JPH0363202B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for taping electronic components (diodes, resistors, capacitors, etc.) having multiple ends (lead wires), and in particular, a taping method for producing taped products whose width is narrower than the entire length of a single electronic component. Regarding the method.

In recent years, the automation of mounting electronic components onto printed circuit boards has progressed, and users have traditionally purchased tape with a wide tape width (for example, 52 mm internal width), re-taped each electronic component using their own equipment, and mounted it onto the printed circuit boards described above. However, now that a variety of automatic mounting machines have been developed, it is becoming more common to request manufacturers to tape electronic components in the required width without re-taping. The present invention is directed to the above-mentioned narrow taping product (for example, an inner width of 26 mm).
mm).

Conventionally, as a method for taping an electronic component having thin leads (terminals) at both ends, such as a diode, for example, as shown in FIG. The entire length of the electronic component 1 is cut to be the same as or shorter than the taping width L when taping as shown in figure b, and the electronic component 1 is taped with taping tape 3 having the specified width a, and then cut as shown in figure c. There is a method of manufacturing a taping article 4 as shown. Further, as shown in FIGS. 2a to 2c, the ends of the long leads 2 are taped with the auxiliary tape 5, and then re-taped with the taping tape 3 of the specified width a using another device, and then There is a method of manufacturing a taped article 4 having a taping width L as shown in FIG.

However, since the former method involves cutting individual electronic components, (a) the holding mechanism for small electronic components becomes complicated; (b) Since the cut chips scatter in undefined directions, it is difficult to collect them, and the leaked chips can enter nearby mechanical parts, causing trouble in the drive system of the device. (c) If the electronic parts are cut short, problems will occur during transportation later due to their light weight. Furthermore, the latter method requires a plurality of taping devices. Further, auxiliary materials such as taping tape and interlayer paper are required twice as much, which increases the cost. Moreover, as seen in FIG. 2c, the cut portion protrudes from the edge of the taping tape. Further, since the taping dimension is based on the inner width l, the outer width dimension L in FIGS. 1c and 2c is several steps less accurate than the inner width dimension l.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a taping method that requires less man-hours for taping and facilitates recovery of the lead portion that has been cut and removed.

In order to achieve such an object, the present invention provides a taping method in which a taped article is manufactured by arranging electronic components having terminals at both ends in parallel, and attaching and sandwiching both terminals with two strips of tape. After taping the desired terminal part with a tape wider than the specified width, both tapes and the terminal part taped with this tape are stretched in the longitudinal direction of the tape so that both tapes have the specified width. By cutting, the tape and the terminal are cut to produce a taped article of a desired width. In addition, by taping the desired terminal part with a tape wider than the specified width in advance, and then cutting the tape and the terminal so that both tapes each have the specified width, the desired taping width can be achieved. It manufactures goods.

3a to 3c are diagrams showing a method of taping electronic components according to an embodiment of the present invention, in which FIG. 3a is a plan view of electronic components arranged in parallel, and FIG. FIG. 3C is a plan view showing a taped article obtained by cutting the tape.

In the taping method of this embodiment, as shown in FIG.
They are arranged on an electronic component 1 having elongated leads (terminals) 2 at both ends, and the intermediate portions of the leads 2 extending to both ends of the package 6 are pasted and clamped with a pair of adhesive tapes (taping tapes 3 and 3'). do. This taping tape 3 consists of an upper tape 3 and a lower tape 3' that sandwich the lead, and either both of them (the upper tape 3 and the lower tape 3') have adhesive properties, or only one of them has adhesive properties. However, the other type is non-adhesive. At this time, the taping tapes 3, 3' are made wide by b, which is wider than the specified width a, and the taping tapes 3,
Tape to define the inner width l (for example, 26 mm) of 3' (see figure b). This taping is performed using a conventionally known taping device. Next, as shown in FIG. The specified width is L.

According to such a taping method, the unnecessary lead portion 7 can be removed together with the cutting and removal tape 8 in a connected state, making recovery easy and reliable. As a result, it is possible to prevent failures of the device and peripheral devices due to scattering of the conventional removal lead portion, and improve the operating rate. Further, since taping only needs to be done once, the number of taping members can be reduced and the number of taping steps can be reduced. Moreover, since electronic components can be taped in a long state, they are easy to handle and taping is also facilitated.

As described above, the taping method of the present invention requires fewer taping steps and less taping material, and can reduce taping costs. In addition, since the taping dimensions (l, L) are accurate,
It also becomes easier to attach electronic components to a printed circuit board on a mounting machine.

[Brief explanation of drawings]

1a to 2c are plan views showing a conventional taping method, and FIGS. 3a to 3c are plan views showing a taping method according to an embodiment of the present invention. FIG. 3C is a plan view of the electronic component before and after taping, and FIG. 1B is a sectional view of the electronic component in the taped state. 1...Electronic component, 2...Lead, 3,3'...
Taping tape, 4... Taping article, 7...
Unnecessary lead part, 8... Cut and remove tape.

Claims (1)

[Claims] 1. In a taping method in which a taped article is manufactured by arranging electronic components having terminals at both ends in parallel and sandwiching both terminals by pasting and sandwiching each terminal with two strips of tape, the terminal portion is After taping with tape, both tapes and the terminal portion taped with this tape are cut in the longitudinal direction of the tape so that both tapes each have a specified width. A taping method in which a terminal and tape are removed in a connected state to produce a taped article having a specified outer width.