JPH0334222B2 - - Google Patents
Info
- Publication number
- JPH0334222B2 JPH0334222B2 JP27306985A JP27306985A JPH0334222B2 JP H0334222 B2 JPH0334222 B2 JP H0334222B2 JP 27306985 A JP27306985 A JP 27306985A JP 27306985 A JP27306985 A JP 27306985A JP H0334222 B2 JPH0334222 B2 JP H0334222B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- point solder
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔概要〕
本発明の半導体冷却装置は、ヒートシンクと半
導体素子間に介在する低融点ハンダの量を規制す
るための突起部を備えている。DETAILED DESCRIPTION OF THE INVENTION [Summary] A semiconductor cooling device of the present invention includes a protrusion for regulating the amount of low melting point solder interposed between a heat sink and a semiconductor element.
従つて本発明においては、ヒートシンク着脱時
に熱伝導媒体である前記低融点ハンダが外部へ流
出して冷却効率が低下するといつた事故は発生し
ない。 Therefore, in the present invention, an accident in which the low melting point solder, which is a heat conductive medium, flows out to the outside when the heat sink is attached or detached, and the cooling efficiency is reduced, does not occur.
本発明は大型電算機等に装備される半導体素子
用冷却装置の改良に係り、特に熱伝導媒体である
ハンダの流出事故を防止する手段を備えた半導体
冷却装置に関する。
The present invention relates to improvements in cooling devices for semiconductor devices installed in large-scale computers and the like, and more particularly to a semiconductor cooling device equipped with means for preventing solder, which is a heat-conducting medium, from flowing out.
〔従来の技術〕
第３図は従来の半導体冷却装置の構成例を示す
要部側断面図である。[Prior Art] FIG. 3 is a sectional side view of a main part showing an example of the configuration of a conventional semiconductor cooling device.
同図に示すように、半導体冷却装置は、冷却体
７と、該冷却体７上に圧接機構４を介して配設さ
れたヒートシンク６とを具備している。 As shown in the figure, the semiconductor cooling device includes a cooling body 7 and a heat sink 6 disposed on the cooling body 7 via a pressure contact mechanism 4.
そして基板１０上の半導体素子１と前記ヒート
シンク６とを低融点ハンダ２で接合することによ
つて半導体素子１側の熱が低融点ハンダ２および
ヒートシンク６を介して冷媒液２０側へ放熱され
る構成になつている。 By bonding the semiconductor element 1 on the substrate 10 and the heat sink 6 with the low melting point solder 2, the heat on the semiconductor element 1 side is radiated to the coolant liquid 20 side via the low melting point solder 2 and the heat sink 6. It's structured well.
なお上記半導体冷却装置は、熱伝導媒体として
低融点ハンダ２を用いている関係上、冷却装置の
着脱時には該低融点ハンダ２を一旦溶融する必要
がある。 Note that since the semiconductor cooling device described above uses low melting point solder 2 as a heat conducting medium, it is necessary to melt the low melting point solder 2 once when the cooling device is attached or detached.
ところが上記従来の半導体冷却装置の場合は、
半導体素子１の放熱面１ａと、これに対向する位
置に位置決めされたヒートシンク６の吸熱面即ち
ハンダ接合面６ａとが共にフラツトな平面型に形
成されているため、前記低融点ハンダ２が溶融状
態になると、ヒートシンク６を矢印Ａ方向へ押圧
している圧接機構４がヒートシンク６と半導体素
子１間に介在している低融点ハンダ２を外部方向
即ち矢印Ｂ−B′方向へ押し出す現象が生じ、こ
のため半導体素子１の冷却効率が低下するという
問題があつた。
However, in the case of the conventional semiconductor cooling device mentioned above,
Since the heat dissipating surface 1a of the semiconductor element 1 and the heat absorbing surface, that is, the solder joint surface 6a of the heat sink 6 positioned opposite to the heat dissipating surface 1a are both formed in a flat planar shape, the low melting point solder 2 is in a molten state. Then, a phenomenon occurs in which the pressure contact mechanism 4 pressing the heat sink 6 in the direction of the arrow A pushes out the low melting point solder 2 interposed between the heat sink 6 and the semiconductor element 1 in the outward direction, that is, in the direction of the arrow B-B'. For this reason, there was a problem that the cooling efficiency of the semiconductor element 1 was reduced.
