JPH021226B2 - - Google Patents
Info
- Publication number
- JPH021226B2 JPH021226B2 JP5405081A JP5405081A JPH021226B2 JP H021226 B2 JPH021226 B2 JP H021226B2 JP 5405081 A JP5405081 A JP 5405081A JP 5405081 A JP5405081 A JP 5405081A JP H021226 B2 JPH021226 B2 JP H021226B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- vapor deposition
- shielding plate
- frequency
- crystal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
本発明は水晶振動子の真空蒸着装置、特に、複
数個の水晶片に同時に励振電極を設け、次いで、
1つ1つの水晶片に順次周波数調整を可能とした
真空蒸着装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus for a crystal resonator, in particular, to provide excitation electrodes on a plurality of crystal pieces at the same time, and then
The present invention relates to a vacuum evaporation device that allows frequency adjustment to be performed sequentially on each crystal piece.
一般に水晶振動子1は第1図に示すように所定
の角度に切り出した水晶片2の両面にクロム、
金、銀、アルミニユーム等の金属物質を真空蒸着
により2層、3層等の複数層に蒸着して、励振電
極3,3(一方は図示せず)および端子4,4を
形成し、この水晶片2を基台5に植設した導出端
子6,6と接続された保持部材7,7に挾持させ
た後、保持部材7,7と端子4,4とを導電性の
接着剤により接着し、水晶片2の振動エネルギー
を端子4,4、保持部材7,7、導出端子6,6
を介して外部へ取出すものである。 Generally, a crystal resonator 1 has a crystal piece 2 cut out at a predetermined angle, and chromium is coated on both sides of the crystal piece 2, as shown in FIG.
Excitation electrodes 3, 3 (one not shown) and terminals 4, 4 are formed by vacuum-depositing a metal material such as gold, silver, or aluminum into multiple layers such as two or three layers. After the piece 2 is held between the holding members 7, 7 connected to the lead-out terminals 6, 6 planted on the base 5, the holding members 7, 7 and the terminals 4, 4 are bonded with a conductive adhesive. , the vibration energy of the crystal piece 2 is transferred to the terminals 4, 4, the holding members 7, 7, and the lead-out terminals 6, 6.
It is taken out to the outside through.
ところで、前記した水晶振動子1の振動周波数
は水晶片2の厚み、大きさあるいは励振電極3,
3、端子4,4の質、量により決定するものであ
るが、水晶片2の厚みを正確に切り出すことが困
難なことから単に所定形状の水晶片2に、所定の
物質(クロム、金、銀、アルミニユーム)を所定
量、真空蒸着装置内で蒸着しただけでは予め定め
られた正確な周波数0にて振動する水晶振動子を
得ることは困難なことであり、そのため、従来の
水晶振動子1は、一旦水晶片2に真空蒸着装置内
で励振電極3,3を2層ないし3層等に蒸着した
後、真空蒸着装置より取出し、前記したように保
持部材7,7に挾持させ、該水晶振動子1を第2
図あるいは第3図に示すように保管の都合上トレ
ー8,8′にその複数個(10〜15個)を収納し、
その後、以下に説明する方法により、水晶片2の
励振電極3,3上に更に微少量の物質を数回に分
けて蒸着し続け、蒸着より変化していく周波数1
があらかじめ定められた周波数0と等しくなる点
を求め、その蒸着を停止し、基準周波数0を備え
た水晶振動子1を得るものである。 By the way, the vibration frequency of the crystal resonator 1 described above depends on the thickness and size of the crystal piece 2 or the excitation electrode 3,
3. This is determined by the quality and quantity of the terminals 4, 4, but since it is difficult to accurately cut out the thickness of the crystal piece 2, the crystal piece 2 of a predetermined shape is simply coated with a predetermined material (chromium, gold, gold, etc.). It is difficult to obtain a crystal resonator that vibrates at a predetermined accurate frequency of 0 simply by depositing a predetermined amount of silver, aluminum) in a vacuum evaporation device. After the excitation electrodes 3, 3 are vapor-deposited in two or three layers on the crystal piece 2 in a vacuum evaporation apparatus, the crystal piece 2 is taken out from the vacuum evaporation apparatus, held between the holding members 7, 7 as described above, and the crystal piece 2 is Transducer 1 to 2nd
As shown in the figure or FIG.
Thereafter, by the method described below, a minute amount of material is continued to be deposited on the excitation electrodes 3, 3 of the crystal piece 2 in several steps, and the frequency 1 changes as the deposition progresses.
The point at which is equal to a predetermined frequency of 0 is determined, and the vapor deposition is stopped to obtain a crystal resonator 1 having a reference frequency of 0 .
なお、第3図示では水晶振動子1が個々の収納
台9を介してトレー8′に収納されている。 In addition, in the third illustration, the crystal resonators 1 are stored in a tray 8' via individual storage stands 9.
