JPH0556032B2 - - Google Patents
Info
- Publication number
- JPH0556032B2 JPH0556032B2 JP12477187A JP12477187A JPH0556032B2 JP H0556032 B2 JPH0556032 B2 JP H0556032B2 JP 12477187 A JP12477187 A JP 12477187A JP 12477187 A JP12477187 A JP 12477187A JP H0556032 B2 JPH0556032 B2 JP H0556032B2
- Authority
- JP
- Japan
- Prior art keywords
- resin powder
- piezoelectric ceramic
- electrode conductor
- resin
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000007610 electrostatic coating method Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000009503 electrostatic coating Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、圧電セラミツク積層体電子部品の製
造方法に関し、特に外部引出端子の取出方法およ
び外装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a piezoelectric ceramic laminate electronic component, and particularly to a method for taking out external lead terminals and a method for packaging the same.
［従来の技術］
第５図従来の製造方法により製造された圧電セ
ラミツク積層体電子備品の断面図である。[Prior Art] FIG. 5 is a sectional view of a piezoelectric ceramic laminate electronic equipment manufactured by a conventional manufacturing method.
この製造方法は、積層形の圧電セラミツク素子
１の外部電極導体層５にリード線６をはんだ８に
よりはんだ付け接続する工程と、圧電セラミツク
素子１の上下端面に絶縁性の外装樹脂を付着させ
ないためにマスキング治具１０で圧電セラミツク
素子１をはさみ、圧電セラミツク素子１を約100
℃に加熱して樹脂粉体槽の粉体（図示省略）に浸
漬する流動浸漬法により外装樹脂１３を付着させ
る工程と、外装樹脂を完全硬化するための加熱硬
化工程からなつている。 This manufacturing method includes a step of soldering and connecting a lead wire 6 to an external electrode conductor layer 5 of a laminated piezoelectric ceramic element 1 using a solder 8, and a step of not attaching an insulating exterior resin to the upper and lower end surfaces of the piezoelectric ceramic element 1. Sandwich the piezoelectric ceramic element 1 with the masking jig 10, and place the piezoelectric ceramic element 1 about 100
The process consists of a process of attaching the exterior resin 13 by a fluidized dipping method in which the resin is heated to a temperature of 0.degree.
［発明が解決しようとする問題点］
上述した従来の製造方法は以下のような欠点が
ある。[Problems to be Solved by the Invention] The conventional manufacturing method described above has the following drawbacks.
(1) マスキング治具およびリード線も加熱されて
樹脂粉体に浸漬されるため、圧電セラミツク素
子以外に、マスキング治具およびリード線にも
樹脂粉体が付着し、硬化してしまい、素子の取
りはずし、素子のバリ処理、リード線に付着し
た樹脂の除去および治具の清掃に多くの時間が
費やされる。(1) Since the masking jig and lead wires are also heated and immersed in resin powder, the resin powder adheres to the masking jig and lead wires in addition to the piezoelectric ceramic element, causing them to harden and damage the element. Much time is spent on removal, deburring the elements, removing resin adhering to the lead wires, and cleaning the jig.
(2) リード線の被覆材は耐熱性で樹脂粉体が付着
しにくいものを使用するため、コストアツプに
なる。(2) The lead wires are coated with a heat-resistant material that is resistant to resin powder adhesion, which increases costs.
(3) リード線を接続したまま外装を行うので、自
動化がむずかしく、外装工程の合理化が困難で
ある。(3) Since packaging is performed with the lead wires connected, it is difficult to automate and rationalize the packaging process.
［問題点を解決するための手段］
本発明の圧電セラミツク積層体電子部品の製造
方法は、
静電塗装法により絶縁性樹脂の粉末を積層体の
外周に付着させる工程と、
前記外部電極導体層に付着した絶縁性樹脂の粉
末を部分的に除去する工程と、
前記絶縁性樹脂の粉末を溶融硬化させる工程
と、
前記外部電極導体層と前記外部引出端子とを接
続する工程と、
前記外部電極導体層と前記外部引出端子との接
続部を絶縁被覆する工程とを有することを特徴と
する。[Means for Solving the Problems] The method for manufacturing a piezoelectric ceramic laminate electronic component of the present invention includes the steps of: adhering insulating resin powder to the outer periphery of the laminate by electrostatic coating; and the external electrode conductor layer. a step of partially removing insulating resin powder adhering to the insulating resin powder; a step of melting and hardening the insulating resin powder; a step of connecting the external electrode conductor layer and the external lead terminal; and a step of connecting the external electrode conductor layer and the external lead terminal. The method is characterized by comprising a step of insulatingly covering a connecting portion between the conductor layer and the external lead terminal.
