中で
加熱させ、又は(iii)空気、水素、水蒸気、二酸化炭
素又はそれらの混合物から成る群から選ばれるガ
スであつて、該温度で該ダイヤモンド自体とは反
応しないが、該金属又は合金中に溶解してくるダ
イヤモンド炭素と反応する該ガスの雰囲気中で加
熱させ; これにより、該ダイヤモンドと接触する該型が
それと接触したダイヤモンド炭素を溶解し、該ダ
イヤモンドの外観を変化させることを含んでな
る。
That is, this diamond processing method involves bringing the diamond into contact with a mold made of a metal or an alloy thereof that melts diamond carbon;
(i) heated under vacuum, (ii) heated in an inert gas atmosphere, or (iii) within a temperature range of ~1800°C and at which the respective temperatures of the diamond and the mold are the same. a gas selected from the group consisting of air, hydrogen, water vapor, carbon dioxide, or mixtures thereof, which does not react with the diamond itself at the temperature, but reacts with the diamond carbon dissolved in the metal or alloy; heating in an atmosphere of the gas, whereby the mold in contact with the diamond melts the diamond carbon in contact with it and changes the appearance of the diamond.

型は、鉄、ニツケル、白金もしくはそれらの合
金から造られるのが好ましい。
Preferably, the mold is made of iron, nickel, platinum or alloys thereof.

ダイヤモンド処理時間を速めるために、接触
が、接触温度においてダイヤモンドとは反応しな
いが、同温度で金属もしくは合金中に溶解するダ
イヤモンド炭素と反応するガス雰囲気中で行なわ
れることが好ましい。
To speed up the diamond processing time, contacting is preferably carried out in a gas atmosphere which does not react with the diamond at the contacting temperature, but which reacts with the diamond carbon dissolved in the metal or alloy at the same temperature.

上記のガスには、水素、水蒸気、炭酸ガス、空
気、酸素もしくはこれらの混合物が含まれる。
The above gases include hydrogen, water vapor, carbon dioxide, air, oxygen, or mixtures thereof.

本発明方法は、ダイヤモンドの処理を実質的に
簡易化しかつダイヤモンド中に孔、通路、および
複雑な溝を形成することを可能にし、更にマイク
ロカツターの如き複雑な形状の製品の製造を可能
にする。更に、本発明は、レリーフ像の形成並び
にダイヤモンド表面の艶消を可能にする。本発明
方法の他の特徴は、型がダイヤモンド処理工程に
おいて実質的に摩耗しないことであり、更に多く
のダイヤモンド処理に対し単一の型が使用できる
ことである。
The method of the invention substantially simplifies the processing of diamond and makes it possible to form holes, passages and complex grooves in the diamond, and also allows the production of products with complex shapes such as micro-cutters. do. Furthermore, the invention allows the formation of relief images as well as the matting of diamond surfaces. Another feature of the method of the invention is that the mold is substantially free of wear during the diamond treatment process, and that a single mold can be used for multiple diamond treatments.

発明を実施するための最良の形態 製品の最終形状に応じて、ダイヤモンド処理方
法が多くの方法で実施できる。例えば、平らな表
面もしくはレリーフ像を有するダイヤモンドを得
るために、ダイヤモンドを大きな型(ダイヤモン
ド径に比較して)と接触させる。接触は不活性雰
囲気中もしくは真空中で行なわれる。型は、鉄も
しくは鉄をベースにした合金の如く、炭素を可能
な限り溶解し得る金属もしくは合金にて造られ
る。処理温度は、金属もしくは炭素との合金の共
融点近くで選ばれる。型が鉄で造られる場合、ダ
イヤモンドは1100℃の温度で接触する。と言うの
は、鉄―炭素の共融点が1147℃であるからであ
る。
DETAILED DESCRIPTION OF THE INVENTION Depending on the final shape of the product, the diamond processing method can be implemented in many ways. For example, the diamond is brought into contact with a large mold (compared to the diameter of the diamond) in order to obtain a diamond with a flat surface or relief image. Contacting takes place in an inert atmosphere or under vacuum. The mold is made of a metal or alloy that can dissolve as much carbon as possible, such as iron or iron-based alloys. The treatment temperature is chosen close to the eutectic point of the metal or alloy with carbon. If the mold is made of iron, the diamond contacts at a temperature of 1100℃. This is because the eutectic point of iron and carbon is 1147°C.

艶消像を得るため、又はダイヤモンド表面の艶
消を行うため、型はペーストの形で又はスパツタ
リングによりダイヤモンド表面に適用される金属
もしくは合金の薄層から成るのが好ましい。ダイ
ヤモンドは、600ないし1100℃で型と接触するの
が好ましい。プロセスは、接触温度でダイヤモン
ドとは反応しないが、該温度で金属又は合金中に
溶解した炭素と反応するガス雰囲気中で行なわれ
る。600℃未満の温度でダイヤモンドを型と接触
させるのは不都合である。と言うのは、600℃未
満ではダイヤモンドの金属の型に対する溶解速度
が遅いからであり、一方1100℃を超える温度では
ダイヤモンド表面は余りに深くエツチングされる
からである。かかる適用において、型が白金、ニ
ツケル、鉄およびクロムから造られるのが好まし
い。最も好ましい材料は白金である。何故なら、
白金は、酸化雰囲気中、酸化物皮膜で被覆される
ことなくかつ他の金属に比較して低温度(例えば
600℃)でダイヤモンド炭素を溶かし始めるから
である。高温度で、ガスによるダイヤモンドの直
接エツチングを避けるため、酸素圧は好ましくは
低下せられるか、又はダイヤモンドと徐々に反応
するガスが用いられる(ガスは、ダイヤモンドと
の反応速度を減少させる順序で選ばれる:O2
空気―CO2―H2O―H2)。
In order to obtain a matte image or to make the diamond surface matte, the mold preferably consists of a thin layer of metal or alloy applied to the diamond surface in the form of a paste or by sputtering. Preferably, the diamond contacts the mold at a temperature of 600 to 1100°C. The process is carried out in a gas atmosphere which does not react with the diamond at the contact temperature, but which reacts with the carbon dissolved in the metal or alloy at that temperature. It is disadvantageous to contact the diamond with the mold at temperatures below 600°C. This is because below 600°C the dissolution rate of the diamond into the metal mold is slow, while at temperatures above 1100°C the diamond surface is etched too deeply. In such applications, it is preferred that the mold is made of platinum, nickel, iron and chromium. The most preferred material is platinum. Because,
Platinum can be used in an oxidizing atmosphere without being coated with an oxide film and at lower temperatures than other metals (e.g.
This is because diamond carbon begins to melt at 600℃). At high temperatures, to avoid direct etching of the diamond by the gas, the oxygen pressure is preferably reduced or gases that react slowly with the diamond are used (the gases are chosen in an order that reduces the rate of reaction with the diamond). Becomes: O 2 -
Air - CO 2 - H 2 O - H 2 ).

複雑な工具、マイクロカツターもしくはダイヤ
モンド中に孔を造る際ダイヤモンドの厚い層(ダ
イヤモンドの径に匹敵する)を除去するため、ダ
イヤモンドを、接触温度でダイヤモンドとは反応
せず複雑な材料中に溶解したダイヤモンド炭素と
反応するガスの雰囲気中1100ないし1800℃の温度
で接触させるのが好ましい。1100℃未満の接触
は、処理プロセスが余りに長く不都合であり、更
に1800℃を超える場合ダイヤモンドの黒鉛化が開
始する。1100ないし1300℃では、Fe、Co、Niも
しくはそれらの合金、並びに該金属とMnおよび
Crとの合金から製造される型を用いるのが好ま
しい。1300℃を超える温度では、型は白金もしく
は白金基合金から造られる。1100℃ないし1800℃
の温度で、反応速度を増加させるために一定量の
水蒸気が加えられている水素の雰囲気中で接触さ
せるのが好ましい。
In order to remove a thick layer of diamond (comparable to the diameter of the diamond) when creating holes in complex tools, micro-cutters or diamonds, the diamond does not react with the diamond at the contact temperature but melts into the complex material. The contact is preferably carried out at a temperature of 1100 to 1800° C. in an atmosphere of a reacting gas with the diamond carbon. Contact below 1100°C is disadvantageous as the treatment process is too long, and above 1800°C graphitization of the diamond begins. At 1100 to 1300°C, Fe, Co, Ni or their alloys, and the metals and Mn and
Preferably, a mold made of an alloy with Cr is used. At temperatures above 1300°C, molds are made from platinum or platinum-based alloys. 1100℃ to 1800℃
The contacting is preferably carried out at a temperature of 100 ml, in an atmosphere of hydrogen with an amount of water vapor added to increase the reaction rate.