そして、周波数を調整する場合、トレー8,
8′上の水晶振動子1を1つづつ周波数を調整す
るため真空蒸着室(図示せず)内のターンテーブ
ル10,10′に設けた端子挿入部11,11あ
るいは収納台9の収納孔11′に入れ替え、その
後、ターンテーブル10,10′を間欠的に回転
し、蒸発源12,12′よりクロム、金、銀、ア
ルミニユーム等の物質を微少量、対向する水晶振
動子1の励振電極3上に蒸着し、その水晶振動子
1の周波数1が基準周波数0になるまで、数回に
分けて蒸着を行うものである。数回に分けて蒸着
を行うのは1度に蒸着を行うと、その途中で基準
周波数0を越えてしまうのを防止するためで、一
般には2回目の蒸着は前記第1回目よりさらに微
少量で、また、3回目はさらに微少量の蒸着を行
うもので、この3回目の蒸着中にに基準周波数0
に到達するものが多いものである。 When adjusting the frequency, tray 8,
Terminal insertion portions 11, 11 provided on turntables 10, 10' in a vacuum deposition chamber (not shown) or storage holes 11 of storage stand 9 are used to adjust the frequency of crystal oscillators 1 on 8' one by one. ', then the turntables 10, 10' are rotated intermittently, and a minute amount of a substance such as chromium, gold, silver, aluminum, etc. is applied from the evaporation sources 12, 12' to the excitation electrode 3 of the facing crystal resonator 1. Then, the vapor deposition is carried out in several steps until the frequency 1 of the crystal oscillator 1 becomes the reference frequency 0 . The reason why the evaporation is carried out in several parts is to prevent the reference frequency from exceeding 0 in the middle of the evaporation if the evaporation is carried out at once.In general, the second evaporation is performed in an even smaller amount than the first one. In addition, the third time is to perform a further minute amount of deposition, and during this third deposition, the reference frequency is set to 0.
Many of them reach this point.
また、基準周波数0に到達したか否かは調整し
ようとする水晶振動子1の導出端子6,6を発振
回路(図示せず)に接続して発振させ、該発振回
路からの信号と別に基準周波数0で発振する発振
器からの信号とのゼロビートを検出させればよい
ものである。 Also, to determine whether the reference frequency 0 has been reached, connect the lead-out terminals 6, 6 of the crystal resonator 1 to be adjusted to an oscillation circuit (not shown) and oscillate it, and separate the reference frequency from the signal from the oscillation circuit. It is sufficient to detect a zero beat with a signal from an oscillator that oscillates at a frequency of 0 .
そして、調整後、真空蒸着室の真空状態を解除
し、水晶振動子1を再びトレー8,8′に収納し、
再び、他のトレー8,8′から他の水晶振動子1
を取出し、同様の作業を行うものである。 After the adjustment, the vacuum state in the vacuum deposition chamber is released, and the crystal resonator 1 is stored in the trays 8 and 8' again.
Again, from other trays 8, 8', other crystal units 1
, and perform the same work.
ところで、前記した従来の水晶振動子は、真空
蒸着内に先ず、水晶片2に励振電極3,3を蒸着
するため収納および取出し、また、周波数調整の
ため再び真空蒸着室(同一もしくは他の真空蒸着
室)内に収納し、取出す必要があるため、その工
程が複雑で、また、トレー8,8′に収納された
水晶振動子を1つづつ取出し、真空蒸着室内のタ
ーンテーブル10,10′に装着し、調整後、再
びトレー8,8′に収納するものであるため、作
業能率が悪く、水晶振動子1の出入が多く、その
途中で水晶片2が破損してしまう等の欠点があつ
た。 By the way, the conventional crystal oscillator described above is first stored and taken out in a vacuum evaporation chamber in order to evaporate the excitation electrodes 3, 3 onto the crystal piece 2, and then returned to the vacuum evaporation chamber (in the same or another vacuum chamber) for frequency adjustment. The process is complicated because the crystal resonators stored in the trays 8, 8' must be taken out one by one, and the turntables 10, 10' inside the vacuum deposition chamber must be taken out one by one. Since it is installed in the tray 8, 8' after adjustment, the work efficiency is poor and the crystal unit 1 is moved in and out frequently, resulting in damage to the crystal piece 2 in the process. It was hot.
本発明は叙上の点に鑑み、同一の真空蒸着室内
に複数個の水晶片を収納し、各水晶片に同時に励
振電極用の基礎蒸着を施すと共に、次いで、その
真空状態を保つたまま、順次1つ1つの周波数調
整を行うことにより前記欠点を解消し、作業能率
の向上および水晶片の破損がないものを提供する
ことを目的とする。 In view of the above points, the present invention stores a plurality of crystal pieces in the same vacuum evaporation chamber, simultaneously applies basic vapor deposition for excitation electrodes to each crystal piece, and then, while maintaining the vacuum state, It is an object of the present invention to eliminate the above-mentioned drawbacks by sequentially adjusting the frequencies one by one, and to provide an apparatus that improves work efficiency and does not cause damage to the crystal piece.
