JPH0253173B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting device for electronic components, and particularly for illuminating the background side of electronic components attached to a mounting head.
The present invention relates to an improved electronic component mounting device that makes the image of the electronic component clear, accurately recognizes the image, and accurately mounts the chip electronic component on a circuit board.

Electronic component 1 as shown in FIGS. 1a and 1b
are sequentially conveyed by a tape 2 shown in FIG. 2, and vacuum-adsorbed by a mounting head 10.

Next, the electronic component is transferred in a suctioned state to an illumination position, where it is illuminated and recognized by the line scan camera 23, and its relative position and directional deviation with respect to the mounting head 10 is determined. After correcting the position and direction by this deviation, the electronic component 1 is mounted on the circuit board 15 at a predetermined position. Therefore, the electronic component 1 is connected to the circuit board 15.
In order to correctly imposition the electronic component 1 at a predetermined position, the recognition of the electronic component 1 by the line scan camera 23 must be accurate. However, in the conventional technology, the reflectance of the surface of the electronic component 1 is not constant, and
Due to the uneven shape of the peripheral edge of the electronic component 1, it is difficult to accurately grasp the image thereof, which has the drawback of impairing the imposition accuracy of the electronic component 1.

That is, the electronic component 1 in FIG. 1a shows a resistor or a capacitor, and the electronic component 1 in FIG. 1b shows a mini-mold transistor. These electronic components 1 without lead wires are housed in a tape 2 as shown in FIGS. 2 and 3. Electronic parts 1,
1', 1'', 1, etc. are sequentially stored one by one in the recess 30 of the tape 2 as shown in FIG.
19'', 19, 19''''', etc., and the sprocket 9 is engaged with the sprocket 9 and transferred.

As shown in FIG. 4, the tape 2 is a base tape 2 that forms a recess 30 in which the electronic component 1 is housed.
, an upper tape 2' and a lower tape 2'' attached to the upper and lower sides of the base tape 2. Furthermore, between the electronic component 1 and the recess 30, the electronic component 1 is
A gap is formed to facilitate removal of the electronic component 1, and the electronic component 1 can move freely within the gap within the recess 30.

Next, as shown in FIG.
is wound, and the reel 3 is pivotally attached to a shaft 5 of a reel holder 4 mounted on a base 31. The tapes 2 are provided facing each other, and the tapes 2
It is inserted into the gap between the guide base 6 and the guide plate 7, which form a gap through which the guide base 6 and the guide plate 7 can pass, and is intermittently fed by the sprocket 9 at a constant pitch through the feed holes 19, etc. Note that the guide base 6, guide plate 7, sprocket 9, etc. are each supported on the base 31 side by means not shown. The upper tape 2' of the tape 2 is peeled off at the exit end of the guide plate and wound around the winding lead wire 8 which is also supported on the base 31 side.

The mounting head 10 is positioned at a position A above the outlet end of the guide plate 7, is pivotally attached to the slide base 11, and is rotated by a DC servo motor A24. Further, the slide base 11 is supported by the slide shafts 13, 13', and is moved in the screw feeding direction by a feed screw A12 connected to the motor 14. In addition, the slide shaft 13,
13' is also supported on the base 31 side by means not shown. An XY table 16 that supports a circuit board 15 is provided below position B on the end side of the slide base 11 in the screw feeding direction. XY
The table 16 is supported by the base 31, and
It can be moved in the X direction or the Y direction by DC servo motors B18 and C32 and feed screws B18a and C32a connected to these, and supports the circuit board 15 via holders 17 and 17'. There is.

Further, a line scan camera 23 is provided at a position C between positions A and B to recognize the electronic component 1 vacuum-adsorbed on the mounting head 10. That is, a suction nozzle 22 inserted into the shaft portion 33 (FIG. 5) is provided on the tip side of the mounting head 10, and the electronic component 1 suctioned by the suction nozzle 22 is illuminated by light sources 25 and 25'. and is recognized by the line scan camera 23 provided below the electronic component 1.

Now, the electronic components 1 that have been sequentially transferred by the sprocket 9 are picked up by the mounting head 10 waiting at position A as described above. After that,
As described above, the position C is recognized, and the relative position and direction of the electronic component 1 with respect to the mounting head 10 are determined. That is, as shown in FIG. 6, since the electronic component 1 can move within the recess 30, it is often housed with deviations in the X and Y directions and in the direction of rotation thereof. Therefore, the electronic component 1 is attracted with a deviation from the center of the mounting head 10 in the X and Y directions and in the direction of rotation thereof. The line scan camera 23 accurately detects this deviation by means not shown. A recognition signal from the line scan camera 23 is inputted to the DC servo motor A24, DC servo motor B18, and DC servo motor C32 by a control means (not shown), and the XY table 16 and the mounting head 10 are corrected by the amount of deviation. Next, load head 1
0 is located at position B, the electronic component 1 is released from the suction nozzle 22, and the electronic component 1 is placed on the circuit board 15 at a predetermined position.

