JPH04358B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the assembly of electrical connection terminals, specifically connection terminals for connecting small electronic circuit component supports (so-called monolithic or hybrid ICs, etc.) to printed circuit boards. The present invention relates to a method and a lead structure used therein.

(Prior Art) Recently, integrated circuit elements have appeared that have a rectangular outer shape and have external terminals on all four sides. Such a circuit element has a large number of external terminals, and therefore it is impossible due to its dimensions to directly connect the leads to a conductor such as a printed circuit board, unlike a conventional dual-in-line integrated circuit element. Therefore, connecting elements or sockets are used to increase the spacing between the terminals of the integrated circuit to achieve this goal.

In this way, a conductive metal wire is generally used as a connecting element between a circuit element and a printed circuit board. Usually, the thin metal wire is a drawn copper alloy wire plated with tin or the like, cut into an appropriate length, partially bent as necessary, and then molded into a mold. It is then cast into an insulating material such as synthetic resin to form a connecting element.

An example is shown in FIG. In the figure, 1 is an insulator,
2 and 3 are thin metal wires, thin metal wires 2 and 3
For example, the lower parts are alternately bent in opposite directions like 6 and 7, and the interval between adjacent thin wires is narrower at the upper part and wider at the lower part,
Soldering to printed circuit boards is becoming easier.
In the figure, reference numeral 8 denotes a device having a large number of leads, such as an IC, which is attached to this connector, and the upper part 5 of the thin metal wire comes into contact with the side wall electrode terminal of the device, thereby exerting a slight pressure on the inside. Further, 9 is a printed circuit board to which thin wires 6 and 7 are connected by contacting or soldering.

(Problems to be Solved by the Invention) When using the above-mentioned connecting element, the number of thin contact wires ranges from several tens to over a hundred, and furthermore, even if a jig is used to connect such a large number of thin wires, It is certainly not easy to place the mold in place, and it takes a considerable amount of time to accomplish this. Therefore, the product has a considerably high price, while there is an oversupply or shortage of fine wire during manufacturing, and
Accidents such as short circuits between adjacent thin wires caused by defective products, especially the latter, can also occur due to improper supply. Further, the interval between the lower leads cannot be made too large.

An object of the present invention is to provide a method for assembling a connecting element by appropriately spacing the leads, supplying the required amount of thin wires to serve as leads at predetermined locations, and assembling a connecting element.

(Means for Solving the Problems) As a result of repeated research to solve these problems, the inventors of the present invention have discovered that a plurality of leads are arranged in parallel, and they are electrically conductively integrated at their upper ends. A lead structure consisting of a connecting body connected to the lead structure, an insulating material that holds and aligns the leads in a line approximately in the middle of the lead, and a lead structure that is inserted and fixed into a long groove provided around a flat insulator frame. The present invention was completed based on the knowledge that assembly can be easily carried out by inserting the tip of the connector into a hole provided at the bottom of the long groove and then cutting and removing the connector.

(Function) In the present invention, since the leads are held and aligned at predetermined intervals using an insulating material, the leads can be attached to predetermined positions on the insulating frame without shorting between adjacent leads.

Further, since the insulating material fits into the groove of the frame and the lead is inserted into the hole, the work is simple.

(Example) Hereinafter, an example of the present invention will be described based on the drawings.

FIG. 1A is a partially longitudinal side view of a connecting element of the present invention. In the figure, 11 is a frame made of an insulator, and its shape is square (see Figure 1B).
Long grooves 12 run adjacent to the four sides. The bottoms 13 of these long grooves 12 (see FIG. 1C) are provided with at least two rows of lead holes 14, three rows in the illustrated example. Since the lead holes are drilled in this manner, as shown in FIG. 1B, the distance between adjacent holes can be made considerably larger than in the case where there is only one row of holes.

A lead structure 15 described below is inserted into the long groove 12 of the frame 11.

As shown in FIG. 2A, the lead structure 15 has a plurality of leads 16 arranged in parallel.
It consists of a long insulating material 17 that holds the leads 16 in an aligned state at a longitudinally intermediate portion thereof.

The outer shape of the elongated insulating material is substantially the same as the shape of the elongated groove 12, and can be inserted into the elongated groove. lead 1
6 consists of an integral metal piece electrically conductively connected at its upper end by a connecting body 18 as shown in FIG. 2A;
The leads 16 are connected to each other by a long insulating material 17 at the center to form a lead structure 15. The part of the lead 16 connected to the connector 18 is shown in Figure 2B.
As shown in , it is bent so that, for example, an IC or the like can be pressed to the side.

