JPH0356900B2 - - Google Patents
Info
- Publication number
- JPH0356900B2 JPH0356900B2 JP62245578A JP24557887A JPH0356900B2 JP H0356900 B2 JPH0356900 B2 JP H0356900B2 JP 62245578 A JP62245578 A JP 62245578A JP 24557887 A JP24557887 A JP 24557887A JP H0356900 B2 JPH0356900 B2 JP H0356900B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- laminate
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 40
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 13
- 239000002966 varnish Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000007666 vacuum forming Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
- B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
- B29B15/125—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex by dipping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
Description
［発明の目的］
（産業上の利用分野）
本発明は積層板用に使用される樹脂含浸基材
（プリプレグ）の製造方法に関し、特に樹脂付着
量を自由に制御（コントロール）し、また、レジ
ンフローの管理をする樹脂含浸基材の製造方法で
ある。
（従来の技術）
電子、電気機器用の印刷配線板は、その使用さ
れる機器の軽量化、小形化、高機能化に伴つて、
配線パターンの高密度化、導通用スルーホールの
径の縮小、そのランドレス化等の傾向が進んでい
る。このような点から印刷配線板用基板に要求さ
れる特性も従来に比べて非常に厳しくなつてきて
いる。すなわち、寸法変化率の小さいこと、縦横
の寸法変化率が均一であること、反り・ネジレの
発生が少ないこと等が挙げられる。従来からの印
刷配線板用基材の製法としては、基材にできるか
ぎり均一に樹脂を塗布含浸したプリプレグを用い
積層板を得ていた。これらの方法によれば、反
り・ネジレの減少、寸法変化率の縮小等に抜本的
な対策をもたらすことはできなかつた。これに対
し、最近行われるようになつた真空成形によれ
ば、反り・ネジレ、寸法変化率の小さい積層板を
得ることができるが、基材周辺部分のレジンフロ
ーのコントロールが困難で、積層板周辺部の特性
維持が難しいという欠点がある。また、マスラミ
ネーシヨン等による多層板の成形の際には、内層
パターン回路のない部分（空白部分）の特性維持
が困難であるという欠点があつた。
（発明が解決しようとする問題点）
本発明は、上記の事情に鑑みてなされたもの
で、プリプレグにおけるレジンフローを部分的に
異なつた値にするという管理を行うことができ、
また真空成形における積層板周辺部の特性向上、
多層板成形における内層パターン間の空白部分の
特性向上、大形積層板の成形性向上、又は積層板
の耐熱性向上を図る積層板用樹脂含浸基材の製造
方法を提供しようとするものである。
［発明の構成］
（問題点を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意
研究を重ねた結果、積層板用基材に熱硬化性樹脂
を含浸させる前に有機溶剤を部分的に含浸させ、
次いで熱硬化性樹脂を塗布含浸させることによ
り、基材の任意の位置の樹脂付着量を容易にコン
トロールすることができることを見いだし、本発
明を完成させたものである。すなわち、本発明
は、積層板用基材に熱硬化性樹脂を含浸する樹脂
含浸基材の製造方法において、積層板用基材に有
機溶剤を選択的に含浸させ、次いで熱硬化性樹脂
を塗布含浸させて、前記基材の任意の位置の樹脂
付着量をコントロールすることを特徴とする積層
板用樹脂含浸基材の製造方法である。
本発明に用いる積層板用基材としては、コツト
ン紙、リターン紙、コツトンリンター紙等の紙基
材、ガラス織布、ガラス不織布、ガラスペーパー
等のガラス繊維基材等積層板用基材として使用さ
れているものはすべて使用することができる。
本発明に用いる熱硬化性樹脂としては、フエノ
ール樹脂、メラミン樹脂、ブチラール樹脂、不飽
和ポリエステル樹脂、エポキシ樹脂、ポリイミド
樹脂およびこれらの変性樹脂等が挙げられ、これ
らは単独もしくは２種以上混合して使用される。
熱硬化性樹脂は通常溶剤等に溶解して樹脂溶液
（ワニス）として使用する。ワニスは使用する積
