JPH046100B2 - - Google Patents
Info
- Publication number
- JPH046100B2 JPH046100B2 JP61061645A JP6164586A JPH046100B2 JP H046100 B2 JPH046100 B2 JP H046100B2 JP 61061645 A JP61061645 A JP 61061645A JP 6164586 A JP6164586 A JP 6164586A JP H046100 B2 JPH046100 B2 JP H046100B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- refrigerant
- heat exchanger
- curved surface
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/772—Bellows
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/776—Arrangements for jet impingement, e.g. for spraying
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔概 要〕
本発明の集積回路素子冷却装置は、冷却体と集
積回路素子とを熱的に結合する伝熱板の冷媒接触
面が凹型に形成され、且つそのコーナー部には曲
面が形成されている。[Detailed Description of the Invention] [Summary] In the integrated circuit device cooling device of the present invention, the refrigerant contact surface of the heat exchanger plate that thermally connects the cooling body and the integrated circuit device is formed in a concave shape, and the corners thereof are formed in a concave shape. A curved surface is formed on the part.
このため、冷媒の流動性が良くなつて、コーナ
ー部において冷媒が澱む現象が解消され、冷却効
率が改善される。 Therefore, the fluidity of the refrigerant is improved, the phenomenon of refrigerant stagnation at the corners is eliminated, and the cooling efficiency is improved.
本発明は大型電算機等に装備される、集積回路
素子の冷却システムに関するものである。
The present invention relates to a cooling system for integrated circuit elements installed in large computers and the like.
第４図は従来の集積回路素子冷却装置の構成例
を示す要部側断面図である。
FIG. 4 is a side sectional view of a main part showing an example of the configuration of a conventional integrated circuit device cooling device.
同図に示すように、従来の冷却装置は、ノズル
６を備えた冷却体２０と、伝熱板２を具備し、ベ
ローズ等で構成された可撓性構造体１とによつて
構成され、可撓性弾性構造体１は、例えば接合板
９を介するなどして冷却体２０に取付け、固定さ
れている。 As shown in the figure, the conventional cooling device includes a cooling body 20 equipped with a nozzle 6, a flexible structure 1 equipped with a heat exchanger plate 2, and configured with bellows or the like. The flexible elastic structure 1 is attached and fixed to the cooling body 20 via, for example, a bonding plate 9.
冷却時には、基板１５上の集積回路素子５に前
記伝熱板２が位置決めされ、冷却体２０のノズル
６から噴射される冷媒１０によつて集積回路素子
５の冷却が行われる構成になつている。 During cooling, the heat transfer plate 2 is positioned on the integrated circuit element 5 on the substrate 15, and the integrated circuit element 5 is cooled by the coolant 10 injected from the nozzle 6 of the cooling body 20. .
なお伝熱板２は、例えば溶接等の手段によつて
可撓性弾性構造体１に接合されている。 Note that the heat exchanger plate 2 is joined to the flexible elastic structure 1 by means such as welding, for example.
しかしながら、上記従来の集積回路素子冷却装
置は、第４図に示すように、伝熱板２の冷媒接触
面３が平面であるため、可撓性弾性構造体１と冷
媒接触面３とで形成されるコーナー部Ｃに冷媒１
０が澱んで、所謂死水域１４を生じ、その部分の
熱伝達率ｈ（Ｗ／m2・deg）が著しく低下すると
いう問題点があつた。
However, as shown in FIG. 4, in the conventional integrated circuit device cooling device described above, since the coolant contact surface 3 of the heat transfer plate 2 is flat, it is formed by the flexible elastic structure 1 and the coolant contact surface 3. Refrigerant 1 is applied to the corner C where
0 stagnates, creating a so-called dead area 14, which causes a problem in that the heat transfer coefficient h (W/m 2 ·deg) in that area decreases significantly.
第５図は上記従来の冷却装置における熱伝達率
の分布傾向を示す図であつて、縦軸は熱伝達率ｈ
を、横軸は冷媒接触面の位置をそれぞれ示してい
る。 FIG. 5 is a diagram showing the distribution tendency of the heat transfer coefficient in the above-mentioned conventional cooling device, where the vertical axis is the heat transfer coefficient h
, the horizontal axis indicates the position of the refrigerant contact surface, respectively.
