JPH0530512B2 - - Google Patents
Info
- Publication number
- JPH0530512B2 JPH0530512B2 JP60177129A JP17712985A JPH0530512B2 JP H0530512 B2 JPH0530512 B2 JP H0530512B2 JP 60177129 A JP60177129 A JP 60177129A JP 17712985 A JP17712985 A JP 17712985A JP H0530512 B2 JPH0530512 B2 JP H0530512B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- head
- coating
- coating head
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は接着剤塗布装置に関し、特にリードレ
スタイプの電子部品（以下チツプ部品と称す）を
配線基板上に半田付けする際に、その前にチツプ
部品を基板に仮固定するために接着剤を基板に塗
布する装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an adhesive applicator, and in particular, when soldering a leadless type electronic component (hereinafter referred to as a chip component) onto a wiring board, the present invention relates to an adhesive applicator. This invention relates to a device that applies adhesive to a substrate in order to temporarily fix components to the substrate.
従来の技術
配線基板にチツプ部品を半田付けする際に、そ
れに先立つてチツプ部品を予め接着剤で仮固定す
るために、接着剤塗布ヘツド先端に接着剤を供給
し、その接着剤を基板上に移し替え、その後この
接着剤の上にチツプ部品を載置して取付ける方法
が、特開昭55−110097号公報に開示されている。
その接着剤塗布装置は、第６図に示すように塗布
ヘツド２１に小径パイプからなる一対の塗布ノズ
ル２２を設けた構成となつており、塗布ノズル２
２先端に接着剤２３を吐出し、これを基板２４に
押し付けて基板２４上に移し替えることにより第
７図に示すように小山状の接着剤２３を形成し、
その後チツプ部品２５をその電極部２５ａが配線
基板２４の導体部２４ａに接するように載置し、
チツプ部品２５の裏面及び側面の一部を接着剤２
３にて基板２４に接着し、半田付けの前に接着剤
２３に紫外線等を照射して硬化固定するようにし
ている。Prior art When chip components are soldered to a wiring board, in order to temporarily fix the chip components with adhesive in advance, adhesive is supplied to the tip of an adhesive application head, and the adhesive is applied onto the board. JP-A-55-110097 discloses a method of transferring and then mounting chip parts on this adhesive.
As shown in FIG. 6, the adhesive coating device has a configuration in which a coating head 21 is provided with a pair of coating nozzles 22 made of small diameter pipes.
By discharging adhesive 23 at the tip of 2, pressing it against a substrate 24 and transferring it onto the substrate 24, a mound of adhesive 23 is formed as shown in FIG. 7,
Thereafter, the chip component 25 is placed so that its electrode portion 25a is in contact with the conductor portion 24a of the wiring board 24,
Apply adhesive 2 to part of the back and side surfaces of the chip component 25.
3, the adhesive 23 is bonded to a substrate 24, and before soldering, the adhesive 23 is irradiated with ultraviolet rays or the like to harden and fix.
発明が解決しようとする問題点
ところが、上記構成では接着剤の塗布量を変化
させて厚さを調整することは可能であるが、その
ためには接着剤の供給圧力や供給時間を変える必
要があつて均一な制御が難しく、また接着剤の形
状が小山状であるため塗布量を多くするとその形
状精度が悪くなり、位置ずれを生じたり、接着剤
が電極部に付着する等の問題があつた。また、塗
布ノズルの間隔は変化させることができないた
め、チツプ部品が小さいときは接着剤が外れすぎ
て接着不良を生じたり、大きいときは接着剤が隠
れて紫外線等が照射され難く硬化不良のために接
着固定が不十分になつたりするという問題があつ
た。Problems to be Solved by the Invention However, with the above configuration, it is possible to adjust the thickness by changing the amount of adhesive applied, but to do so, it is necessary to change the adhesive supply pressure and supply time. Moreover, since the shape of the adhesive is mound-like, the precision of the shape deteriorates when a large amount is applied, causing problems such as misalignment and adhesion of the adhesive to the electrodes. . In addition, since the spacing between the application nozzles cannot be changed, if the chip parts are small, the adhesive may come off too much, resulting in poor adhesion, or if the chips are large, the adhesive will be hidden and difficult to irradiate with UV rays, resulting in poor curing. There was a problem that the adhesive fixation was insufficient.
本発明は上記問題点を解消することを目的とす
るものである。 The present invention aims to solve the above problems.
問題点を解決するための手段
本発明は上記目的を達成するため、少なくとも
一方向に相対移動可能なヘツド支持部に、幅広の
接着剤吐出穴を形成した塗布ヘツドを塗布平面に
沿つて回転可能に配設したことを特徴とする。Means for Solving the Problems In order to achieve the above object, the present invention has a coating head in which a wide adhesive discharge hole is formed in a head support portion that is relatively movable in at least one direction, and is rotatable along a coating plane. It is characterized by being placed in.
