JPH0311601B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Technical Field> The present invention relates to a dicing apparatus, and more particularly to a dicing apparatus for cutting a semiconductor wafer along cutting lines arranged in a grid pattern.

<Prior Art> As is well known, in the semiconductor device manufacturing process, the surface of a substantially disk-shaped semiconductor wafer is cut by a plurality of cutting lines arranged in a grid (such cutting lines are generally called streets). The circuit is divided into rectangular areas, and a required circuit pattern is applied to each of the rectangular areas. Next, the wafer is cut along the cutting lines, and thus a plurality of rectangular regions carrying circuit patterns are individually separated (the individually separated rectangular regions are generally referred to as chips). It is important to cut the wafer with sufficient precision along the cutting line, and the width of the cutting line is extremely narrow.
Generally, it is about several tens of μm.

A typical example of a conventional dicing apparatus for cutting a wafer along the above-mentioned cutting lines is the one disclosed in Japanese Patent Application Laid-Open No. 155534/1983. Such a dicing apparatus includes wafer support means selectively positioned in the cutting zone and the alignment zone. In the cutting area,
A cutting means having a rotating shaft and a cutting blade fixed thereto is arranged, and the alignment area includes:
Detection means is provided for detecting the cutting line of the wafer. The wafer support means is mounted so as to be movable between the alignment region and the cutting region, and is also rotatably mounted. In such a dicing apparatus, wafer support means, which holds the wafer placed on its surface by vacuum suction or the like, is initially present in the alignment area. In this alignment area, the detection means detects a cutting line on the surface of the wafer,
Wafer alignment is performed based on such detection. The cutting of the wafer, which is performed later, is a cutting in which the wafer supporting means supporting the wafer and the cutting means are linearly moved relative to each other in a predetermined direction extending perpendicularly to the central axis of the rotating shaft of the cutting means. Although cutting of the wafer is performed by movement, as mentioned above, it is important to perform the cutting of the wafer with sufficient precision along the cutting line. Aligning the wafer in the alignment zone includes positioning the wafer support means in position based on detection of a cut line such that a particular cut line on the surface of the wafer is sufficiently precisely aligned with the cutting path during cutting. This is accomplished by positioning. Positioning the wafer support means includes rotating the wafer support means to bring the wafer into a predetermined angular position with sufficient precision. Thereafter, the wafer support means is moved to the cutting area and cutting of the wafer is performed. In such cutting, the above-mentioned cutting movement and a pitch movement in which the wafer support means and the cutting means are linearly moved relative to each other by the distance between the cutting lines in a direction perpendicular to the cutting movement direction are performed alternately. The wafer is cut along one set of cutting lines extending parallel to the top. Then,
The wafer support means or cutting means is rotated substantially 90 degrees and said cutting movement and said pitch movement are performed again in an alternating manner, thus extending substantially parallel to each other and substantially perpendicular to said one set of cutting lines. The wafer is cut along the other set of cutting lines. When the cutting of the wafer is thus completed, the wafer support means is returned to the alignment area, the cut wafer is removed from the wafer support means, and the next wafer to be cut is placed on the wafer support means.

<Problem to be Solved> The conventional dicing apparatus as described above has a serious problem of low dicing efficiency.

That is, in conventional dicing machines, the cutting means disposed in the cutting area has only one cutting blade, and therefore, one cutting movement can cut along one cutting line. The wafer can only be cut by applying it. Therefore, in order to cut a wafer along a large number of cutting lines existing on the surface of the wafer, it is necessary to perform the above-mentioned cutting movements in a number corresponding to the number of cutting lines. It requires a considerable amount of time. Thus, in the conventional dicing apparatus, the wafer dicing efficiency is limited, and a sufficiently high dicing efficiency cannot be achieved.

<Problems to be solved by the invention> The present invention has been made in view of the above facts, and its technical problem is to appropriately cope with such changes even if the intervals between mutually parallel cutting lines change. To provide a new and superior wafer dicing device that can cut a wafer along two or more mutually parallel cutting lines with multiple cutting movements, thereby improving dicing efficiency. It is to be.

<Solution Means of the Invention> The solution means of the present invention for achieving the above technical problem is as follows: (1) If the direction of relative linear movement between the cutting means and the wafer support means is the x-axis direction, (2) disposing two rotating shafts extending in the y-axis direction perpendicular to the cutting means, and fixing a cutting blade to each of the two rotating shafts; (2) one of the rotating shafts is fixed relative to the other; (3) one of the rotating shafts is moved relatively linearly in the y-axis direction with respect to the other, so that the two cutting blades A cutting blade spacing setting means for appropriately setting the spacing in the y-axis direction is provided.

That is, according to the present invention, as a wafer dicing apparatus that achieves the above technical problem, it is a dicing apparatus for cutting a semiconductor wafer along cutting lines arranged in a grid, and includes a cutting means, a wafer supporting means, and a cutting means. The wafer supported by the wafer support means is cut by the cutting means by relatively linearly moving the cutting means and the wafer support means in a predetermined direction, the cutting means is the relative linear movement direction of the cutting means and the wafer supporting means in the x-axis direction, two rotating shafts extending in the y-axis direction perpendicular to the x-axis direction, fixed to each of the rotating shafts; and a rotating means for rotating the rotating shaft, one of the rotating shafts being mounted so as to be linearly movable relative to the other in the y-axis direction, and the cutting means There is provided a dicing apparatus, further comprising: a cutting blade interval setting means for linearly moving the one of the rotating shafts relative to the other in the y-axis direction.

<Action of the invention> In the wafer dicing apparatus of the invention,
The wafer is cut along two mutually parallel cutting lines by the two cutting blades while the cutting means and the wafer support means are moved linearly relative to each other, thus greatly improving dicing efficiency. You can force it. The change in the spacing between mutually parallel cutting lines on the wafer is controlled by the cutting blade spacing setting means, which changes the distance between the two cutting blades by adjusting the distance between the two cutting blades.
This can be dealt with by appropriately changing the axial spacing.

<Preferred Specific Example of the Invention> Hereinafter, a specific example of the dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, in the illustrated example, one cutting area 2 and two alignment areas 4A and 4B are defined. The cutting area 2 is arranged between the alignment areas 4A and 4B, in other words, the alignment areas 4A and 4B are arranged on both sides of the cutting area 2, respectively. The specific example shown in the figure includes a wafer transport means generally designated by the number 6, a cutting means generally designated by the number 8 disposed in the cutting region 2, and a detection device disposed in the alignment regions 4A and 4b, respectively. It is equipped with means 10A and 10B.