However, the electronic component 1 is as shown in FIGS. 1a and 1b, and the reflectance of its surface is not always constant in many cases. In particular, the above-mentioned illumination 2 is applied to components with high reflectivity, such as the solder parts 34 of the electronic component 1 in FIG. 1a and the lead terminals 35 in FIG. 1b.
When 5 and 25' are illuminated, the electronic component 1 causes halation, making it difficult for the line scan camera 23 to accurately recognize the image of the electronic component 1. Furthermore, if the peripheral edge of the electronic component 1 is formed in an uneven shape or has a tapered portion, the outer edges of the image and the real thing will not match, making it difficult to accurately determine the amount of deviation. Therefore, an error occurs in the correction value by the line scan camera 23, and the circuit board 1
5, the electronic component 1 was mounted off the pattern on the circuit board 15, causing problems such as connection failures and adjacent patterns. .

The present invention was devised to solve the above-mentioned problems, and its purpose is to provide an electronic component mounting device that can clearly recognize images of chip components and that can accurately imprint them on predetermined positions on circuit boards. It is about providing.

In order to achieve the above object, the device of the present invention includes a supply section for supplying electronic components, a mounting head for sucking electronic components from the supply section at a tip end, and the mounting head is provided with: A reflective surface located closer to the mounting head than the electronic component attracted to the nozzle tip, and a reflective surface located closer to the mounting head than the electronic component attracted by the nozzle tip, an illumination means for illuminating a surface; and a visual recognition means provided opposite to the mounting head and facing the electronic component in order to recognize the position and direction of the electronic component attracted by the mounting head by a silhouette. and a control means for controlling the mounting of the electronic component on the board by correcting the relative position between the board and the electronic component based on the position and direction of the electronic component recognized by the visual recognition means. It is something.

Hereinafter, one embodiment of the present invention will be described based on the drawings.

First, an overview of the embodiment will be explained with reference to FIGS. 7 and 8.

As shown in FIG. 7, a shaft portion 33 and a suction nozzle 22 having a smaller diameter than the shaft portion 33 are formed on the distal end side of the mounting head 10, and a stepped portion 33a is formed. The electronic component 1 picked up from the tape 2 is sucked at the tip of the suction nozzle 22 . The stepped portion 33a forms a flat surface and is made of the same material with uniform reflectance.

A plurality of lighting devices 3 are installed around the mounting head 10.
6 is provided. The light source 37 of the illumination device 36 is connected to the mounting head 1 by means of feed screws D39 and E42.
The light source 37 is movable in the longitudinal direction and the radial direction thereof, and its optical axis angle is also variable by rotating the light source 37 around the support pin 45.
The light from the light source 37 does not directly illuminate the chip electronic component 1, but is first illuminated toward the stepped portion 33a, and after being reflected, is illuminated in contact with the peripheral edge of the chip electronic component 1. Therefore, the electronic component 1 is illuminated only from its back side, and the image of the electronic component 1 can be accurately grasped as a silhouette.
Therefore, the position and direction of the electronic component 1 can be accurately recognized by the line scan camera 23 provided facing the electronic component 1.

Examples will be described in more detail below.

As mentioned above, the mounting head 10 has a cylindrical shaft portion 3.
The DC
It can be driven in the rotational direction by a servo motor A24. A stepped portion 33a (FIG. 7) is formed at the boundary between the shaft portion 33 and the suction nozzle 22.
The stepped portion 33a described above forms a flat surface and is made of a uniform material with the same reflectance. Therefore, when light hits the stepped portion 33a, a uniform reflected light beam is formed, and the same function is achieved as if a light source were located at the stepped portion 33a.

A plurality of lighting devices 36 are provided around the mounting head 10 so as to surround it. Lighting device 3
The base 43 of No. 6 is placed on the base 31, and the base 43 is provided with a feed screw E42 extending in the longitudinal radial direction of the mounting head 10. This rotating means A44 is connected to the feed screw E42. Feed screw E4
A feed base 41 is screwed onto and supported by 2 so as to be screw-feedable. The feed base 41 is provided with a feed screw D39 extending in the longitudinal direction of the loading head 10, and the feed screw D39 is provided with a rotating means B40.
is connected. Further, a light source support stand 38 is threadedly supported by the feed screw D39. Light source support stand 38
A light source 37 is pivotally mounted above the support pin 37 .