［作用］
本発明は、外装工程の合理化を容易にするため
に、静電塗装法を適用し、不要な場所に付着した
外装用樹脂粉末を除去した後に樹脂を硬化させ、
その後リード線を接続し、仕上、修正工程を省略
するものである。[Function] In order to facilitate the rationalization of the exterior packaging process, the present invention applies an electrostatic coating method, removes exterior resin powder that has adhered to unnecessary areas, and then hardens the resin.
After that, the lead wires are connected, and the finishing and repair steps are omitted.
［実施例］
次に、本発明の実施例について図面を参照して
説明する。第１図ａ，ｂはそれぞれ本発明の製造
方法の一実施例による圧電セラミツク積層体電子
部品の断面図および斜視図、第２図〜第４図は第
１図の圧電スラミツク積層体電子部品の製造方法
の各工程を示す断面図である。[Example] Next, an example of the present invention will be described with reference to the drawings. 1a and 1b are a cross-sectional view and a perspective view, respectively, of a piezoelectric ceramic laminate electronic component according to an embodiment of the manufacturing method of the present invention, and FIGS. 2 to 4 show the piezoelectric laminate electronic component of FIG. 1. FIG. 3 is a cross-sectional view showing each step of the manufacturing method.
積層形の圧電セラミツク素子１は、内部電極導
体層２と電歪材層３を交互に積層し、対向する２
側面の内部電極導体層２の露出した端面を１層お
きに絶縁層４で被覆し、さらに導電性の外部電極
導体層５を形成したものである。 A laminated piezoelectric ceramic element 1 has internal electrode conductor layers 2 and electrostrictive material layers 3 alternately laminated, and two opposing layers
The exposed end faces of the internal electrode conductor layers 2 on the side surfaces are coated every other layer with an insulating layer 4, and a conductive external electrode conductor layer 5 is further formed.
次に、この圧電セラミツク素子１の製造方法に
ついて第２図〜第４図により説明する。 Next, a method of manufacturing this piezoelectric ceramic element 1 will be explained with reference to FIGS. 2 to 4.
まず、圧電セラミツク素子１の上下面を、樹脂
粉末が付着しにくい樹脂、たとえばテフロン（登
録商標）等でできたマスキング治具１０ではさ
み、静電塗装機（図示省略）により絶縁性樹脂の
粉末を圧電セラミツク素子１に付着させ樹脂粉末
層７を形成する（第２図）。次に、吸引ノズル１
１によりリード線取付予定部分の樹脂粉末を吸引
除去し、外部電極導体層５を樹脂除去部１２に露
出させ、また、マスキング治具１０に付着した樹
脂粉末を除去した後、オーブン等（図示省略）で
樹脂粉末層７を溶融硬化させ、マスキング治具１
０を取りはずす（第３図）。次に、樹脂除去部１
２に露出した外部電極導体層５とリード線６とを
はんだ８で接続する（第４図）。次に、はんだ８
の表面に絶縁膜９を形成して圧電セラミツク積層
体電子部品を完成させる（第１図）。 First, the upper and lower surfaces of the piezoelectric ceramic element 1 are sandwiched between masking jigs 10 made of a resin to which resin powder does not easily adhere, such as Teflon (registered trademark), and insulating resin powder is applied using an electrostatic coating machine (not shown). is adhered to the piezoelectric ceramic element 1 to form a resin powder layer 7 (FIG. 2). Next, suction nozzle 1
1, the resin powder from the area where the lead wires are to be attached is removed by suction, the external electrode conductor layer 5 is exposed to the resin removal part 12, and the resin powder adhering to the masking jig 10 is removed. ) to melt and harden the resin powder layer 7, and masking jig 1
Remove 0 (Figure 3). Next, resin removal section 1
The external electrode conductor layer 5 exposed at 2 and the lead wire 6 are connected with solder 8 (FIG. 4). Next, solder 8
An insulating film 9 is formed on the surface of the piezoelectric ceramic laminate to complete the piezoelectric ceramic laminate electronic component (FIG. 1).
なお、本実施例では、外部電極導体層５へのリ
ード線６の取付けをはんだ８で行う方法を説明し
たが、これを導電性接着剤を用いても全く同様の
セラミツク積層体電子部品が得られる。 In this example, the method of attaching the lead wire 6 to the external electrode conductor layer 5 using the solder 8 was explained, but it is also possible to obtain a completely similar ceramic laminate electronic component using a conductive adhesive. It will be done.
［発明の効果］
以上説明したように本発明は、静電塗装法を適
用し、外装用の樹脂粉末を付着させることなく形
成し、樹脂粉末を硬化させることにより、次のよ
うな効果がある。[Effects of the Invention] As explained above, the present invention has the following effects by applying an electrostatic coating method, forming resin powder for exterior use without adhering it, and curing the resin powder. .
