JPH0259962B2 - - Google Patents
Info
- Publication number
- JPH0259962B2 JPH0259962B2 JP8061483A JP8061483A JPH0259962B2 JP H0259962 B2 JPH0259962 B2 JP H0259962B2 JP 8061483 A JP8061483 A JP 8061483A JP 8061483 A JP8061483 A JP 8061483A JP H0259962 B2 JPH0259962 B2 JP H0259962B2
- Authority
- JP
- Japan
- Prior art keywords
- monomer
- substrate
- transparent gel
- light guide
- refractive index
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000178 monomer Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 61
- 230000003287 optical effect Effects 0.000 claims description 20
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 13
- 239000000057 synthetic resin Substances 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 4
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SYFOAKAXGNMQAX-UHFFFAOYSA-N bis(prop-2-enyl) carbonate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.C=CCOC(=O)OCC=C SYFOAKAXGNMQAX-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PIPBVABVQJZSAB-UHFFFAOYSA-N bis(ethenyl) benzene-1,2-dicarboxylate Chemical compound C=COC(=O)C1=CC=CC=C1C(=O)OC=C PIPBVABVQJZSAB-UHFFFAOYSA-N 0.000 description 1
- FWICIOVOJVNAIJ-UHFFFAOYSA-N bis(ethenyl) benzene-1,3-dicarboxylate Chemical compound C=COC(=O)C1=CC=CC(C(=O)OC=C)=C1 FWICIOVOJVNAIJ-UHFFFAOYSA-N 0.000 description 1
- IHXBXGHGYCSRAP-UHFFFAOYSA-N bis(ethenyl) benzene-1,4-dicarboxylate Chemical compound C=COC(=O)C1=CC=C(C(=O)OC=C)C=C1 IHXBXGHGYCSRAP-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
- KJWHEZXBZQXVSA-UHFFFAOYSA-N tris(prop-2-enyl) phosphite Chemical compound C=CCOP(OCC=C)OCC=C KJWHEZXBZQXVSA-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、合成樹脂から成る透明な基板中にこ
の基板よりも大きい屈折率を有する導光路を形成
するに際し、この導光路が光の進行方向に垂直な
断面内で光軸から周辺に向かつて連続的に減少す
る屈折率分布をもつようにした合成樹脂光回路の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for forming a light guide path in a transparent substrate made of synthetic resin, which has a refractive index larger than that of the substrate, in a cross section perpendicular to the direction in which light travels. The present invention relates to a method of manufacturing a synthetic resin optical circuit having a refractive index distribution that continuously decreases from the optical axis toward the periphery.
分岐・合流、分波・合波など種々の光信号処理
機能をもつた光回路は、光通信用の周辺デバイス
等に極めて有用である。上述のような合成樹脂光
回路を製造する場合、第1図に示すように、屈折
率がNaの網状重合体(共重合体を含む)Paを生
成する単量体(単量体混合物を含む)Maを一部
重合させて透明なゲル状の基板10をつくり、こ
の基板10の表面に形成すべき導光路の平面パタ
ーンに合せた溝11を残して感光性樹脂の塗布等
によりマスク12を施し、この溝11を通して基
板中に上記屈折率Naよりも大きな屈折率Nbを有
する重合体(共重合体を含む)Pbを形成する単
量体Mb(単量体混合物を含む)を拡散及び重合
させて、細長い導光路13を形成する方法が知ら
れている。 Optical circuits with various optical signal processing functions such as branching, merging, demultiplexing, and multiplexing are extremely useful as peripheral devices for optical communications. When manufacturing a synthetic resin optical circuit as described above, as shown in Fig. ) A transparent gel-like substrate 10 is made by partially polymerizing Ma, and a mask 12 is formed by applying photosensitive resin or the like, leaving grooves 11 that match the planar pattern of the light guide to be formed on the surface of this substrate 10. Then, through this groove 11, a monomer Mb (including a monomer mixture) to form a polymer (including a copolymer) Pb having a refractive index Nb larger than the refractive index Na is diffused and polymerized into the substrate. There is a known method of forming an elongated light guide path 13 in this way.
また他の方法として、第2図に示すように、上
記と同様に単量体Maを用いてゲル状透明基板1
4をつくり、この基板面の導光路部分に限定して
マスク15を施し、周辺から基板14と重合して
Naよりも小さい屈折率Nbの重合体をつくるよう
な単量体Mbを拡散させて、マスク15直下の基
板中に導光路16をつくる方法もある。 As another method, as shown in FIG.
