JPH0548300B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to improvements in ion plating apparatus.

[Prior Art] As a conventional ion plating apparatus, one having the structure described below is known.

a vacuum chamber, a substrate holder provided in the chamber, an evaporation source for evaporating the evaporation material in the crucible disposed in the chamber by electron beam irradiation, and an evaporation source disposed on the side wall of the chamber, in which the evaporation source from the evaporation source is disposed on a side wall of the chamber; An ion plating device consisting of a hollow cathode gun for irradiating plasma onto evaporated deposition material.
In such an apparatus, a deposition material evaporated from a deposition source is irradiated with plasma from a hollow cathode gun, so that the ionized deposition material collides with a substrate of a holder to form a film.

A vacuum chamber, a substrate holder provided in this chamber, a magnet placed on a side opposite to the substrate holding side of this holder, and a material for evaporation in a crucible placed in the chamber by electron beam irradiation. An ion plating apparatus comprising: an evaporation source; and a plasma gun provided on a side wall of the chamber for drawing plasma into the chamber. In such a device,
Plasma drawn into the chamber from the plasma gun is collected on the surface of the substrate held in the holder by the magnetic field of a magnet placed in the holder, and the evaporation material evaporated from the evaporation source and directed toward the substrate is ionized by the plasma. Film formation is performed by colliding ionized vapor deposition material with the substrate.

[Problems to be Solved by the Invention] However, in the above-mentioned ion plating apparatus, the shape of the plasma is fixed depending on the strength of the magnetic field, etc., so the evaporation material ionized by the plasma is ionized by the plasma into a complex shape with unevenness, etc. It cannot be expected to wrap around the entire board. In addition, in the above-mentioned ion plating apparatus, the plasma drawn into the chamber from the plasma gun can be collected on the substrate surface by the magnetic field of the magnet placed on the opposite side of the holder substrate. It is almost impossible to wrap the material around the entire board that has a complicated shape, such as unevenness. This is because changing the magnetic field only increases or decreases the spread of the entire plasma, but cannot change the directionality of the plasma.

The present invention has been made to solve the above-mentioned conventional problems, and aims to provide an ion plating apparatus that can efficiently form a uniform film over the entire surface of a substrate even if it has a complex shape.

[Means for Solving the Problems] The present invention includes a vacuum chamber, a substrate holder disposed within the chamber, a deposition source disposed within the chamber, and a method for introducing plasma into the chamber. a plasma generation source, and an air core provided on the outside of the chamber corresponding to the outer periphery of the plasma generation source and on the outside of the chamber facing the plasma generation source, for focusing the plasma drawn into the chamber. a plurality of opposing electrodes disposed within the chamber and containing magnets for focusing plasma introduced into the chamber from the plasma generation source toward the substrate held by the holder; and these opposing electrodes. This is an ion plating apparatus characterized by comprising a plurality of drive mechanisms for respectively moving and swinging the ion plating apparatus in the X and Y directions.

[Operation] According to the present invention, a plurality of opposing electrodes each having a built-in magnet inside a vacuum chamber are moved and swung in the X and Y directions by a drive mechanism to achieve a desired positional relationship with respect to the surface of a substrate held in a holder. and by arranging them at a desired angle and facing each other, and by generating a magnetic field from the magnets of each of the opposing electrodes, the plasma introduced into the chamber from the plasma generation source is directed to the surface of the substrate by each of the opposing electrodes. The plasma can be focused at high density, and at the same time, the plasma can be irradiated onto the substrate surface from multiple directions. Therefore, the evaporation material evaporated from the evaporation source disposed in the chamber can be efficiently ionized by the plasma, and the ionized evaporation material can be introduced into the substrate from multiple directions. Therefore, the ionized vapor deposition material has a good ability to spread around a complex-shaped substrate, so it is possible to obtain an ion plating apparatus that can efficiently form a uniform film over the entire surface of the substrate.