作 用
本発明は上記した構成を有するもので、塗布ヘ
ツドの吐出穴から接着剤を吐出しながら塗布ヘツ
ドを移動させることにより、所望の長さの接着剤
層を形成でき、かつ塗布ヘツドをその移動方向に
対して適当角度回転させることによつて接着剤層
の塗布幅も任意に選定することができ、さらに塗
布ヘツドの移動速度を調節することによつて接着
剤の供給速度を一定にしたままで接着剤層の厚さ
を任意に設定することができる。Function The present invention has the above-mentioned configuration, and by moving the coating head while discharging adhesive from the discharge hole of the coating head, it is possible to form an adhesive layer of a desired length, and to move the coating head into the adhesive layer. The application width of the adhesive layer can be arbitrarily selected by rotating the head at an appropriate angle with respect to the direction of movement, and the adhesive supply speed can be kept constant by adjusting the movement speed of the application head. The thickness of the adhesive layer can be set as desired.
実施例
以下本発明の一実施例について、第１図〜第５
図を参照しながら説明する。Embodiment Hereinafter, an embodiment of the present invention will be described in FIGS. 1 to 5.
This will be explained with reference to the figures.
第１図において、１は接着剤供給管２から供給
される接着剤を基板３上に塗布する塗布ヘツド
で、ヘツド支持部４に回転手段５にて所定角度往
復回転可能に接着されている。またこの塗布ヘツ
ド１は図外適宜手段で昇降可能に構成されてい
る。前記ヘツド支持部４は、Ｘ−Ｙ移動装置６に
固定され、Ｘ方向及びＹ方向に任意の速度で移動
駆動可能に構成されている。このＸ−Ｙ移動装置
６は、基台７上にＸ方向に移動自在に設置されＸ
軸モータ８ａにて駆動されるＸ方向移動体８と、
このＸ方向移動体８にＹ方向に移動自在に設置さ
れＹ軸モータ９ａにて駆動されるＹ方向移動体９
とから構成され、Ｙ方向移動体９の一端部に前記
ヘツド支持部４が固定されている。１０はマイク
ロプロセツサ及び記憶装置を内蔵した制御部であ
り、前記Ｘ軸モータ８ａ、Ｙ軸モータ９ａ及び回
転手段５の制御や接着剤の供給・停止制御を行う
ように構成されている。 In FIG. 1, reference numeral 1 denotes a coating head for coating a substrate 3 with adhesive supplied from an adhesive supply pipe 2, and is bonded to a head support 4 by a rotating means 5 so as to be rotatable back and forth at a predetermined angle. Further, the coating head 1 is configured to be movable up and down by suitable means not shown. The head support section 4 is fixed to an X-Y moving device 6 and is configured to be movable in the X direction and the Y direction at an arbitrary speed. This X-Y moving device 6 is installed on a base 7 so as to be movable in the X direction.
an X-direction moving body 8 driven by a shaft motor 8a;
A Y-direction moving body 9 is installed on this X-direction moving body 8 so as to be movable in the Y direction, and is driven by a Y-axis motor 9a.
The head support section 4 is fixed to one end of the Y-direction moving body 9. Reference numeral 10 denotes a control section incorporating a microprocessor and a storage device, and is configured to control the X-axis motor 8a, Y-axis motor 9a, and rotation means 5, and control supply and stop of adhesive.
前記塗布ヘツド１には、第２図に示すように１
つの細長い幅広の吐出穴１１が形成されており、
その幅Ｗは適用すべき最大のチツプ部品を接着す
るのに最適な接着剤層の幅に対応して設定されて
いる。 As shown in FIG.
Two elongated and wide discharge holes 11 are formed,
The width W is set to correspond to the width of the adhesive layer that is optimal for bonding the largest chip component to which it is applied.
以上の構成において、第３図に示すように大き
なチツプ部品P1を接着固定する場合は塗布ヘツ
ド１の吐出穴１１の長手方向を移動方向に対して
垂直にしてその全幅Ｗの接着剤層１２が形成され
るようにする。又、第４図に示すように比較的小
さいチツプ部品P2を接着固定する場合は、塗布
ヘツド１を回転手段５で所定角度回転させ、吐出
穴１１を移動方向に対して角度θだけ傾斜した姿
勢にしてWcosθの幅の接着剤層１２が形成される
ようにする。このように、チツプ部品の大きさに
応じて塗布ヘツド１を所定角度回転させることに
より接着剤層１２の幅をその電子部品に最適の幅
に設定することができる。 In the above configuration, when a large chip part P 1 is to be adhesively fixed as shown in FIG. is formed. In addition, as shown in Fig. 4, when a relatively small chip part P2 is to be fixed by adhesive, the coating head 1 is rotated by a predetermined angle by the rotating means 5, and the discharge hole 11 is tilted by an angle θ with respect to the moving direction. The adhesive layer 12 having a width of W cos θ is formed in the posture. In this manner, by rotating the coating head 1 by a predetermined angle depending on the size of the chip component, the width of the adhesive layer 12 can be set to the optimum width for the electronic component.