4 is made, a mask 15 is applied only to the light guide path portion of this substrate surface, and the mask 15 is overlapped with the substrate 14 from the periphery.
There is also a method of creating the light guide path 16 in the substrate directly under the mask 15 by diffusing a monomer Mb that forms a polymer with a refractive index Nb smaller than that of Na.
ところが、上述した様な第1図及び第2図に示
す従来方法では、単量体Mbの拡散を妨げる為に
設けられるマスク12,15とゲル基板10,1
4との密着性が余程良好でない限り、単量体Mb
がマスクとゲル基板との間に侵入してゲル基板の
表面全体に拡散してしまうので、屈折率分布をも
つた導光路を形成することができないという問題
をしばしば生じていた。 However, in the conventional method shown in FIGS. 1 and 2 as described above, masks 12, 15 and gel substrates 10, 1 provided to prevent the diffusion of monomer Mb
Unless the adhesion with 4 is very good, monomeric Mb
This often causes the problem that it is impossible to form a light guide path with a refractive index distribution because it enters between the mask and the gel substrate and diffuses over the entire surface of the gel substrate.
本発明は上記従来の問題点を解決し、屈折率分
布をもつ導光路を形成するようにした合成樹脂光
回路の製造に際しマスクとゲル基板との密着性の
問題を回避し得る新規な合成樹脂光回路の製造方
法を提供することを目的としている。 The present invention solves the above-mentioned conventional problems and provides a new synthetic resin that can avoid the problem of adhesion between a mask and a gel substrate when manufacturing a synthetic resin optical circuit in which a light guide path with a refractive index distribution is formed. The purpose of this invention is to provide a method for manufacturing an optical circuit.
すなわち、本発明に係る合成樹脂光回路の製造
方法は、屈折率がNaの網状重合体Paを生成する
1種または2種以上の単量体Maを不完全に重合
させて透明なゲル状の基板を形成し、この透明ゲ
ル基板中に、Naとは異なる屈折率Nbを有する重
合体Pbを生成する1種または2種以上の単量体
Mbを拡散・浸透させ、前記透明ゲル基板の表面
領域に部分的硬化処理を施して、形成すべき導光
路のパターンに合わせた硬化部および未硬化部を
前記表面領域に形成し、前記透明ゲル基板の前記
硬化処理が施された側の表面を介して、主として
前記未硬化部およびこの未硬化部に対応した前記
透明ゲル基板の内部の前記単量体Mbを除去し、
これによつて、前記硬化部の近傍における前記透
明ゲル基板内に前記単量体Mbが連続的に変化す
る濃度勾配でもつて残留している状態を形成し、
この状態において前記単量体MaおよびMbの重
合を完結させることからなつている。なお、本発
明でいう重合は共重合も含んでいるものとする。 That is, the method for producing a synthetic resin optical circuit according to the present invention involves incompletely polymerizing one or more monomers Ma that produces a network polymer Pa having a refractive index of Na to produce a transparent gel-like polymer. One or more monomers forming a substrate and forming a polymer Pb having a refractive index Nb different from that of Na in this transparent gel substrate.
Diffuse and permeate Mb, perform a partial hardening treatment on the surface area of the transparent gel substrate, form a cured part and an uncured part in the surface area in accordance with the pattern of the light guide to be formed, and Mainly removing the uncured portion and the monomer Mb inside the transparent gel substrate corresponding to the uncured portion via the surface of the substrate on which the curing treatment has been performed;
By this, a state is formed in which the monomer Mb remains in the transparent gel substrate in the vicinity of the cured portion even with a concentration gradient that continuously changes,
In this state, the polymerization of the monomers Ma and Mb is completed. Note that the term "polymerization" as used in the present invention includes copolymerization.
上述したように本発明においては、透明ゲル基
板の表面に形成された硬化部分を単量体Mbを除
去する際におけるいわばマスクとして用いること
によつて、単量体Mbが上述したような状態で基
板内に残留することになる。この硬化部分は透明
ゲル基板と一体のものであるから、第1図および
第2図に示したような従来例におけるマスクと透
明ゲル基板との間の密着性は問題にならない。し
たがつて所望の屈折率分布をもつた導光路が基板
内に形成できる。 As described above, in the present invention, by using the hardened portion formed on the surface of the transparent gel substrate as a so-called mask when removing monomer Mb, monomer Mb is kept in the above-mentioned state. It will remain inside the board. Since this hardened portion is integrated with the transparent gel substrate, the adhesion between the mask and the transparent gel substrate in the conventional example shown in FIGS. 1 and 2 is not a problem. Therefore, a light guide path having a desired refractive index distribution can be formed within the substrate.
