JPH025818B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus for a crystal resonator, in particular, to provide excitation electrodes on a plurality of crystal pieces at the same time, and then
The present invention relates to a vacuum evaporation device that allows frequency adjustment to be performed sequentially on each crystal piece.

Generally, a crystal resonator 1 has a crystal piece 2 cut out at a predetermined angle, and chromium is coated on both sides of the crystal piece 2, as shown in FIG.
Excitation electrodes 3, 3 (one not shown) and terminals 4, 4 are formed by vacuum-depositing a metal material such as gold, silver, or aluminum into multiple layers such as two or three layers. After the piece 2 is held between the holding members 7, 7 connected to the lead-out terminals 6, 6 planted on the base 5, the holding members 7, 7 and the terminals 4, 4 are bonded with a conductive adhesive. , the vibration energy of the crystal piece 2 is transferred to the terminals 4, 4, the holding members 7, 7, and the lead-out terminals 6, 6.
It is taken out to the outside through.

By the way, the vibration frequency of the crystal resonator 1 described above depends on the thickness and size of the crystal piece 2 or the excitation electrode 3,
3. This is determined by the quality and quantity of the terminals 4, 4, but since it is difficult to accurately cut out the thickness of the crystal piece 2, the crystal piece 2 of a predetermined shape is simply coated with a predetermined material (chromium, gold, gold, etc.). It is difficult to obtain a crystal resonator that vibrates at a predetermined accurate frequency f ₀ by simply depositing a predetermined amount of silver (silver, aluminum) in a vacuum evaporation device. 1, once the excitation electrodes 3, 3 are deposited in two or three layers on the crystal piece 2 in a vacuum evaporation apparatus, and then taken out from the vacuum evaporation apparatus, held between the holding members 7, 7 as described above, and crystal oscillator 1
As shown in the figure or FIG.
After that, by the method described below, a minute amount of material is continued to be deposited on the excitation electrodes 3, 3 of the crystal piece 2 in several steps, and the frequency changes as a result of the deposition.
A point where f ₁ becomes equal to a predetermined frequency f ₀ is determined, and the vapor deposition is stopped to obtain a crystal resonator 1 having a reference frequency f ₀ .

In addition, in the third illustration, the crystal resonators 1 are stored in a tray 8' via individual storage stands 9.

When adjusting the frequency, tray 8,
Terminal insertion parts 11, 11 provided on turntables 10, 10' in a vacuum deposition chamber (not shown) for adjusting the frequency of the crystal oscillators 1 on 8' one by one.
Alternatively, it is replaced with the storage hole 11' of the storage stand 9, and then the turntables 10, 10' are rotated intermittently to remove chromium, gold, silver, etc. from the evaporation sources 12, 12'.
A method in which a minute amount of a substance such as aluminum is deposited on the excitation electrode 3 of the opposing crystal oscillator 1, and the deposition is performed in several steps until the frequency f ₁ of the crystal oscillator 1 becomes the reference frequency f ₀ . It is. The reason why the evaporation is performed in several steps is to prevent the reference frequency f ₀ from being exceeded in the middle of the evaporation if the evaporation is performed at once.
Generally, the second evaporation is performed in an even smaller amount than the first, and the third evaporation is performed in an even smaller amount, and during this third evaporation, the reference frequency f ₀
Many of them reach this point.

In addition, whether or not the reference frequency f ₀ has been reached can be determined by connecting the lead-out terminals 6, 6 of the crystal resonator 1 to be adjusted to an oscillation circuit (not shown) and oscillating it, separately from the signal from the oscillation circuit. It is sufficient to detect the zero beat with respect to the signal from the oscillator that oscillates the reference frequency f ₀ .

After the adjustment, the vacuum state in the vacuum deposition chamber is released, and the crystal resonator 1 is stored in the trays 8 and 8' again.
Again, other crystal units 1 are taken out from other trays 8, 8' and the same operation is performed.