The illustrated wafer transport means 6 comprises two stationary support rails 1 extending substantially horizontally and parallel to each other and fixed to a suitable support structure (not shown).
Contains 2. Each of the support rails 12 is formed from a substantially straight elongated member having a T-shaped cross section. For convenience of explanation, the direction in which the support rail 12 extends is assumed to be the x-axis direction. The above support rail 12
Two main movable frames 14A and 14B are slidably attached to the main movable frames 14A and 14B. Main movable frames 14A and 14B
are the horizontal plates 16A and 16B, and the four corners hanging from the lower surfaces of the horizontal plates 16A and 16B, respectively.
It has book pillars 18A and 18B. 4 pillars 1
The support rail 1 is attached to the lower end of 8A and 18B.
A groove having a T-shaped cross section corresponding to the cross-sectional shape of support rail 1 is formed.
2, the main movable frame 14A
and 14B are separately and independently mounted to be slidable along the support rail 12 in the x-axis direction. Main movable frames 14A and 14B are each provided with main moving means 20A and 20B for moving them in the x-axis direction. The main moving means 20A attached to the main movable frame 14A includes a male threaded rod 22A rotatably attached to a support structure (not shown) and extending in the x-axis direction, and a deceleration mechanism 24A attached to the support structure. Male threaded rod 2 through
2A includes a drive source 26A, which may be a pulse motor, drivingly coupled to the motor 2A. On the other hand, a connecting member 28A that hangs downward is fixed to the lower surface of the horizontal plate 16A, and a through female screw hole extending in the x-axis direction is formed in the connecting member 28A. The male threaded rod 22A is screwed into this female threaded hole. Therefore, when the male threaded rod 22A is rotated by the drive source 26A, the main movable frame 14A is linearly moved in the x-axis direction. Main movable frame 14
Similarly, the main movement source 20B attached to the horizontal plate 16B includes a male threaded rod 22B and a drive source 26B that is drivingly connected to the male threaded rod 22B via a deceleration mechanism 24B, and is fixed to the lower surface of the horizontal plate 16B. The male threaded rod 22B is screwed into a through female threaded hole formed in the connecting member 28B. Therefore, when the male threaded rod 22B is rotated by the drive source 26B, the main movable frame 14B is moved linearly in the x-axis direction.

Referring to FIG. 2 as well as FIG. 1, a sub movable frame 30A is attached to the main movable frame 14A. Two support rails 32A extending substantially horizontally and substantially perpendicularly to the x-axis direction are formed on the upper surface of the horizontal plate 16A of the main movable frame 14A. For convenience of explanation, the direction in which the support rail 32A exists is assumed to be the y-axis direction. The cross-sectional shape of each of the support rails 32A is T-shaped.
The sub movable frame 30A has a horizontal plate 34A, and two protrusions 36A extending parallel to each other are formed on the lower surface of the horizontal plate 34A. And protrusion 36A
A groove having a T-shaped cross section corresponding to the cross-sectional shape of the support rail 32A is formed in each of the support rails 32A, and by engaging the groove with the support rail 32A, the sub movable frame 30A is supported. It is mounted so as to be slidable in the y-axis direction along the rail 32A. The sub movable frame 30A is attached with sub moving means 38A for moving it in the y-axis direction. The sub-moving means 38A includes a male screw rod 40A that is rotatably attached to the lower surface of the horizontal plate 16A of the main movable frame 14A and extends in the y-axis direction, and a horizontal plate 16A of the main movable frame 14A.
A drive source 44A, which may be a pulse motor, is mounted on the lower surface of the motor A and is drivingly connected to the male threaded rod 40A via a speed reduction mechanism 42A. A slot 46A extending in the y-axis direction is formed in the horizontal plate 16A of the main movable frame 14A, and a slot 46A is formed in the horizontal plate 16A of the main movable frame 14A.
A connecting member 48A that hangs downward through the slot 46A is fixed to the lower surface of the horizontal plate 34A. A through female threaded hole extending in the y-axis direction is formed in this connecting member 48A, and the male threaded rod 40A is screwed into this female threaded hole.
Therefore, the male threaded rod 40 is driven by the drive source 44A.
When A is rotated, the sub movable frame 30A is linearly moved in the y-axis direction with respect to the main movable frame 14A.

The sub movable frame 30A includes a wafer support means 5.
0A is installed. As shown in Figure 2,
The wafer support means 50A includes a horizontal disk 52A on which the wafer W is placed and this disk 52A.
It has an axis 54A that hangs down substantially vertically from the center of the lower surface. On the other hand, the horizontal plate 34 of the sub movable frame 30A
A substantially vertical through hole is formed in the center of A, and the shaft 54A is rotatably mounted in the through hole via a suitable bearing member 56A,
The wafer support means 50A is thus mounted on the sub movable frame 30A so as to be rotatable about the central axis extending substantially vertically. The wafer support means 50A is provided with a rotation means 58A for rotating the wafer support means 50A. This rotating means 58
A includes a drive source 60A, which may be a pulse motor, mounted on the lower surface of the horizontal plate 34A of the sub-movable frame 30A via a mounting member 59A. Drive source 60A
is the wafer support means 50 via the deceleration mechanism 62A.
Therefore, the wafer support means 50A is rotated by the drive source 60A. At least a portion of the disc 52A of the wafer support means 50A is formed of a porous material such as porous ceramic, and a suitable suction path (not shown) is formed in the shaft 54A of the wafer support means 50A. ing. This suction path is connected to the vacuum source 6 via a conduit having a control valve 63A.
Connected to 4A. When the suction path is communicated with the vacuum source 64A, air is sucked through the disk 52A, and the wafer W placed on the disk 52A is vacuum-adsorbed onto the disk 52A. Disk 52A
Instead of forming at least a portion of the disc 52A from a porous material, a plurality of suction holes may be formed in the disc 52A.

Referring to FIG. 1, similarly, a sub-movable frame 30B is attached to the main movable frame 14B so as to be movable in the y-axis direction, and the sub-movable frame 30B substantially has a wafer support means 50B. It is rotatably mounted around a vertically extending central axis. The sub movable frame 30B is provided with a sub moving means 38B for linearly moving it in the y-axis direction, and the wafer supporting means 50B is provided with a rotating means (not shown) for rotating it. It is attached. Sub movable frame 30B, sub moving means 38B attached thereto, and wafer supporting means 50
B and the rotation means attached thereto (not shown) are the same as the above-mentioned sub-movable frame 30A, sub-movement means 38A attached thereto, wafer support means 50A and rotation means 58A attached thereto. Therefore, a detailed explanation of these will be omitted.