以下、本発明の1実施例を図面にに基づいて詳
細に説明する。第7図は水晶片2を基台5に取付
けた状態を示す正面図である。この状態では水晶
片2の両面には励振電極3,3および端子4,4
は設けてなく、単に保持部材7,7に仮止めされ
た状態である。図において、20はマスクで、該
マスク20は基台5に嵌合されており、またその
正面および裏面には蒸着を許容するための孔2
1,21が設けてある。なお、6,6は端子であ
る。また、前記状態を以下試料と称す。 Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. FIG. 7 is a front view showing the state in which the crystal piece 2 is attached to the base 5. As shown in FIG. In this state, excitation electrodes 3, 3 and terminals 4, 4 are provided on both sides of the crystal piece 2.
is not provided, and is simply temporarily fixed to the holding members 7, 7. In the figure, reference numeral 20 denotes a mask, which is fitted onto the base 5, and has holes 2 on its front and back surfaces for allowing vapor deposition.
1 and 21 are provided. Note that 6 and 6 are terminals. Further, the above state is hereinafter referred to as a sample.
第8図は真空蒸着室22の部分断側面図であ
る。23は基板で、該基板23には複数本の支持
柱24…が設けてあり、該支持柱24…の先端に
は第1の蒸着物遮蔽板25が回転不能に取付けら
れている。26a〜26fは第1の蒸着物遮蔽板
25に設けた蒸着を許容するための孔で、該孔2
6a〜26fは第10図に示すようにモニター用
の孔27から等距離に、且つ、等間隔に設けてあ
る。なお、同図において、28…は支持柱24と
嵌合する孔である。29は孔26aと孔26fと
の中間に設けた周波数調整用の調整孔で、前記孔
26a〜26fと同様モニター用の孔27から等
距離に設けてある。30はその外周囲に歯31を
設けた回転部材で、該回転部材30には複数本
(実施例では6本)の支持部32a〜32fが設
けてあり、各支持部32a〜32fの先端は外方
へ傾斜し、該傾斜部33a〜33fに後述する試
料取付部材を取付けるための孔34a〜34fが
設けてある。また、支持部32a〜32fには後
述する第2の蒸着物遮蔽板を支持するための矩形
孔35a〜35fが設けてある。36…は回転部
材30の下面に設けられ、前記基板23と接触す
る回転子、37は歯31と噛合する歯車で、該歯
車37はモータ38の回転に伴なつて回転するも
のである。39は第2の蒸着物遮蔽板で、該第2
の蒸着物遮蔽板39は特に第9図に示すように前
記第1の蒸着物遮蔽板25に設けた孔26a〜2
6fに対応する位置に孔40a〜40fが設けて
ある。41a〜41fは第2の蒸着物遮蔽板に設
けた矩形の突出片で、該突出片41a〜41fが
前記支持部32a〜32fに設けた矩形孔35a
〜35fと嵌合する。従つて、第2の蒸着物遮蔽
板39は回転部材30の回転に伴なつて回転でき
るものである。なお、突出片41a〜41fは各
孔40a〜40fと対応する位置に設けてある。
42はモニター用の孔である。43a〜43fは
支持部32a〜32fに回転可能に設けられた試
料取付部材で、該取付部材43a〜43fは第1
1図に示すように前記第2の蒸着物遮蔽板39に
設けた各孔40a〜40fに対応するもので、何
れも同一構成であり、その詳細について第12図
を用いて説明すると、44は試料の端子6,6を
挿入するための挿入孔45,46を備えた基台
部、47は基台部44に取付けられた回転軸で、
該回転軸47が回転部材30のの支持部32aに
設けた孔34aを貫通し、その端部には基台部4
4を反回転させるための反転機構と噛合する歯車
48が設けてある。49は周波数調整時の周波数
を取出すための取出部材で、該取出部材49は上
下動可能で、端部には試料の端子6,6と接触す
る取出し端子50,50(一方は図示せず)が、
他端には上下動用のカム板52と係合するピン5
1が設けてある。53はカム板52を移動させる
ためのソレノイドで、該ソレノイド53ぎ励磁す
ると、プランジヤー54が吸引され、プランジヤ
ー54と接続するカム板52が移動し、カム板5
2のカム面(傾斜面)52aがピン51を押圧
し、それに伴なつて取出部材49を上昇させるも
のである。なお、ソレノイド53の励磁を解消す
れば、プランジヤー54は特に図示してないがバ
ネの弾力により元に復帰するものである。55は
取出部材49に設けた反転機構で、該反転機構5
5は取付部材43a〜43fに設けた歯車48…
と噛合し、取付部材を反転させるためのラツク歯
車56が設けてある。また、反転機構55は取出
部材49の上下動に追従するものであり、取出部
材49が上昇した位置にある時のみラツク歯車5
6は歯車48…と噛合が可能である。57は各試
料に対し、等距離となるように基板23に設けた
蒸発源で、該蒸発源57に蒸着すべき金属を収納
し、通電することにより金属が蒸発するものであ
る。58はモニター用の水晶片で、この水晶片5
8には予め電極が設けられており、この電極に蒸
着する金属量をモニターすることにより試料の蒸
着状態を判断するもので、水晶片58は第1、第
2の蒸着物遮蔽板25,39に設けたモニター用
の孔27,42と対応するものである。59は取
外しが可能なカバーである。 FIG. 8 is a partially sectional side view of the vacuum deposition chamber 22. Reference numeral 23 denotes a substrate, and the substrate 23 is provided with a plurality of support columns 24, and a first deposit shielding plate 25 is non-rotatably attached to the tips of the support columns 24. 26a to 26f are holes provided in the first vapor deposition material shielding plate 25 to allow vapor deposition;
6a to 26f are provided at equal distances from the monitor hole 27 and at equal intervals, as shown in FIG. In addition, in the figure, 28... are holes that fit into the support columns 24. Reference numeral 29 denotes a frequency adjustment adjustment hole provided between the holes 26a and 26f, and is provided equidistantly from the monitoring hole 27 like the holes 26a to 26f. Reference numeral 30 denotes a rotating member having teeth 31 on its outer periphery. The rotating member 30 is provided with a plurality of (six in this embodiment) supporting parts 32a to 32f, and the tips of each of the supporting parts 32a to 32f are Holes 34a to 34f are provided in the slanted portions 33a to 33f to attach sample mounting members, which will be described later. Further, the support portions 32a to 32f are provided with rectangular holes 35a to 35f for supporting a second deposit shielding plate, which will be described later. 