By the way, the above-mentioned conventional crystal resonator is first stored and taken out in a vacuum deposition chamber in order to deposit the excitation electrodes 3, 3 on the crystal piece 2, and then returned to the vacuum deposition chamber (in the same or another vacuum chamber) for frequency adjustment. The process is complicated because the crystal resonators stored in the trays 8, 8' must be taken out one by one, and the turntables 10, 10' inside the vacuum deposition chamber must be taken out one by one. After adjustment,
Since it is to be stored in trays 8 and 8' again,
There were disadvantages such as poor working efficiency, the crystal resonator 1 being moved in and out a lot, and the crystal piece 2 being damaged during the movement.

The present invention has been made in order to eliminate the above-mentioned drawbacks, and provides a crystal resonator that can improve work efficiency and prevent damage to crystal pieces when a plurality of metal substances are sequentially vacuum-deposited onto a plurality of crystal pieces. The purpose is to provide a vacuum evaporation device.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. FIG. 7 is a front view showing the state in which the crystal piece 2 is attached to the base 5. As shown in FIG. As is clear from the figure, in this state, the excitation electrodes 3, 3 and terminals 4, 4 are not provided on both surfaces of the crystal piece 2, and are merely temporarily fixed to the holding members 7, 7. In the figure, 20 is a mask, which is fitted onto the base 5, and holes 21, 21 are provided on the front and back surfaces of the mask to allow vapor deposition. Note that 6 and 6 are lead-out terminals. Note that this state is referred to as a sample. FIG. 8 is a partially sectional side view of the vacuum deposition chamber 22. 23 is a surface plate of the vacuum deposition chamber 22, and a plurality of support columns 24 are provided on the surface plate 23. The support columns 24... are provided with stepped portions 24a..., 24b... for positioning an upper plate and a lower plate, which will be described later. Reference numeral 26 denotes an upper plate, which is located at the step portion 24b of the support column 24, and is attached to the support column 24 with nuts 25. 27 is a motor held at the lower center of the upper plate 26; 28 is a motor 27;
29 is a transmission shaft attached to the rotation shaft 28, and the transmission shaft 29 has a large diameter part 29a and a small diameter part 29.
b, and a threaded portion is provided at the tip of the narrow diameter portion 29b so as to be able to engage with the nut 30. 31 is a first portion attached to the narrow diameter portion 29b of the transmission shaft 29;
As is particularly clear from the plan view shown in FIG. 9, the deposition shielding plate 31 is provided with a mounting hole 31a in its center, and holes are provided at equal distances and intervals from the mounting hole 31a. A plurality of holes 32a to 32f (six holes in the embodiment) are provided to allow vapor deposition, and a frequency adjustment hole 33 is provided between the holes 32a and 32f. Note that the adjustment hole 33 is also provided at a position equidistant from the attachment hole 31a. 34 is a locking piece provided on the deposit shielding plate 31. Reference numeral 35 designates a second deposit shielding plate, and as is particularly clear from the plan view shown in FIG. is provided,
Holes 32a~ provided in the first vapor deposit shielding plate 31
Although holes 36a to 36f are provided at positions corresponding to hole 32f, no hole corresponding to adjustment hole 33 is provided. The first vapor deposit shielding plate 31 is rotatably mounted to the transmission shaft 29, and the second vapor deposit shielding plate 35 is non-rotatably mounted to the transmission shaft 29. About, No. 8
To explain with a diagram, first, the coil spring 37 is inserted into the narrow diameter portion 29b, and then the first vapor deposit shielding plate 31 is inserted.
Insert. At this time, the mounting hole 31a is attached to the small diameter portion 29.