Next, the detection means 10A provided in the alignment area 4A will be explained. Referring to FIG. 1, a stationary support 66A fixed to a suitable support structure (not shown) is disposed above the alignment area 4A. A movable frame 68A is attached to the lower surface of the support base 66A. Two support rails 70 extending in the y-axis direction and having a T-shaped cross section are provided on the lower surface of the support stand 66A.
A (only a small portion of which is shown in FIG. 1) is formed. On the other hand, two grooves 72A having a T-shaped cross section corresponding to the cross-sectional shape of the support rail 70A are formed on the upper surface of the movable frame 68A, and the grooves 72A are engaged with the support rail 70A. Depending on the movable frame 68
A is attached so as to be slidable in the y-axis direction along the support rail 70A. The movable frame 68A is provided with a moving means 74A for moving it in the y-axis direction. The moving means 74A includes a male threaded rod 76A rotatably mounted on the upper surface of the support base 66A and extending in the y-axis direction, and a male threaded rod 76A mounted on the upper surface of the support base 66A and drivingly connected to the male threaded rod 76A via a speed reducer 78A. It also includes a drive source 80A which may be a pulse motor. A slot 82A extending in the y-axis direction is formed in the support base 66A, and the slot 82A is formed in the upper surface of the movable frame 68A.
A connecting member 84A that protrudes upward through A is fixed. A through female threaded hole extending in the y-axis direction is formed in this connecting member 84A, and the male threaded rod 76A is screwed into this female threaded hole. Therefore, when the male threaded rod 76A is rotated by the drive source 80A, the movable frame 68A is linearly moved in the y-axis direction with respect to the support base 66A.

A microscope 86A constituting optical input means of the detection means 10A is attached to the movable frame 68A. The optical center axis of the microscope 86A, which requires relatively low magnification, extends substantially vertically. For convenience of explanation, the direction of the optical center axis of the microscope 86A, that is, the vertical direction is defined as the z-axis direction. The detection means 10A is
There is also an electronic processing means (not shown) that appropriately processes the image incident through the microscope 86A (therefore, the image of a part of the surface of the wafer W placed on the wafer support means 50A). Contains.
The processing means detects a cutting line on the surface of the wafer W by performing a pattern matching process or the like. Examples of this processing means include Patent Application No. 162031 filed in 1982 by the present applicant (filing date: September 5, 1988, title of invention: automatic precision alignment system), Patent Application No. 162031 filed in 1988 Application No. 32576 (filing date: February 24, 1980, title of invention: Automatic precision alignment system), 1988 Patent Application No.
No. 100658 (filing date: May 21, 1980, title of invention: automatic precision alignment system), Patent Application No. 264488 (filing date: December 17, 1988, title of invention: automatic) Precision alignment system) and 1986
Patent Application No. 44713 (filing date: March 8, 1985)
The means disclosed in the specification and drawings of the title of the invention: automatic precision alignment system with automatic key pattern setting means are preferably used. Therefore, a detailed explanation of the processing means will be left to the specification and drawings of the patent application and will be omitted in this specification. The detection means 10A further includes a display means 8, which may be a CRT (cathode ray tube), for enlarging and visually displaying the image incident on the microscope 86A.
Also includes 8A. This display means 88A is mounted on a suitable support structure (not shown).

Similarly, a stationary support base 66B, a movable frame 68B, and a moving means 74B are arranged in the upper part of the alignment area 4B, and a microscope 86B constituting the optical input means of the detection means 10B is attached to the movable frame 68B. and the detection means 10B includes electronic processing means and display means 88B. These means provided in connection with the alignment area 4B may be substantially identical to the above-mentioned means provided in connection with the alignment area 4A, and therefore a detailed description of these means will be omitted. Omitted.

Next, the cutting means 8 provided in the cutting area 2 will be explained. To explain with reference to Figure 1,
A stationary support 90 is arranged above the cutting zone 2 and is fixed to a suitable support structure (not shown). This support stand 90 has a horizontal plate part 92 and side plate parts 94 that hang down from both sides of this horizontal plate part 92, respectively. The support stand 90 includes a movable main support frame 96 having a horizontal plate portion 98 and side plate portions 100 hanging downward from both sides of the horizontal plate portion 98.
is installed. Two protrusions 102 extending in the y-axis direction are provided on the lower surface of the horizontal plate portion 92 of the support base 90, and each of the protrusions 102 includes:
A groove is formed that extends in the y-axis direction and has a T-shaped cross section. On the other hand, the horizontal plate portion 9 of the main support frame 96
Two support rails 104 having a T-shaped cross-sectional shape corresponding to the cross-sectional shape of the groove are formed on the upper surface of the groove. By engaging the support rail 104 in the groove, the support base 90
A main support frame 96 is attached to the main support frame 96 so as to be movable in the y-axis direction along the groove. The main support frame 96 is attached with a y-axis direction moving means 106 for moving it in the y-axis direction. This transportation means 106
is a male threaded rod 1 rotatably mounted on the upper surface of the horizontal plate portion 92 of the support base 90 and extending in the y-axis direction.
08 and a male threaded rod 10 attached to the upper surface of the horizontal plate portion 92 of the support stand 90 and
8 and a drive source 112, which may be a pulse motor. Horizontal plate portion 9 of support stand 90
2 is formed with a slot 114 extending in the y-axis direction, and a connecting member 116 that projects upward through the slot 114 is fixed to the upper surface of the horizontal plate portion 98 of the main support frame 96. This connecting member 1
16 is formed with a through female threaded hole extending in the y-axis direction, and the male threaded rod 1 is inserted into the female threaded hole.
08 is screwed together. Therefore, when the male threaded rod 108 is rotated by the drive source 112, the main support frame 96 is moved linearly in the y-axis direction with respect to the support base 90.

Referring to FIG. 3 as well as FIG. 1, on the lower surface of the horizontal plate portion 98 of the main support frame 96, there is a pair of suspension plates 118 and 119 hanging downward at a predetermined interval in the y-axis direction. Fixed. A support shaft 120 extending in the y-axis direction is attached to the lower ends of the pair of suspension plates 118 and 119 so as to be movable in the y-axis direction. The support shaft 120 is attached with a cutting blade interval setting means 122 for moving the support shaft in the y-axis direction. To explain this setting means 122, a pair of suspension plates 124 and 125 that hang downward at a predetermined interval in the y-axis direction are also fixed to the lower surface of the horizontal plate portion 98 of the main support frame 96. The setting means 122 includes a male threaded rod 126 rotatably mounted between a pair of suspension plates 124 and 125 and extending in the y-axis direction, and a male threaded rod 126 mounted on the suspension plate 125 and drivingly connected to the male threaded rod 126 via a speed reduction mechanism 128. and a drive source 130, which may be a pulse motor. At the rear end of the support shaft 120,
A connecting member 132 extending upward is fixed.
A through female threaded hole extending in the y-axis direction is formed in this connecting member 132, and the male threaded rod 126 is screwed into this female threaded hole. Therefore,
When the male threaded rod 126 is rotated by the drive source 130, the support shaft 120 is rotated with respect to the main support frame 96.
is moved linearly in the y-axis direction.