全ての適用において、処理終了後、ダイヤモン
ドを、ダイヤモンドに付着している型の金属もし
くは合金から洗浄するか、又は処理表面上の黒鉛
薄膜から洗浄する。洗浄は、体積比で3:1の濃
塩酸および硝酸の煮沸混合物中に該ダイヤモンド
を置き、引き続き室温下K2Cr2O7で飽和した煮沸
濃硫酸中に浸漬することによつて行なわれる。
In all applications, after treatment is completed, the diamond is cleaned from the type of metal or alloy attached to it, or from a thin graphite film on the treated surface. Cleaning is carried out by placing the diamond in a boiling mixture of concentrated hydrochloric acid and nitric acid in a 3:1 volume ratio followed by immersion in boiling concentrated sulfuric acid saturated with K 2 Cr 2 O 7 at room temperature.

本発明を、以下の実施例により更に説明する。 The invention is further illustrated by the following examples.

実施例 1 ダイヤモンドを処理するための型は、約0.1mm
の深さに彫刻模様を有する2mm厚の鉄板であつ
た。ダイヤモンドを該模様の最高部に載置した。
ダイヤモンドを10-2Torrの真空下1100℃で3時
間型と接触させた。ダイヤモンドと型との接触
後、模様の鏡像が、彫刻の深さに対応する高さの
レリーフを有するダイヤモンド切り子面上に得ら
れた。
Example 1 The mold for processing diamonds is approximately 0.1 mm.
It was a 2mm thick iron plate with a carved pattern at the depth of . A diamond was placed on top of the pattern.
The diamond was contacted with the mold for 3 hours at 1100° C. under a vacuum of 10 −2 Torr. After contact of the diamond with the mold, a mirror image of the pattern was obtained on the diamond facet with a relief of height corresponding to the depth of the engraving.

実施例 2 接触をアルゴン媒体中で行う他は実施例1に述
べたと同様にプロセスを行つた。
Example 2 The process was carried out as described in Example 1, except that the contact was carried out in an argon medium.

実施例 3 ダイヤモンドの(100)切り子面を、機械的処
理によつて得た。カロホニーおよびH2PlCl6の同
重量混合物のアルコール性溶液で該切り子面に塗
布し模様像を形成した。上述の如く該面上に形成
された模様を有するダイヤモンドを、空気中600
℃に加熱した。温度が600℃に達する前に、混合
物は分解し、ダイヤモンド表面上に微細に分散し
た白金層を型として残した。ダイヤモンドを、空
気雰囲気中600℃で5時間、型と接触させた後、
模様の微細な艶消像がダイヤモンドの表面に現出
した。
Example 3 A (100) facet of diamond was obtained by mechanical treatment. An alcoholic solution of an equal weight mixture of calohony and H 2 PlCl 6 was applied to the facets to form a pattern image. A diamond with a pattern formed on its surface as described above was exposed to air for 600 minutes.
heated to ℃. Before the temperature reached 600°C, the mixture decomposed, leaving a finely dispersed platinum layer as a mold on the diamond surface. After the diamond was in contact with the mold for 5 hours at 600°C in an air atmosphere,
A fine matte image of the pattern appeared on the surface of the diamond.

実施例 4 微細に分散した白金層から造られた模様をした
型を、同様の方法(実施例3)でダイヤモンドの
(111)切り子面に形成したダイヤモンドを、95容
量%のCO2および5容量%のH2からなるガス雰
囲気中で型と1時間接触せしめると、実施例3に
おけるよりもはるかに鮮明な模様の像がダイヤモ
ンド上に現われた。
Example 4 A mold with a pattern made from a finely dispersed platinum layer was formed on the (111) facets of a diamond in a similar manner (Example 3) . After 1 hour of contact with the mold in a gas atmosphere consisting of % H2 , a much sharper image of the pattern appeared on the diamond than in Example 3.