Since it has a larger diameter than b, it is loosely fitted. Next, a friction plate 38 made of felt or the like is inserted, and then the second deposit shielding plate 35 is tightly fitted into the narrow diameter portion 29b, and the nut 30 is engaged.
Since the first vapor deposit shielding plate 31 is moderately pressed against the second vapor deposit shielding plate 35 via the friction plate 38 due to the elasticity of the coil spring 37, the first vapor deposit shielding plate 31 is applied with a torque exceeding a certain level. It is possible to rotate with the rotation of the transmission shaft 29 without idling as long as the rotation is not applied. Reference numeral 39 denotes a sample (crystal piece 2, etc.) mounting member provided at the lower part of the upper plate 26, and the sample mounting member 39 has a cylindrical shape, as is particularly clear from the plan view shown in Figure 11, and is used for the second vapor deposition. Attachment portions 40a to 40f, the number of which is equal to the number of holes 36a to 36f provided in the object shielding plate 35, are provided at equal intervals and with their tips inclined downward. And the mounting part 40a
The sample shown in FIG. 7 is attached to 40f. The details will be explained using FIG. 12. As shown in the figure, the mounting portion 40a is provided with a lead-out terminal insertion hole 41a, and when the lead-out terminals 6, 6 of the sample are inserted into the insertion hole 41a, the lead-out terminals 6, 6 are inserted into the insertion hole 41a. terminal 6,
6, the insertion hole 4 is inserted through the hole 42a provided in the mounting portion 40a.
The detection piece 43 extending into the inside 1a comes into contact with the lead-out terminals 6, 6. 44 is a lower plate;
is positioned and fixed on the step portion 24a of the support column 24. Reference numeral 45 denotes a motor provided on the surface plate 23. A rotating shaft 45a of the motor 45 projects upward from the hole 44a of the lower plate 44, and a rotary table 46 is attached to the tip thereof. Further, the center of rotation of the rotary table 46 is located eccentrically from the center of rotation of the transmission shaft 29. As shown in FIGS. 8 and 13, a plurality of saucers 4 are placed on the rotary table 46 to serve as evaporation sources.
7, 48 (two types in the example) are stacked,
When the rotary table 46 is rotated and the saucer 47 or 48 is positioned at a predetermined position, the position is positioned directly below the transmission shaft 29 as shown in FIG. Therefore, as shown by the dashed line in FIG. 8, the incident angle α for each sample (crystal piece 2) is
are at equal angles from the transmission axis, that is, the saucers containing the metal to be deposited are positioned at the same position with respect to each sample. The saucers 47 and 48 are made of tungsten, molybdenum, etc.
7 contains chromium 49 as a metal substance, and the other saucer 48 contains gold 50. Therefore, two layers of chromium 49 and gold 50 are deposited on the surface of the crystal piece 2 in this embodiment. Reference numeral 51 denotes an electrode, and the electrode 51 is provided to be movable up and down, and when the rotary table 46 rotates and is positioned at a predetermined position, it rises and energizes a predetermined saucer.
This evaporates metal such as chromium 49 in the saucer. Reference numeral 52 denotes a solenoid plunger for raising or lowering the electrode 51, and the electrode 51 is moved up and down by the reciprocating motion of a plunger 53 provided on the solenoid plunger 52. That is, a cam surface 53a is provided at the tip of the plunger 53, and the cam surface 53a presses a pin 51a provided on the electrode 51. Reference numeral 54 denotes a movable member that engages with the locking piece 34 provided on the first vapor deposit shielding plate 31 to rotate the first vapor deposit shielding plate 31 against the elasticity of the coil spring 37; 54 is movable by a solenoid plunger 55 provided on the lower surface of the lower plate 44. In addition,
56... are lead wires connected to the detection pieces 43.... 57 is a removable cover.