本発明は第１図の実施例に示すように、半導体
素子１の放熱面１ａとヒートシンク６の吸熱面即
ちハンダ接合面６ａ間に、両者が互いに密接する
のを防止すると共に、両者間の接触圧力を集中す
るための突起部５が形成された構成になつてい
る。
As shown in the embodiment of FIG. 1, the present invention prevents the heat radiation surface 1a of the semiconductor element 1 and the heat absorption surface 6a of the heat sink 6 from coming into close contact with each other, and also prevents contact between the two. The structure includes a protrusion 5 for concentrating pressure.
このように構成されたものにおいては、ヒート
シンク着脱時に溶融した低融点ハンダ２が外部へ
押し出され、“半導体素子１とヒートシンク６間
に介在すべき熱伝導媒体が喪失してしまう”とい
つた障害の発生は的確に防止される。
With this configuration, when the heat sink is attached or detached, the melted low melting point solder 2 is pushed out, causing a problem such as "the heat conductive medium that should be interposed between the semiconductor element 1 and the heat sink 6 is lost." The occurrence of this is precisely prevented.
以下図面に示した実施例に基づいて本発明を詳
細に説明する。
The present invention will be described in detail below based on embodiments shown in the drawings.
第１図および第２図は本発明の実施例および変
形例を示す要部側断面図であるが、前記第３図と
同一部分には同一符号を付している。 1 and 2 are side sectional views of main parts showing an embodiment and a modification of the present invention, and the same parts as in FIG. 3 are given the same reference numerals.
第１図の実施例に示すように、本発明の半導体
冷却装置を構成するヒートシンク６は、半導体素
子１の放熱面１ａと対向する吸熱面、即ちハンダ
接合面６ａに複数個の突起部５を持つている。 As shown in the embodiment of FIG. 1, a heat sink 6 constituting the semiconductor cooling device of the present invention has a plurality of protrusions 5 on a heat absorbing surface opposite to a heat dissipating surface 1a of a semiconductor element 1, that is, a solder joint surface 6a. I have it.
このため、溶融状態の熱伝導媒体、即ち低融点
ハンダ２は、該突起部５によつて放熱面１ａとハ
ンダ接合面６ａ間に形成される隙間Ｈ（この隙間
Ｈは突起部５の背丈に相当する）内に貯蔵され、
さらに自ら表面張力も作用して外部への流出が防
止される。特に突起部５の個数を３個にして、こ
れを鼎状に配置した場合は、安定した隙間Ｈを形
成することができる。 Therefore, the heat conductive medium in the molten state, that is, the low melting point solder 2 is heated by the protrusion 5, forming a gap H between the heat dissipation surface 1a and the solder joint surface 6a (this gap H is equal to the height of the protrusion 5). corresponding),
Furthermore, surface tension acts on itself to prevent leakage to the outside. In particular, when the number of protrusions 5 is three and these are arranged in a hook shape, a stable gap H can be formed.
なお該突起部５は冷却機構の装着に際して低融
点ハンダ２の接触圧を高め、低融点ハンダ２を集
中的に溶融し得る機能を有する。 The protrusion 5 has the function of increasing the contact pressure of the low melting point solder 2 and melting the low melting point solder 2 intensively when the cooling mechanism is attached.
次は第２図によつて本発明の変形例を説明す
る。 Next, a modification of the present invention will be explained with reference to FIG.
第２図の変形例は第１図の実施例と異なり、ヒ
ートシンク６のハンダ接合面６ａ上に形成された
突起部が半球型の球形突起部５′から成つている。
このため該球形突起部５′の先端と半導体素子１
の放熱面１ａとが接触し、接触した部分の周囲に
溶融状の低融点ハンダ２が溜められて熱伝導媒体
を構成する。 The modified example shown in FIG. 2 differs from the embodiment shown in FIG. 1 in that the projection formed on the solder joint surface 6a of the heat sink 6 is a hemispherical spherical projection 5'.