[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram of an ion plating apparatus showing an embodiment of the present invention, and FIG.
3 is a sectional view taken along the Y-Y line in FIG. 1, FIG. 4 is a sectional view showing the counter electrode in FIG. 1 and its driving mechanism, and FIG. 5 is a sectional view taken in FIG. 4. FIG. 1 in the figure is a vacuum chamber, and an exhaust pipe 2 is provided at the bottom of the chamber 1 and communicates with a vacuum pump (not shown) for maintaining the chamber 1 at a predetermined degree of vacuum. 3 in the diagram is
It is a source of vapor deposition. This vapor deposition source 3 is connected to the chamber 1.
a crucible 4 disposed near the bottom of the chamber; an electron gun 5 disposed on the lower side wall of the chamber 1 for irradiating an electron beam; and an electron gun 5 disposed near the top of the crucible 4 to emit electrons from the electron gun 5. It is comprised of a deflection coil 6 for deflecting the beam and irradiating the vapor deposition material in the crucible 4. Further, a plasma gun 7 as a plasma generation source is provided on the outer wall of the chamber 1, and an introduction pipe 8 for introducing a predetermined gas such as argon gas is provided at the rear of the plasma gun 7. ing. Note that a plasma constriction section 9 is provided on the side wall of the chamber 1 in which the plasma gun 7 is provided. Further, near the connection of the plasma gun 7 with the chamber 1 and on the outer wall portion of the chamber 1 facing the plasma gun 7, air-core magnets 10a and 10b are provided to prevent the plasma drawn from the plasma gun 7 from diffusing. are provided for each. On the side wall of the chamber 1, a plurality of drive mechanisms 11 (for example, 5 drive mechanisms) for moving and swinging the counter electrode in the XY directions are located substantially on the same plane as the installation location of the plasma gun 7. It is installed so that it penetrates like this.

The drive mechanism 11 for the counter electrode will be described in detail below. As shown in FIGS. 4 and 5, this drive mechanism 11 includes a flange 13 that is tilted downward and fixed to an annular support plate 12 attached to the side wall 1a of the chamber 1 via a seal member. ing. The cylindrical support portion 14 of this flange 13 has an X
X to move the direction slider in the arrow X direction
A directional drive shaft 15 is pivotally supported via a sealing material and a sliding cylindrical body 16 fitted to the drive shaft 15. A screw 17 is cut into the vicinity of the end of the drive shaft 15 on the flange 13 side, and a groove 19 is formed into which a stop pin 18 inserted from the cylindrical support portion 14 is inserted. The screw 17 of the drive shaft 15 has a gear 2 threaded on the inside.
0 are screwed together, and the gear 20 is meshed with a gear 23 rotated by an X-direction slider drive motor 21 and a shaft 22. That is, by rotating the motor 21, the rotation of the gear 23 of the shaft 22 is transmitted to the gear 20, and the drive shaft 15, which is threadedly engaged with the gear 20 and has the stop pin 18 inserted into the groove 19, becomes a cylinder. It is adapted to be moved in the X direction while being pivotally supported by the shaped support part 14. An X-direction slider 24 having a T-shaped cross section is attached to the distal end side of the X-direction drive shaft 15 . This slider 24 includes a Y-direction slider 2 having a cavity 25 inside.
6 are engaged so as to embrace the upper part of the slider 24, and the bearings 27a, 27b of these engagement parts
It is disposed so as to be movable in the Y direction via the .

The flange 13 has a Y as shown in FIG.
A directional slider drive motor 27 is provided.
A Y-direction drive shaft 28 disposed parallel to the X-direction drive shaft 15 is pivotally attached to this motor 27 . The tip of the drive shaft 28 is inserted into a cylindrical boss 29 having a spline groove formed inside, and is fixed by a screw (not shown). A rear end portion of a spline shaft 30 having spline teeth formed on its outer peripheral surface is inserted into and engaged with the boss 29 from the side opposite to the drive shaft 28 . This spline shaft 3
0 is pivotally supported by a bearing 32 of a support block 31 extending from the X-direction slider 24, and a pinion 33 is fitted to the tip thereof. This pinion 33 is meshed with a rack 34, and the rack 34 extends in a direction perpendicular to the axis 30 on a side wall of the Y-direction slider 26 parallel to the axial direction of the spline shaft 30. It is attached. In other words, the Y-direction slider drive motor 27
The rotation is transmitted to the spline shaft 30 via the drive shaft 28 and the boss 29, and by rotating the pinion 33 at the tip, the rack 34 meshed with the pinion 33 moves in the Y direction. Accordingly, the Y-direction slider 26 to which the rack 34 is attached is moved in the Y-direction along the X-direction slider 24. Note that when the X-direction slider drive motor 21 is rotated to move the X-direction slider 24 in the X direction, the boss 29 into which the Y-direction drive shaft 28 is inserted and fixed is spline-coupled to the spline shaft 30. Therefore, the spline shaft 30 can move forward and backward following the movement of the X-direction slider 24 in the X direction.