Next, to explain the operation of the present invention, first, the cover 57 is removed, the sample is attached to the attachment parts 40a to 40f of the sample attachment member 39, and the metal for evaporation is placed on the saucers 47 and 48 on the rotary table 46. A hole 32a is formed in the first vapor deposit shielding plate 31 by storing chromium 49 and gold 50 in respective trays 47 and 48 and moving the movable member 54.
32f correspond to the holes 36a to 36f provided in the second vapor deposit shielding plate 35 as shown in FIG. 14, and the motor 27 is slightly rotated.
Each of the holes 32a to 32f is positioned at a position corresponding to the sample attached to the attachment parts 40a to 40f. In addition, the rotary table 46 is also rotated so that the chrome 49
The tray 47 containing the evaporation chamber is set so as to be positioned directly below the transmission shaft 29, and then the cover 57 is placed on the chamber to evacuate the inside of the vacuum evaporation chamber. and,
By operating the solenoid plunger 52, the electrode 5
1 is raised and the saucer 47 is energized, chromium 4
9 evaporates, holes 32a to 32f (36a to 36f)
Each sample (each crystal piece 2) is simultaneously metal-deposited (chromium-deposited) through the hole 21 of the mask 20 provided in each sample. When the specified amount of chromium deposition is completed,
The solenoid plunger 52 is operated again to lower the electrode 51. Then, the motor 45 is rotated, the rotary table 46 is rotated half a turn, this time the saucer 48 containing the gold 50 is set so as to be positioned directly below the transmission shaft 29, the electrode 51 is raised again, and the saucer When 48 is energized, the gold 5 in the saucer 48
0 evaporates and more gold is deposited on top of the chromium deposit on each sample. After all vapor deposition is completed, although not particularly shown in the drawings, the mounting parts 40a to 40f are rotated half a turn, or the vacuum state is once released, and the cover 5 is
7 is removed, the sample is turned half a turn and attached, the cover 57 is covered again to create a vacuum state, the rotary table 46 is turned half a turn again, and the saucer 47 containing the chromium 49 is placed directly under the transmission shaft 29 again. By setting it in a fixed position and performing chromium vapor deposition as described above, then gold vapor deposition by turning the rotary table 46 half a turn, the basic vapor deposition of each housed sample is simultaneously completed to become the excitation electrodes 3, 3. do. The saucers 47 and 48 containing the metal to be evaporated are always positioned directly below the transmission shaft 29 so that the evaporation source (the saucer) and each sample are at the same position. It is possible to prevent uneven deposition when metal is deposited on a layer.

Next, frequency adjustment after basic vapor deposition on both sides of the sample (crystal blank 2) will be explained. First, when the basic vapor deposition is completed, the movable member 54 is moved by the solenoid plunger 55, and the first vapor deposition shielding plate 3 is moved.
1 is slightly rotated against the elasticity of the coil spring 37, and the adjustment hole 33 provided in the first vapor deposit shielding plate 31 is opened.
As shown in FIG.
This corresponds to one of the holes provided in, for example, 36f. Therefore, the other holes 3 provided in the second vapor deposit shielding plate 35
6a to 36e are closed by the first vapor deposit shielding plate 31, and the holes 32a to 32f provided in the first vapor deposit shielding plate 31 are closed by the second vapor deposit shielding plate 3.
5, it becomes a closed state. Therefore, only the adjustment holes 33 and 36f are opened in both the deposit shielding plates 31 and 35, and the adjustment holes 33 are opened one after another.
The frequency is adjusted according to each sample.

That is, first, the adjustment hole 33 is made to correspond to the sample attached to the attachment part 40f, and then the rotary table 46
When the saucer containing the gold 50 of
It passes through the hole 21 and is deposited on the base plating (excitation electrode). At this time, the excitation electrode of the crystal piece 2 is connected to the detection piece 4 from the holding members 7, 7 and the lead-out terminals 6, 6.
3 to a lead wire 56, the lead wire 56 is connected to an oscillation circuit (not shown) for oscillation, and a signal from an oscillator that oscillates a reference frequency f ₀ separately from the signal from the oscillation circuit. As in the conventional example, fine adjustments are made several times, zero beat is detected, and the adjustment of one sample is completed. After completing the adjustment of one sample, rotate the motor 27 by a predetermined amount, and
Rotating the two vapor deposition shielding plates 31 and 35 at the same time,
The adjustment hole 33 is made to correspond to the next sample, and the same adjustment as described above is performed. Then, by rotating the motor 27 approximately once, frequency adjustment for all samples is completed. After finishing, release the vacuum state and close the cover 57.
When the crystal blank 2 is removed and each sample is removed, a crystal piece 2 with excitation electrodes 3 and frequency adjustment completed will be created.