36 is a rotor provided on the lower surface of the rotating member 30 and comes into contact with the substrate 23; 37 is a gear that meshes with the teeth 31; the gear 37 rotates as the motor 38 rotates. 39 is a second vapor deposit shielding plate;
As shown in FIG.
Holes 40a to 40f are provided at positions corresponding to 6f. 41a to 41f are rectangular protruding pieces provided on the second vapor deposit shielding plate, and the protruding pieces 41a to 41f are rectangular holes 35a provided in the supporting parts 32a to 32f.
- Fits with 35f. Therefore, the second deposit shielding plate 39 can rotate as the rotating member 30 rotates. Note that the protruding pieces 41a to 41f are provided at positions corresponding to the respective holes 40a to 40f.
42 is a hole for monitoring. 43a to 43f are sample mounting members rotatably provided on the support parts 32a to 32f, and the mounting members 43a to 43f are the first
As shown in FIG. 1, the holes 44 correspond to the holes 40a to 40f provided in the second vapor deposit shielding plate 39, and have the same structure. A base part is provided with insertion holes 45 and 46 for inserting the terminals 6 and 6 of the sample, 47 is a rotating shaft attached to the base part 44,
The rotary shaft 47 passes through a hole 34a provided in the support portion 32a of the rotary member 30, and the base portion 4 is attached to the end of the hole 34a.
A gear wheel 48 is provided which meshes with a reversing mechanism for counter-rotating 4. Reference numeral 49 denotes a take-out member for taking out the frequency during frequency adjustment, and the take-out member 49 is movable up and down, and has take-out terminals 50, 50 (one not shown) at the ends that make contact with the terminals 6, 6 of the sample. but,
At the other end is a pin 5 that engages with a cam plate 52 for vertical movement.
1 is provided. Reference numeral 53 denotes a solenoid for moving the cam plate 52. When the solenoid 53 is energized, the plunger 54 is attracted, the cam plate 52 connected to the plunger 54 moves, and the cam plate 5
The second cam surface (slanted surface) 52a presses the pin 51 and raises the take-out member 49 accordingly. Note that when the solenoid 53 is deenergized, the plunger 54 returns to its original state due to the elasticity of the spring, although not particularly shown. 55 is a reversing mechanism provided on the extraction member 49, and the reversing mechanism 5
5 is a gear 48 provided on the mounting members 43a to 43f.
A rack gear 56 is provided for meshing with and reversing the mounting member. Further, the reversing mechanism 55 follows the vertical movement of the take-out member 49, and the rack gear 5 only moves when the take-out member 49 is in the raised position.
6 can mesh with gears 48... Reference numeral 57 denotes an evaporation source provided on the substrate 23 so as to be equidistant from each sample.The evaporation source 57 houses the metal to be evaporated, and the metal is evaporated by applying electricity. 58 is a crystal piece for the monitor, and this crystal piece 5
8 is provided with an electrode in advance, and the vapor deposition state of the sample is determined by monitoring the amount of metal vapor deposited on this electrode. This corresponds to the monitor holes 27 and 42 provided in the. 59 is a removable cover.