第５図で明らかなように、従来の冷却装置の場
合は、ノズル６の真下に位置するＯ点（第４図参
照、なお一般にこのＯ点のことを岐点という）お
よびその周辺部の熱伝達率は高いが、コーナー部
Ｃの周辺の熱伝達率は極端に低くなつている。そ
の理由は上述の死水域１４に起因するものである
ことはいうまでもない。 As is clear from Fig. 5, in the case of the conventional cooling device, the heat at point O (see Fig. 4, this point O is generally referred to as the turning point) located directly below the nozzle 6 and its surrounding area is Although the heat transfer coefficient is high, the heat transfer coefficient around the corner portion C is extremely low. Needless to say, the reason for this is the dead area 14 mentioned above.
本発明は第３図の原理図に示すように、伝熱板
２の冷媒接触面３が凹型に形成されるとともに、
該凹型形成部のコーナー部Ｃに曲面７が形成され
た構成になつている。
As shown in the principle diagram of FIG. 3, the present invention has a refrigerant contact surface 3 of a heat exchanger plate 2 formed in a concave shape, and
A curved surface 7 is formed at the corner C of the concave forming part.
このように構成されたものにおいては、冷媒１
０が曲面７に沿つて流動するため、冷媒１０の澱
む領域が無くなり、死水域１４が発生しなくな
る。
In a device configured in this way, the refrigerant 1
Since the refrigerant 10 flows along the curved surface 7, there is no region where the refrigerant 10 stagnates, and a dead zone 14 is not generated.
以下実施例図に基づいて本発明を詳細に説明す
る。
The present invention will be described in detail below based on embodiment figures.
第１図は本発明の集積回路素子冷却装置の一実
施例を示す要部側断面図であるが、前記第３図〜
第５図と同一部分には同一符号を付している。 FIG. 1 is a sectional side view of essential parts showing an embodiment of the integrated circuit device cooling device of the present invention, and FIG.
The same parts as in FIG. 5 are given the same reference numerals.
第１図に示すように、本発明の集積回路素子冷
却装置は、可撓性弾性構造体１の先端部に装備さ
れた伝熱板２の冷媒接触面３が凹型に形成され、
且つ該凹型形成部の周囲には曲面７が形成されて
いる。 As shown in FIG. 1, the integrated circuit device cooling device of the present invention has a refrigerant contact surface 3 of a heat exchanger plate 2 provided at the tip of a flexible elastic structure 1 formed in a concave shape.
Further, a curved surface 7 is formed around the concave forming portion.
従つて、前記第４図に示したようなコーナー部
Ｃが無くなり、冷却体２０のノズル６から噴射さ
れた冷媒１０は、冷媒接触面３の中央部から周辺
部へと円滑に流動することになる。このため、従
来の冷却装置に見られるような冷媒１０の滞留現
象が無くなり、冷却効率が大幅に向上する。 Therefore, the corner C shown in FIG. 4 is eliminated, and the refrigerant 10 injected from the nozzle 6 of the cooling body 20 flows smoothly from the center to the periphery of the refrigerant contact surface 3. Become. Therefore, the phenomenon of stagnation of the refrigerant 10 that occurs in conventional cooling devices is eliminated, and the cooling efficiency is significantly improved.
第２図ａ，ｂは伝熱板の凹部の形成例を示す要
部側断面図であつて、ａは球型曲面の場合、ｂは
小径曲面の場合をそれぞれ示している。 FIGS. 2a and 2b are side sectional views of essential parts showing an example of forming the recessed portions of the heat exchanger plate, where a shows the case of a spherical curved surface and b shows the case of a small diameter curved surface, respectively.
凹部を第２図ａに示すような曲率半径Ｒの大き
い球型曲面７ａにするか、或いは第２図ｂに示す
ような曲率半径ｒの小さい小径型曲面７ｂにする
かは集積回路素子の発熱量、実装密度、さらに伝
熱板の寸法、材質、ノズルから伝熱板までの距
離、等を勘案して決定される。 Whether the recess is to be a spherical curved surface 7a with a large radius of curvature R as shown in FIG. 2a, or a small diameter curved surface 7b with a small radius of curvature r as shown in FIG. 2b depends on the heat generation of the integrated circuit element. It is determined by taking into account the amount, mounting density, dimensions and material of the heat exchanger plate, the distance from the nozzle to the heat exchanger plate, etc.