The support shaft 120 includes a first sub-support frame 134.
and a second sub-support frame 136 are attached. The first sub-support frame 134 has a hollow cylindrical main portion 13
8, and the main portion 13 at a predetermined interval in the y-axis direction.
a pair of connecting arms 140 and 14 protruding from 8;
2. A pair of connecting arms 140 and 14
2 is rotatably connected to the support shaft 120, and thus the first sub-support frame 1 is rotatably connected to the main support frame 96 about the central axis of the support shaft 120.
34 is installed. Between the suspension plate 118 to which the support shaft 120 is attached and the connection arm 140 of the first sub-support frame 134, the sleeve 14
4 is loosely fitted to the support shaft 120, and similarly, the suspension plate 119 to which the support shaft 120 is attached and the first
A sleeve (not shown) is connected to the support shaft 1 between the secondary support frame 134 and the connecting arm 142.
20 is loosely fitted. Such a sleeve holds the first sub-support frame 13 against the suspension plates 118 and 119.
4 from moving in the y-axis direction, and thus prevents the first sub-support frame 134 from moving in the y-axis direction with respect to the main support frame 96. Second sub-support frame 13
6. A hollow cylindrical main part 146 and this main part 14
6 and a connecting arm 148 protruding from the connecting arm 148 . The connecting arm 148 is rotatably connected to the support shaft 120, and is thus rotatably connected to the main support frame 96 about the central axis of the support shaft 120.
A sub-support frame 136 is attached. On both sides of the connecting arm 148 of the second sub-support frame 136,
A sleeve 150 is fixed to the support shaft 120. This sleeve 150 prevents the second sub-support frame 136 from moving in the y-axis direction with respect to the support shaft 120. As described above, when the main support frame 96 and the support shaft 120 attached thereto are moved in the y-axis direction by the y-axis direction moving means 106 (FIG. 1), the first Both the sub-support frame 134 and the second sub-support frame 136 are
It is moved in the axial direction. On the other hand, when the support shaft 120 is moved in the y-axis direction with respect to the main support frame 96 by the cutting blade interval setting means 122, the first sub-support frame 134 is not moved in the y-axis direction. Only the second sub-support frame 136 is moved together with the support shaft 120 in the y-axis direction.

Continuing the explanation with reference to FIG. 3, the main portion 138 of the first sub-support frame 134 includes a rotating shaft 152.
A is rotatably mounted, and a blade rotating means 152A for rotating this rotating shaft 152A is also mounted. Rotating means 154A
may be a DC motor whose output shaft is drivingly connected to the rotating shaft 152A by suitable coupling means 156A. The rotating shaft 152A protrudes forward beyond the main portion 138, and a thin disc-shaped cutting blade 158A is fixed to the protruding end thereof.
Similarly, the main portion 146 of the second sub-support frame 136
A rotary shaft 152B is rotatably mounted on the rotary shaft 152B, and its output shaft is drivingly connected to the rotary shaft 152B via an appropriate coupling means 156B.
A rotating means 154B, which may be a DC motor, is installed. A thin disk-shaped cutting blade 158B is fixed to the protruding end of the rotary shaft 152B that protrudes forward beyond the main portion 146. The cutting blades 158A and 158B may be of any type known per se containing natural or synthetic diamond abrasive grains suitable for cutting wafers.

The cutting means 8 further includes a z-axis moving means for moving up and down the rotating shafts 152A and 152B and the cutting blades 158A and 158B fixed thereto in the z-axis direction. In the illustrated example, the z-axis direction moving means includes a first pivoting means 160A for pivoting the first sub-support frame 134 about the central axis of the support shaft 120, and 120, and a second pivoting means 160B for pivoting the second sub-support frame 136 about the central axis of the support frame 120. To explain with reference to Fig. 3, the first
The rotation movement means 160A has one end connected to the support frame 96.
The support frame 164A is fixed to the lower surface of the horizontal plate part 98 of the main support frame 96 via a connecting member 162A whose other end extends upward. On the upper surface of this support frame 164A is a male threaded rod 16 extending in the x-axis direction.
6A is rotatably mounted, and the male threaded rod 16 is connected via an appropriate speed reduction mechanism 168A.
A drive source 170A, which may be a pulse motor, is attached to the drive unit 6A. The first pivot movement means 160A further includes an actuation member 174A extending in the z-axis direction through a slot 172A formed in the support frame 164A. A through female threaded hole extending in the x-axis direction is formed at the upper end of the operating member 174A, and the male threaded rod 166A is screwed into the female threaded hole.
On the other hand, the connecting arm 142 of the first sub-support frame 134
A substantially L-shaped non-operating member 176A extending upward from the tip is integrally formed. The free end of the non-actuating member 176A, which preferably has a semicircular cross-sectional shape, is brought into contact with one side of the lower end of the actuating member 174A.
When the male threaded rod 166A is rotated by the drive source 170A to move the actuating member 174A in the direction shown by the arrow 178, the free end of the non-actuating member 176A moves in the direction shown by the arrow 178 in response to the movement of the actuating member 174A. be moved to In this way, the first sub-support frame 134 is pivoted in the direction shown by the arrow 180 about the central axis of the support shaft 120, thereby causing the rotating shaft 152A and the cutting blade 158A fixed thereto to rise in an arc. I am forced to do it. Conversely, when the drive source 170A rotates the male threaded rod 166A to move the actuating member 174A in the direction indicated by the arrow 182, the first sub-support frame 134 will move due to its own weight. The free end of the non-actuating member 176A is rotated about the central axis of the support shaft 120 in the direction shown by the arrow 184, and the free end of the non-actuating member 176A is connected to the actuating member 1
It continues to be in contact with one side of the lower end of 74A. In this way, the rotating shaft 152A and the cutting blade 158A fixed thereto are lowered in a circular arc. The second pivoting means 160B disposed in relation to the second sub-support frame 136 also has substantially the same configuration as the first pivoting means 160A, with one end attached to the main support frame 96. A connecting member 16 fixed to the other inner surface of the side plate portion 100 and having the other end extending upward.
It includes a support frame 164B fixed to the lower surface of the horizontal plate part 98 of the main support frame 96 via 2B.
A male threaded rod 166B extending in the x-axis direction is rotatably mounted on the upper surface of the support frame 164B, and may be a pulse motor drivingly connected to the male threaded rod 166B via an appropriate speed reduction mechanism 168B. A drive source 170B is attached. The second pivoting means 160B further includes a slot 172B formed in the support frame 160B.
It includes an actuating member 174B extending therethrough in the z-axis direction. A through female threaded hole extending in the x-axis direction is formed at the upper end of the operating member 174B, and the male threaded rod 166 is inserted into the female threaded hole.
B is screwed together. On the other hand, the second sub-support frame 13
A substantially L-shaped non-operating member 176B extending upward from the tip of the connecting arm 148 of No. 6 is integrally formed. And this non-operating member 176
A free end of B, which preferably has a semicircular cross-sectional shape, is brought into contact with one side of the lower end of the actuating member 174B. The actuating member 1 is rotated by the drive source 170B to rotate the male threaded rod 166B.
When 74B is moved in the direction shown by arrow 182, the free end of non-actuated member 176B is moved in the direction shown by arrow 182 in response to the movement of actuated member 174B. Thus, the second sub-support frame 13
6 is an arrow 1 centered on the central axis of the support shaft 120.
The rotating shaft 152B and the cutting blade 158B fixed to the rotating shaft 152B are thereby raised in a circular arc. Conversely, the male threaded rod 166B is driven by the drive source 170B.
When the actuating member 174B is rotated to move in the direction shown by the arrow 178, the second sub-support frame 136 correspondingly moves in the direction shown by the arrow 180 around the central axis of the support shaft 120 due to its own weight. It is pivoted in the direction shown, and the free end of the non-actuating member 176B continues to abut one side of the lower end of the actuating member 174B. In this way, the rotating shaft 152B and the cutting blade 158B fixed thereto are lowered in a circular arc.

FIG. 4 illustrates an example of a semiconductor wafer W diced by the dicing apparatus according to the present invention. A large number of cutting lines CL1 and CL2 arranged in a grid are arranged on the surface of the wafer W, which is approximately disk-shaped except for a flat part F generally called an orientation flat. A large number of rectangular areas RA are defined by cutting lines CL1 and CL2. Cutting line CL1 and
CL2 includes a first set of cutting lines CL1 that extend parallel to each other at a predetermined interval P1, and
substantially perpendicular to the cutting line CL1 of the set of
and a second set of cutting lines CL2 extending parallel to each other at a predetermined interval P2. Although the adjacent cutting line interval P1 in the first set of cutting lines CL1 and the adjacent cutting line interval P2 in the second set of cutting lines CL2 may be substantially the same, they are usually different from each other (P1 ≠P2). A required circuit pattern is applied to each of the rectangular areas RA.

The dicing action of the wafer W in the above-described dicing apparatus according to the present invention will be explained as follows.

To explain with reference to FIGS. 1 and 3, in the dicing apparatus as described above, before actually dicing the wafer W, the cutting blades 158A and 158B in the cutting means 8 are
and a microscope 8 in the detection means 10A and 10B.
Mutual alignment in the y-axis direction with the optical centers of 6A and 86B is performed. In an example of such a mutual alignment operation, first, the main support frame 96 mounted movably in the y-axis direction with respect to the stationary support base 90 of the cutting means 8 is positioned at a predetermined initial position, and the main support frame 96 is positioned at a predetermined initial position. 96 so as to be movable in the y-axis direction. Thus, in principle, the position in the y-axis direction of the cutting blade 158A fixed to the rotating shaft 152A attached to the first sub-support frame 134 and the position of the cutting blade 158A fixed to the rotation shaft 152A attached to the second sub-support frame 136 are determined. The y-axis direction positions of the cutting blade 158B fixed to the rotating shaft 152B coincide with each other. Next, in the wafer transport means 6, the main movable frame 14A is positioned in the alignment area 4A by the main moving means 20A, as shown by the solid line in FIG.
B positions the main movable frame 14B in the cutting area 6. The main movable frame 14 existing in the cutting area 6
A dummy wafer (this dummy wafer may be one without cut lines CL1 and CL2 and a circuit pattern) is placed on the wafer support means 50B mounted on the wafer support means 50B, and is held by suction. After that, in the cutting means 8, the first sub-support frame 134 is moved by the first pivoting means 160A.
is rotated by a predetermined angle in the direction shown by arrow 184 in FIG. Support means 50B
(raised to a non-cutting position where it does not interfere with the dummy wafer above). Next, the rotating means 154
A is energized to move the cutting blade 158A in the direction of arrow 1.
For example, 15000 to 20000r.pm in the direction indicated by 86.
The main moving means 20B rotates at a speed of
The main movable frame 14B is moved by a predetermined amount in the direction shown by the arrow 188 at a relatively low speed of, for example, about 100 mm per second, and thus the cutting blade 158A
The dummy wafer is actually cut. Thereafter, the rotation of the cutting blade 158A is stopped, and the first sub-support frame 134 is turned by a predetermined angle in the direction indicated by an arrow 180 in FIG. 3 by the first turning means 160A. is raised to a non-cutting position where it does not interfere with the dummy wafer on the wafer support means 50B. Next, as shown by the two-dot chain line in FIG.
It is moved in the direction shown by 88 and positioned in the alignment area 4B. Thereafter, the actual cutting line on the dummy wafer is observed by looking at the display means 88B that visually displays the image input to the microscope 86B. Then, it is checked whether the optical center of the microscope 86B, ie, the center of the display surface of the display means 88B, and the actual cutting line precisely match in the y-axis direction. When the actual cutting line and the optical center of the microscope 86B do not precisely match in the y-axis direction, the moving means 7
4B, the movable frame 68B and the microscope 86B attached thereto are moved by a required amount in the y-axis direction, and the position of the optical center of the microscope 86B in the y-axis direction is precisely aligned with the above-mentioned actual cutting line. Mutual alignment of cutting blade 158A and detection means 10B is thus established. Thereafter, cutting blade 158 is cut in substantially the same manner as described above.
A and the detection means 10A are mutually aligned. That is, the main movable frame 1 is moved by the main moving means 20A.
4A is moved in the direction shown by arrow 188 to position it in the cutting area 6. Next, a dummy wafer is placed on the wafer support means 50A mounted on the main movable frame 14A, and is held by suction. After that, the cutting blade 158A is lowered to the cutting position. Next, the cutting blade 158A is rotated in the direction shown by the arrow 186, and the main movable frame 14A is moved in the direction shown by the arrow 18 by the main moving means 20A.
The dummy wafer is moved by a predetermined amount in the direction indicated by 8, and the dummy wafer is actually cut by the cutting blade 158A. After that, cutting blade 158A
The rotation of the cutting blade 15 is stopped and the rotation of the cutting blade 15 is stopped.
8A to the non-cutting position, and then the main movable frame 14A is moved in the direction of the arrow 190 by the main moving means 20A.
Move it in the direction shown by and position it in the alignment area 4A. After that, the actual cutting line on the dummy wafer is observed by looking at the display means 88A that visually displays the image input to the microscope 86A, and the movable frame 68A and the cutting line are moved by the moving means 74A as necessary. Microscope 8 attached to
6A by the required amount in the y-axis direction, and the microscope 86
The position of the optical center of A in the y-axis direction is precisely matched with the actual cutting line. Mutual alignment of cutting blade 158A and detection means 10A is thus established. In one example of a mutual alignment operation, mutual alignment verification of the initial position of cutting blade 158A and the initial position of cutting blade 158B is also performed. In this confirmation, the main movable frame 14A (or the main movable frame 14B) is positioned in the cutting area 6, and a dummy wafer is placed on the wafer support means 50A attached to the main movable frame 14A and held by suction. . Next, the second sub-support frame 136 is rotated by a predetermined angle in the direction indicated by an arrow 180 in FIG. 3 by the second rotation movement means 160B,
Thus, the cutting blade 158B is lowered to the cutting position where it interferes with the dummy wafer on the wafer support means 50A (at this time, the other cutting blade 158A is raised to the non-cutting position). Next, the rotating means 154B is biased to rotate the cutting blade 158B in the direction shown by arrow 186, and the main movable frame 14A is moved in the direction shown by arrow 18.
The dummy wafer is moved by a predetermined amount in the direction indicated by 8, and the dummy wafer is actually cut by the cutting blade 158B. After that, the cutting blade 158B
, and the second sub-support frame 136 is rotated by a predetermined angle in the direction indicated by the arrow 184 in FIG.
In this way, the cutting blade 158B is raised to a non-cutting position where it does not interfere with the dummy wafer on the wafer support means 50A. Next, the main moving means 20A
The main movable frame 14A is moved in the direction shown by the arrow 190 and positioned in the alignment area 4A.
Thereafter, by viewing the display means 88A that visually displays the image input to the microscope 86A,
It is checked whether the position of the actual cutting line of the dummy wafer in the y-axis direction precisely matches the optical center of the microscope 86A. If the position of the actual cutting line in the y-axis direction is shifted from the optical center of the microscope 86A, the cutting blade spacing setting means 122 of the cutting means 8 adjusts the second sub-support frame 136 to the above-mentioned shift. The initial position of the cutting blade 158B is corrected by moving the cutting blade 158B in the y-axis direction by an amount of .
The position in the y-axis direction is made to match with sufficient precision the initial position of .