実施例 5 約10mgのダイヤモンド結晶上に、Ni86重量%
およびFe14重量%からなる合金で造られた直径
0.15mmのワイヤー形状の型を載置した。ワイヤー
の両端を、重力下で低下し得るニツケル輪に結び
つけた。ダイヤモンドおよびワイヤーを有する輪
を内径10mmのコランダム管内に装入した。管を電
気炉で加熱し次いで乾燥水素流を大気圧で0.5/
hの速度で通過させた。ダイヤモンド内に0.64mm
の深さの溝が、1250℃で13.5時間内に形成した。
平均切り取り速度は0.05mm/hであつた。
Example 5 86% Ni by weight on approximately 10 mg of diamond crystals
Diameter made of an alloy consisting of and Fe14% by weight
A 0.15 mm wire-shaped mold was placed. Both ends of the wire were tied to a nickel loop that could be lowered under gravity. A ring with diamonds and wire was placed in a corundum tube with an inner diameter of 10 mm. The tube was heated in an electric furnace and then a stream of dry hydrogen was added at atmospheric pressure to
It passed at a speed of h. 0.64mm inside the diamond
grooves of depth were formed within 13.5 hours at 1250°C.
The average cutting speed was 0.05 mm/h.

実施例 6 0.85mm厚の三角形のプレート状の圧縮された双
晶ダイヤモンド上に、1.5mm辺および0.1mm厚を有
する等辺三角形状の型を載置した。型は実施例5
で用いた合金で造られた。ダイヤモンドを、乾燥
水素流中、型と1200℃で45時間接触させた。接触
後、型と同じ大きさの均一な内壁を有する三角形
の貫通孔が、ダイヤモンド内に形成された。処理
速度は0.02mm/hであつた。
Example 6 An equilateral triangular mold with 1.5 mm sides and 0.1 mm thickness was placed on a 0.85 mm thick triangular plate of compressed twinned diamond. The mold is Example 5
It was made from the alloy used in The diamond was contacted with the mold at 1200° C. for 45 hours in a stream of dry hydrogen. After contact, a triangular through-hole with a uniform inner wall of the same size as the mold was formed in the diamond. The processing speed was 0.02 mm/h.

実施例 7 三角形状プレート状の圧縮された双晶ダイヤモ
ンド上に、外径2.7mmの14個の歯を有する歯車に
対応した形で孔を有する0.1mm厚の六面体形状の
型を載置した。型は、実施例5で用いた合金にて
製造した。1200℃の乾燥水素流に29時間曝露後、
型は、該型内の孔に相当する、形状および大きさ
の歯車をダイヤモンドから形成するため、ダイヤ
モンドに0.4mmの深さで入り込んだ。処理速度は、
0.014mm/hであつた。
Example 7 A hexahedral mold with a thickness of 0.1 mm and a hole corresponding to a gear having 14 teeth with an outer diameter of 2.7 mm was placed on a compressed twinned diamond in the shape of a triangular plate. The mold was manufactured from the alloy used in Example 5. After 29 hours of exposure to a dry hydrogen stream at 1200°C,
The mold was penetrated into the diamond to a depth of 0.4 mm in order to form from the diamond a gear of a shape and size corresponding to the hole in the mold. The processing speed is
It was 0.014mm/h.

実施例 8 正方形のニツケルプレートの形状にある1×1
×0.5mmの大きさの型を、ダイヤモンド結晶上に
載置した。ダイヤモンドを、露点+25℃(H2O
蒸気圧24Torr)の水素流中1230℃で50分間型と
接触させた。型はダイヤモンド結晶の0.27mmの深
さに侵入した。その結果処理速度は、0.3mm/h
であつた。
Example 8 1×1 in the shape of a square nickel plate
A mold with a size of ×0.5 mm was placed on the diamond crystal. The diamond was heated to a dew point of +25°C (H 2 O
The mold was contacted for 50 minutes at 1230° C. in a hydrogen stream at a vapor pressure of 24 Torr. The mold penetrated the diamond crystal to a depth of 0.27 mm. As a result, the processing speed is 0.3mm/h
It was hot.

