JPH021225B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus for a crystal oscillator, and more particularly, to a vacuum evaporation apparatus for a quartz crystal oscillator that can simultaneously evaporate multiple layers of metal onto a large number of crystal pieces.

Generally, a crystal resonator 1 has a crystal piece 2 cut out at a predetermined angle, and chromium is coated on both sides of the crystal piece 2, as shown in FIG.
A metal material such as gold, silver, or aluminum is suitably selected and deposited in multiple layers such as two or three layers to form excitation electrodes 3, 3 (one not shown) and terminals 4, 4.
After forming the crystal piece 2 between the holding members 7, 7 connected to the lead-out terminals 6, 6 implanted in the base 5, the holding members 7, 7 and the terminals 4, 4 are made conductive. The vibration energy of the crystal piece 2 is transferred to the terminal 44, the holding members 7, 7, and the lead-out terminals 6, 6.
It is taken out to the outside via.

By the way, the excitation electrodes 3, 3 provided on the crystal piece 2 described above are generally provided in multiple layers, such as 2 to 3 layers, and moreover, a large number of crystal pieces 2 are housed in the same vacuum deposition chamber, and excitation electrodes 3, 3 are provided on the crystal piece 2 at the same time. This is to provide the basic plating that will become the electrode.

For this reason, in the case of a conventional basic vapor deposition process, for example, two-layer basic vapor deposition, two vapor deposition sources are used in the vacuum vapor deposition chamber.
For example, a chromium vapor deposition source and a gold vapor deposition source are provided, and first,
A chromium deposition source is evaporated to deposit chromium on the surfaces of a large number of crystal blanks 2, and then a gold deposition source is evaporated,
Gold vapor deposition was performed on the chromium vapor deposition of each crystal piece 2.

However, in the basic evaporation process, when a plurality of evaporation sources are provided in the vacuum evaporation chamber, the distances from each evaporation source to each crystal piece 2 are not equal, so that the basic evaporation on the crystal piece 2 is uneven. occurs,
It has been difficult to obtain a crystal resonator with good characteristics.

The frequency of the crystal resonator 1 described above is determined by the shape and size of the crystal blank 2 or the quality and quantity of the excitation electrodes 3, 3 and terminals 4, 4, but the thickness of the crystal blank 2 must be determined accurately. Because it is difficult to cut out a crystal piece 2 of a predetermined shape, simply depositing a predetermined amount of a predetermined substance (chromium, gold, silver, aluminum) in a vacuum evaporation device on a crystal piece 2 of a predetermined shape will not produce a predetermined accurate frequency f ₀ It is difficult to obtain a crystal oscillator that vibrates at 100°C, and therefore, the conventional crystal oscillator 1 is made by first forming two or three layers of excitation electrodes 3, 3 on the crystal blank 2 in a vacuum evaporation apparatus. After the vapor deposition, the holding member 7,
7, and the crystal resonator 1 is placed in trays 8, 8' for storage as shown in FIG. 2 or 3.
After that, by the method described below, a small amount of the substance is continuously deposited on the excitation electrodes 3 and 3 of the crystal piece 2 in several steps. The point where the changing frequency f ₁ becomes equal to the predetermined frequency f ₀ is determined, and the vapor deposition is stopped to obtain the crystal resonator 1 having the reference frequency f ₀ .

In addition, in the third illustration, the crystal resonators 1 are stored in a tray 8' via individual storage stands 9.

When adjusting the frequency, tray 8,
Terminal insertion portions 11, 11 provided on turntables 10, 10' in a vacuum deposition chamber (not shown) for adjusting the frequency of the crystal oscillators 1 on 8' one by one, or storage holes 11 in storage stand 9. ', then the turntables 10, 10' are rotated intermittently, and a minute amount of a substance such as chromium, gold, silver, aluminum, etc. is applied from the evaporation sources 12, 12' to the excitation electrode 3 of the facing crystal resonator 1. Then, the vapor deposition is performed in several steps until the frequency f ₁ of the crystal oscillator 1 reaches the reference frequency f ₀ . The reason why the evaporation is performed in several steps is to prevent the reference frequency f ₀ from being exceeded in the middle of the evaporation if it is performed at one time.Generally, the second evaporation is performed at an even finer frequency than the first one. A small amount is deposited, and an even smaller amount is deposited the third time, and the reference frequency f ₀ is often reached during the third deposition.