層板用基材の種類に応じて適正な粘度に、かつ樹
脂付着量に応じて濃度を適宜調整することができ
る。
本発明に用いる有機溶剤としては、メチルエチ
ルケトン、アセトン等のケトン系溶剤、メタノー
ル、エタノール等のアルコール系溶剤、トルエ
ン、キシレン等の芳香族系溶剤、メチルセロソル
ブ、エチルセロソルブ等、積層板の製造に使用で
きるものはすべて使用可能である。この有機溶剤
は、積層板用基材に熱硬化性樹脂を塗布含浸する
前に、積層板用基材に含浸するもので、熱硬化性
樹脂の樹脂溶液（ワニス）を溶解する時に使用す
る溶剤と同一又は異なつてもよい。有機溶剤の含
浸方法には特に制限はなく、浸漬、吹付け、噴
射、塗布のいずれの方法でもよいが噴射が特に有
効に使用できる。それは、積層板用基材の任意の
位置にかつ、必要程度含浸可能であるからであ
る。
次に図面を用いて説明する。
第１図は、本発明の積層板用樹脂含浸基材の製
造方法例を示す概念図である。ロール１から積層
板用基材２をロール１１を経由してプレ樹脂含浸
槽１４に導入する。その際、ロール１１の前に設
置された有機溶剤噴射装置３で、多層成形する内
層回路パターンの空白部、真空成形や大形積層板
の周辺部に対応するような積層板用基材２の任意
の位置に有機溶剤を噴射した後、デイツプロール
６を通じてプレ樹脂含浸槽１４の熱硬化性樹脂の
ワニス５を塗布・含浸させる。噴射装置３には、
そこに有機溶剤を供給する有機溶剤タンク４とポ
ンプ１７とが接続されており、これらを制御装置
１６でコントロールしている。噴射装置３の噴射
ノズルの圧力は積層板用基材への樹脂付着量によ
り0.01〜1.0Kg／cm2の間で適宜調整する。プレ樹
脂含浸槽１４を通過した基材２はロール１２，１
３を経由して、樹脂含浸槽１５に導入される。樹
脂含浸槽１５には熱硬化性樹脂のワニス７が入れ
てありデイツプロール８を通じてワニス７を積層
板用基材２に塗布含浸させる。樹脂含浸層１５の
ワニス７は樹脂含浸槽１４のワニス５と同一又は
異なつてもよく要求される特性に応じてワニスを
適宜変更することができる。その後、ワニス７を
含浸した積層板用基材２はスクイズロール９を通
して樹脂付着量を調整し、乾燥塔１０に送り込ま
れ、ここで加熱乾燥半硬化して積層板用樹脂含浸
基材を製造することができる。こうして得られた
任意の位置に樹脂付着量がコントロールされた積
層板用樹脂含浸基材は積層板、多層板等に使用さ
れる。第１図では有機溶剤の含浸をプレ樹脂含浸
槽１４の前で行つたが樹脂含浸槽１５の前でも、
また、両槽１４，１５の前で同時に行つてもよ
く、必要に応じて行うことができる。
（作用）
第２図は、本発明で得られる積層板用樹脂含浸
基材の適用例を示す断面図である。積層板用基材
に、熱硬化性樹脂を含浸させる前に有機溶剤を含
浸させると、熱硬化性樹脂が含浸しやすくなり、
樹脂付着量が多くなる。このように積層板用基材
の任意の位置の必要な範囲にだけ有機溶剤を含浸
させ、樹脂付着量をコントロールすることによつ
て、必要箇所に必要な樹脂付着量をもつ樹脂含浸
基材を得ることができる。例えばＡ部分に樹脂付
着量の多い樹脂含浸基材２０を得て、これを絶縁
基板上に導体回路２２を形成したためにＢ部分に
空白部分を有する回路板２２に重ね合わせて成形
すれば、Ｂの空白部分に樹脂含浸基材のＡ部分の
樹脂がよく回り込み、成形後の特性を大巾に向上
させることができる。これと同様にしてプリプレ
グの周辺部に樹脂含有量を高めれば、真空成形時
の周辺特性の特性向上や大形積層板の成形性向上
を図ることができる。そしてまた、成形性と耐熱
性を高めることに利用することもできる。
（実施例）
次に本発明を実施例によつて説明する。
実施例 １
第１図について説明した樹脂含浸装置と含浸方
法を用いて、厚さ、100ミクロンのガラス布WEA
−116（日東紡社製、商品名）に、全体の樹脂付着
量が50重量％となるようにFR−４用樹脂を含浸
し、加熱乾燥して半硬化の積層板用樹脂含浸基材
（プリプレグ）を製造した。厚さ0.3mmの内層板
TLC−5511M（東芝ケミカル社製、商品名）と、
プリプレグおよび銅箔を重ね合わせて、温度170
℃，圧力20Kg／cm2の条件で90分間加熱加圧して、
総板厚1.6mmの６層の多層板を製造した。
実施例 ２
第１図について説明した樹脂含浸装置と含浸方
法を用いて、厚さ50μmのガラス布AS1080（旭シ
ユエーベル社製、商品名）に、全体の樹脂付着量
が70重量％となるようにポリイミド樹脂を含浸
し、加熱乾燥し半硬化のプリプレグを製造した。
このプリプレグと銅箔と厚さ0.1mmの内層板TLC
−583M（東芝ケミカル社製、商品名）を用いて温
度190℃，圧力30Kg／cm2の条件で120分間加熱し
て、総板厚2.0mmの12層の多層板を製造した。
比較例 １
従来の樹脂含浸方法で実施例１で用いたガラス
布およびFR−４用樹脂を用いて、同じ樹脂付着
量のプリプレグを製造した。このプリプレグを用
い実施例１と同様にして総板厚1.6mmの６層の多
層板を製造した。
比較例 ２
従来の樹脂含浸方法で実施例２で用いたガラス
布およびポリイミド樹脂を用いて、同じ樹脂付着
量のプリプレグを製造した。このプリプレグを用