As shown in FIGS. 2B and 2C, the lower part of the lead is located at the left, center, right,... when looking at the lead structure 15 from the side.
The leads 16 are bent in the opposite direction every other lead in the order shown in FIG. It has such a structure that it can be inserted into the hole 14 at the bottom of the long groove.

Such a lead structure is made by pressing or etching a thin plate material into a group of 16 leads whose ends are connected by connectors 18 and 19 as shown in FIG. Material 17
(Fig. 3) and connect the lower connection body 19 to the lead 16.
Cut off at the bottom of the lead, and then fold the upper lead as described above.

In this case, before separating the upper and lower connectors, make a plurality of leads 16 connected with long insulators with the lead connectors 18 and lower lead connectors 19 still connected, and make the required number of leads ( For example, 4 pieces)
While the lead structures remained connected, the lead connecting body 18 and the lower lead connecting body 19 were cut in parallel to the lead 16, and then the lower lead connecting body 19 was separated, and the upper lead end was bent and formed as described above. Afterwards, the lead connection body 18 is left. Furthermore, four lead structures may be inserted into four long grooves of the frame at the same time. The lead structure and the frame long groove are fixed to each other by an appropriate method, such as an insulating adhesive.

Under special circumstances, a plurality of lead structures (e.g., four) as shown in Figure 4 may be interconnected with rectangular, square, or L-shaped elongated insulating material, and A connecting element (not shown) may be made by inserting it into a frame having a long groove of the same shape as the insulating material.

Until the IC 8 or the like is inserted into the connection element manufactured in this way and the terminal and the upper part of the lead 16 are connected by solder or the like, the connection body 18 is
Preferably, it remains connected to lead 16.

The reason for this is that recent ICs may include MOS type elements, so by shorting the terminals with such a connector 18, it is possible to reduce the electrostatic charge of this type of semiconductor element. This is to avoid damage due to mechanical shock.

(Effects) As is clear from the above, it is clear that the connecting element can be manufactured very easily since it is only necessary to insert the leads, which are aligned in advance with an insulating material, into the groove of the frame. Furthermore, since the materials used are efficient and the process is simple, the manufacturing cost is low.

Further, due to the manufacturing method of the lead structure as described above, the lead 16 has a slightly wider rectangular cross section. Therefore, the lead 16 has considerable rigidity in the longitudinal direction of the long insulator, and the distance between the lead and the semiconductor contact is
and the risk of lateral misalignment between the leads and printed circuit board connections is also reduced. Also noteworthy is the presence of the conductive upper connector 18, which prevents unnecessary damage to the expensive IC.

[Brief explanation of drawings]

FIG. 1A is a partial cross-sectional view of a connecting element according to an embodiment of the present invention. FIG. 1B is a partial top view of the frame of the present invention, FIG. 1C is a sectional view thereof, and FIGS. 2A, B, and C.
is the lead structure of the present invention. FIGS. 3 and 4 are explanatory diagrams of a method for manufacturing the lead structure. FIG. 5 is a partial cross-sectional view of a conventional connecting element. 11... Frame, 12... Long groove, 13... Bottom, 1
4... Lead hole, 15... Lead structure, 16... Lead, 17... Long insulating material, 18... Connection body, 19... Lower lead connection body, 21... Printed circuit board.

Claims (1)

[Claims] 1. A plurality of leads 16 arranged in parallel, a connecting body 18 that electrically conductively connects them together at their upper ends, and holds the leads in a line approximately at the middle of the leads. A lead structure 15 consisting of an insulating material 17 that is aligned and has approximately the same shape as the long groove 12 and is inserted and fixed into the long groove is inserted and fixed into the long groove 12 provided around the flat insulator frame 11. A method for assembling a connecting element, in which the tip end is inserted into a hole 14 provided in the bottom 13 of a long groove 12, and then the connecting body 18 is cut and removed. 2 The holes 14 in the bottom 13 of the long groove 12 are arranged in a zigzag pattern, and the leads 1 are arranged in a zigzag pattern.
6. The assembly method according to claim 1, wherein every other lower part of the holder 6 is bent in the opposite direction. 3. The assembly method according to claim 1 or 2, wherein the cross-sectional shape of the insulating material 17 is rectangular. 4. A plurality of leads 16 arranged in parallel, a connecting body 18 that conductively connects them together at their upper ends, and an insulating material 17 that holds and aligns the leads in a line approximately in the middle of the leads. The lower part of the lead is bent at right angles to the alignment surface of the lead. 5. The lead structure according to claim 4, in which every other lower part of the lead 16 is bent in the opposite direction. 6. Claim 4 or 5, characterized in that the leads are a plurality of leads made by removing a part of the plate material by punching or etching and leaving the lead 16 and the connecting body 18 as one body. Lead structure as described in Section.