次に、本発明の動作について説明する。先ず、
カバー57を取外し、各取付部材43a〜43f
に設けた挿入孔45,46に試料の端子6,6を
挿入し、試料を取付部材43a〜43fに取付け
る。また、蒸発源57には蒸着すべき金属を収納
する。その後、カバー59を被せて、真空蒸着室
22内を真空状態にすると共に、モータ38を回
転させて、回転部材30を回転し、第13図に示
すように、第2の蒸着部遮蔽板39に設けた孔4
0a〜40fが第1の蒸着部遮蔽板25に設けた
孔26a〜26fに対応するようにセツトする。
また、この状態ではソレノイド53が励磁されて
いるため、プランジヤー54が吸引され、取出部
材49は上昇した位置(第8図に点線で示す)に
あり、取出し端子50,50は試料の端子6,6
には接触することなく、また、反転機構55のラ
ツク歯車56も上昇位置にあり、各取付部材43
a〜43fの歯車48…と噛合可能状態にある。
さらに、各孔40a〜40f、26a〜26fが
対応しているため、第1の蒸着物遮蔽板25に設
けた調整孔は第2の蒸着物遮蔽板39に遮蔽され
た状態にセツトされている。この状態から、蒸発
源57を通電すると、金属が蒸発し、孔26a〜
26f(40a〜40f)および各試料に設けた
マスク20の孔21より各試料(各水晶片2)が
同時に金属蒸着される。この蒸着状態をモニター
用の水晶片58でモニターしながら、所定量の蒸
着が終了したら、蒸発源57への通電を解消し、
モータ38を回転させて、回転部材30を1回転
すると、途中で取付部材43a〜43fに設けた
歯車48…が反転機構55のラツク歯車56と噛
合するため、取付部材43a〜43fは回転し、
試料を反回転させる。そして、再び蒸発源57を
通電させることにより、金属を蒸発させ、各水晶
片2の他方の面に金属蒸着を行うことにより各水
晶片2の両面に励振電極3,3が蒸着できる。す
なわち、基礎蒸着工程が終了する。 Next, the operation of the present invention will be explained. First of all,
Remove the cover 57 and attach each mounting member 43a to 43f.
The terminals 6, 6 of the sample are inserted into the insertion holes 45, 46 provided in the sample, and the sample is attached to the mounting members 43a to 43f. Further, the evaporation source 57 stores the metal to be evaporated. Thereafter, the cover 59 is placed on the vacuum deposition chamber 22 to create a vacuum state, and the motor 38 is rotated to rotate the rotary member 30 so that the second deposition section shielding plate 39 is closed as shown in FIG. Hole 4 provided in
The holes 0a to 40f are set to correspond to the holes 26a to 26f provided in the first vapor deposition section shielding plate 25.
In addition, in this state, the solenoid 53 is energized, so the plunger 54 is attracted, the extraction member 49 is in the raised position (shown by the dotted line in FIG. 8), and the extraction terminals 50, 50 are connected to the sample terminal 6, 6
The rack gear 56 of the reversing mechanism 55 is also in the raised position, and each mounting member 43
It is in a state where it can mesh with the gears 48 of a to 43f.
Further, since the holes 40a to 40f and 26a to 26f correspond to each other, the adjustment holes provided in the first vapor deposit shielding plate 25 are set to be shielded by the second vapor deposit shielding plate 39. . When electricity is applied to the evaporation source 57 from this state, the metal evaporates and the holes 26a to
26f (40a to 40f) and the holes 21 of the mask 20 provided in each sample, each sample (each crystal piece 2) is metal-deposited simultaneously. While monitoring the evaporation state with a monitoring crystal piece 58, when a predetermined amount of evaporation has been completed, the energization to the evaporation source 57 is removed.
When the motor 38 is rotated and the rotating member 30 rotates once, the gears 48 provided on the mounting members 43a to 43f mesh with the rack gears 56 of the reversing mechanism 55, so the mounting members 43a to 43f rotate.
Rotate the sample counter-rotate. Then, by energizing the evaporation source 57 again, the metal is evaporated, and the metal is deposited on the other surface of each crystal piece 2, so that the excitation electrodes 3, 3 can be deposited on both sides of each crystal piece 2. That is, the basic vapor deposition process is completed.