い、実施例２と同様に加熱加圧して、総板厚2.0
mmの12層の多層板を製造した。
実施例および比較例で得られた多層板につい
て、製品コーナー部の白化面積、耐熱性を試験し
たのでその結果を第１表に示した。本発明の実施
例では白化面積がなく、耐熱性が優れており、本
発明の効果が確認された。
[Objective of the invention] (Industrial field of application) The present invention relates to a method for manufacturing a resin-impregnated base material (prepreg) used for laminates, and in particular, a method for freely controlling the amount of resin deposited, and This is a method for manufacturing a resin-impregnated base material that controls flow. (Prior art) Printed wiring boards for electronic and electrical equipment have become lighter, smaller, and more sophisticated as the equipment they are used in has become lighter, smaller, and more sophisticated.
Trends include increasing the density of wiring patterns, reducing the diameter of conductive through holes, and making them landless. From this point of view, the characteristics required of substrates for printed wiring boards have become much stricter than in the past. That is, the dimensional change rate is small, the vertical and lateral dimensional change rates are uniform, and the occurrence of warping and twisting is small. Conventional methods for producing substrates for printed wiring boards have been to obtain laminates using prepregs, which are coated and impregnated with resin as uniformly as possible on the substrate. According to these methods, it has not been possible to bring about drastic measures to reduce warpage/twisting, reduce the rate of dimensional change, etc. On the other hand, with vacuum forming, which has recently become popular, it is possible to obtain laminates with low warpage, twisting, and dimensional change, but it is difficult to control the resin flow around the base material, and the laminate The disadvantage is that it is difficult to maintain the characteristics of the peripheral area. Furthermore, when forming a multilayer board by mass lamination or the like, there is a drawback in that it is difficult to maintain the characteristics of areas without inner layer pattern circuits (blank areas). (Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and it is possible to manage the resin flow in the prepreg by partially setting it to a different value.
In addition, improving the characteristics of the periphery of the laminate during vacuum forming,
The present invention aims to provide a method for producing a resin-impregnated base material for a laminate, which improves the characteristics of blank areas between inner layer patterns in multilayer board molding, improves the formability of large laminates, or improves the heat resistance of laminates. . [Structure of the Invention] (Means for Solving the Problems) As a result of intensive research aimed at achieving the above object, the present inventors discovered that before impregnating a thermosetting resin into a base material for a laminate, partially impregnated with organic solvent,
The inventors have now completed the present invention by discovering that by coating and impregnating a thermosetting resin, it is possible to easily control the amount of resin deposited at any position on the substrate. That is, the present invention provides a method for producing a resin-impregnated base material in which a thermosetting resin is impregnated into a laminate base material, in which the laminate base material is selectively impregnated with an organic solvent, and then the thermosetting resin is applied. This is a method for manufacturing a resin-impregnated base material for a laminate, which comprises impregnating the base material and controlling the amount of resin deposited at any position on the base material. The substrates for laminates used in the present invention include paper substrates such as cotton paper, return paper, and cotton linter paper, and glass fiber substrates such as glass woven fabric, glass nonwoven fabric, and glass paper. Everything that is used can be used. Thermosetting resins used in the present invention include phenolic resins, melamine resins, butyral resins, unsaturated polyester resins, epoxy resins, polyimide resins, and modified resins thereof, which may be used alone or in combination of two or more. used.
Thermosetting resins are usually dissolved in a solvent or the like and used as a resin solution (varnish). The viscosity of the varnish can be adjusted to an appropriate level depending on the type of substrate for the laminate used, and the concentration can be adjusted as appropriate depending on the amount of resin attached. Examples of organic solvents used in the present invention include ketone solvents such as methyl ethyl ketone and acetone, alcohol solvents such as methanol and ethanol, aromatic solvents such as toluene and xylene, and methyl cellosolve and ethyl cellosolve, which are used in the production of laminates. Everything that can be used is available. This organic solvent is used to impregnate the laminate substrate before coating and impregnating the thermosetting resin on the laminate substrate, and is a solvent used when dissolving the resin solution (varnish) of the thermosetting resin. may be the same or different. There are no particular restrictions on the method of impregnating the organic solvent, and any method may be used such as dipping, spraying, spraying, or coating, but spraying is particularly effective. This is because the laminate base material can be impregnated at any desired position and to the required extent. Next, it will be explained using drawings. FIG. 1 is a conceptual diagram showing an example of a method for producing a resin-impregnated base material for a laminate according to the present invention. The laminate base material 2 is introduced from the roll 1 into the pre-resin impregnation tank 14 via the roll 11. At that time, an organic solvent injection device 3 installed in front of the roll 11 is used to spray the base material 2 for the laminate, which corresponds to the blank area of the inner layer circuit pattern to be multi-layered, vacuum formed, or the peripheral area of the large laminate. After spraying the organic solvent at a desired location, the thermosetting resin varnish 5 in the pre-resin impregnation tank 14 is applied and impregnated through the date roll 6. The injection device 3 includes
An organic solvent tank 4 and a pump 17 for supplying an organic solvent are connected thereto, and these are controlled by a control device 16. The pressure of the injection nozzle of the injection device 3 is appropriately adjusted between 0.01 and 1.0 Kg/cm 2 depending on the amount of resin adhered to the laminate substrate. The base material 2 that has passed through the pre-resin impregnation tank 14 is rolled into rolls 12 and 1.
3 and is introduced into the resin impregnation tank 15. The resin impregnation tank 15 contains a thermosetting resin varnish 7, and the varnish 7 is applied to the laminate substrate 2 through a date roll 8 to impregnate it. The varnish 7 of the resin-impregnated layer 15 may be the same as or different from the varnish 5 of the resin-impregnated tank 14, and the varnish can be changed as appropriate depending on the required characteristics. Thereafter, the laminate base material 2 impregnated with the varnish 7 is passed through a squeeze roll 9 to adjust the amount of resin attached, and sent to a drying tower 10, where it is heated and semi-hardened to produce a resin-impregnated base material for a laminate. be able to. The thus obtained resin-impregnated base material for laminates, in which the amount of resin deposited on arbitrary positions is controlled, is used for laminates, multilayer boards, and the like. In FIG. 1, the impregnation with the organic solvent was performed in front of the pre-resin impregnation tank 14, but even before the resin impregnation tank 15,
Moreover, it may be performed simultaneously in front of both tanks 14 and 15, and can be performed as necessary. (Function) FIG. 2 is a sectional view showing an example of application of the resin-impregnated base material for a laminate obtained by the present invention. If the base material for the laminate is impregnated with an organic solvent before being impregnated with the thermosetting resin, the thermosetting resin will be more easily impregnated.
The amount of resin attached increases. In this way, by impregnating the base material for laminates with organic solvent only in the required range at any position and controlling the amount of resin deposited, we can create a resin-impregnated base material with the required amount of resin deposit at the required location. Obtainable. For example, if a resin-impregnated base material 20 with a large amount of resin adhesion is obtained in the A part, and this is superimposed on the circuit board 22 which has a blank part in the B part because the conductor circuit 22 is formed on an insulating substrate and is molded, B The resin of the A part of the resin-impregnated base material goes around the blank part well, and the properties after molding can be greatly improved. In a similar manner, by increasing the resin content in the peripheral portion of the prepreg, it is possible to improve the peripheral characteristics during vacuum forming and the moldability of a large laminate. It can also be used to improve moldability and heat resistance. (Example) Next, the present invention will be explained by referring to an example. Example 1 Using the resin impregnation apparatus and impregnation method described in FIG.
-116 (manufactured by Nittobo Co., Ltd., trade name) is impregnated with resin for FR-4 so that the total resin adhesion amount is 50% by weight, and semi-cured by heating and drying.Resin-impregnated base material for laminates ( Prepreg) was manufactured. Inner layer plate with a thickness of 0.3mm
TLC-5511M (manufactured by Toshiba Chemical Co., Ltd., trade name),
Prepreg and copper foil are layered and heated to a temperature of 170℃.
℃, pressure 20Kg/ cm2 for 90 minutes,
A six-layer multilayer board with a total board thickness of 1.6 mm was manufactured. Example 2 Using the resin impregnation apparatus and impregnation method described in FIG. 1, a glass cloth AS1080 (manufactured by Asahi Schuebel Co., Ltd., trade name) with a thickness of 50 μm was coated with the resin so that the total amount of resin deposited was 70% by weight. A semi-cured prepreg was produced by impregnating it with polyimide resin and drying it by heating.
This prepreg, copper foil and 0.1mm thick inner layer TLC
-583M (manufactured by Toshiba Chemical Co., Ltd., trade name) was heated for 120 minutes at a temperature of 190° C. and a pressure of 30 kg/cm 2 to produce a 12-layer multilayer board with a total thickness of 2.0 mm. Comparative Example 1 A prepreg with the same amount of resin adhesion was produced using the glass cloth and FR-4 resin used in Example 1 using a conventional resin impregnation method. Using this prepreg, a six-layer multilayer board with a total board thickness of 1.6 mm was manufactured in the same manner as in Example 1. Comparative Example 2 A prepreg with the same resin coverage was produced using the glass cloth and polyimide resin used in Example 2 using a conventional resin impregnation method. Using this prepreg, heat and pressure was applied in the same manner as in Example 2, and the total plate thickness was 2.0.
A multilayer board with 12 layers of mm was manufactured. The multilayer boards obtained in Examples and Comparative Examples were tested for whitening area at product corners and heat resistance, and the results are shown in Table 1. In the examples of the present invention, there was no whitening area and the heat resistance was excellent, confirming the effects of the present invention.
