JPH0145229B2 - - Google Patents
Info
- Publication number
- JPH0145229B2 JPH0145229B2 JP59037926A JP3792684A JPH0145229B2 JP H0145229 B2 JPH0145229 B2 JP H0145229B2 JP 59037926 A JP59037926 A JP 59037926A JP 3792684 A JP3792684 A JP 3792684A JP H0145229 B2 JPH0145229 B2 JP H0145229B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- glass
- jig
- side wall
- support rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0444—Apparatus for wiring semiconductor or solid-state device
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明はガラス端子接合用治具、例えばアンプ
パツケージのガラス端子接合（はんだ付け）を迅
速かつ正確に行うことのできる治具に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a jig for bonding glass terminals, for example, a jig that can quickly and accurately bond (solder) glass terminals of an amplifier package.
(2) 技術の背景
第１図に符号１で示されるパツケージ１内には
所定の数の半導体素子が収納されている。図にお
いて、１ａは入力端子を示し、それの反対側には
図示しない出力端子が配置されている。２はガラ
ス端子を示し、それによつて気密封止されたパツ
ケージ内の素子と外部電源が接続される。パツケ
ージはステンレスまたは銅で作られ、その内部は
気密に保たれている。かかるパツケージの製作技
術は十分に確定されたものである。(2) Background of the Technology A predetermined number of semiconductor elements are housed in a package 1 indicated by the reference numeral 1 in FIG. In the figure, 1a indicates an input terminal, and an output terminal (not shown) is arranged on the opposite side. Reference numeral 2 indicates a glass terminal, through which the element in the hermetically sealed package is connected to an external power source. The package is made of stainless steel or copper, and its interior is kept airtight. The technology for making such packages is well established.
(3) 従来技術と問題点
従来のアンプパツケージのガラス端子接合用に
は特にこれといつた治具は用いられることなく、
アンプパツケージにガラス端子をセツテイングす
る際に、ガラス端子が脱落しないように下からセ
ラミツク板などで支持するか、または内側に穴の
あいた錘が用いられる。いずれにしてもセツテイ
ングのために時間がかかり、またはんだ付け等で
端子を接合する際に端子が動いてしまい、後でガ
ラス端子の傾きを調整しなくてはならないという
欠点がある。(3) Prior art and problems A jig such as this was not used for bonding the glass terminals of conventional amplifier packages.
When setting the glass terminal on the amplifier package, the glass terminal is supported from below with a ceramic plate or the like, or a weight with a hole inside is used to prevent the glass terminal from falling off. In any case, there are disadvantages in that it takes time to set up, and the terminals move when they are joined by soldering or the like, and the inclination of the glass terminal must be adjusted later.
なお前記の方法においても、ガラス端子を水平
に保持することのみが考慮され、ガラス端子をパ
ツケージの側壁に向けて水平方向に押し付けるこ
と（このことはガラス端子のはんだ付けのために
は重要なことである）についてはなんら工夫がな
されていなかつた。 Note that in the above method, only holding the glass terminal horizontally is taken into account, and pushing the glass terminal horizontally toward the side wall of the package (this is important for soldering glass terminals) ), no efforts were made for this.
(4) 発明の目的
本発明は上記従来の問題に鑑み、アンプパツケ
ージのようなパツケージにガラス端子をはんだ付
け等により接合する際に、正確な位置に接合で
き、かつ十分な気密性が保たれた状態で接合でき
る治具を提供するものである。(4) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention provides a method for bonding a glass terminal to a package such as an amplifier package by soldering or the like, while being able to bond it at an accurate position and maintaining sufficient airtightness. This provides a jig that can be joined in a fixed state.
(5) 発明の構成
そしてこの目的は本発明によれば、断面Ｕ字型
の治具本体側壁にばね力が加えられた支持棒を配
置し、治具本体の底に固定されたパツケージに装
着されたガラス端子を前記支持棒によつてパツケ
ージの側壁に押圧し、かかる状態でガラス端子を
パツケージ側壁にはんだ付けする構成としたこと
を特徴とするガラス端子接合用治具を提供するこ
とによつて達成される。(5) Structure of the Invention According to the present invention, a support rod to which a spring force is applied is arranged on the side wall of a jig body having a U-shaped cross section, and is attached to a package cage fixed to the bottom of the jig body. By providing a jig for bonding glass terminals, the glass terminal is pressed against the side wall of the package by the support rod, and the glass terminal is soldered to the side wall of the package in this state. It will be achieved.