次に、周波数調整について説明する。先ず、基
礎蒸着が終了したら、モータ38を回転させて、
回転部材30を12分の1回転させ、第2の蒸着物
遮蔽板39に設けた孔40a〜40fの1つを、
例えば第14図に示すように孔40aを第1の蒸
着物遮蔽板25に設けた調整孔29と対応させ
る。従つて、他の孔40b〜40fおよび第1の
蒸着物遮蔽板25の孔26a〜26fは互に他の
蒸着物遮蔽板25,39により遮蔽される。その
後、ソレノイド53に励磁を解消すると、プラン
ジヤー54は元の位置に復帰するため、カム板5
2も復帰し、上昇位置にあつた取出部材49が下
降し、取出し端子50,50が試料の端子6,6
と接触する。この状態から、蒸発源57を通電す
ると微少量の金属が蒸発し、調整孔29、孔40
aおよびマスク20の孔21を介して、微少量の
金属がさらに蒸着する。この時、水晶片2の励振
電極は保持部材7,7、端子6,6、取出し端子
50,50に導出されるので、この端子50をさ
らにリード線(図示せず)を介して発振回路(図
示せず)に接続して発振させ、該発振回路からの
信号と別に基準周波数0を発振する発振器からの
信号とにより、従来例と同様ゼロビートを検出さ
せその試料の調整を終了する。1つの試料の調整
が終了したら、モータ38を回転させて、回転部
材30を6分の1回転させ、次の孔40bを調整
孔29と対応させ、次の試料の調整を行い、回転
部材30を1回転させることにより、総ての試料
に対する周波数調整が終了する。終了後、真空状
態を解除し、カバー59を取外し、各試料を取出
せば、水晶片2には励振電極3,3と周波数調整
が終了したものが誕生することになる。 Next, frequency adjustment will be explained. First, when the basic vapor deposition is completed, the motor 38 is rotated,
Rotating the rotating member 30 by 1/12 rotation, one of the holes 40a to 40f provided in the second vapor deposition shielding plate 39,
For example, as shown in FIG. 14, the hole 40a is made to correspond to the adjustment hole 29 provided in the first deposit shielding plate 25. Therefore, the other holes 40b to 40f and the holes 26a to 26f of the first deposit shielding plate 25 are mutually shielded by the other deposit shielding plates 25 and 39. After that, when the solenoid 53 is de-energized, the plunger 54 returns to its original position, so the cam plate 5
2 also returns, the extraction member 49 that was in the raised position is lowered, and the extraction terminals 50, 50 are connected to the terminals 6, 6 of the sample.
come into contact with. In this state, when the evaporation source 57 is energized, a small amount of metal is evaporated, and the adjustment holes 29 and 40
A and through the holes 21 of the mask 20, a small amount of metal is further deposited. At this time, the excitation electrodes of the crystal blank 2 are led out to the holding members 7, 7, the terminals 6, 6, and the extraction terminals 50, 50, so the terminals 50 are further connected to the oscillation circuit (not shown) via lead wires (not shown). (not shown) to generate oscillation, and using a signal from the oscillation circuit and a separate signal from an oscillator that oscillates at a reference frequency of 0 , the zero beat is detected as in the conventional example, and the adjustment of the sample is completed. When the adjustment of one sample is completed, the motor 38 is rotated, the rotating member 30 is rotated one-sixth of a turn, the next hole 40b is made to correspond to the adjustment hole 29, the next sample is adjusted, and the rotating member 30 is rotated. By rotating once, frequency adjustment for all samples is completed. After the completion, the vacuum state is released, the cover 59 is removed, and each sample is taken out, so that the crystal piece 2 with the excitation electrodes 3 and the frequency adjustment completed is created.
なお、前記実施例においては、2つの蒸着物遮
蔽板25,39に6つの孔26a〜26f、40
a〜40fを、また、試料の取付部材43a〜4
3fを6個としたが、必ずしも6個に限定される
ことなく、個数については設計上の任意のことで
ある。 In the above embodiment, six holes 26a to 26f, 40 are provided in the two vapor deposit shielding plates 25, 39.
a to 40f, and sample mounting members 43a to 4
Although six 3fs are used, the number is not necessarily limited to six, and the number is arbitrary in terms of design.
また、反転機構の1例として、歯車48…とラ
ツク歯車56との噛合によつて行うよう説明した
が、これは単なる1例であつて、他に、例えば、
カム機構、バネ機構等任意に選択できるものであ
る。 Further, as an example of the reversing mechanism, it has been explained that the reversing mechanism is performed by meshing the gears 48 and the rack gear 56, but this is just one example.
A cam mechanism, a spring mechanism, etc. can be selected arbitrarily.
また、回転部材30を回転させるのにモータ3
8を利用したが、モータに限定されることなく、
例えばソレノイドプランジヤー等を用いても可能
である。 Also, the motor 3 is used to rotate the rotating member 30.
8 was used, but it is not limited to motors,
For example, it is possible to use a solenoid plunger or the like.
以上、詳細に説明したように、本発明によれ
ば、水晶片2と蒸発源57との間に設けた2つの
蒸着物遮蔽板25,39の一方を回転可能に、他
方を回転不能と成すと共に、2つの蒸着物遮蔽板
には各々対応する位置に複数個の孔26a〜26
f、40a〜40fを設け、回転可能な蒸着物遮
蔽板39には水晶片2の取付部材43a〜43f
を設け、且つ、回転不能な蒸着物遮蔽板25には
孔40a〜40fより1つ余分に調整孔29を設
け、基礎メツキ時には調整孔29を除く各孔26
a〜26f、40a〜40fを対応させて、取付
部材に取付けた各水晶片に同時に金属蒸着を行う
と共に、周波数調整時には回転可能に設けた蒸着
物遮蔽板の各孔を順次調整孔に対応させ、調整孔
と対応した水晶片のみが周波数調整のための金属
蒸着を可能としたので、同一の真空蒸着室内で、
真空破壊を起すことなく基礎メツキと周波数調整
とが行うことができ、作業工程が簡素化し、且
つ、真空破壊もないので、安価な水晶振動子が大
量に提供でき、また、水晶片の出入が少なくてす
むので、水晶片を破損させることがない等の効果
を奏する。 As described above in detail, according to the present invention, one of the two vapor deposit shielding plates 25 and 39 provided between the crystal blank 2 and the evaporation source 57 is rotatable, and the other is non-rotatable. In addition, the two vapor deposit shielding plates each have a plurality of holes 26a to 26 at corresponding positions.
f, 40a to 40f, and the rotatable deposit shielding plate 39 has mounting members 43a to 43f for the crystal piece 2.