A swing motor 35 is provided on the flange 13 . A drive shaft 36 disposed parallel to the X-direction drive shaft 15 is pivotally attached to the motor 35 . The tip of this drive shaft 36 is connected to a connecting shaft 38 via a first universal joint 37.
The connecting shaft 38 is inserted into a cylindrical boss 39 having a spline groove formed inside, and is fixed by a screw (not shown). Said boss 3
9, a rear end portion of a spline shaft 40 having spline teeth formed on its outer peripheral surface is inserted and engaged from the side opposite to the connecting shaft 38. This spline shaft 40
is connected to the shaft 42 via a second universal joint 41. The tip of this shaft 42 is
The Y-direction slider 26 is inserted into the cavity 25 through the side wall thereof, and the bearings 43a,
43b. In addition, the shaft 4
A bevel gear 44 is pivotally attached to the tip of 2. This bevel gear 44 is inserted from the upper surface of the Y-direction slider 26 and meshed with a bevel gear 47 at the lower end of the shaft 46 which is pivotally supported via bearings 45a and 45b. An engagement plate 48 is pivotally attached to a portion of the shaft 46 that protrudes from the Y-direction slider 26 . A frame-shaped frame 49 is provided on the Y-direction slider 26. The engagement plate 48 includes:
The lower end of the arm 50 inclined at a predetermined angle is the bearing 5
1, and a support base 52 is integrally attached to the upper end of the arm 50.
The arm 50 has a bearing portion attached to the frame 49.
A counter electrode 54 is fixed to the support base 52 at the upper end thereof. Further, a shaft 55 is provided in the bearing portion of the arm 50.
is rotatably supported, and the shaft 55 passes through the bearing 53 perpendicularly to the frame 49.
It is pivoted at the top. In other words, the arm 50
The rotational fulcrum of the bearing portion serves as the central axis of the miso scraping motion for swinging the opposing electrode 54 fixed to the tip of the arm 50 in all directions.

Further, the counter electrode 54 has a disk shape,
Moreover, a ring-shaped electromagnet 56 is built inside. Further, a water-cooled tube (not shown) is buried in the counter electrode 54, and a pair of flexible tubes 57 ₁ and 57 ₂ are connected to both ends of the water-cooled tube through the support base 55. These flexible tubes 57 ₁ and 57 ₂ extend outside the chamber 1 through the annular support plate 12 . A lead wire (not shown) is connected to the electromagnet 56,
The lead wires are extended to the outside through the same routes as the water-cooled pipes and flexible pipes 57 ₁ and 57 ₂ . Further, each member electrically connected to the counter electrode 54 is grounded. That is, by grounding the counter electrodes 54 through the respective members, the plasma of the plasma gun 7 can be drawn out toward the counter electrodes 54 in the chamber 1.

Furthermore, a holder 58 for holding a substrate on which a film is to be formed is provided near the plasma generation region of the chamber 1.
is installed. This holder 58 has a variable DC power supply 5 for applying a negative voltage.
9 is connected. Further, a heater (not shown) is arranged around the holder 58.

Next, thin film formation using the ion plating apparatus of the present invention will be explained.

First, the substrate 60 is held in the holder 58, and a predetermined vapor deposition material 61 is accommodated in the crucible 4 of the vapor deposition source.