Therefore, the tip of the spherical protrusion 5' and the semiconductor element 1
The molten low melting point solder 2 is collected around the contact portion and constitutes a heat conduction medium.
なお上記ヒートシンク６は、熱の伝導度が良好
で、しかも低融点ハンダ２との融合性即ちハンダ
付け性に優れた金属、例えば、銅、黄銅等で形成
される。 The heat sink 6 is made of a metal having good thermal conductivity and excellent compatibility with the low melting point solder 2, that is, excellent solderability, such as copper or brass.
以上述べた実施例および変形例は何れもヒート
シンク６側に突起部５または球形突起部５′を設
けた場合について述べたが、これらの各突起部を
半導体素子１側に設けても良いことはいうまでも
ない。 In the embodiments and modifications described above, the case has been described in which the protrusion 5 or the spherical protrusion 5' is provided on the heat sink 6 side, but it is also possible to provide each of these protrusions on the semiconductor element 1 side. Needless to say.
本発明は以上説明したように、半導体素子とヒ
ートシンク間に介在する熱伝導媒体（低融点ハン
ダ）が冷却装置の着脱時にも散逸しない構成にな
つている。このため、冷却装置の効率を恒久的に
維持し得る効果がある。
As described above, the present invention has a structure in which the thermally conductive medium (low melting point solder) interposed between the semiconductor element and the heat sink does not dissipate even when the cooling device is attached or detached. This has the effect of permanently maintaining the efficiency of the cooling device.
第１図は本発明の一実施例を示す要部側断面
図、第２図は本発明の変形例を示す要部側断面
図、第３図は従来の半導体冷却装置の構成を示す
要部側断面図である。
図中、１は半導体素子、１ａは放熱面、２は低
融点ハンダ、４は圧接機構、５は突起部、５′は
球形突起部、６はヒートシンク、６ａはハンダ接
合面、７は冷却体、１０は基板、２０は冷媒液を
それぞれ示す。
FIG. 1 is a side sectional view of the main part showing an embodiment of the present invention, FIG. 2 is a side sectional view of the main part showing a modification of the invention, and FIG. 3 is a main part showing the configuration of a conventional semiconductor cooling device. FIG. In the figure, 1 is a semiconductor element, 1a is a heat radiation surface, 2 is a low melting point solder, 4 is a pressure contact mechanism, 5 is a protrusion, 5' is a spherical protrusion, 6 is a heat sink, 6a is a solder joint surface, and 7 is a cooling body , 10 indicates a substrate, and 20 indicates a refrigerant liquid, respectively.
Claims (1)
ンダ２で接合し、該低融点ハンダ２を熱伝導媒体
として前記半導体素子１の冷却を行う半導体冷却
装置の構成において、 前記ヒートシンク６のハンダ接合面に、低融点
ハンダ２の量を規制する突起部５を設けたことを
特徴とする半導体冷却装置。[Scope of Claims] 1. A configuration of a semiconductor cooling device in which a semiconductor element 1 and a heat sink 6 are bonded with a low melting point solder 2, and the semiconductor element 1 is cooled using the low melting point solder 2 as a heat conduction medium, comprising: A semiconductor cooling device characterized in that a protrusion 5 for regulating the amount of low melting point solder 2 is provided on the solder joint surface of 6.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27306985A JPS62131547A (en) | 1985-12-03 | 1985-12-03 | Semiconductor cooling device |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| DE86307669T DE3688962T2 (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit arrangement. |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27306985A JPS62131547A (en) | 1985-12-03 | 1985-12-03 | Semiconductor cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131547A JPS62131547A (en) | 1987-06-13 |
| JPH0334222B2 true JPH0334222B2 (en) | 1991-05-21 |
Family
ID=17522711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27306985A Granted JPS62131547A (en) | 1985-10-04 | 1985-12-03 | Semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131547A (en) |
-
1985
- 1985-12-03 JP JP27306985A patent/JPS62131547A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131547A (en) | 1987-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |