JPH021390B2 - - Google Patents

Description

[Detailed description of the invention] (a) Technical field of the invention The present invention is a manual design by hand.
The present invention relates to a multilayer printed board according to the present invention, and particularly relates to a pattern wiring structure of a multilayer printed board having three or more layers used as signal layers.

(b) Background of the technology A multilayer printed board is formed by laminating multiple conductor layers (wiring layers) in one step with an insulating layer or prepreg layer (bonding sheet) interposed therebetween. These conductor layers are the signal layer used for signals,
The power layer is used for power supply (power supply), and the ground layer is used for grounding. In the case of a circuit with a relatively complex configuration, the signal patterns formed on each signal layer are connected to each other via through holes in predetermined multiple layers of signal layers stacked above and below. One circuit is formed. Signal pattern drawings for forming such circuits may be created by hand design (manual design by humans) or by automatic design using a computer or the like. especially,
When forming a multilayer printed circuit board by creating a signal pattern drawing by hand, it is important to keep the number of signal layers connected to form a circuit as small as possible. This is preferable for creating drawings, and also preferable for functional inspection of manufactured multilayer printed boards.

(c) Prior art and problems Figure 1 is a diagram schematically showing a conventional hand-designed multilayer printed board (in this case, a six-layer structure) 10 (however, only the conductor layer is shown, and the insulating layer or prepreg layer is omitted). ). In the figure, symbols 11 to 1
6 indicates a conductor layer, and 11,
12, 15, and 16 are signal layers, 13 is a power layer (feeding layer), and 14 is a ground layer, respectively. signal layer 1
1, signal patterns 17, 18, and 19 are arranged as shown in the figure. Signal patterns 18 and 19
A signal pattern 19 is interposed between VIA lands 17a and 18a. Therefore, VIA lands 17a and 18a are connected to signal layer 11.
Therefore, the VIA land 17a has a through hole (in the figure).
20a (shown by a dotted line) to a VIA land 21a provided on the signal layer 12, and the VIA land 21a is connected to a VIA land 21b via a signal pattern 21. VIA land 21b is connected to VIA land 22a provided in signal layer 15 via through hole 20b, and VIA land 22a is connected to VIA land 22b via signal pattern 22. VIA land 22b is connected to VIA land 23a provided in signal layer 16 via through hole 20c, and VIA land 23a is connected to VIA land 23b via signal pattern 23. VIA land 23b is connected to VIA land 18a of signal layer 11 via through hole 20d. Furthermore, although not shown, the signal patterns 21 and 22 of the signal layers 12 and 15 are connected to other patterns, forming one circuit as a whole. In this way, the VIA lands 17a and 18a have a total of four signal layers 11 and 1.
2, 15 and 16. Therefore,
In this conventional example, since the signal pattern path is complicated, the circuit configuration becomes three-dimensionally more complicated. When manufacturing the multilayer printed board 10 based on such hand-designed design, a pattern drawing is first created by hand-designed based on the circuit drawing.
In this case, a draft drawing of the pattern diagram is first created, and a pattern diagram for each signal layer is created based on this draft diagram. That is, in the case of this conventional example, four pattern drawings corresponding to the signal layers 11, 12, 15, and 16 are created.
After the pattern drawing is completed, it is necessary to superimpose these four drawings and visually check whether the wiring and connection states between the signal patterns in each signal layer match the circuit drawing. This check work, for example, can be done from the first to the second
In order to visually check the wiring and connection status of the signal pattern in the 3rd and 3rd sheets,
It is extremely complicated and time-consuming, and is prone to checking errors. Therefore, the conventional multilayer printed board 10 manufactured based on such pattern drawings
As mentioned above, the circuit configuration becomes more complicated, and inspection of the signal patterns that make up the circuit as a product is extremely complicated and time-consuming, as in the case of the drawings mentioned above. There is a problem in that the quality of pattern wiring is likely to deteriorate.

(d) Purpose of the Invention In view of the problems of the prior art described above, the purpose of the present invention is to simplify the circuit configuration in the signal layer, simplify the signal pattern design, and improve the wiring of the signal pattern at the pattern design stage and the product stage. Another object of the present invention is to provide a hand-designed multilayer printed board with a pattern wiring structure that can simplify the inspection of the connection state and improve the quality of the pattern wiring.

(E) Structure of the Invention In order to achieve the above object, according to the present invention, a circuit in a single signal layer, which is a constituent unit of a multilayer printed board having three or more signal layers, can be configured as necessary. At least two blocks are distinguished, each signal pattern of each of these distinguished blocks is divided into two parts, one of the divided signal patterns is applied to the first single signal layer, and the signal of the remaining other is applied to the first signal layer. A pattern is applied to a second single signal layer, and the signal patterns of the two divided portions are connected to each other via a through hole, so that the signal pattern of each block is formed in units of two layers. A hand-designed multilayer printed board is provided.

(f) Embodiments of the invention Examples of the invention will be described in detail below with reference to the drawings.