本発明に係る方法において単量体Maとして
は、重合したときに透明な網状重合体となるもの
であればいずれも使用可能であり、1分子内に開
裂して架橋を形成しうる二重結合を2個以上有す
る1種または2種以上の化合物が用いられてよ
い。この好適例としては、ジアリルフタレート、
ジアリルイソフタレート、ジアリルテレフタレー
ト、ジエチレングリコールビスアリルカーボネー
トの如きジアリルエステル;トリメリト酸トリア
リル、リン酸トリアリル、亜リン酸トリアリルの
如きトリアリルエステル;メタクリル酸アリル、
アクリル酸アリルの如き不飽和酸アリルエステ
ル;フタル酸ジビニル、イソフタル酸ジビニル、
テレフタル酸ジビニルの如きビニルエステルを挙
げることができる。 In the method according to the present invention, any monomer Ma can be used as long as it forms a transparent network polymer when polymerized, and any double bond that can be cleaved into one molecule to form a crosslink can be used. One or more compounds having two or more may be used. Suitable examples include diallyl phthalate,
diallyl esters such as diallyl isophthalate, diallyl terephthalate, diethylene glycol bisallyl carbonate; triallyl esters such as triallyl trimellitate, triallyl phosphate, triallyl phosphite; allyl methacrylate;
Unsaturated acid allyl esters such as allyl acrylate; divinyl phthalate, divinyl isophthalate,
Mention may be made of vinyl esters such as divinyl terephthalate.
なお本発明の網状重合体Paは、上述した如き
単量体Maの1種を重合して得られるホモポリマ
ー、及びこれらの単量体の2種以上から得られる
共重合体、並びにこれら単量体Maとスチレン、
メタクリル酸エステル、安息香酸ビニルなどの如
き単量体との共重合体を含んでいる。また、この
網状重合体PaはNaの屈折率を有しているものと
する。 The network polymer Pa of the present invention includes a homopolymer obtained by polymerizing one type of monomer Ma as described above, a copolymer obtained from two or more of these monomers, and a copolymer obtained from two or more of these monomers. Body Ma and styrene,
Contains copolymers with monomers such as methacrylic acid esters and vinyl benzoate. Further, it is assumed that this network polymer Pa has a refractive index of Na.
本発明ではまず、上述した単量体Maを重合さ
せて透明なゲル状の基板を作製する。単量体Ma
の重合は、重合体が流動性を失つた透明なゲルと
なつたところで、すなわち重合未完の状態で一旦
中止される。この重合を所定の形状を有する型や
枠中で行えばゲル基板の成形が同時に行える。次
いで得られたゲル基板に、Naとは異なる屈折率
Nbを有する重合体を生成する単量体Mbを拡散・
浸透させる。 In the present invention, first, the monomer Ma described above is polymerized to produce a transparent gel-like substrate. monomeric Ma
The polymerization is temporarily stopped when the polymer loses fluidity and becomes a transparent gel, that is, when the polymerization is not completed. If this polymerization is carried out in a mold or frame having a predetermined shape, the gel substrate can be formed at the same time. The resulting gel substrate is then coated with a refractive index different from that of Na.
Diffusion of monomer Mb to produce a polymer with Nb
Let it penetrate.
この過程で使用する単量体Mbとしては、重合
したときに、線形重合体となるものであつても網
状重合体となるものであつてもよいが、前述した
単量体Maと共重合して透明な共重合体を生成し
うるものが好ましい。このような単量体Mbとし
て、スチレン、メタクリル酸エステル、アクリル
酸エステル、酢酸ビニル、塩化ビニル、アクリロ
ニトリル、ブタジエンまたはこれらのうちの2種
以上からなる混合物が好適に使用できる。 The monomer Mb used in this process may be one that becomes a linear polymer or a network polymer when polymerized, but it may be one that becomes a linear polymer or a network polymer when polymerized. Preferably, those that can be used to produce a transparent copolymer. As such monomer Mb, styrene, methacrylic ester, acrylic ester, vinyl acetate, vinyl chloride, acrylonitrile, butadiene, or a mixture of two or more of these can be suitably used.