In addition, six holes 32a to 32f, 36a to 36f are provided in both the deposit shielding plates 31 and 35, and
The sample mounting member 39 has six mounting parts 40a to 40.
f is provided, but the number is not necessarily limited to six, and the number is arbitrary in terms of design.

In addition, two saucers 4 are placed on the rotary table 46.
7, 48, but it is not necessarily limited to 2, but by stacking 3, 4 to 10 types, 2
~10 layers or more can be deposited.

Further, the adjustment hole 33 is connected to the first vapor deposit shielding plate 31.
However, on the contrary, it may be provided on the second vapor deposit shielding plate 35.

As described above, according to the present invention, the evaporation sources made of a plurality of metals can be arranged movably in sequence by keeping the distance between the evaporation source and each crystal piece equal, so that the evaporation sources can be distributed evenly to a large number of crystal pieces at the same time. Provided is a vacuum evaporation device for a crystal oscillator that can efficiently perform basic evaporation for an excitation electrode and does not cause misalignment of the evaporated film even when there are many types of evaporated materials.

In addition, by combining two shielding plates to appropriately shield the deposition of metal substances on each crystal piece, the electrode formation and frequency adjustment of the crystal resonator can be performed in the same vacuum deposition chamber, and the vacuum can be broken. Since the process is performed continuously without any problems, damage to the crystal piece can be prevented and vapor deposition can be performed with high work efficiency.

[Brief explanation of drawings]

Figure 1 is a front view of the crystal resonator 1, Figures 2 to 6
The figure shows a conventional example of frequency adjustment, Figure 2 shows the first tray 8, Figure A is a front view, Figure B is a side view,
Figure 3 shows the second tray 8', Figure A is a front view;
Figure B is a side view, Figure 4 is a front view of the adjustment device, Figure 5 is a front view of the adjustment device,
The figure is a plan view of the same, FIG. 6 is a plan view of an adjusting device of other shapes, and FIGS. 7 to 15 show embodiments of the present invention.
Figure 7 is a front view of the sample, Figure 8 is the vacuum deposition chamber 22.
FIG. 9 is a partially sectional side view of the first vapor deposit shielding plate 3.
1, and FIG. 10 is a plan view of the second vapor deposit shielding plate 35.
11 is a plan view of the sample attachment member 39, FIG. 12 is a partially sectional side view showing a state in which a sample is attached to the attachment part 40a, FIG. 13 is a plan view of the rotary table 46, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the basic plating state, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the frequency adjustment state. 1...Crystal resonator, 2...Crystal piece, 3,3...
Excitation electrode, 22... Vacuum deposition chamber, 31... Deposit shielding plate, 32a-32f... Hole, 33... Adjustment hole, 35... Deposit shielding plate, 36a-36f...
Hole, 39... Sample mounting member, 40a to 40f...
Mounting part, 46... Rotary table, 47, 48...
...Saucer (evaporation source).

Claims (1)

[Claims] 1. A vacuum evaporation chamber, a plurality of evaporation sources that are selectively movable at predetermined positions in the vacuum evaporation chamber and each store a metal substance; an electrode for evaporating a metallic substance; a plurality of crystal pieces arranged at equal intervals on a circumference equidistant from the evaporation source positioned at the predetermined position; and a plurality of crystal pieces arranged between each crystal piece and the evaporation source. It has a fixed shielding plate that has openings at predetermined positions corresponding to each crystal piece, and an adjustment hole that is rotatably provided with respect to the shielding plate and opens and closes each opening simultaneously and opens only a specific opening. 1. A vacuum evaporation apparatus for a crystal resonator, comprising: a rotating shield plate.