In addition, whether or not the reference frequency f ₀ has been reached can be determined by connecting the lead-out terminals 6, 6 of the crystal resonator 1 to be adjusted to an oscillation circuit (not shown) and oscillating it, separately from the signal from the oscillation circuit. It is sufficient to detect the zero beat with respect to the signal from the oscillator that oscillates the reference frequency f ₀ .

After the adjustment, the vacuum state in the vacuum deposition chamber is released, and the crystal resonator 1 is stored in the trays 8 and 8' again.
Again, from other trays 8, 8', other crystal units 1
, and perform the same work.

By the way, the above-mentioned conventional crystal resonator is first stored and taken out in a vacuum deposition chamber in order to deposit the excitation electrodes 3, 3 on the crystal piece 2, and then returned to the vacuum deposition chamber (in the same or another vacuum chamber) for frequency adjustment. The process is complicated because the crystal resonators stored in the trays 8, 8' must be taken out one by one, and the turntables 10, 10' inside the vacuum deposition chamber must be taken out one by one. After installation and adjustment,
Since it is to be stored in trays 8 and 8' again,
There were disadvantages such as poor working efficiency, the crystal resonator 1 being moved in and out a lot, and the crystal piece 2 being damaged during the movement.

In view of the above points, the present invention provides a rotary table in a vacuum evaporation chamber, and a plurality of evaporation sources are stacked on the rotary table. By placing it in the same position with respect to the crystal piece, uneven vapor deposition on the crystal piece is prevented,
The purpose is to provide high-performance crystal units.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. FIG. 7 is a front view showing the state in which the crystal piece 2 is attached to the base 5. As shown in FIG. As is clear from the figure, in this state, the excitation electrodes 3, 3 and terminals 4, 4 are not provided on both surfaces of the crystal piece 2, and are merely temporarily fixed to the holding members 7, 7. In the figure, 20 is a mask, which is fitted onto the base 5, and holes 21, 21 are provided on the front and back surfaces of the mask to allow vapor deposition. Note that 6 and 6 are lead-out terminals. Note that this state is referred to as a sample. FIG. 8 is a partially sectional side view of the vacuum deposition chamber 22. 23 is a surface plate of the vacuum deposition chamber 22, and a plurality of support columns 24 are provided on the surface plate 23. The support columns 24 are provided with stepped portions 24a, 24b, for positioning the upper and lower plates, which will be described later. Reference numeral 26 denotes an upper plate, which corresponds to the stepped portion 24 of the support column 24...
b..., and is attached to the support column 24 by nuts 25.... 27 is a motor held at the lower center of the upper plate 26, 28 is a rotating shaft of the motor 27,
Reference numeral 29 denotes a transmission shaft attached to the rotating shaft 28. The transmission shaft 29 has a large diameter portion 29a and a narrow diameter portion 29b, and the tip of the narrow diameter portion 29b is provided with a screw portion so as to be able to engage with the nut 30. be. 31 is the transmission shaft 2
The first deposit shielding plate 31 is attached to the narrow diameter portion 29b of No. 9, and the deposit shielding plate 31 has a mounting hole 31 in the center thereof, as is particularly clear from the plan view shown in FIG.
Holes 32a to 3 for allowing vapor deposition are provided at equal distances from the mounting hole 31a and at equal intervals.
A plurality of 2fs (six in the example) are provided,
Furthermore, an adjustment hole 33 for frequency adjustment is provided between the holes 32a and 32f. Note that the adjustment hole 33 is also provided at a position equidistant from the attachment hole 31a. 34 is a locking piece provided on the deposit shielding plate 31. Reference numeral 35 designates a second deposit shielding plate, and as is particularly clear from the plan view shown in FIG. are provided, and holes 32a to 3 provided in the first vapor deposit shielding plate 31
Although holes 36a to 36f are provided at positions corresponding to 2f, a hole corresponding to adjustment hole 33 is not provided.