次に、単量体Mbを拡散させた前記透明ゲル基
板の表面において、場所的に不均一な重合条件を
与えて表面領域のみを選択的に硬化させる。場所
的に不均一な重合条件としては、局部加熱、光照
射、電子線照射などが用いられ得るが、これらの
内で、可式光線および/または紫外線の照射が方
法の簡便さという点では最適であろう。なお、必
要であれば、単量体Maおよび/または単量体
Mbに、熱重合開始剤、光重合開始剤、光増感剤
などを添加しておくこともできる。 Next, on the surface of the transparent gel substrate on which monomer Mb has been diffused, locally non-uniform polymerization conditions are applied to selectively harden only the surface region. Local heating, light irradiation, electron beam irradiation, etc. can be used as locally non-uniform polymerization conditions, but among these, irradiation with visible light and/or ultraviolet rays is the most convenient method. Will. In addition, if necessary, monomer Ma and/or monomer
A thermal polymerization initiator, a photopolymerization initiator, a photosensitizer, etc. can also be added to Mb.
このように場所的に不均一な重合条件を与えて
表面領域を硬化することによつて、硬化部と未硬
化部とにより所定のパターンが形成されるように
する。硬化部と未硬化部とによるパターンは、形
成すべき光回路の導光路の形状、大きさ、位置、
NaとNbとの大小関係などに依つて決定される。
例えばNa<Nbの場合には、表面領域の硬化部は
光回路の導光路を形成しようとする部分に対応
し、Na>Nbの場合には逆に未硬化部が対応す
る。 By curing the surface region by applying locally non-uniform polymerization conditions in this manner, a predetermined pattern is formed by the cured portions and uncured portions. The pattern of cured and uncured parts depends on the shape, size, position, and shape of the light guide path of the optical circuit to be formed.
It is determined depending on the magnitude relationship between Na and Nb.
For example, when Na<Nb, the hardened portion of the surface region corresponds to a portion where the light guide path of the optical circuit is to be formed, and conversely, when Na>Nb, the uncured portion corresponds.
次いで、未硬化部及び基板内部に拡散している
未重合の単量体Mbを、前記透明ゲル基板のパタ
ーンを形成した表面を介して除去する。除去する
方法としては、単量体Mbの溶解能をもつ溶剤に
浸漬する方法、減圧して気化させる方法、前者の
後に後者を行なう方法など、種々採用しうる。こ
の様な方法で前記透明ゲル基板から単量体Mbを
取り除く操作を行つた場合、この工程の前段階に
おいて硬化させた部分を通つて内部の単量体Mb
が抜けて行くことは困難であり、主として未硬化
部及びその内部の単量体Mbが未硬化部を通つて
抜け出て行く。この現象に依つて単量体Mbの濃
度分布が硬化部の近傍における透明ゲル基板内に
生じることになる。この様にして単量体Mbの濃
度分布を透明ゲル基板内に形成した後に、単量体
Mbの分布を固定化することにより、上記した様
な光回路の導光路を合成樹脂基板内に形成するこ
とができる。 Next, the unpolymerized monomer Mb diffused into the uncured portion and inside the substrate is removed through the patterned surface of the transparent gel substrate. Various methods can be used for removal, such as immersion in a solvent capable of dissolving monomer Mb, vaporization under reduced pressure, and performing the latter after the former. When monomer Mb is removed from the transparent gel substrate using this method, the monomer Mb inside is removed through the part that was cured in the previous step of this process.
It is difficult for Mb to escape, and mainly the uncured portion and the monomer Mb inside thereof escape through the uncured portion. Due to this phenomenon, a concentration distribution of the monomer Mb is generated in the transparent gel substrate in the vicinity of the cured portion. After forming the monomer Mb concentration distribution in the transparent gel substrate in this way, the monomer Mb
By fixing the distribution of Mb, the light guide path of the optical circuit as described above can be formed in the synthetic resin substrate.
次に本発明を図面に示した実施例に基づいて詳
細に説明する。 Next, the present invention will be described in detail based on embodiments shown in the drawings.