In addition, the non-rotatable deposit shielding plate 25 is provided with one adjustment hole 29 in addition to the holes 40a to 40f, and each hole 26 except the adjustment hole 29 is provided during foundation plating.
A to 26f and 40a to 40f are made to correspond to each other, and metal vapor deposition is performed simultaneously on each crystal piece attached to the mounting member, and at the time of frequency adjustment, each hole of a rotatably provided vapor deposition shielding plate is sequentially made to correspond to an adjustment hole. , only the crystal piece corresponding to the adjustment hole made it possible to deposit metal for frequency adjustment, so in the same vacuum deposition chamber,
Basic plating and frequency adjustment can be performed without causing vacuum breakdown, the work process is simplified, and there is no vacuum breakdown, so inexpensive crystal resonators can be provided in large quantities, and crystal pieces can be put in and out easily. Since only a small amount is required, there is an effect that the crystal piece will not be damaged.
また、取付部材が反転可能であるので、簡単に
水晶片の両面に励振電極を設けることができる。 Furthermore, since the mounting member is reversible, excitation electrodes can be easily provided on both sides of the crystal piece.
また、蒸発源に近い方の蒸着物遮蔽板を回転不
能としたので、水晶片は上側で取付けることがで
き、作業能率がよいものである。 Furthermore, since the deposit shielding plate closer to the evaporation source is made non-rotatable, the crystal piece can be attached on the upper side, improving work efficiency.
さらに、調整孔と対応する位置に周波数調整時
のみ水晶片の端子と接触する取出し端子を設けた
ので、周波数の取出しが簡単である。 Further, since a take-out terminal is provided at a position corresponding to the adjustment hole and comes into contact with the terminal of the crystal piece only during frequency adjustment, the frequency can be taken out easily.
第1図は水晶振動子1の正面図、第2図〜第6
図は周波数調整の従来例を示し、第2図は第1の
トレー8を示し、イ図は正面図、ロ図は側面図、
第3図は第2のトレー8′を示し、イ図は正面図、
ロ図は側面図、第4図は調整装置の正面図、第5
図は同平面図、第6図は他形状の調整装置の平面
図、第7図〜第14図は本発明の実施例を示し、
第7図は試料の正面図、第8図は真空蒸着室22
の部分断側面図、第9図は第2の蒸着物遮蔽板3
9の平面図、第10図は第1の蒸着物遮蔽板25
の平面図、第11図は試料の取付け状態を示す平
面図、第12図は取付部材の拡大した平面図、第
13図は基礎蒸着状態を示す蒸着物遮蔽板25,
39の平面図、第14図は周波数調整状態を示す
蒸着物遮蔽板25,39の平面図である。
1…水晶振動子、2…水晶片、3,3…励振電
極、6,6…端子、22…真空蒸着室、25…蒸
着物遮蔽板、26a〜26f…孔、29…調整
孔、30…回転部材、32a〜32f…支持部、
39…蒸着物遮蔽板、40a〜40f…孔、43
a〜43f…取付部材、48…歯車、49…取出
部材、50,50…取出し端子、55…反転機
構、56…ラツク歯車、57…蒸発源。
Figure 1 is a front view of the crystal resonator 1, Figures 2 to 6
The figure shows a conventional example of frequency adjustment, Figure 2 shows the first tray 8, Figure A is a front view, Figure B is a side view,
Figure 3 shows the second tray 8', Figure A is a front view;
Figure B is a side view, Figure 4 is a front view of the adjustment device, Figure 5 is a front view of the adjustment device,
The figure is a plan view of the same, FIG. 6 is a plan view of an adjusting device of other shapes, and FIGS. 7 to 14 show embodiments of the present invention.
Figure 7 is a front view of the sample, Figure 8 is the vacuum deposition chamber 22.
FIG. 9 is a partially sectional side view of the second vapor deposit shielding plate 3.
9, and FIG. 10 is a plan view of the first vapor deposit shielding plate 25.
, FIG. 11 is a plan view showing the mounting state of the sample, FIG. 12 is an enlarged plan view of the mounting member, and FIG. 13 is the deposit shielding plate 25 showing the basic vapor deposition state.