The dicing operation of the wafer W performed after performing the preliminary mutual alignment operations as described above is as follows. In the above-described dicing apparatus according to the present invention, when one of the two main movable frames 14A and 14B in the wafer transport means 6, for example, the main movable frame 14B, is present in the cutting area 2, the two main movable frames The other of the frames 14A and 14B, ie, the main movable frame 14A, exists in the alignment area 4A. Then, in the cutting area 2, dicing of the wafer W that has already been placed on the wafer support means 50B, held there by suction, and aligned as required is performed as described later in the alignment area 4B. . During this time, in the alignment area 4A, first, the control valve 63A
(FIG. 2) is switched and the wafer support means 50
The suction path A is disconnected from the vacuum source 64A, suction of the wafer W that has already been diced as required in the cutting area 2 as described later is stopped, and the wafer W is transferred to an appropriate loading and unloading means ( (not shown) wafer support means 5
It is taken out from above 0A. Next, the wafer W to be diced next is placed on the wafer support means 50A by the carrying-in and carrying-out means. The wafer W to be diced is placed alone on the wafer support means 50A. Alternatively, as is well known to those skilled in the art, the wafer may be attached to a frame (not shown) surrounding the wafer W with tape attached across the back surface of the wafer W and the back surface of the frame. It is placed on the support means 50A. In either case, the wafer W is placed with the surface on which the cutting lines CL1 and CL2 (Fig. 4) are arranged facing upward, and with its flat part F as a reference or the frame on which it is mounted. The wafer is placed on the wafer support means 50A within a certain degree of error, although not sufficiently precise, based on the formed positioning notch. Next, the control valve 63A (FIG. 2) is switched again to connect the suction path of the wafer support means 50A to the vacuum source 64A, and thus the wafer W is transferred to the wafer support means 50.
It is adsorbed and held on A. After that, the detection means 1
Based on the detection of specific cutting lines CL1 and/or CL2 on the surface of the wafer W by 0A, sufficiently precise alignment is automatically performed. Such alignment is performed by cutting line CL1 (or CL2) in the detection means 10A with respect to an x-axis reference line extending in the x-axis direction through the optical center of the microscope 86A.
The rotation means 58A (FIG. 2) rotates the wafer support means 50A according to the detected inclination.
, thereby making the cutting line CL1 (or CL2) sufficiently precisely parallel to the reference line in the x-axis direction. Furthermore, in the specific example shown in the figure, a positional shift in the y-axis direction between the reference line in the x-axis direction and the specific cutting line CL1 (or CL2) is detected, and the sub-movable frame is moved by the sub-movement means 38A according to the detected deviation. 30A is the main movable frame 14A
, and thus the above x
It also includes matching the y-axis position of the specific cutting line CL1 (or CL2) with the y-axis position of the axial reference line with sufficient precision. Such automatic alignment is disclosed in the above-mentioned Patent Application No. 162031 of 1983, Patent Application No. 32576 of 1988, Patent Application No. 100658 of 1988,
Patent Application No. 264488 of 1988 and Patent Application No. 1988
No. 44713, it can be conveniently accomplished by the same means as detailed in the specification and drawings of the above-mentioned patent application, and therefore, the detailed description thereof is referred to the specification and drawings of the above-mentioned patent application, and the present invention is incorporated herein by reference. It is omitted in the specification.

In the alignment area 4A, the alignment of the wafer W placed on the wafer support means 50A and attracted thereto is completed as described above, and then in the cutting area 2, the wafer W is placed on the wafer support means 50B. When dicing of the wafer W held there is completed, the wafer supporting means 50
B is moved to the alignment area 4B, and
The wafer support means 50A is moved to the cutting area 2. More specifically, the main movable frame 14B is moved by the main moving means 20B in the direction shown by the arrow 188, and is placed in the alignment area 4B as shown by the two-dot chain line in FIG. At the same time, the main movable frame 14A is moved in the direction shown by the arrow 188 by the main moving means 20A, and is brought into the cutting area 2. In the alignment area 4B, substantially the same procedure as described above in connection with the alignment area 4A is performed. That is, while the main movable frame 14B is stationary at a predetermined position, first,
The suction of the wafer W by the wafer support means B is stopped, and the already diced wafer W is taken out from the wafer support means 50B by an appropriate loading and unloading means (not shown), and then,
By the loading and unloading means, the next wafer W to be diced is placed on the wafer support means 50B and held there by suction, and then a specific cutting line CL1 on the surface of the wafer W is detected by the detection means 10B. and/or based on the detection of CL2, a sufficiently precise automatic alignment is performed. On the other hand, in the cutting area 2, dicing of the wafer W held by suction on the wafer support means 50A is performed.