まず第3図イに示す様に型枠18,19中で屈
折率Naの網状重合体Paを生成する単量体Maを
重合させて透明ゲル基板17をつくる。次に、こ
の透明ゲル基板17の表面に屈折率Nbの重合体
Pbを生成する単量体Mbを液相や気相で接触さ
せ、第3図イに示す様に、透明ゲル基板17の表
面全体から単量体Mbを拡散させる。このとき、
単量体Mbを拡散させる際の温度が高いほど単量
体Mbの拡散速度は大きいが、単量体Mbが単独
で重合したり、単量体Maと共重合したりする温
度より低い温度に設定される。次に、第3図ロに
示す様に、単量体Mbを拡散させた透明ゲル基板
17表面に光を遮蔽する為の遮光マスク20を乗
せて光を照射する。マスク20の幅R1は第3図
ハに示した様な硬化部間にあいた細長い溝(未硬
化部)21の幅R2に等しくなるが、これは第3
図ニに示した導光路部22の幅R3よりもかなり
小さくしておいた方が好ましい。照射する光は、
通常の光硬化性樹脂に用いられる紫外線が好まし
い。光照射に依つて第3図ハに示す様に、硬化部
23が形成される。硬化部23の厚みは、単量体
Mbが容易に透過しない程度に厚くなければなら
ないが、その条件を満たす限りにおいて薄い方が
好ましい。硬化部23にある幅R2の溝21から
次の工程で単量体Mbを除去するが、形成しよう
としている導光路の幅R3よりもR2が充分小さ
くなければ、単量体Mbの等濃度曲線はこの部分
で透明ゲル基板17の表面と平行になり、断面が
同心円の円柱状にならない。単量体Mbを除去す
る方法としては、単量体Mbが単量体Maよりも
はるかに揮発し易いものである場合には減圧する
だけで良く、揮発性が似かよつている場合には、
溶解性の異なる溶剤に浸漬する方法が採られてよ
い。どうしても単量体Maと単量体Mbがほゞ等
量で抜けてしまう場合には、単量体Mbの濃度分
布は既に基板内に形成されているので、重合を完
結させる際に透明ゲル基板17を単量体Maに接
触させておけば、抜け出たことによる単量体Ma
の不足が補われて重合時の収縮を緩和することが
できる。単量体Mbを溝21を介して除去する事
に依つて形成された単量体Mbの濃度分布を固定
する為に重合を完結させ、次いで表面を研磨すれ
ば、第3図ニに示す様な断面を有する細長い導光
路部22が形成された透明合成樹脂光回路24が
完成する。導光路部22の幅R3は硬化部23の
溝21の幅R2(=遮光マスクの幅R1)、透明
ゲル基板17の架橋密度、単量体Mb除去条件な
どに影響される。この例ではNaとNbの大小関係
はNa>Nbである。 First, as shown in FIG. 3A, a transparent gel substrate 17 is prepared by polymerizing a monomer Ma that produces a network polymer Pa having a refractive index Na in molds 18 and 19. Next, a polymer with a refractive index of Nb is coated on the surface of this transparent gel substrate 17.
The monomer Mb that generates Pb is brought into contact with it in a liquid phase or gas phase, and the monomer Mb is diffused from the entire surface of the transparent gel substrate 17 as shown in FIG. 3A. At this time,
The higher the temperature at which monomer Mb is diffused, the higher the diffusion rate of monomer Mb, but at a temperature lower than the temperature at which monomer Mb polymerizes alone or copolymerizes with monomer Ma Set. Next, as shown in FIG. 3B, a light shielding mask 20 for shielding light is placed on the surface of the transparent gel substrate 17 in which the monomer Mb is diffused, and light is irradiated. The width R1 of the mask 20 is equal to the width R2 of the elongated groove (uncured part) 21 between the hardened parts as shown in FIG.
It is preferable to make the width R3 of the light guide path section 22 considerably smaller than the width R3 shown in FIG. The light emitted is
Ultraviolet rays used for ordinary photocurable resins are preferred. By light irradiation, a hardened portion 23 is formed as shown in FIG. 3C. The thickness of the hardened portion 23 is the same as that of the monomer.
It must be thick enough that Mb does not easily pass through it, but as long as it satisfies this condition, thinner materials are preferable. In the next step, monomer Mb is removed from the groove 21 of width R2 in the cured part 23, but if R2 is not sufficiently smaller than the width R3 of the light guide to be formed, the isoconcentration curve of monomer Mb is parallel to the surface of the transparent gel substrate 17 in this portion, and the cross section does not have a concentric cylindrical shape. As a method for removing monomeric Mb, if monomeric Mb is much more volatile than monomeric Ma, it is sufficient to simply reduce the pressure, but if the volatilities are similar,
A method may be adopted in which the material is immersed in solvents having different solubility. If monomer Ma and monomer Mb are inevitably removed in approximately equal amounts, the concentration distribution of monomer Mb has already been formed within the substrate, so when completing the polymerization, the transparent gel substrate If 17 is kept in contact with the monomer Ma, the monomer Ma
This can compensate for the lack of and alleviate the shrinkage during polymerization. By removing the monomer Mb through the groove 21, the polymerization is completed to fix the concentration distribution of the monomer Mb formed, and then the surface is polished, as shown in FIG. 3D. A transparent synthetic resin optical circuit 24 in which an elongated light guide path portion 22 having a cross section is formed is completed. The width R3 of the light guide path portion 22 is influenced by the width R2 of the groove 21 of the cured portion 23 (=width R1 of the light-shielding mask), the crosslinking density of the transparent gel substrate 17, the monomer Mb removal conditions, etc. In this example, the magnitude relationship between Na and Nb is Na>Nb.