【表】
［発明の効果］
以上の説明および第１表から明らかなように、
本発明の積層板用樹脂含浸基材の製造方法によれ
ば、任意の位置に樹脂付着量がコントロールでき
るため、このプリプレグを使用すれば多層板の回
路空白部分の特性や、真空成形時の周辺特性また
大形積層板の成形性を向上させることができ、か
つ耐熱性に優れた積層板を得ることができる。[Table] [Effects of the invention] As is clear from the above explanation and Table 1,
According to the manufacturing method of the resin-impregnated base material for laminates of the present invention, the amount of resin deposited at any position can be controlled, so if this prepreg is used, the characteristics of the circuit blank area of the multilayer board and the surrounding area during vacuum forming can be controlled. The properties and formability of large laminates can be improved, and laminates with excellent heat resistance can be obtained.
第１図は、本発明の積層板用樹脂含浸基材の製
造方法を示す概念図、第２図は本発明で得られた
積層板用樹脂含浸基材の適用例を示す断面図であ
る。
１，１１，１２，１３……ロール、１２……積
層板用基材、３……噴射装置、４……溶剤タン
ク、５，７……ワニス、６，８……デイツプロー
ル、９……スクイズロール、１０……乾燥塔、１
４，１５……樹脂含浸槽、１６……制御装置、１
７……溶剤ポンプ。
FIG. 1 is a conceptual diagram showing a method of manufacturing a resin-impregnated base material for a laminate according to the present invention, and FIG. 2 is a sectional view showing an example of application of the resin-impregnated base material for a laminate obtained according to the present invention. 1, 11, 12, 13... Roll, 12... Base material for laminate, 3... Injection device, 4... Solvent tank, 5, 7... Varnish, 6, 8... Date roll, 9... Squeeze Roll, 10...Drying tower, 1
4, 15...Resin impregnation tank, 16...Control device, 1
7...Solvent pump.
Claims (1)
含浸基材の製造方法において、積層板用基材に有
機溶剤を選択的に含浸させ、次いで熱硬化性樹脂
を塗布含浸させて、前記基材の任意な位置の樹脂
付着量を制御することを特徴とする積層板用樹脂
含浸基材の製造方法。 ２ 積層板用基材の幅方向に、樹脂付着量を制御
する特許請求の範囲第１項記載の積層板用樹脂含
浸基材の製造方法。 ３ 積層板用基材に有機溶剤を噴射させて含浸を
行う特許請求の範囲第１項又は第２項記載の積層
板用樹脂含浸基材の製造方法。[Claims] 1. A method for producing a resin-impregnated base material in which a thermosetting resin is impregnated into a laminate base material, in which the laminate base material is selectively impregnated with an organic solvent, and then the thermosetting resin is impregnated with the thermosetting resin. A method for manufacturing a resin-impregnated base material for a laminate, which comprises coating and impregnating the base material to control the amount of resin deposited on any arbitrary position of the base material. 2. The method for producing a resin-impregnated base material for a laminate according to claim 1, wherein the amount of resin deposited is controlled in the width direction of the base material for a laminate. 3. A method for producing a resin-impregnated base material for a laminate according to claim 1 or 2, wherein the base material for a laminate is impregnated by spraying an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62245578A JPS6487232A (en) | 1987-09-29 | 1987-09-29 | Manufacture of impregnated base material for laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62245578A JPS6487232A (en) | 1987-09-29 | 1987-09-29 | Manufacture of impregnated base material for laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6487232A JPS6487232A (en) | 1989-03-31 |
| JPH0356900B2 true JPH0356900B2 (en) | 1991-08-29 |
Family
ID=17135811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62245578A Granted JPS6487232A (en) | 1987-09-29 | 1987-09-29 | Manufacture of impregnated base material for laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6487232A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4490713B2 (en) * | 2004-03-24 | 2010-06-30 | シチズンセイミツ株式会社 | Timepiece dial and method for manufacturing the same |
| JP4734953B2 (en) * | 2005-02-23 | 2011-07-27 | パナソニック電工株式会社 | Manufacturing method of prepreg |
-
1987
- 1987-09-29 JP JP62245578A patent/JPS6487232A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6487232A (en) | 1989-03-31 |
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