FIG. 2 is a diagram schematically showing a hand-designed multilayer printed board (in this case, a six-layer structure) 30 which is an embodiment of the present invention (however, only the conductor layer is shown, and the insulating layer or prepreg layer is omitted). ). In this figure, parts that are the same as or correspond to those in FIG. Therefore, similarly to FIG. 1, numerals 11 to 16 indicate conductor layers, 11, 12, 15, and 16 indicate a signal layer, 13 indicates a power layer, 14 indicates a ground layer, and 17 , 18, 19, and 23 are signal patterns, 17a, 18a, 23a, and 23b are VIA lands, and 20a to 20d are through holes (indicated by dotted lines), and their explanations will be omitted. In the case of this embodiment, the VIA land 17a of the signal pattern of the signal layer 11 is directly connected to the VIA land 23a of the signal layer 16 via the through hole 20a, and the VIA land 17a of the signal pattern of the signal layer 11 is directly connected to the VIA land 23a of the signal layer 16.
3a is VIA land 2 via signal pattern 23
3b. VIA land 23b is directly connected to VIA land 18a via through hole 20d. In this way, signal pattern 17
and 18, the signal layers are connected in units of two layers, 11 and 16. On the other hand, signal patterns 31, 32, and 33 are arranged on the signal layer 12 as shown in the figure. As in the case of the signal layer 11, a signal pattern 33 is interposed between the VIA lands 31a and 32a of the patterns 31 and 32. Therefore, also in this case, the VIA land 31a is directly connected to the VIA land 34a of the signal layer 15 via the through hole 20b, and the VIA land 34a is directly connected to the VIA land 34a of the signal layer 15.
a is connected to VIA land 34 via signal pattern 34
connected to b. And VIA Land 34b is
VIA land 32 via through hole 20c
connected directly to a. In this way, the signal patterns 31 and 32 are also similar to the signal patterns 17 and 1.
Similarly to the case of 8, the signal layer is 12 and 15.
Connections are formed layer by layer. Now, in the case of this embodiment, the blocks of signal patterns 17 and 18 and 3
Blocks 1 and 32 originally constitute one circuit, but they are divided into two blocks based on signal A transmitted to signal pattern 17 and signal B transmitted to signal pattern 31. It is what was done. By distinguishing into two blocks in this way, the signal patterns (17 and 18, 31 and 32) in each block can be simplified and connected in units of two signal layers. Although not shown, these two blocks can be simply connected in units of two layers, forming one circuit as a whole. Therefore, according to this embodiment, by forming such a signal pattern in units of two layers, it is possible to easily and accurately inspect the signal pattern constituting the circuit as a product for each two layers. . Also,
When creating a pattern drawing, draw a single draft drawing using two colored pencils (for example, red and blue), color-coded for each of the two signal layers (for example, signal layers 11 and 15). Based on this, pattern drawings for each signal layer can be easily created. Since this pattern drawing always consists of two sheets, it is necessary to visually check (inspect) whether the wiring and connection conditions between the signal patterns in each signal layer match the original circuit drawing.
This work can be done extremely easily and accurately by superimposing only two pattern drawings and comparing them with each other. Therefore, the occurrence of check errors can be almost completely prevented, the quality of pattern wiring can be improved, and pattern design can be simplified.

(g) Effects of the Invention As explained in detail above, the hand-designed multilayer printed board of the present invention forms a signal pattern in units of two layers and configures a circuit using this, thereby forming a circuit in the signal layer. It is possible to simplify the configuration of the signal pattern, simplify the inspection of signal pattern wiring and connection status at the pattern design stage and product stage, and improve the quality of pattern wiring. There are some great effects.

[Brief explanation of drawings]

FIG. 1 is a diagram schematically showing a conventional hand-designed multilayer printed board (in this case, a six-layer structure) (however, the insulating layer or prepreg layer is omitted and only the conductor layer is shown).
FIG. 2 is a diagram schematically showing a hand-designed multilayer printed board (in this case, a six-layer structure) of the present invention (however, the insulating layer or prepreg layer is omitted and only the conductor layer is shown). In the figure, numeral 30 indicates a means-designed multilayer printed board of the present invention, numerals 11 to 16 indicate conductor layers, among which 11, 12, 15, and 16 are signal layers, 13 is a power layer (feeding layer), and 14 is a Indicates the earth layer, 17,1
8, 19, 23, 31, 32, 33, 34 indicate signal patterns, 17a, 18a, 23a, 23
b, 31a, 32a, 34a, and 34b indicate VIA lands, and A and B indicate signals A and B, respectively.

Claims (1)

[Claims] 1 The circuit in a single signal layer, which is a constituent unit of a multilayer printed circuit board having three or more signal layers, is divided into at least two blocks as necessary, and each signal pattern of each of these divided blocks is divided into two parts. one of the divided signal patterns is applied to the first single signal layer, and the remaining signal pattern is applied to the second single signal layer to obtain the signals of the two divided parts. 1. A hand-designed multilayer printed board characterized in that the patterns are connected to each other via through holes so that the signal patterns of each block are formed in units of two layers.