The first vapor deposit shielding plate 31 is connected to the transmission shaft 2.
9, and the second vapor deposit shielding plate 35 is attached to the transmission shaft 29 in a non-rotatable manner. Coil spring 3 to 29b
7, and then insert the first deposit shielding plate 31. At this time, since the attachment hole 31a has a larger diameter than the narrow diameter portion 29b, it is loosely fitted. Next, a friction plate 38 made of felt or the like is inserted, and then the second deposit shielding plate 35 is inserted into the narrow diameter portion 2.
9b and engage the nut 30, the first
Since the deposit shielding plate 31 is moderately pressed against the second deposit shielding plate 35 via the friction plate 38 due to the elasticity of the coil spring 37, the first deposit shielding plate 31 is not subjected to torque above a certain level. It can rotate with the rotation of the transmission shaft 29 without idling unless the transmission shaft 29 rotates idly. Reference numeral 39 denotes a sample (crystal piece 2, etc.) mounting member provided at the lower part of the upper plate 26, and the sample mounting member 39 has a cylindrical shape, as is particularly clear from the plan view shown in Figure 11, and is used for the second vapor deposition. Attachment parts 40a to 40f, the number of which is equivalent to the number of holes 36a to 36f provided in the object shielding plate 35, are provided at equal intervals and with their tips inclined downward. And the mounting parts 40a to 4
The sample shown in FIG. 7 above is attached to 0f. The details are explained using Fig. 12.
As shown in the figure, the mounting portion 40a is provided with a lead-out terminal insertion hole 41a, and when the lead-out terminals 6, 6 of the sample are inserted into the insertion hole 41a, the lead-out terminals 6, 6 are inserted into the hole provided in the mounting portion 40a. Insertion hole 41a from 42a
The detection piece 43 extending inward comes into contact with the lead-out terminals 6, 6. Reference numeral 44 denotes a lower plate, and the lower plate 44 is positioned and fixed above the step portion 24a of the support column 24. 45 is a motor provided on the surface plate 23, and the rotating shaft 45a of the motor 45 is connected to the hole 44a of the lower plate 44.
It protrudes further upwards, and a rotary table 46 is attached to its tip. In addition, the rotary table 46
The center of rotation of the transmission shaft 29 is located eccentrically from the center of rotation of the transmission shaft 29. As shown in FIGS. 8 and 13, a plurality of saucers 47 and 48 (two types in the embodiment) are stacked on the rotary table 46 to serve as evaporation sources. When the receiving plate 47 or 48 is positioned at a predetermined position by rotating the receiving plate 47 or 48, the position is positioned directly below the transmission shaft 29 as shown in FIG. Therefore, as shown by the dashed line in FIG. 8, the incident angle α for each sample (crystal piece 2) is at an equal angle from the transmission axis, that is, the saucer containing the metal to be deposited is at an equal angle for each sample. This is something that will be localized to a certain position. The saucers 47 and 48 are made of tungsten, molybdenum, etc., and one saucer 47 contains chromium 49 as a metal material, and the other saucer 48 contains gold 50. Therefore, two layers of chromium 49 and gold 50 are deposited on the surface of the crystal blank 2 in this embodiment. 51 is an electrode, and the electrode 51 is provided to be movable up and down, and when the rotary table 46 rotates and is oriented at a predetermined position,
It rises, energizes a predetermined saucer, and evaporates the metal, such as chromium 49, in the saucer. 52 is a solenoid plunger for raising or lowering the electrode 51;
The electrode 51 is moved up and down by the reciprocating movement of a plunger 53 provided at 2. That is, a cam surface 53a is provided at the tip of the plunger 53, and the cam surface 53a presses the pin 51a provided on the electrode 51. 54 is the first vapor deposit shielding plate 31
A movable member that engages with a locking piece 34 provided on the lower plate 44 to rotate the first deposit shielding plate 31 against the elasticity of the coil spring 37.
It is movable by a solenoid plunger 55 provided on the lower surface. In addition, 56... is the detection piece 4
This is the lead wire connected to 3. 57 is a removable cover.