With the above configuration, the light source 37 of the illumination device 36 can rotate around the support pin 45 to change the optical axis direction, and the feed screw D39 and the feed screw E42
can be moved in the longitudinal direction and the longitudinal radial direction of the loading head 10 by rotating it by the rotating means B40 and the rotating means A44.

Therefore, the electronic component 1 that is attracted to the suction head 22
By adjusting the position and optical axis of the light source 37 according to the shape of the stepped part 33, the light from the light source 37 is directed to the stepped part 33.
After being reflected at a, the light can be illuminated through the periphery of the electronic component 1. Due to the above,
The electronic component 1 can be illuminated only from its back side, and the image can be made to stand out clearly.

Next, the operation of the embodiment will be explained with reference to FIG.
In the figure, the same reference numerals as in FIG. 2 indicate the same parts or the same functions.

The chip electronic component 1 housed on the tape 2 is sucked at position A by the suction nozzle 22 of the mounting head 10. Next, attach the slide base 11 to the motor 1
4, electronic component 1 moves to position C.
will be transferred to. At position C, an illumination device 36 is installed surrounding the mounting head 10, and a line scan camera 23 is also installed. As described above, the electronic component 1 is illuminated from the back side by the light from the light source 36, and is recognized by the line scan camera 23, so that the amount of deviation from the mounting head 10 can be accurately determined. As mentioned above, the measured value of this amount of deviation is determined by the DC servo motor A24 of the mounting head 10, the DC servo motor B18 of the XY table 16,
The position of the electronic component 1 and the circuit board 15 is corrected by inputting it to the DC servo motor C32 and rotating these components by the amount of deviation. next,
The electronic component 1 is transferred to position B, where the mounting head 10 is directed downward in its longitudinal direction, positions the electronic component 1 on the circuit board 15, and releases the suction of the suction nozzle 22 to perform imposition. Thereafter, the same process is repeated to perform imposition of the electronic components 1 that are sent one after another.

In the above embodiment, the stepped portion 33a of the mounting head 10 was used as a direct reflection surface; however, this stepped portion 33a
A plate with uniform reflectance may be attached to the surface and used as a reflective surface. Further, although the lighting device 36 in this example is of a variable type, it may be of a fixed type if the shape of the electronic component 1 does not change much.
Furthermore, it goes without saying that the variable means described above is not limited to the embodiments.

As is clear from the above description, the mounting apparatus of the present invention has the advantage that images of electronic components can be clearly recognized and electronic components can be imprinted at predetermined positions on a circuit board with high precision.

[Brief explanation of the drawing]

1a and 1b are perspective views showing electronic components, FIG. 2 is a side view showing a conventional electronic component recognition means and mounting structure for imposition thereof, and FIG. 3 is a perspective view showing electronic components. FIG. 4 is a cross-sectional view showing the cross section of the table taken along the - line arrow in FIG. 6; FIG. 5 is a partial side view showing a conventional lighting method for electronic components; FIG. 6 is a perspective view showing the taped state; 7 is an explanatory view showing a state in which electronic components are housed in the tape, FIG. 7 is a partial side view showing an illumination device and illumination method according to an embodiment of the present invention, and FIG. 8 is a recognition means for chip components according to an embodiment. FIG. 3 is a side view showing a mounting structure for imposition thereof. 1...Electronic component, 2...Tape, 10...Mounting head, 15...Circuit board, 16...XY table, 22
...Suction nozzle, 23...Line scan camera, 3
DESCRIPTION OF SYMBOLS 1... Base, 33... Shaft part, 36... Lighting device, 37...
light source.

Claims (1)

[Claims] 1. A mounting device for electronic components that optically recognizes the position and direction of an electronic component and mounts the electronic component on a board after correcting the position or direction, comprising: a supply unit that supplies the electronic component; A mounting head that sucks electronic components from a supply section with the tip of a nozzle having a smaller cross-sectional area than the electronic component, and a mounting head that is provided on the mounting head and is located closer to the mounting head than the electronic components that are sucked to the nozzle tip. a reflective surface that illuminates the reflective surface such that the illumination light passes through the peripheral edge of the electronic component that is attracted to the electronic component that has been attracted by the mounting head; visual recognition means provided opposite the mounting head and facing the electronic component in order to recognize the position and direction of the electronic component by silhouette; and the position and orientation of the electronic component recognized by the visual recognition means. An electronic component mounting apparatus comprising: control means for correcting a relative position between a board and the electronic component based on the above, and controlling the electronic component to be mounted on the board.