第4図にNa<Nbである場合の実施例を示す。
本例でも前述したNa>Nbである場合と同様に、
まず型枠26,27内で屈折率Naの網状重合体
Paを生成する単量体Maを一部重合させて透明ゲ
ル基板25をつくり、屈折率Nbの重合体Pbを生
成する単量体Mbを接触させ、第4図イに示す様
にその表面全体から拡散させる。このときの温度
もMbが重合しない温度に設定される。次に、第
4図ロに示す様に、単量体Mbを拡散させた透明
ゲル基板24に導光路部に対応する部分では透光
性を有し他の部分では光を遮蔽する遮光マスク2
8を乗せ、紫外線を照射する。遮光マスク28の
透光部の幅R4は、第4図ハに示した硬化部29
の幅R5に等しくなり、これは大体第4図ニに示
した導光路部31の幅R6に等しくなる。紫外線
照射に依つて第4図ハに示す様に線状の硬化部2
9が形成される。この厚みは、単量体Mbが透過
しない限りにおいて、出来るだけ薄いことが望ま
しい。次に、透明ゲル基板25から単量体Mbを
除去する。透明ゲル基板25の表面の未硬化部3
0から単量体Mbが抜けると濃度勾配が生じ、硬
化部29の下や透明ゲル基板25の深部より単量
体Mbがそこへ移動してきて、更に新たな濃度勾
配が生じる。この様にして断面同心円状の単量体
Mbの濃度分布を形成させたあとで、それを固定
する為に重合を完結させ、次いで表面を研磨すれ
ば、第4図ニに示す様な断面を有する細長い導光
路部31の形成された合成樹脂光回路32が完成
する。導光路部31の幅R6は、ほゞ硬化部分2
9の幅R5(=遮光マスクの透光部の幅R4)に
依つて決まる。 FIG. 4 shows an example in which Na<Nb.
In this example, as in the case of Na>Nb mentioned above,
First, a reticular polymer with a refractive index of Na is formed in the formworks 26 and 27.
A transparent gel substrate 25 is made by partially polymerizing the monomer Ma that generates Pa, and the monomer Mb that generates the polymer Pb with a refractive index Nb is brought into contact with the substrate 25, and the entire surface of the substrate 25 is made to polymerize as shown in FIG. spread from. The temperature at this time is also set at a temperature at which Mb does not polymerize. Next, as shown in FIG. 4B, a transparent gel substrate 24 in which the monomer Mb is diffused is coated with a light-shielding mask 24 that is translucent in a portion corresponding to the light guide path portion and shields light in other portions.
8 and irradiate it with ultraviolet light. The width R4 of the light-transmitting part of the light-shielding mask 28 is equal to the width R4 of the hardened part 29 shown in FIG.
This is approximately equal to the width R6 of the light guide path portion 31 shown in FIG. 4D. Due to ultraviolet irradiation, a linear hardened part 2 is formed as shown in Fig. 4 (c).
9 is formed. It is desirable that this thickness be as thin as possible as long as monomer Mb does not pass through. Next, monomer Mb is removed from the transparent gel substrate 25. Uncured portion 3 on the surface of transparent gel substrate 25
When monomer Mb is removed from 0, a concentration gradient is generated, and monomer Mb moves there from below the hardened portion 29 and from the deep part of the transparent gel substrate 25, and a new concentration gradient is generated. In this way, a monomer with a concentric circular cross section
After forming the Mb concentration distribution, polymerization is completed to fix it, and then the surface is polished, resulting in the formation of an elongated light guide section 31 having a cross section as shown in FIG. 4D. The resin optical circuit 32 is completed. The width R6 of the light guide path portion 31 is approximately equal to the width of the hardened portion 2.
9 (=width R4 of the light-transmitting part of the light-shielding mask).
以上の様にして、平面導光路パターンを有した
分岐・合流回路、分波・合波回路、ミキシング回
路など所定の導光路が設けられた平板光回路を得
ることができる。 In the manner described above, it is possible to obtain a flat optical circuit provided with a predetermined light guide path, such as a branching/combining circuit, a branching/combining circuit, a mixing circuit, etc., each having a planar light guide pattern.