Next, to explain the operation of the present invention, first, the cover 57 is removed, the sample is attached to the attachment parts 40a to 40f of the sample attachment member 39, and the metal for evaporation is placed on the saucers 47 and 48 on the rotary table 46. A hole 32a is formed in the first vapor deposit shielding plate 31 by storing chromium 49 and gold 50 in respective trays 47 and 48 and moving the movable member 54.
32f correspond to the holes 36a to 36f provided in the second vapor deposit shielding plate 35 as shown in FIG. 14, and the motor 27 is slightly rotated.
Each of the holes 32a to 32f is positioned at a position corresponding to the sample attached to the attachment parts 40a to 40f. In addition, the rotary table 46 is also rotated so that the chrome 49
The tray 47 containing the evaporation chamber is set so as to be positioned directly below the transmission shaft 29, and then the cover 57 is placed on the chamber to evacuate the inside of the vacuum evaporation chamber. and,
By operating the solenoid plunger 52, the electrode 5
1 is raised and the saucer 47 is energized, chromium 4
9 evaporates, holes 32a to 32f (36a to 36f)
Each sample (each crystal piece 2) is simultaneously metal-deposited (chromium-deposited) through the hole 21 of the mask 20 provided in each sample. When the specified amount of chromium deposition is completed,
The solenoid plunger 52 is operated again to lower the electrode 51. Then, the motor 45 is rotated, the table 46 is rotated half a turn, this time the saucer 48 containing the gold 50 is set so as to be positioned directly below the transmission shaft 29, and the electrode 51 is raised again.
When the saucer 48 is energized, the gold 50 in the saucer 48 evaporates, and more gold is deposited on the chromium deposit of each sample. After this entire vapor deposition is completed, although not particularly shown, the mounting parts 40a to 40f are rotated by half a turn, or the vacuum state is once released, and the cover 57
Remove the sample, rotate the sample half a turn, attach it, put the cover 57 on again to create a vacuum state, turn the rotary table 46 half a turn again, and place the saucer 47 containing the chromium 49 directly under the transmission shaft 29 again. By setting it in a fixed position and performing chromium vapor deposition as described above, then gold vapor deposition by turning the rotary table 46 half a turn, the basic vapor deposition of each housed sample is simultaneously completed to become the excitation electrodes 3, 3. do. The saucers 47 and 48 containing the metal to be evaporated are always positioned directly below the transmission shaft 29 so that the evaporation source (the saucer) and each sample are at the same position. It is possible to prevent uneven deposition when metal is deposited on a layer.

Next, frequency adjustment after basic vapor deposition on both sides of the sample (crystal blank 2) will be explained. First, when the basic plating is completed, the movable member 54 is moved by the solenoid plunger 55, and the first deposit shielding plate 31 is slightly rotated against the elasticity of the coil spring 37. Adjustment hole 33 provided
As shown in FIG.
This corresponds to one of the holes provided in, for example, 36f. Therefore, the other holes 3 provided in the second vapor deposit shielding plate 35
6a to 36e are closed by the first vapor deposit shielding plate 31, and the holes 32a to 32f provided in the first vapor deposit shielding plate 31 are closed by the second vapor deposit shielding plate 3.
5, it becomes a closed state. Therefore, only the adjustment holes 33 and 36f are opened in both the deposit shielding plates 31 and 35, and the adjustment holes 33 are opened one after another.
The frequency is adjusted according to each sample.