Next, when the X slider drive motor 21 of each drive mechanism 11 is rotated, the rotation of the gear 23 of the shaft 22 pivotally attached to the motor 21 is transmitted to the gear 20, which is screwed into the gear 20 and stopped in the groove 19. The X-direction drive shaft 15 into which the pin 18 is inserted is moved in the X-direction while being pivotally supported by the cylindrical support portion 14.
An X-direction slider 24 fixed to the tip of the shaft 15
is moved to a predetermined position. Next, when the Y-direction slider drive motor 27 is rotated, the rotation is transmitted to the spline shaft 30 via the drive shaft 28 and the boss 29, and the pinion 33 at the tip thereof is transmitted to the spline shaft 30.
As the pinion 33 rotates, the rack 34 meshed with the pinion 33 moves in the Y direction, and as a result, the Y direction slider 26 to which the rack 34 is attached moves along the X direction slider 24. It is moved to a predetermined position in the Y direction. Further, when the swing motor 35 of each drive mechanism 11 is rotated at a predetermined circumferential angle, the rotation is caused by the drive shaft 36, the first
universal joint 37, connecting shaft 38,
The shaft 42 is connected to the shaft 42 via the boss 39, the spline shaft 40, the second universal joint 41, and the shaft 42.
The signal is transmitted to the bevel gear 44 at the tip. When the bevel gear 44 rotates at a predetermined circumferential angle, the rotation is transmitted to the bevel gear 47 that meshes with the bevel gear 44 and the shaft 46 that is pivotally attached to the gear 47. An arm 50 that is pivotally supported by a bearing 51 of the engagement plate 48 and inclined at a predetermined angle rotates by a predetermined circumferential angle. By rotating the arm 50,
A bearing portion of an arm 50 and a shaft 5 in which opposing electrodes 54 fixed to the tips thereof are arranged to intersect with each other.
3 and a shaft 55 which is supported by the frame 49 as a fulcrum, and stops at a predetermined angle. Due to the movement of the X-direction slider 24 and the Y-direction slider 26 of the plurality of (for example, five) drive mechanisms 11, the opposing electrodes 54 connected to the Y-direction slider 26 via various members such as the arm 50 are moved. The holder 58 is arranged in a predetermined positional relationship according to the shape of the substrate 60, and the rotation of the swing motor 35 at a predetermined circumferential angle causes the counter electrodes 54 to be arranged in a predetermined position according to the shape of the substrate 60. Tilted and opposed at an angle.

Next, a vacuum pump (not shown) is activated to exhaust the gas in the chamber 1 through the exhaust pipe 2 to bring the interior of the chamber 1 to a predetermined degree of vacuum (for example, 10 ^-3 ~
10 ^-4 torr). Subsequently, an electron beam is emitted from the electron gun 5, and the electron beam is accommodated in the crucible 4 by the deflection coil 6.
It is irradiated to melt and evaporate.

At the same time, by supplying a predetermined plasma generating gas such as argon to the plasma gun 7, plasma is generated from the plasma gun 7. The plasma 62 generated in this way is drawn out from inside the air-core magnet 10a into the chamber 1 through the constriction part 9, and is prevented from spreading within the wide chamber 1 by the magnetic fields of the air-core magnets 10a and 10b placed outside the chamber 1. Ru. In addition, the substrate holder 58
When a predetermined negative voltage is applied from the variable DC power supply 59 to , the positive ions in the extracted plasma 62 ionize the vapor gas, and the ions are accelerated and collided with the substrate 60 . At this time, the substrate 6 of the holder 58 is driven by the drive mechanism 11 described above.
arranged in a predetermined positional relationship according to the shape of 0,
When a predetermined current is applied to the electromagnet 56 of each counter electrode 54 which is tilted at a predetermined angle depending on the shape of the substrate 60 and faces each other, a magnetic field is generated from the surface of each counter electrode 54 and generated by the plasma gun 7. The generated plasma 62 is focused at high density on the entire lower surface of the substrate 60 in the chamber 1. The above-mentioned evaporation source 3 is placed in this high-density plasma 62 region.
When the evaporated material arrives, it is ionized and the positively ionized evaporation material in the plasma 62 is ionized by the magnetic field from each opposing electrode 54 and the attractive force of the holder 58 to which a negative voltage is applied. Since the entire held substrate 60 is accelerated and collided uniformly and efficiently, a thin film is formed on the surface of the substrate 60. Note that when applying a predetermined current to the electromagnet 56 of the counter electrode 54, the flexible tubes 57 ₁ , 5
By supplying and circulating water to a water cooling pipe (not shown) of each counter electrode 54 through 7 ₂ , the temperature of each counter electrode 54 is prevented from rising.