実施例 9 ニツケル90重量%およびCr10重量%からなる
合金からなる大きさ1×1×0.05mmの型を、ダイ
ヤモンド結晶上に載置した。ダイヤモンドを、露
点+10℃(H2O蒸気圧9Torr)の水素流中1250℃
で3時間接触させた。接触後、0.9mm深さの四方
空間がダイヤモンド内に形成した。処理速度は
0.3mm/hであつた。
Example 9 A mold made of an alloy consisting of 90% by weight of Nickel and 10% by weight of Cr and having a size of 1×1×0.05 mm was placed on a diamond crystal. Diamonds were heated at 1250°C in a hydrogen stream with a dew point of +10°C (H 2 O vapor pressure 9 Torr).
for 3 hours. After contact, a 0.9 mm deep square space was formed within the diamond. The processing speed is
It was 0.3mm/h.

実施例 10 大きさ1×1×0.05mmの正方形白金板形状の型
板を、ダイヤモンド結晶上に載置した。ダイヤモ
ンドを、乾燥水素流中で1600℃下30分間型と接触
させた。接触後、深さ0.05mmの正方形の空間が
0.1mm/hの処理速度をもつて、ダイヤモンド内
に形成された。
Example 10 A template in the shape of a square platinum plate with dimensions of 1 x 1 x 0.05 mm was placed on a diamond crystal. The diamond was contacted with the mold for 30 minutes at 1600° C. in a stream of dry hydrogen. After contact, a square space with a depth of 0.05mm is created.
It was formed in diamond at a processing speed of 0.1 mm/h.

産業上の利用可能性 ダイヤモンドの処理方法は、晶結晶ダイヤモン
ド工具類および宝石の製造において使用できる。
Industrial Applicability The diamond processing method can be used in the production of crystalline diamond tooling and jewelry.

JP54501016A 1979-04-13 1979-04-13 Expired JPH0139966B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SU1979/000018 WO1980002247A1 (en) 1979-04-13 1979-04-13 Method of processing diamonds

Publications (2)

Publication Number Publication Date
JPS56500371A JPS56500371A (en) 1981-03-26
JPH0139966B2 true JPH0139966B2 (en) 1989-08-24

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ID=21616519

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JP (1) JPH0139966B2 (en)
DE (1) DE2953636C2 (en)
GB (1) GB2061904B (en)
WO (1) WO1980002247A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197375B1 (en) * 1992-01-17 2001-03-06 Lucent Technologies Inc. Method comprising removal of material from a diamond film
US5486263A (en) * 1992-07-02 1996-01-23 At&T Bell Laboratories Etching a diamond body with a molten or partially molten metal
EP0618043A1 (en) * 1993-03-29 1994-10-05 AT&T Corp. Article comprising polycrystalline diamond, and method of shaping the diamond
RU2189896C1 (en) * 2001-01-03 2002-09-27 Калининградский государственный технический университет Semiprecious-stone cabochon treatment device
JP7088194B2 (en) * 2017-08-15 2022-06-21 住友電気工業株式会社 Solid carbon-containing material processed product, its manufacturing method and its manufacturing equipment
US11629104B2 (en) 2017-08-15 2023-04-18 Sumitomo Electric Industries, Ltd. Body obtained by processing solid carbon-containing material and producing method thereof
DE102019203928A1 (en) * 2019-03-22 2020-09-24 Robert Bosch Gmbh Process for structuring a diamond substrate and diamond substrate
JP7478335B2 (en) * 2020-05-28 2024-05-07 国立大学法人金沢大学 How diamonds are processed

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1013540B (en) * 1956-02-14 1957-08-08 Dr Otto Fritsch Method and device for working diamonds

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU51148A1 (en) * 1936-08-01 1936-11-30 А.А. Валов Diamond polishing method
SU119096A1 (en) * 1957-12-02 1958-11-30 А.В. Моргунов The method of processing jewelry and haberdashery products from alloys of precious and non-ferrous metals

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1013540B (en) * 1956-02-14 1957-08-08 Dr Otto Fritsch Method and device for working diamonds

Also Published As

Publication number Publication date
WO1980002247A1 (en) 1980-10-30
GB2061904B (en) 1983-03-30
JPS56500371A (en) 1981-03-26
GB2061904A (en) 1981-05-20
DE2953636C2 (en) 1985-03-21
DE2953636T1 (en) 1982-01-28

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