JPH0567487B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method for taping electronic components, in which electronic components such as resistor networks and semiconductor elements are arranged in rows on a tape.

(B) Prior Art Conventionally, a flexible tape on which electronic components are arranged in rows has been used as a means for supplying electronic components to an automatic mounting device that automatically mounts electronic components onto a board.

A conventional method of arranging electronic components on a tape, that is, a method of taping electronic components, will be explained with reference to FIGS. 5a, 5b, and 5c.
Electronic components 12 such as a resistor network are arranged in a row on a metal tie bar 11 whose lower ends of leads 13, . . . , 13 are integrally connected (FIG. 5a). These electronic components 12, . . . , 12 have leads 13,
..., 13 is cut along the cutting line a-a that crosses the lower end. The electronic components 12, . . . , 12 separated from the tie bar 11 are connected to respective leads 13, .
. . , 13 are supported by being sandwiched between two paper tapes 15a, 15a which are pasted together, and are arranged in rows at equal intervals on the tape 15 (see FIG. 5b).

The tape 15 is fed into an automatic mounting device, and the electronic components 12, . . . , 12 are attached to their leads 13, .
..., 13 are separated from the tape 15 by being cut along line bb in FIG.
..., 16a, and is mounted on the board 16 [see FIG. 5c].

(c) Problems to be Solved by the Invention When the electronic component 12 taped by the above electronic component taping method is separated from the tape 15, as shown in FIG. 5c, the leads 13,...
The leading ends of the leads 13, ..., 13 are in an angular state, and these corners hit the peripheries of the through holes 16a, ..., 16a of the substrate 16, and the leads 13, ..., 13 are smoothly inserted into the through holes 16a, ..., 16a. This makes it difficult to insert the electronic component 12 into the board 17, which may result in improper mounting of the electronic component 12 onto the board 17, resulting in a reduction in the operating rate of the automatic mounting device.

The present invention has been made in view of the above-mentioned disadvantages, and an object of the present invention is to provide a taping method for electronic components that prevents defective mounting of electronic components onto a board in an automatic mounting device and improves its operating rate.

(d) Means for Solving the Problems The electronic component taping method of the present invention includes electronic components that are arranged in a row via leads having a tie on a tie bar, and the leads are placed between the tie bar and the tie bar. The electronic component is taped by cutting the separated electronic component using a tie bar and supporting the tip of the lead with the tape while exposing the joint part of the lead of the separated electronic component.

(E) Effect The electronic component taping method of the present invention involves taping a lead so as to expose a joint, and in an automatic electronic component mounting device, the lead is cut at this joint. The lead cut portion (tip) of the electronic component is tapered or rounded to facilitate insertion of the lead into the substrate through-hole, thereby preventing incorrect mounting of the electronic component onto the substrate.

(F) Embodiment An embodiment of the present invention will be described below based on FIGS. 1 to 4.

In this embodiment, the present invention is applied to the taping of a resistance network. FIG. 2 is a diagram showing an electronic component series in which resistor networks (electronic components) 2, . . . , 2 are arranged in series. Each resistor network 2,...,2 has a resistor at the upper end of the lead 3,...,3 whose base end 3a,...,3a is integrally connected to the upper edge of the tie bar 1 made of a strip-shaped metal plate. An element (not shown) is attached thereto and covered with resin or the like.

On the other hand, the leads 3, .
4 is provided. As shown in FIG.
It is provided with notches 4a, 4a having a radius of 4.b. Note that the shape of the notches 4a, 4a is not limited to this, and can be changed to a wedge shape, a semicircular shape, etc. as appropriate.

Resistor network 2, ..., 2 has leads 3,
. . , 3 are cut along the first cutting line A-A shown by the broken line in FIG. 2, and separated from the tie bar 1.

Next, the resistance networks 2, ..., 2 separated from the tie bar 1 are attached to the upper edge of a flexible tape 5 made of paper or the like at predetermined intervals, as shown in FIG. To go. The tape 5 is constructed by pasting two tapes 5a, 5a together with a suitable adhesive, and connects the base ends 3a, ..., 3a of the leads 3, ..., 3 between both tapes 5a, 5a. A resistive network 2 is attached to the upper edge of the tape 5. At this time, lead 3,...
..., 3 are exposed from the upper edge of the tape. Note that the small holes 5 arranged in a row in the tape 5
b, . . . , 5b are used to engage the sprocket pawls and the like in the automatic mounting device for tape feeding and positioning.

Through the above process, when the taped resistance network 2,..., 2 is handled in an automatic mounting device, the joints 4,... of the leads 3,..., 3 are processed.
..., 4 along the second cutting line B--B, and mounted on the substrate 6. The shapes of the tips 3b, . . . , 3b of the leads 3, . . . , 3 are wedge-shaped as shown in FIG.
It becomes easy to insert the leads 3, . . . , 3 into the through holes 6a, .

Although the above embodiment shows an example in which the present invention is applied to taping a resistor network, the taping method of the present invention is not limited to resistor networks, and can be applied to various electronic components such as semiconductor devices. is widely applicable.

(g) Effects of the Invention The method for taping electronic components of the present invention involves cutting electronic components arranged in a row on a tie bar through leads having a tie, and cutting the leads between the tie bar and the tie bar. When the tape obtained by this method is used in an automatic mounting device, the tape is separated from the tie bar, and the lead tips are supported by the tape while exposing the constriction part and the electronic components are arranged in a row. If the lead is cut at the constriction, a taper or roundness is formed at the tip of the lead of the electronic component, making it easier to mount the electronic component onto the board, which has the advantage of improving the operating rate of the automatic mounting device.

In addition, since the lead is cut at the knot, the lead can be easily cut, reducing the burden on the cutter installed in the automatic mounting device.
This has the advantage of extending its life and requiring a smaller drive mechanism for the cutter.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the state of taping of electronic components in one embodiment of the present invention, FIG. 2 is a plan view showing a series of electronic components with tie bars in the same embodiment, and FIG. 3 is a diagram showing the taping state of electronic components in the same embodiment. FIG. 4 is an enlarged view of the main part of the electronic component lead, and FIG. 4 is a diagram illustrating how the electronic component separated from the tape is attached to the board in the same embodiment. FIGS. 5a to 5c are the conventional FIG. 5A is a diagram illustrating a series of electronic components with tie bars in a conventional taping method for electronic components, and FIG. 5B is a diagram illustrating a taping state of electronic components in the same taping method.
FIG. 5c is a diagram showing the state in which the electronic component is separated from the tape and mounted on the board. 1... tie bar, 2... resistance network, 3...
...3...lead, 4...4...bracket, 5...tape.

Claims (1)

[Claims] 1. Electronic components arranged in a row on a tie bar through leads having a joint are separated from the tie bar by cutting the leads between the joint and the tie bar, and the leads are separated from the tie bar while exposing the joint. A method of taping electronic components, in which electronic components are supported by the tape and arranged in rows on the tape.