具体例 1
この具体例1は第3図に示す方法に従つたもの
であつて、まずジエチレングリコールビスアリル
カーボネート(CR−39)に過酸化ベンゾイル及
びベンゾフエノンを3重量%ずつ溶解させ、型に
注入して80℃で90分間加熱し、50mm×50mm×5mm
の透明ゲル基板を作製した。これを、過酸化ベン
ゾイル及びベンゾフエノンをそれぞれ3重量%ず
つ溶解させた安息香酸ビニル(VB)に浸漬し、
表面から透明ゲル基板中に拡散させた。次に、こ
の50mm×50mmの基板表面に幅0.2mmの黒線を10本
つけたフオトマスクを乗せて、超高圧水銀ランプ
で紫外線を照射したところ、フオトマスクの黒線
に対応する部分を除いた透明ゲル基板の表面が硬
化した。これをアセトン中に浸漬し、単量体を一
部溶出させてからデシケータに入れ、真空ポンプ
をつないで減圧してアセトンを揮散させた。これ
にCR−39を接触させて80℃に15時間保ち、重合
を完結させたのち、後から接触させたCR−39の
重合体より成る部分を研磨して除去した。この
CR−39とVBより成る硬化体には、太さ約1.0mm
の導光路が10本形成されていた。Specific Example 1 This specific example 1 follows the method shown in Figure 3. First, 3% by weight of benzoyl peroxide and benzophenone were dissolved in diethylene glycol bisallyl carbonate (CR-39) and poured into a mold. Heat at 80℃ for 90 minutes, and make 50mm x 50mm x 5mm.
A transparent gel substrate was prepared. This was immersed in vinyl benzoate (VB) in which benzoyl peroxide and benzophenone were each dissolved in an amount of 3% by weight,
It was diffused from the surface into the transparent gel substrate. Next, a photomask with 10 black lines of 0.2mm width was placed on the surface of this 50mm x 50mm substrate and exposed to ultraviolet light using an ultra-high pressure mercury lamp. The surface of the gel substrate was cured. This was immersed in acetone to partially elute the monomer, then placed in a desiccator, connected to a vacuum pump, and reduced pressure to volatilize the acetone. This was brought into contact with CR-39 and kept at 80° C. for 15 hours to complete polymerization, and then the portion of CR-39 that was brought into contact with the polymer was removed by polishing. this
The cured body made of CR-39 and VB has a thickness of approximately 1.0 mm.
Ten light guide paths were formed.
具体例 2
この具体例2は第4図に示す方法に従つたもの
であつて、まず、ジアリルイソフタレート
(DAIP)にベンゾイルパーオキサイド3重量%
及びベンゾフエノン4重量%を溶解し、これを型
に注入して80℃で3時間放置して50mm×50mm×5
mmの透明ゲル基板を作製した。このゲル物体の50
mm×50mmの面に、トリフロロエチルメタクリレー
ト(3FMA)を接触させてこの面全体から拡散さ
せ、これに幅3.0mmのスリツトを10本つけたフオ
トマスクを乗せて超高圧水銀ランプからの紫外線
を照射したところ、フオトマスクのスリツトに対
応する部分の透明ゲル基板表面が硬化した。次に
これをデシケータに入れ、真空ポンプをつないで
減圧し、未硬化部より3FMAの一部を除いた。こ
れを80℃で15時間保持して重合を完結させ、次い
で研磨したところ、太さ約3.0mmの導光路が10本
形成されていた。Specific Example 2 This specific example 2 follows the method shown in FIG. 4, and first, 3% by weight of benzoyl peroxide is added to diallyl isophthalate (DAIP).
Dissolve 4% by weight of benzophenone, pour this into a mold, and leave it at 80℃ for 3 hours to form a mold of 50mm x 50mm x 5.
A transparent gel substrate of mm size was prepared. 50 of this gel object
Trifluoroethyl methacrylate (3FMA) is brought into contact with a mm x 50 mm surface and diffused from the entire surface, and a photomask with 10 3.0 mm wide slits is placed on it and UV rays from an ultra-high pressure mercury lamp are irradiated. As a result, the surface of the transparent gel substrate in the area corresponding to the slit of the photomask was hardened. Next, this was placed in a desiccator, and a vacuum pump was connected to reduce the pressure, and a portion of 3FMA was removed from the uncured portion. When this was held at 80°C for 15 hours to complete polymerization and then polished, 10 light guide paths with a thickness of about 3.0 mm were formed.