Therefore, according to the present invention, a plurality of units (for example, 5
Each counter electrode 54 is moved in the XY direction within the chamber 1 by the driving mechanism 11 of the counter electrode 54, and is swung to be tilted at a predetermined angle so that they face each other. By generating a magnetic field and simultaneously evaporating the evaporation material from the evaporation source 3,
The plasma can be spread over the entire lower surface of the substrate 60 held in the plasma gun or the generated plasma holder 58, and the evaporated deposition material is ionized in the plasma, and the positively ionized deposition material is applied to the surface of the substrate 60. It is possible to improve the ability of the vapor deposition material to wrap around the surface of the substrate 60 by accelerating and colliding with it at high density and from multiple directions, so it is possible to efficiently form a uniform and homogeneous thin film with high adhesion even on substrates with multiple shapes. .

Further, each of the opposing electrodes 54 is oscillated by each of the driving mechanisms 11 in order to make each of the opposing electrodes 54 incline and face the substrate 60 at a predetermined angle. Deterioration and breakage of the flexible tubes 57 ₁ and 57 ₂ connected to the electrode 54 and exposed to the harsh environment within the chamber 1 can be suppressed.

In the above embodiment, five drive mechanisms were used to move and swing the counter electrode in the X and Y directions, but two to four or six or more drive mechanisms may be provided on the side wall of the chamber on the same plane. good.

In the above embodiment, an electromagnet is built in the counter electrode, but a permanent magnet may be built in instead.

In the above embodiment, a structure in which an electron beam generated by an electron gun is irradiated onto a crucible in a chamber by means of a deflection coil was used as the evaporation source, but a structure having an EB gun may also be used.

[Effects of the Invention] As described in detail above, the ion plating apparatus of the present invention accelerates and collides the deposition material positively ionized in plasma against the substrate surface at high density and from many directions. Since it is possible to improve the ability of the material to wrap around the surface of the substrate, it has remarkable effects such as being able to efficiently form a uniform and homogeneous thin film with high adhesion even on complex-shaped substrates.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of an ion plating apparatus showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line X--X in FIG. 1, and FIG.
4 is a sectional view taken along the Y line, FIG. 4 is a sectional view showing the counter electrode of FIG. 1 and its driving mechanism, and FIG. 5 is a plan view of FIG. 4. 1... Vacuum chamber, 3... Evaporation source, 4... Crucible, 5... Electron gun, 6... Deflection coil, 7...
Plasma gun, 11 ... Drive mechanism, 13... Flange, 15... X direction drive shaft, 21... X direction slider drive motor, 24... X direction slider, 26
... Y direction slider, 27 ... Y direction slider drive motor, 28 ... Y direction drive shaft, 33 ... pinion, 34 ... rack, 35 ... rocking motor, 3
6... Drive shaft, 44, 47... Bevel gear, 49...
... Frame, 50 ... Arm, 54 ... Counter electrode, 56 ... Electromagnet, 57 ₁ , 57 ₂ ... Flexible tube, 58 ... Substrate holder, 60 ... Substrate, 6
1... Vapor deposition material, 62... Plasma.

Claims (1)

[Claims] 1. A vacuum chamber, a substrate holder disposed within the chamber, a deposition source disposed within the chamber, a plasma generation source for introducing plasma into the chamber, and an outer periphery of the plasma generation source. an air-core magnet disposed inside the chamber and provided on the outside of the chamber facing the plasma generation source and on the outside of the chamber facing the plasma generation source to focus the plasma drawn into the chamber; A plurality of opposing electrodes each having a built-in magnet for focusing plasma introduced into the chamber from a generation source onto the surface of the substrate held in the holder, and for moving and swinging these opposing electrodes in X and Y directions, respectively. An ion plating apparatus characterized by comprising a plurality of drive mechanisms.