また、その接着剤層１２の厚さは、接着剤供給
管２からの供給量を一定にしたままで、塗布ヘツ
ド１の移動速度を調節することによつて調節する
ことが可能である。 Further, the thickness of the adhesive layer 12 can be adjusted by adjusting the moving speed of the coating head 1 while keeping the supply amount from the adhesive supply pipe 2 constant.
さらに、接着剤層１２の幅を上記のようにチツ
プ部品の大きさに対応させて調節する場合におい
て、接着剤の供給量を一定にしたままでその接着
剤層１２の厚さを一定にすることも塗布ヘツド１
の移動速度を調節することによつて可能である。
即ち、第５図において、接着剤の単位時間当たり
の供給量をＱ、所定の接着剤層１２の長さ又は塗
布ヘツド１の移動量をＬ＝ｖ・ｔ（ｖは移動速度、
ｔは移動時間）、接着剤層１２の厚さをｈ、塗布
ヘツド１の回転角をθとすると、この接着剤層１
２の接着剤の量Ｓは、
Ｓ＝Ｑ・ｔ＝ｖ・ｔ・ｈ・Wcosθ
となり、ｖは、
ｖ＝Ｑ／ｈ・Wcosθ
で与えられる。 Furthermore, when adjusting the width of the adhesive layer 12 in accordance with the size of the chip component as described above, the thickness of the adhesive layer 12 is kept constant while keeping the amount of adhesive supplied constant. Kotomo coating head 1
This is possible by adjusting the speed of movement.
That is, in FIG. 5, the amount of adhesive supplied per unit time is Q, and the length of the predetermined adhesive layer 12 or the amount of movement of the coating head 1 is L=v·t (v is the moving speed,
t is the moving time), the thickness of the adhesive layer 12 is h, and the rotation angle of the coating head 1 is θ.
The amount S of the adhesive in No. 2 is given by S=Q·t=v·t·h·Wcosθ, and v is given by v=Q/h·Wcosθ.
従つて、接着剤の単位時間当たりの供給量Ｑを
一定にしたままで接着剤層１２の幅を可変しても
その厚さｈを一定にするには、回転角θに応じて
上式より決まる移動速度ｖで塗布ヘツド１を移動
させればよい。そのために前記制御部１０に塗布
ヘツド１の回転角θを入力し、それによつて上式
によりＸ軸モータ８ａやＹ軸モータ９ａを制御す
るように設定しておけばよいのである。 Therefore, in order to keep the thickness h constant even if the width of the adhesive layer 12 is varied while keeping the supply amount Q of the adhesive per unit time constant, the above formula is calculated according to the rotation angle θ. It is sufficient to move the coating head 1 at a determined moving speed v. For this purpose, the rotation angle .theta. of the coating head 1 may be input to the control section 10, and the X-axis motor 8a and the Y-axis motor 9a may be controlled according to the above equation.
本発明は上記実施例に示す外、種々の態様で実
施することができ、例えば塗布ヘツド１をＸ−Ｙ
移動装置６により二方向に移動させるのではな
く、逆に基板３を移動させるようにしてもよく、
また塗布ヘツド１又は基板３を単に一方向に移動
させるだけでよい場合もあり、さらに塗布ヘツド
と基板をそれぞれ互いに直交する一方向に移動さ
せるようにしてもよい。又、移動装置や回転手段
の具体構成も任意に設計すればよい。 The present invention can be carried out in various modes other than those shown in the above embodiments. For example, the coating head 1 can be
Instead of moving the substrate 3 in two directions using the moving device 6, the substrate 3 may be moved in the opposite direction.
In some cases, it may be sufficient to simply move the coating head 1 or the substrate 3 in one direction, or the coating head and the substrate may each be moved in one direction orthogonal to each other. Further, the specific configurations of the moving device and the rotating means may be arbitrarily designed.