Referring to FIG. 1 and FIG. 3, the dicing of the wafer W performed in the cutting area 2 will be described in detail as follows. Immediately before actually dicing the wafer W in the cutting area 2, the entire wafer W held by suction on the wafer support means 50A is cut by the cutting blade 158B.
The main movable frame 14A is located on one side offset in the direction shown by the arrow 190 from the center of the cutting area 2 in the x-axis direction so that the main movable frame 14A is located at some distance in the direction shown by the arrow 190 not only from the cutting blade 158A. It is stopped at the close position. Then, the cutting blade interval setting means 122 in the cutting means 8 controls the support shaft 1
20 and the second sub-support frame 136 are moved a predetermined distance in the y-axis direction, and therefore the rotating shaft 152B attached to the second sub-support frame 136 and the cutting blade 158B fixed to the tip thereof are moved to the above-mentioned initial stage. It is moved a predetermined distance from the position in the y-axis direction. The above-mentioned movement of the cutting blade 158B by the predetermined distance increases the distance between adjacent cutting lines P1 in the first set of cutting lines CL1 (or the adjacent cutting line interval P in the second set of cutting lines CL2) on the wafer W to be cut.
It is important that it exactly match 2) or be exactly an integer multiple thereof (see also Figure 4).
Thus, the distance in the y-axis direction between the cutting blade 158A and the cutting blade 158B is set to precisely match the above-mentioned adjacent cutting line distance P1 (or P2), or to be precisely an integral multiple thereof. Next, the first sub-support frame 134 is pivoted in the direction shown by the arrow 184 in FIG. 3 by the first pivot movement means 160A,
The cutting blade 158A is lowered to a predetermined cutting position, and the second auxiliary support frame 136 is pivoted in the direction shown by arrow 180 in FIG. 3 by the second pivoting means 160B.
lower to a predetermined cutting position. The cutting positions of the cutting blades 158A and 158B can be set such that the lower ends of the outer peripheral edges of the cutting blades 158A and 158B are located slightly above the surface of the wafer support means 50A. Thus, the cutting blade 158 is cut as described below.
When the wafer W is cut by A and 158B, if the wafer W is adsorbed by itself on the wafer support means 50A, the wafer W leaves some uncut parts on the back surface and is partially cut. Even if the wafer W is cut and thus the wafer W is cut along all the cutting lines CL1 and CL2, the wafer W continues to remain integral without being separated into individual rectangular areas RA (in this case, a person skilled in the art will be able to explain As is well known, in a later step, by applying a slight force to the wafer W, the remaining uncut portions are broken and the individual rectangular areas RA are separated). on the other hand,
On the wafer support means 50A, the wafer W is attached to the frame with tape as described above.
is adsorbed, the wafer W is cut over its entire thickness, but the tape remains uncut, and therefore the wafer W is cut along all cutting lines CL1 and CL2. The wafer W is then completely separated into individual rectangular areas RA, but the individual rectangular areas RA continue to be held together by the tape (in this case, as is well known to those skilled in the art, in subsequent steps , the tape is removed to actually separate the individual rectangular areas RA).

After that, the blade rotation means 154A and 1
54B is energized to cut the cutting blades 158A and 1
58B in the direction indicated by arrow 186, for example 15000.
It is rotated at a speed of 20,000r.pm. The main movable frame 14 is also moved by the main moving means 20A.
A is moved from the one-side offset position to the other side offset position in the direction indicated by arrow 188 at a relatively low speed of, for example, about 100 mm per second. In the other side offset position, the wafer support means 50
The entire wafer W suctioned and held on A is cut not only by the cutting blade 158A but also by the cutting blade 158B.
It is also located some distance apart in the direction indicated by arrow 188. Thus, while the main movable frame 14A is being moved to cut, the rotating cutting blade 158A is moving along one cutting line CL1 (or CL1).
2), and at the same time, the rotating cutting blade 158B cuts the wafer W along another cutting line CL1 (or CL2).

Then, the blade rotation means 154A and 154
B is deenergized and the cutting blades 158A and 158
The rotation of B is stopped. Then, the first sub-support frame 134 is moved to the third position by the first pivoting means 160A.
The cutting blade 158A is raised to a non-cutting position where it does not interfere with the wafer W by turning in the direction shown by the arrow 180 in the figure, and the second sub-support frame 136 is moved to the third position by the second turning means 160B.
The cutting blade 158B is turned in the direction shown by an arrow 184 in the figure to raise the cutting blade 158B to a non-cutting position where it does not interfere with the wafer W. Furthermore, the main support frame 96 is moved a predetermined distance in the y-axis direction by the y-axis direction moving means 106 in the cutting means 8, and therefore both the cutting blades 158A and 158B are moved a predetermined distance in the y-axis direction. As is easily understood, the above-mentioned movement of the cutting blades 158A and 158B by the predetermined distance is so-called pitch feeding, and the distance between adjacent cutting lines P1 in the first set of cutting lines CL1 (or the distance between adjacent cutting lines in the second set of cutting lines CL2) is so-called pitch feeding. It is important that the distance between adjacent cutting lines (P2) is precisely matched or exactly an integral multiple thereof. On the other hand, the main movable frame 14A is moved back from the other side biased position to the one side biased position in the direction shown by arrow 190 by the main moving means 20A.
Thereafter, the wafer W is cut by the cutting blades 158A and 158B as described above.

In the above-described cutting procedure, the wafer W is not cut while the main movable frame 14A is moved back from the other side offset position to the one side offset position, but if desired, Even when the main movable frame 14A is moved back, the cutting blades 158A and 158B are lowered to the cutting position and rotated, thereby allowing the cutting blades 158A and 158B to cut the wafer W. In this case,
When the main movable frame 14A moves back, it is preferable to rotate the cutting blades 158A and 158B in the direction opposite to the direction indicated by the arrow 186, from the viewpoint of the cutting characteristics of the wafer W by the cutting blades 158A and 158B.