第1図及び第2図はそれぞれ合成樹脂光回路の
製造方法の従来例を示す断面図であり、第3図及
び第4図はそれぞれ本発明による合成樹脂光回路
の製造方法の実施例を示す断面図である。
なお図面に用いた符号において、17,25…
透明ゲル基板、20,28…遮光マスク、21,
30…未硬化部、23,29…硬化部、22,3
1…導光路部、24,32…合成樹脂光回路であ
る。
1 and 2 are cross-sectional views each showing a conventional example of a method for manufacturing a synthetic resin optical circuit, and FIGS. 3 and 4 each show an example of a method for manufacturing a synthetic resin optical circuit according to the present invention. FIG. In addition, in the symbols used in the drawings, 17, 25...
Transparent gel substrate, 20, 28... Light shielding mask, 21,
30...Uncured part, 23,29...Cured part, 22,3
1... Light guide path section, 24, 32... Synthetic resin optical circuit.
Claims (1)
りも大きい屈折率を有する導光路を形成し、この
際、この導光路が光の進行方向に垂直な断面内で
光軸から周辺に向かつて連続的に減少する屈折率
分布をもつようにした合成樹脂光回路の製造方法
において、 (a) 屈折率がNaの網状重合体Paを生成する1種
または2種以上の単量体Maを不完全に重合さ
せて透明なゲル状の基板を形成する工程、 (b) この透明ゲル基板中に、Naとは異なる屈折
率Nbを有する重合体Pbを生成する1種または
2種以上の単量体Mbを拡散・浸透させる工
程、 (c) 前記透明ゲル基板の表面領域に部分的硬化処
理を施して、形成すべき導光路のパターンに合
わせた硬化部および未硬化部を前記表面領域に
形成する工程、 (d) 前記透明ゲル基板の前記硬化処理が施された
側の表面を介して、主として前記未硬化部およ
びこの未硬化部に対応した前記透明ゲル基板の
内部の前記単量体Mbを除去し、これによつ
て、前記硬化部の近傍における前記透明ゲル基
板内に前記単量体Mbが連続的に変化する濃度
勾配でもつて残留している状態を形成する工
程、 (e) 前記単量体Mbの前記残留状態において、前
記単量体MaおよびMbの重合を完結させる工
程、 を有することを特徴とする合成樹脂光回路の製造
方法。[Claims] 1. A light guide path having a refractive index larger than that of the substrate is formed in a transparent substrate made of synthetic resin, and in this case, the light guide path has an optical axis within a cross section perpendicular to the traveling direction of light. In a method for producing a synthetic resin optical circuit having a refractive index distribution that continuously decreases from the center to the periphery, (a) one or more monomers forming a network polymer Pa having a refractive index of Na; (b) a step of incompletely polymerizing polymer Ma to form a transparent gel-like substrate; (c) performing a partial hardening treatment on the surface area of the transparent gel substrate to form hardened portions and unhardened portions in accordance with the pattern of the light guide path to be formed; (d) forming on the surface area mainly the uncured portion and the inside of the transparent gel substrate corresponding to the uncured portion through the surface of the transparent gel substrate on which the curing treatment has been performed; removing the monomer Mb, thereby creating a state in which the monomer Mb remains in the transparent gel substrate in the vicinity of the cured portion with a concentration gradient that continuously changes; (e) a step of completing the polymerization of the monomers Ma and Mb in the residual state of the monomer Mb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8061483A JPS59204803A (en) | 1983-05-09 | 1983-05-09 | Manufacture of optical circuit of synthetic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8061483A JPS59204803A (en) | 1983-05-09 | 1983-05-09 | Manufacture of optical circuit of synthetic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59204803A JPS59204803A (en) | 1984-11-20 |
| JPH0259962B2 true JPH0259962B2 (en) | 1990-12-14 |
Family
ID=13723210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8061483A Granted JPS59204803A (en) | 1983-05-09 | 1983-05-09 | Manufacture of optical circuit of synthetic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59204803A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH081487B2 (en) * | 1988-05-31 | 1996-01-10 | 松下電器産業株式会社 | METHOD FOR CREATING OPTICAL ELEMENT HAVING PATTERN WITH DIFFERENTIAL INDEX, PATTERN TRANSFER PRODUCT AND IMAGE FORMING PRODUCT |
-
1983
- 1983-05-09 JP JP8061483A patent/JPS59204803A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59204803A (en) | 1984-11-20 |
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