(6) 発明の実施例 以下本発明実施例を図面によつて詳説する。(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.
本発明は、ガラス端子をばねにより力をかけな
がらアンプパツケージにセツトすることにより、
接合部のギヤツプを狭く保ち、はんだが毛細管現
象により細部にまで入るようにして、正確な位置
にガラス端子をはんだ付けすることを可能にする
治具を提供するものである。 In the present invention, by setting the glass terminal in the amplifier package while applying force with a spring,
To provide a jig that makes it possible to solder a glass terminal at an accurate position by keeping the gap at the joint narrow and allowing the solder to penetrate into the fine details by capillary action.
第１図に本発明の治具が斜視図で示され、また
第２図はガラス端子の１つと治具の支持棒の１つ
の配置を示す拡大断面図である。 FIG. 1 shows a jig of the invention in a perspective view, and FIG. 2 is an enlarged sectional view showing the arrangement of one of the glass terminals and one of the support rods of the jig.
第１図と第２図を参照して説明する。断面Ｕ字
型の治具本体３に形成した凹部３ａ内に配置され
たアンプパツケージ１の所定の位置にガラス端子
２を挿入し、そのガラス端子を治具本体３の側壁
３ｂ内に保持された支持棒５で支え、ばね４で動
かないように押える。ばね４は支持棒５のガラス
端子に面する側と反対の側と側壁３ａとの間に支
持棒ピン５ａを囲む如くに配置される。ガラス端
子２は第２図から理解される如くパツケージ１の
側壁にはんだ付けされる外殻部２ａと接続用ピン
２ｂとからなり、ピン２ｂと外殻部２ａとの間に
は絶縁用のガラスが封入されている。 This will be explained with reference to FIGS. 1 and 2. A glass terminal 2 is inserted into a predetermined position of an amplifier package 1 placed in a recess 3a formed in a jig main body 3 having a U-shaped cross section, and the glass terminal is held within a side wall 3b of the jig main body 3. It is supported by a support rod 5 and held down by a spring 4 so that it does not move. The spring 4 is arranged between the side of the support rod 5 opposite to the side facing the glass terminal and the side wall 3a so as to surround the support rod pin 5a. As can be understood from FIG. 2, the glass terminal 2 consists of an outer shell part 2a soldered to the side wall of the package 1 and a connecting pin 2b, and an insulating glass is inserted between the pin 2b and the outer shell part 2a. is included.
前記した状態で治具全体をはんだの融点190℃
以上の温度例えば210℃に加熱し、アンプパツケ
ージ１にガラス端子２をはんだ付けにより接合す
る。そのためには図示の如く糸はんだ６を外殻部
２ａの外縁のところに接触させる。ばねにより、
接合部の隙間が小さくなるため、はんだは毛細管
現象により容易に外殻部２ａとパツケージ１の側
壁の間の図に砂地で示す細部にまで流れ、十分な
気密性が保たれた状態になる。 In the above state, the entire jig is heated to the solder melting point of 190℃.
It is heated to the above temperature, for example, 210° C., and the glass terminal 2 is joined to the amplifier package 1 by soldering. To do this, a solder wire 6 is brought into contact with the outer edge of the outer shell 2a as shown in the figure. Due to the spring,
Since the gap between the joints becomes smaller, the solder easily flows by capillary action to the area between the outer shell 2a and the side wall of the package 1, shown as a sandy area in the figure, and a sufficient airtightness is maintained.
はんだ付け終了後、治具を図示しない冷却板の
上において150℃まで冷却し、はんだを固化させ
る。その後、取手７を水平方向に引つ張ることに
より支持棒をガラス端子から離し、アンプパツケ
ージを取り出す。 After soldering, the jig is cooled to 150°C on a cooling plate (not shown) to solidify the solder. Thereafter, the support rod is separated from the glass terminal by pulling the handle 7 horizontally, and the amplifier package is taken out.