Cutting movement of main movable frame 14A, cutting blade 15
Pitch feed of 8A and 158B, and main movable frame 1
The cutting procedure as described above including the return movement of 4A is performed repeatedly, thus cutting the wafer W along all of its first set of cutting lines CL1 (or second set of cutting lines CL2). Thereafter, while the main movable frame 14A is stopped at the one-sided offset position, the wafer support means 50A is rotated substantially 90 degrees by the rotation means 58A, and thus the wafer support means 50A is attracted onto the wafer support means 50A. Rotate the wafer W 90 degrees. In addition, the adjacent cutting line interval P1 in the first set of cutting lines CL1 and the second set of cutting lines CL
If the adjacent cutting line spacing P2 in 2 is different from each other, the cutting blade spacing setting means 122
The support shaft 120 and the second sub-support frame 136
The rotating shaft 152B mounted on the second sub-support frame 136 moves the required distance in the y-axis direction.
and a cutting blade 15 fixed to its tip.
8B is moved the required distance in the y-axis direction. Thus, cutting blade 158A and cutting blade 158
The distance in the y-axis direction from B is set as the cutting line of the second set.
The interval P2 between adjacent cutting lines in CL2 (or the interval P1 between adjacent cutting lines in the first set of cutting lines CL1) is precisely matched or reset to an integral multiple thereof. After that, the main movable frame 14A
cutting movement, cutting blades 158A and 158B
The above-described cutting procedure including pitch feeding and return movement of the main movable frame 14A is repeatedly performed.
Thus, the remaining second cutting line of wafer W
Cut along all of CL2 (or first set of cutting lines CL1).

Dicing of the wafer W adsorbed to the wafer support means 50B attached to the main movable frame 14B is also carried out.
Of course, this is accomplished in a manner similar to the cutting procedure described above.

Although the configuration and operation of a specific example of the dicing apparatus according to the present invention have been described above in detail with reference to the accompanying drawings, the present invention is not limited to such specific example, and there may be no deviation from the scope of the present invention. Needless to say, various modifications and modifications are possible.

<Effects of the Invention> In the dicing device configured according to the present invention as described above, the cutting means 8 includes two cutting blades 158A and 158B, and the interval between the two cutting blades 158A and 158B is can be set appropriately. Therefore, even if the cutting line interval on the wafer W changes, no problem will occur, and the cutting means 8 and the wafer supporting means 50A or 50B can be moved in one relative cutting direction in a predetermined direction. Thus, the wafer W can be cut along two mutually parallel cutting lines, and thus the wafer W can be cut along two mutually parallel cutting lines.
The time required to actually cut the material is also significantly reduced, and dicing efficiency can be greatly improved from this point of view as well. If desired, cutting means 8
3, the mutual spacing can be set appropriately.
By arranging three or more cutting blades and one relative cutting movement between the cutting means 8 and the wafer support means 50A or 50B in a predetermined direction, three or more cuts parallel to each other can be made. It is also possible to cut the wafer W along a line.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the main parts of a dicing apparatus according to the present invention. FIG. 2 is a sectional view showing the main movable frame of the wafer transport means in the dicing apparatus of FIG. 1 and various elements attached to the main movable frame. FIG. 3 is a partially cutaway perspective view showing the main part of the cutting means in the dicing apparatus of FIG. 1; FIG. 4 is a plan view showing an example of a wafer diced by the dicing apparatus shown in FIG. 1. 2... Cutting area, 4A and 4B... Aligning area,
6... Wafer conveying means, 8... Cutting means, 10
A and 10B... detection means, 14A and 14B...
...Main movable frame, 20A and 20B...Main movement means,
30A and 30B...Sub-movable frame, 38A and 38
B... Sub-moving means, 50A and 50B... Wafer supporting means, 58A... Rotating means, 96... Movable main support frame, 106... Y-axis direction moving means, 120
... Support shaft, 122 ... Cutting blade interval setting means, 134 ... First sub-support frame, 136 ... Second
sub-support frame, 152A and 152B... rotating shaft,
154A and 154B...blade rotation means, 1
58A and 158B...cutting blade, 160A
...first rotation movement means (z-axis direction movement means), 1
60B...Second rotation movement means (z-axis direction movement means), W...Semiconductor wafer.

Claims (1)

[Scope of Claims] 1. A dicing device for cutting a semiconductor wafer along cutting lines arranged in a grid pattern, comprising a cutting means and a wafer supporting means, the cutting means and the wafer supporting means The wafer supported by the wafer support means is cut by the cutting means by moving the wafer relatively linearly in a predetermined direction, and the cutting means If the direction of linear movement of the target is the x-axis direction,
two rotating shafts extending in the y-axis direction perpendicular to the x-axis direction, a cutting blade fixed to each of the rotating shafts, and a blade rotation means for rotating the rotating shafts, the rotating shaft one of the rotating shafts is mounted so as to be linearly movable relative to the other in the y-axis direction, and the cutting means further moves the one of the rotating shafts relative to the other in the y-axis direction. A dicing device comprising: a cutting blade spacing design means for causing the cutting blade to move in a straight line. 2. The wafer support means is mounted so as to be movable in the x-axis direction, and a moving means for moving the wafer support means in the x-axis direction is provided, and the wafer supported by the wafer support means The dicing apparatus according to claim 1, wherein the wafer supporting means is moved in the x-axis direction by the moving means when the wafer is cut by the cutting means. 3. The rotating shaft of the cutting means is mounted so as to be movable linearly in the y-axis direction and movably in the z-axis direction perpendicular to both the x-axis direction and the y-axis direction, and the cutting means further includes a y-axis direction moving means for linearly moving the rotating shaft in the y-axis direction, and a z-axis moving means for moving the rotating shaft in the z-axis direction.
The dicing apparatus according to claim 2, comprising axial movement means. 4. The cutting means further includes a main support frame mounted so as to be movable linearly in the y-axis direction, a first sub-support frame mounted on the main support frame, and a main support frame movable linearly in the y-axis direction. a second sub-support frame attached to the support frame, the other of the rotation shafts is rotatably attached to the first sub-support frame, and the one of the rotation shafts is attached to the second sub-support frame; The y-axis moving means is drive-coupled to the main support frame to linearly move the main support frame in the y-axis direction, thus moving both rotation axes in the y-axis direction. and the cutting blade spacing setting means is drivingly connected to the second sub-support frame to move the second sub-support frame linearly in the y-axis direction, thus causing the one of the rotation axes to move in the direction of the y-axis. The dicing device according to claim 3, which moves linearly in the y-axis direction. 5. The dicing apparatus according to claim 4, wherein the cutting means includes two blade rotating means separately attached to each of the rotating shafts. 6. The main support frame has a support shaft extending in the y-axis direction, and the first sub-support frame and the second sub-support frame are attached to the support shaft. Dicing equipment as described. 7. The first sub-support frame and the second sub-support frame are separately and independently mounted to be rotatable about the central axis of the support shaft, and the z-axis direction moving means is attached to the first sub-support frame. The sub-support frame and the second sub-support frame include a first pivoting motion means and a second pivoting motion means respectively attached separately and independently, the first pivoting motion means and the second pivoting motion means. each rotates each of the first sub-support frame and the second sub-support frame about the central axis of the support shaft, so that the other and the one of the rotating shafts respectively rotate along the z-axis. The dicing device according to claim 6, wherein the dicing device is moved in a direction.