発明の効果
本発明の接着剤塗布装置によれば、以上のよう
に少なくとも一方向に相対移動可能なヘツド支持
部に、幅広の塗布穴を形成した塗布ヘツドを塗布
平面に沿つて回転可能に配設しているので、制御
の難しい塗布ヘツドに対する接着剤の供給量は一
定にしたままで、塗布ヘツドの移動速度を制御し
て接着剤層の厚さを調節することができ、かつ接
着剤層の厚さを均一にすることができる。しか
も、塗布ヘツドを回転させることによつて接着剤
層の幅も任意に設定することができ、電子部品の
大きさに適応した幅の接着剤層を形成できる。従
つて、本発明によれば電子部品の位置づれや接着
不良等を完全に無くすことができる。Effects of the Invention According to the adhesive applicator of the present invention, as described above, the applicator head in which the wide applicator hole is formed is arranged rotatably along the applicator plane in the head supporter that is relatively movable in at least one direction. This makes it possible to control the moving speed of the coating head and adjust the thickness of the adhesive layer while keeping the adhesive supply amount constant to the coating head, which is difficult to control. The thickness can be made uniform. Moreover, by rotating the coating head, the width of the adhesive layer can be set arbitrarily, and the adhesive layer can be formed with a width that is suitable for the size of the electronic component. Therefore, according to the present invention, misalignment of electronic components, poor adhesion, etc. can be completely eliminated.
第１図は本発明の一実施例の斜視図、第２図は
塗布ヘツドの先端部の斜視図、第３図及び第４図
は電子部品の接着状態の平面図、第５図は接着剤
層の厚さと塗布ヘツドの移動速度の関係の説明
図、第６図は従来例の正面図、第７図は同電子部
品の接着工程の斜視図である。
１……塗布ヘツド、４……ヘツド支持部、５…
…回転手段、６……Ｘ−Ｙ移動装置、１０……制
御部、１１……塗布穴、１２……接着剤層。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of the tip of the coating head, FIGS. 3 and 4 are plan views of electronic components bonded, and FIG. 5 is an adhesive An explanatory diagram of the relationship between the layer thickness and the moving speed of the coating head, FIG. 6 is a front view of the conventional example, and FIG. 7 is a perspective view of the bonding process of the same electronic component. 1... Application head, 4... Head support part, 5...
...Rotating means, 6...X-Y moving device, 10... Control unit, 11... Application hole, 12... Adhesive layer.
Claims (1)
持部に、幅広の接着剤吐出穴を備えた塗布ヘツド
を塗布平面に沿つて回転可能に配設したことを特
徴とする接着剤塗布装置。 ２ ヘツド支持部の移動速度を制御する制御部を
備えていることを特徴とする特許請求の範囲第１
項に記載の接着剤塗布装置。 ３ 制御部が、ヘツド移動方向に対して垂直方向
に吐出穴が沿う方向を基準とする塗布ヘツドの回
転角に対応してヘツド支持部の移動速度を制御す
るように構成されていることを特徴とする特許請
求の範囲第２項記載の接着剤塗布装置。[Scope of Claims] 1. An adhesive characterized in that a coating head equipped with a wide adhesive discharge hole is arranged rotatably along a coating plane on a head support portion that is relatively movable in at least one direction. Coating device. 2. Claim 1, characterized by comprising a control section that controls the moving speed of the head support section.
Adhesive applicator as described in section. 3. The control section is configured to control the moving speed of the head support section in accordance with the rotation angle of the coating head with reference to the direction along which the discharge hole is perpendicular to the direction of movement of the head. An adhesive coating device according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177129A JPS6238265A (en) | 1985-08-12 | 1985-08-12 | Apparatus for applying adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177129A JPS6238265A (en) | 1985-08-12 | 1985-08-12 | Apparatus for applying adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6238265A JPS6238265A (en) | 1987-02-19 |
| JPH0530512B2 true JPH0530512B2 (en) | 1993-05-10 |
Family
ID=16025677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60177129A Granted JPS6238265A (en) | 1985-08-12 | 1985-08-12 | Apparatus for applying adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6238265A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63236008A (en) * | 1987-03-25 | 1988-09-30 | Matsushita Electric Ind Co Ltd | Manufacturing method of liquid crystal display element |
| JPH07100147B2 (en) * | 1987-04-28 | 1995-11-01 | 松下電器産業株式会社 | Adhesive coating device |
| JPH0666543B2 (en) * | 1988-05-26 | 1994-08-24 | 太陽誘電株式会社 | Adhesive application method to circuit board |
| JP2542893Y2 (en) * | 1991-06-20 | 1997-07-30 | 富士通テン株式会社 | Viscous liquid supply device |
| US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
| DE102020117012A1 (en) * | 2020-06-29 | 2021-12-30 | Lts Lohmann Therapie-Systeme Ag | Dosing device and method for dosing therapeutic liquids |
-
1985
- 1985-08-12 JP JP60177129A patent/JPS6238265A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238265A (en) | 1987-02-19 |
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