That is, first, the adjustment hole 33 is made to correspond to the sample attached to the attachment part 40f, and then the rotary table 46
The saucer 48 containing 50 pieces of gold is energized, and 50 pieces of gold are collected.
When a small amount of gold is evaporated, the gold passes through the adjustment hole 33 and the hole 21 of the mask 20 and is deposited on the base deposition layer (excitation electrode). At this time, the excitation electrode of the crystal piece 2 is led out from the holding members 7, 7 and the lead-out terminals 6, 6 via the detection piece 43 to a lead wire 56, and the lead wire 56 is connected to an oscillation circuit (not shown). Using the signal from the oscillation circuit and a separate signal from an oscillator that oscillates the reference frequency f ₀ , fine adjustments are made several times as in the conventional example, and the zero beat is detected to complete the adjustment of one sample. let After completing the adjustment of one sample, rotate the motor 27 by a predetermined amount, and
Rotating the two vapor deposition shielding plates 31 and 35 at the same time,
The adjustment hole 33 is made to correspond to the next sample, and the same adjustment as described above is performed. Then, by rotating the motor 27 approximately once, frequency adjustment for all samples is completed. After finishing, release the vacuum state and close the cover 57.
When the crystal blank 2 is removed and each sample is removed, a crystal piece 2 with excitation electrodes 3 and frequency adjustment completed will be created.

In addition, six holes 32a to 32f, 36a to 36f are provided in both the deposit shielding plates 31 and 35, and
The sample mounting member 39 has six mounting parts 40a to 40.
f is provided, but the number is not necessarily limited to six, and the number is arbitrary in terms of design.

In addition, two saucers 4 are placed on the rotary table 46.
Although 7 and 48 layers are stacked, it is not necessarily limited to two, but by stacking 3, 4 to 10 types, it is possible to deposit 2 to 10 layers or more.

Further, the adjustment hole 33 is connected to the first vapor deposit shielding plate 31.
However, on the contrary, it may be provided on the second vapor deposit shielding plate 35.

As described above in detail, according to the present invention, the rotary table 46 provided in the vacuum deposition chamber 22
Multiple types of metals are stacked on top at predetermined intervals, and by rotating the rotary table, the evaporation sources (saucers 47, 48) of the metals to be evaporated are always placed at the same position with respect to each crystal piece. Since the crystal element 2 can be localized, the basic vapor deposition on the crystal piece 2 does not cause uneven vapor deposition, and a crystal resonator with good characteristics can be obtained.

[Brief explanation of drawings]

Figure 1 is a front view of the crystal resonator 1, Figures 2 to 6
The figure shows a conventional example of frequency adjustment, Figure 2 shows the first tray 8, Figure A is a front view, Figure B is a side view,
Figure 3 shows the second tray 8', Figure A is a front view;
Figure B is a side view, Figure 4 is a front view of the adjustment device, Figure 5 is a front view of the adjustment device,
The figure is a plan view of the same, FIG. 6 is a plan view of an adjusting device of other shapes, and FIGS. 7 to 15 show embodiments of the present invention.
Figure 7 is a front view of the sample, Figure 8 is the vacuum deposition chamber 22.
FIG. 9 is a partially sectional side view of the first vapor deposit shielding plate 3.
1, and FIG. 10 is a plan view of the second vapor deposit shielding plate 35.
11 is a plan view of the sample attachment member 39, FIG. 12 is a partially sectional side view showing a state in which a sample is attached to the attachment part 40a, FIG. 13 is a plan view of the rotary table 46, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the basic plating state, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the frequency adjustment state. DESCRIPTION OF SYMBOLS 1...Crystal resonator, 2...Crystal piece, 3, 3...Excitation electrode, 22...Vacuum deposition chamber, 31...Deposit shielding plate, 3
2a to 32f...hole, 33...adjustment hole, 35...evaporation shielding plate, 36a to 36f...hole, 39...sample mounting member, 40a to 40f...attachment part, 46...rotary table, 47, 48...receptacle (evaporation source).

Claims (1)

[Claims] 1. In a vacuum evaporation apparatus for a crystal resonator, in which a plurality of types of metals are sequentially vacuum-deposited on the surface of a plurality of crystal pieces at the same time to form a basic vapor deposition layer that becomes an excitation electrode on the surface of the crystal piece, the plurality of types of metals are metals are piled up at predetermined intervals on a rotary table, and by rotating the rotary table, the metal to be deposited can always be positioned at the same position with respect to each crystal piece. Vacuum deposition equipment for crystal oscillators.