(1) 完成電子部品の仕上および修正工程が不要と
なり大幅なコストダウンが可能となる。(1) Finishing and modification processes for finished electronic components are no longer necessary, allowing for significant cost reductions.
(2) 安価なリード線が使用でき、大幅なコストダ
ウンが可能となる。(2) Cheap lead wires can be used, resulting in significant cost reductions.
(3) リード線を接続していない状態で外装を行う
ことができるので、自動化がやりやすく、外装
工程の合理化が可能である。(3) Since packaging can be performed without connecting lead wires, automation is easy and rationalization of the packaging process is possible.
第１図ａ，ｂは本発明の製造方法の一実施例に
よる圧電セラミツク積層体電子部品の断面図およ
び斜視図、第２図〜第４図は第１図の圧電セラミ
ツク積層体電子部品の製造方法の各工程ごとの断
面図、第５図は従来の製造方法により作られた圧
電セラミツク積層体電子部品の断面図である。
１……圧電セラミツク素子、２……内部電極導
体層、３……電歪材層、４……絶縁層、５……外
部電極導体層、６……リード線、７……樹脂粉末
層、８……はんだ、９……絶縁膜、１０……マス
キング治具、１１……吸引ノズル、１２……樹脂
除去部、１３……外装樹脂。
1a and 1b are cross-sectional views and perspective views of a piezoelectric ceramic laminate electronic component according to an embodiment of the manufacturing method of the present invention, and FIGS. 2 to 4 show manufacturing of the piezoelectric ceramic laminate electronic component of FIG. 1. 5 is a cross-sectional view of a piezoelectric ceramic laminate electronic component manufactured by a conventional manufacturing method. DESCRIPTION OF SYMBOLS 1...Piezoelectric ceramic element, 2...Inner electrode conductor layer, 3...Electrostrictive material layer, 4...Insulating layer, 5...Outer electrode conductor layer, 6...Lead wire, 7...Resin powder layer, 8... Solder, 9... Insulating film, 10... Masking jig, 11... Suction nozzle, 12... Resin removal section, 13... Exterior resin.
Claims (1)
体層が交互に積層された積層体を含み、積層体の
対向する一対の側面に露出する内部電極導体層の
一方の端部が前記一対の側面において互い違いに
絶縁され、絶縁されていない前記内部電極導体層
の他方の端部は前記側面ごとに設けられた外部電
極導体層にそれぞれ接続され、前記外部電極導体
層に外部引出端子が接続されている圧電セラミツ
ク積層体電子部品の製造方法において、 静電塗装法により絶縁性樹脂の粉末を積層体の
外周に付着させる工程と、 前記外部電極導体層に付着した絶縁性樹脂の粉
末を部分的に除去する工程と、 前記絶縁性樹脂の粉末を溶融硬化させる工程
と、 前記外部電極導体層と前記外部引出端子とを接
続する工程と、 前記外部電極導体層と前記外部引出端子との接
続部を絶縁被覆する工程とを有することを特徴と
する圧電セラミツク積層体電子部品の製造方法。[Scope of Claims] 1. Includes a laminate in which sheet-like piezoelectric ceramic members and internal electrode conductor layers are alternately laminated, one end of the internal electrode conductor layer exposed on a pair of opposing sides of the laminate. The other end portions of the internal electrode conductor layers that are alternately insulated and not insulated on the pair of side surfaces are connected to external electrode conductor layers provided for each side surface, and external lead terminals are connected to the external electrode conductor layers. A method for manufacturing an electronic component made of a piezoelectric ceramic laminate connected to a laminate, which includes the steps of: adhering insulating resin powder to the outer periphery of the laminate using an electrostatic coating method; a step of partially removing the insulating resin powder, a step of melting and hardening the insulating resin powder, a step of connecting the external electrode conductor layer and the external lead terminal, and a step of connecting the external electrode conductor layer and the external lead terminal. 1. A method for manufacturing a piezoelectric ceramic laminate electronic component, comprising the step of insulatingly coating a connecting portion of the piezoelectric ceramic laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124771A JPS63288076A (en) | 1987-05-20 | 1987-05-20 | Manufacture of piezoelectric ceramic laminate electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124771A JPS63288076A (en) | 1987-05-20 | 1987-05-20 | Manufacture of piezoelectric ceramic laminate electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63288076A JPS63288076A (en) | 1988-11-25 |
| JPH0556032B2 true JPH0556032B2 (en) | 1993-08-18 |
Family
ID=14893708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62124771A Granted JPS63288076A (en) | 1987-05-20 | 1987-05-20 | Manufacture of piezoelectric ceramic laminate electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63288076A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5971286B2 (en) * | 2014-07-29 | 2016-08-17 | Tdk株式会社 | Lens drive device |
-
1987
- 1987-05-20 JP JP62124771A patent/JPS63288076A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63288076A (en) | 1988-11-25 |
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