FIG. 14 is a plan view of the deposit shielding plates 25 and 39 showing the frequency adjustment state. DESCRIPTION OF SYMBOLS 1... Crystal resonator, 2... Crystal piece, 3, 3... Excitation electrode, 6, 6... Terminal, 22... Vacuum deposition chamber, 25... Deposit shielding plate, 26a-26f... Hole, 29... Adjustment hole, 30... Rotating member, 32a to 32f...support part,
39... Deposit shielding plate, 40a to 40f... Hole, 43
a to 43f... Attachment member, 48... Gear, 49... Takeout member, 50, 50... Takeout terminal, 55... Reversing mechanism, 56... Rack gear, 57... Evaporation source.
Claims (1)
複数個の水晶片に同時に励振電極となるべき励振
電極の基礎蒸着を施こし、次いで、1つ1つの水
晶片に順次周波数の調整を行い得るようにした水
晶振動子の真空蒸着装置において、前記水晶片と
蒸発源との間に設けた2つの蒸着物遮蔽板の一方
を回転可能に、他方を回転不能と成すと共に、2
つの蒸着物遮蔽板には各々対応する位置に複数個
の孔を設け、前記回転可能な蒸着物遮蔽板には該
蒸着物遮蔽板の回転に伴なつて回転する水晶片の
取付部材を設け、且つ、前記回転不能な蒸着物遮
蔽板には前記孔より1つ余分に調整孔を設け、基
礎蒸着時には前記調整孔を除く各孔を対応させ
て、取付部材に取付けられた各水晶片に同時に金
属蒸着を行うと共に、周波数調整時には前記回転
可能に設けた蒸着物遮蔽板の各孔を順次調整孔に
対応させ、調整孔と対応した水晶片のみが周波数
調整のための金属蒸着を可能としたことを特徴と
する水晶振動子の真空蒸着装置。 2 前記水晶片の取付部材が反転可能であること
を特徴とする前記特許請求の範囲第1項記載の水
晶振動子の真空蒸着装置。 3 2つの蒸着物遮蔽板のうち、蒸発源に近い方
の蒸着物遮蔽板を回転不能と成したことを特徴と
する前記特許請求の範囲第1項記載の水晶振動子
の真空蒸着装置。 4 前記蒸着物遮蔽板に設けた調整孔と対応する
位置に周波数調整時のみ水晶片の端子と接触する
周波数取出し端子を設けたことを特徴とする前記
特許請求の範囲第1項記載の水晶振動子の真空蒸
着装置。[Scope of Claims] 1. A plurality of crystal pieces are housed in a vacuum deposition chamber, and basic vapor deposition of an excitation electrode to be an excitation electrode is applied to the plurality of crystal pieces at the same time, and then, each crystal piece is deposited one by one. In a vacuum evaporation apparatus for a crystal oscillator, the frequency of which can be adjusted sequentially, one of the two evaporation material shielding plates provided between the crystal piece and the evaporation source is rotatable and the other is non-rotatable. 2.
A plurality of holes are provided in each of the two vapor deposition shielding plates at corresponding positions, and the rotatable vapor deposition shielding plate is provided with a mounting member for a crystal piece that rotates as the vapor deposition shielding plate rotates, In addition, one adjustment hole is provided in the non-rotatable deposition material shielding plate, and at the time of basic deposition, each hole except the adjustment hole is made to correspond to each crystal piece attached to the mounting member at the same time. In addition to performing metal vapor deposition, when adjusting the frequency, each hole of the rotatably provided vapor deposition material shielding plate was made to correspond to the adjustment hole in sequence, so that only the crystal pieces corresponding to the adjustment holes were capable of metal vapor deposition for frequency adjustment. A vacuum evaporation device for a crystal resonator, which is characterized by: 2. The vacuum evaporation apparatus for a crystal resonator according to claim 1, wherein the mounting member for the crystal piece is reversible. 3. The vacuum evaporation apparatus for a crystal resonator according to claim 1, characterized in that of the two evaporation material shielding plates, the one closer to the evaporation source is not rotatable. 4. The crystal oscillation according to claim 1, characterized in that a frequency extraction terminal is provided at a position corresponding to the adjustment hole provided in the vapor deposit shielding plate and comes into contact with a terminal of the crystal piece only during frequency adjustment. Child vacuum evaporation equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5405081A JPS57169087A (en) | 1981-04-10 | 1981-04-10 | Vacuum vapor-deposition device of crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5405081A JPS57169087A (en) | 1981-04-10 | 1981-04-10 | Vacuum vapor-deposition device of crystal resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57169087A JPS57169087A (en) | 1982-10-18 |
| JPH021226B2 true JPH021226B2 (en) | 1990-01-10 |
Family
ID=12959776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5405081A Granted JPS57169087A (en) | 1981-04-10 | 1981-04-10 | Vacuum vapor-deposition device of crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57169087A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2586443B2 (en) * | 1984-07-31 | 1997-02-26 | カシオ計算機株式会社 | Waveform generator |
| JP5550415B2 (en) * | 2010-03-29 | 2014-07-16 | セイコーインスツル株式会社 | Electrochemical cell with terminal and manufacturing method |
-
1981
- 1981-04-10 JP JP5405081A patent/JPS57169087A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57169087A (en) | 1982-10-18 |
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