本発明は以上説明したように、集積回路素子の
熱を冷媒に伝達する伝熱板の冷媒接触面が、冷媒
流に対する抵抗の極めて少ない曲面に形成されて
いる。
As described above, in the present invention, the refrigerant contact surface of the heat transfer plate that transfers the heat of the integrated circuit element to the refrigerant is formed into a curved surface that has extremely little resistance to the refrigerant flow.
このため、冷媒が澱む領域、つまり死水域が無
くなり、装置の冷却効率が大幅に向上する。 Therefore, there is no region where the refrigerant stagnates, that is, a dead zone, and the cooling efficiency of the device is greatly improved.
第１図は本発明の集積回路素子冷却装置の一実
施例を示す要部側断面図、第２図ａ，ｂは伝熱板
凹部の曲面形成例を示す要部側断面図、第３図は
本発明の原理を示す要部側断面図、第４図は従来
の集積回路素子冷却装置の構成例を示す要部側断
面図、第５図は従来の伝熱板の熱伝達率分布傾向
図である。
図中、１は可撓性弾性構造体、２は伝熱板、３
は冷媒接触面、５は集積回路素子、６はノズル、
７は曲面、７ａは球形曲面、７ｂは小径曲面、９
は接合板、１０は冷媒、１４は死水域、１５は基
板、２０は冷却体、Ｃはコーナー部、をそれぞれ
示す。
FIG. 1 is a side sectional view of a main part showing an embodiment of the integrated circuit device cooling device of the present invention, FIGS. 4 is a sectional side view of the main part showing the principle of the present invention, FIG. 4 is a sectional side view of the main part showing an example of the configuration of a conventional integrated circuit device cooling device, and FIG. 5 is a trend of heat transfer coefficient distribution of a conventional heat exchanger plate. It is a diagram. In the figure, 1 is a flexible elastic structure, 2 is a heat exchanger plate, and 3
is a refrigerant contact surface, 5 is an integrated circuit element, 6 is a nozzle,
7 is a curved surface, 7a is a spherical curved surface, 7b is a small diameter curved surface, 9
10 is a joint plate, 10 is a coolant, 14 is a dead area, 15 is a substrate, 20 is a cooling body, and C is a corner portion, respectively.
Claims (1)
素子５と該伝熱板２とを熱的に接続して、前記可
撓性構造体１内に設けられたノズル６より前記伝
熱板２に冷媒１０を噴射することによつて、集積
回路素子５から熱を奪う集積回路素子冷却装置の
構成において、 前記伝熱板２の冷媒接触面３が凹型に形成され
るとともに、該凹型形成部のコーナー部に曲面７
が形成されてなることを特徴とする集積回路素子
冷却装置。[Scope of Claims] 1. A heat transfer plate 2 is provided in a flexible structure 1, and an integrated circuit element 5 and the heat transfer plate 2 are thermally connected. In the structure of the integrated circuit element cooling device which removes heat from the integrated circuit element 5 by injecting the refrigerant 10 onto the heat exchanger plate 2 from the nozzle 6, the refrigerant contact surface 3 of the heat exchanger plate 2 is concave. The curved surface 7 is formed at the corner of the concave forming part.
1. An integrated circuit device cooling device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061645A JPS62217647A (en) | 1986-03-18 | 1986-03-18 | Integrated circuit element cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061645A JPS62217647A (en) | 1986-03-18 | 1986-03-18 | Integrated circuit element cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62217647A JPS62217647A (en) | 1987-09-25 |
| JPH046100B2 true JPH046100B2 (en) | 1992-02-04 |
Family
ID=13177163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61061645A Granted JPS62217647A (en) | 1986-03-18 | 1986-03-18 | Integrated circuit element cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62217647A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4984066A (en) * | 1989-12-12 | 1991-01-08 | Coriolis Corporation | Cooling of large semi-conductor devices |
| JP2712872B2 (en) * | 1991-04-18 | 1998-02-16 | 日本電気株式会社 | Integrated circuit cooling mechanism |
| JPH07115156A (en) * | 1993-10-19 | 1995-05-02 | Nec Corp | Integrated circuit cooling structure |
| JPH07321267A (en) * | 1994-05-30 | 1995-12-08 | Nec Corp | Integrated circuit cooling structure |
| JP5117988B2 (en) * | 2008-10-20 | 2013-01-16 | 株式会社ブリヂストン | Sprinkler head connection joint and sprinkler system |
-
1986
- 1986-03-18 JP JP61061645A patent/JPS62217647A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62217647A (en) | 1987-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |