JPH0417906B2 - - Google Patents
Info
- Publication number
- JPH0417906B2 JPH0417906B2 JP61297625A JP29762586A JPH0417906B2 JP H0417906 B2 JPH0417906 B2 JP H0417906B2 JP 61297625 A JP61297625 A JP 61297625A JP 29762586 A JP29762586 A JP 29762586A JP H0417906 B2 JPH0417906 B2 JP H0417906B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- dielectric constant
- alumina
- cordierite
- borosilicate glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Description
【発明の詳細な説明】
〔概 要〕
本発明は高速コンピユーター用などに用いるセ
ラミツク回路基板において、層間絶縁物をアルミ
ナでコーテイングした誘電率の低いコージエライ
ト粉末と硼珪酸ガラスとから成るガラス−セラミ
ツクス複合体とすることにより、信号の高速伝播
を可能とした回路基板用磁器組成物を提供する。[Detailed Description of the Invention] [Summary] The present invention is a ceramic circuit board used for high-speed computers, etc., in which a glass-ceramic composite consisting of cordierite powder with a low dielectric constant and borosilicate glass coated with alumina as an interlayer insulator is used. The present invention provides a ceramic composition for a circuit board that enables high-speed signal propagation by forming a ceramic composition into a ceramic body.
本発明は回路基板用磁器組成物に係り、特に誘
電率が低いコージエライトを用いた回路基板上磁
器組成物に関する。
The present invention relates to a ceramic composition for a circuit board, and particularly to a ceramic composition for a circuit board using cordierite, which has a low dielectric constant.
高速コンピユータなどに用いる回路基板用絶縁
物の代表的な材料としてアルミナと硼珪酸ガラス
とからなるガラス−セラミツクス複合材料（以下
GCAと記す）が知られている。
A glass-ceramic composite material (hereinafter referred to as ``glass-ceramic composite material'') consisting of alumina and borosilicate glass is a typical material for circuit board insulators used in high-speed computers, etc.
GCA) is known.
GCAの微細構造を従来例として第５図に示す。 The microstructure of GCA is shown in Fig. 5 as a conventional example.
第５図において硼珪酸ガラス１のマトリツクス
（非晶質）中にアルミナ（Al2O3）２が分散して
いる。 In FIG. 5, alumina (Al 2 O 3 ) 2 is dispersed in a matrix (amorphous) of borosilicate glass 1. In FIG.
セラミツク回路基板に要求される条件の１つと
して高周波特性；信号の伝播特性を向上させるた
めに誘電率が低いことが望まれる。 One of the requirements for ceramic circuit boards is high frequency characteristics; low dielectric constant is desired to improve signal propagation characteristics.
従来のGCAよりもさらに誘電率の低い絶縁体
を得るためにはガラスマトリツクス中に分散して
いるアルミナ（誘電率10）をより誘電率の低いコ
ージエライト（誘電率5.3）で置換すればよい。
In order to obtain an insulator with an even lower dielectric constant than conventional GCA, the alumina (dielectric constant 10) dispersed in the glass matrix can be replaced with cordierite (dielectric constant 5.3), which has a lower dielectric constant.
ところがコージエライトと硼珪酸ガラスを単純
に混合させた複合焼成体は焼成後の冷却過程で多
数のクラツクを生じてしまう。このクラツクの原
因は900℃〜1100℃での加熱により複合体中の硼
珪酸ガラス（非晶質）が結晶質SiO2（クリストバ
ライト）へと相転移するためであり、この相転移
を防ぐ方法の開発が必要とされていた。 However, a composite fired body made by simply mixing cordierite and borosilicate glass produces many cracks during the cooling process after firing. The cause of this crack is that the borosilicate glass (amorphous) in the composite undergoes a phase transition to crystalline SiO 2 (cristobalite) due to heating at 900°C to 1100°C. development was needed.
上記問題点は本発明によればアルミナでコーテ
イングしたコージエライト粉末５〜70重量％と、
硼珪酸ガラス9.5〜30重量％とからなる回路基板
用磁器組成物によつて解決される。
According to the present invention, the above problem can be solved by using cordierite powder coated with alumina in an amount of 5 to 70% by weight.
The problem is solved by a porcelain composition for circuit boards comprising 9.5 to 30% by weight of borosilicate glass.
本発明によればコージエライト粉末がアルミナ
によりコーテイングされているのでコージエライ
ト粉末がガラスの結晶核となることを防止するこ
とが可能となるため、ガラスの結晶質SiO2（クリ
ストバライト）がマトリツクス中に析出すること
を抑えられる。
According to the present invention, since the cordierite powder is coated with alumina, it is possible to prevent the cordierite powder from becoming a crystal nucleus of the glass, so that crystalline SiO 2 (cristobalite) of the glass is precipitated in the matrix. I can control things.
以下本発明の実施例を図面に基づいて説明す
る。
Embodiments of the present invention will be described below based on the drawings.
第１図は本発明に係るガラス−セラミツクス複
合体の一実施例を示す模式図である。第１図にお
いて硼珪酸ガラス３のマトリツクス中にアルミナ
４を被覆したコージエライト５が分散されてい
る。 FIG. 1 is a schematic diagram showing an example of a glass-ceramics composite according to the present invention. In FIG. 1, cordierite 5 coated with alumina 4 is dispersed in a matrix of borosilicate glass 3. In FIG.
第１図の複合体を製造する方法を以下詳細に説
明する。 The method for manufacturing the composite of FIG. 1 will now be described in detail.