このようにして製作したアンプパツケージは
10-10atm.c.c.／secの気密性を有することが確認さ
れた。 The amplifier package cage made in this way is
It was confirmed that the airtightness was 10 -10 atm.cc/sec.
支持棒５のピン２ｂと接触する端部にはピン２
ｂの中心ぎめのため凹み５ｂを形成するとピンの
位置ぎめが正確になされる効果がある。 A pin 2 is attached to the end of the support rod 5 that contacts the pin 2b.
Forming the recess 5b for the centering of the pin has the effect of accurately positioning the pin.
(7) 発明の効果
以上詳細に説明した如く本発明によれば、ガラ
ス端子がアンプパツケージに正確に取り付けられ
るので、はんだ付け終了後にガラス端子の位置を
調整する必要はなく、気密性が確実にとられるよ
うになるため信頼性が向上する。また、作業が行
いやすいため、作業工程、作業時間を短縮でき
る。(7) Effects of the Invention As explained in detail above, according to the present invention, the glass terminals are accurately attached to the amplifier package, so there is no need to adjust the position of the glass terminals after soldering, and airtightness is ensured. reliability is improved. In addition, since the work is easy to perform, the work process and work time can be shortened.
なお以上の説明はアンプパツケージを例に説明
したが、本発明の適用範囲はその場合に限られる
ものでなく、その他のパツケージにガラス端子を
はんだ付けする場合にも及ぶものである。また支
持棒をピンとの係合から外す場合、取手以外の手
段を用いてもよい。また治具本体の凹部３ａに代
えて他のアンプパツケージ固定手段を設けてもよ
い。 Although the above explanation has been made using an amplifier package as an example, the scope of application of the present invention is not limited to this case, but also extends to cases where glass terminals are soldered to other packages. Further, when the support rod is disengaged from the pin, means other than the handle may be used. Further, other amplifier package fixing means may be provided in place of the recess 3a of the jig main body.
第１図はアンプパツケージと本発明の治具の外
観を示す斜視図、第２図は第１図のガラス端子と
治具の支持棒の拡大断面図である。
１……アンプパツケージ、２……ガラス端子、
２ａ……外殻部、２ｂ……ピン、３……治具本
体、３ａ……凹部、３ｂ……側壁、４……ばね、
５……支持棒、５ａ……支持棒ピン、５ｂ……凹
み、６……糸はんだ、７……取手。
FIG. 1 is a perspective view showing the external appearance of an amplifier package and a jig of the present invention, and FIG. 2 is an enlarged sectional view of the glass terminal and support rod of the jig shown in FIG. 1. 1...Amplifier package cage, 2...Glass terminal,
2a...outer shell part, 2b...pin, 3...jig body, 3a...recess, 3b...side wall, 4...spring,
5... Support rod, 5a... Support rod pin, 5b... Recess, 6... Solder thread, 7... Handle.
Claims (1)
れた支持棒を配置し、治具本体の底に固定された
パツケージに装着されたガラス端子を前記支持棒
によつてパツケージの側壁に押圧し、かかる状態
でガラス端子をパツケージ側壁にはんだ付けする
構成としたことを特徴とするガラス端子接合用治
具。1 A support rod with a spring applied to it is placed on the side wall of a jig body with a U-shaped cross section, and a glass terminal attached to a package cage fixed to the bottom of the jig body is attached to the side wall of the package by the support rod. A jig for bonding glass terminals, characterized in that the glass terminals are pressed and soldered to the side wall of the package in such a state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59037926A JPS60182754A (en) | 1984-02-29 | 1984-02-29 | Jig for glass terminal junction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59037926A JPS60182754A (en) | 1984-02-29 | 1984-02-29 | Jig for glass terminal junction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60182754A JPS60182754A (en) | 1985-09-18 |
| JPH0145229B2 true JPH0145229B2 (en) | 1989-10-03 |
Family
ID=12511152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59037926A Granted JPS60182754A (en) | 1984-02-29 | 1984-02-29 | Jig for glass terminal junction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60182754A (en) |
-
1984
- 1984-02-29 JP JP59037926A patent/JPS60182754A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60182754A (en) | 1985-09-18 |
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