アルミニウムイソプロポキシド200ｇをトルエ
ン400ｇに溶解し、これにコージエライト粉末を
150ｇ加え、さらにH2Oを180ｇ徐々に加えて、
アルミニウムイソプロポキシドを加水分解する。
乾燥後大気中1200℃で熱処理し、アルミナコーテ
イングされたコージエライト粉末を得た。次にこ
の粉末と硼珪酸ガラスとを１：１の重量比となる
ように混合し、さらにPVB、DBP、MEKを加え
て湿式混合したのちグリーンシートを得た。この
グリーンシートを10枚加圧積層し、大気中1000℃
で4h焼成した。このようにして第１図に示した
複合体を得る。 Dissolve 200g of aluminum isopropoxide in 400g of toluene and add cordierite powder to it.
Add 150g and gradually add 180g of H 2 O.
Hydrolyze aluminum isopropoxide.
After drying, it was heat-treated in the air at 1200°C to obtain alumina-coated cordierite powder. Next, this powder and borosilicate glass were mixed at a weight ratio of 1:1, and PVB, DBP, and MEK were further added and wet mixed to obtain a green sheet. Ten of these green sheets were laminated under pressure and heated to 1000℃ in the atmosphere.
Baked for 4 hours. In this way, the composite shown in FIG. 1 is obtained.
得られた焼成体の熱膨張計数は4.0×10-6／℃
（R.T.〜300℃）と小さく焼成後の冷却過程でク
ラツクを生じることはなかつた。そしてこの焼成
体の誘電率は5.0と従来のGCA（誘電率5.6）に比
べて低かつた。 The thermal expansion coefficient of the obtained fired body is 4.0×10 -6 /℃
(RT ~ 300℃) and no cracks occurred during the cooling process after firing. The dielectric constant of this fired body was 5.0, which was lower than that of conventional GCA (dielectric constant 5.6).
同様の実験をアルミナコーテイング済コージエ
ライト粉末と硼珪酸ガラス粉末の重量比を変えて
行つた場合の誘電率と熱膨張係数および密度の測
定結果を第２図、第３図及び第４図に示す。図４
からコーテイング済コージエライト粉末の量が
5wt％未満となるとクリストバライトの析出によ
り熱膨張係数が大きくなつてしまうことがわか
る。また70wt％を超えるとマトリツクスとなる
べきガラス量が不足し、緻密な焼成体が得られな
くなる。 2, 3, and 4 show the measurement results of the dielectric constant, thermal expansion coefficient, and density when similar experiments were conducted with different weight ratios of alumina-coated cordierite powder and borosilicate glass powder. Figure 4
The amount of coated cordierite powder is
It can be seen that when the content is less than 5 wt%, the thermal expansion coefficient becomes large due to the precipitation of cristobalite. Moreover, if it exceeds 70 wt%, the amount of glass to form a matrix will be insufficient, making it impossible to obtain a dense fired body.
以上説明したように本発明によれば焼成中にク
リストバライトの発生を防止してクラツク発生を
抑えたしかも誘電率の低い磁器組成物を得ること
ができる。
As explained above, according to the present invention, it is possible to obtain a ceramic composition which prevents the generation of cristobalite during firing, suppresses the generation of cracks, and has a low dielectric constant.
第１図は本発明に係るガラス−セラミツクス複
合体の一実施例を示す模式図であり、第２図、第
３図及び第４図はコーテイング済コージエライト
粉末重量比と、誘電率、熱膨張係数及び密度との
関係をそれぞれ示す図であり、第５図は従来例を
説明するための模式図である。
１，３…硼珪酸ガラス、２，４…アルミナ、５
…コージエライト。
FIG. 1 is a schematic diagram showing an example of the glass-ceramics composite according to the present invention, and FIGS. 2, 3, and 4 show the coated cordierite powder weight ratio, dielectric constant, and coefficient of thermal expansion. FIG. 5 is a schematic diagram for explaining a conventional example. 1, 3...borosilicate glass, 2, 4... alumina, 5
...cordierite.
Claims (1)
粉末５〜70重量％と、硼珪酸ガラス95〜30重量％
とからなる回路基板用磁器組成物。1 5-70% by weight of cordierite powder coated with alumina and 95-30% by weight of borosilicate glass
A porcelain composition for circuit boards consisting of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61297625A JPS63151645A (en) | 1986-12-16 | 1986-12-16 | Porcelain composition for circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61297625A JPS63151645A (en) | 1986-12-16 | 1986-12-16 | Porcelain composition for circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151645A JPS63151645A (en) | 1988-06-24 |
| JPH0417906B2 true JPH0417906B2 (en) | 1992-03-26 |
Family
ID=17848986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61297625A Granted JPS63151645A (en) | 1986-12-16 | 1986-12-16 | Porcelain composition for circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63151645A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0643270B2 (en) * | 1988-03-10 | 1994-06-08 | 株式会社村田製作所 | Low temperature sintered porcelain composition for multilayer substrate |
| US5206190A (en) * | 1990-09-04 | 1993-04-27 | Aluminum Company Of America | Dielectric composition containing cordierite and glass |
| JP2906282B2 (en) * | 1990-09-20 | 1999-06-14 | 富士通株式会社 | Glass-ceramic green sheet, multilayer substrate, and manufacturing method thereof |
-
1986
- 1986-12-16 JP JP61297625A patent/JPS63151645A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63151645A (en) | 1988-06-24 |
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