JPH0573498B2 - - Google Patents
Info
- Publication number
- JPH0573498B2 JPH0573498B2 JP18474687A JP18474687A JPH0573498B2 JP H0573498 B2 JPH0573498 B2 JP H0573498B2 JP 18474687 A JP18474687 A JP 18474687A JP 18474687 A JP18474687 A JP 18474687A JP H0573498 B2 JPH0573498 B2 JP H0573498B2
- Authority
- JP
- Japan
- Prior art keywords
- curing
- acid
- alcohol
- curing agent
- agent composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001723 curing Methods 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- -1 alkoxyethanols Chemical class 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 230000009970 fire resistant effect Effects 0.000 claims description 5
- 238000013007 heat curing Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 150000005846 sugar alcohols Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 235000019439 ethyl acetate Nutrition 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000003125 aqueous solvent Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 150000003460 sulfonic acids Chemical class 0.000 claims description 2
- 150000003751 zinc Chemical class 0.000 claims description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-M 2-methylbenzenesulfonate Chemical compound CC1=CC=CC=C1S([O-])(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-M 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920002261 Corn starch Polymers 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- ZZXDRXVIRVJQBT-UHFFFAOYSA-M Xylenesulfonate Chemical compound CC1=CC=CC(S([O-])(=O)=O)=C1C ZZXDRXVIRVJQBT-UHFFFAOYSA-M 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008120 corn starch Substances 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000010112 shell-mould casting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 150000008054 sulfonate salts Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229940071104 xylenesulfonate Drugs 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は加熱硬化製造法に於いて鋳型を製造す
る際に用いられる低温時のスルホン酸塩の結晶析
出の防止された鋳型用硬化剤組成物に関するもの
である。
〔従来の技術及びその問題点〕
従来、加熱硬化鋳型の製造法としては、耐火性
粒状骨材にフエノールノボラツク樹脂を被覆し、
ヘキサメチレンテトラミンを触媒として約300℃
近辺で加熱硬化せしめる、所謂シエルモールド法
がある。この加熱硬化法は設備的に簡便であり、
作業的に使用しやすい等の利点により現在加熱硬
化鋳型製造法としては最も多く使用されている。
しかしながら、硬化時間が長く、硬化温度が高い
ため、金型の歪、鋳型の歪が多く、鋳型のバリ取
り作業が欠かせず、また寸法精度も不充分であつ
た。更に硬化温度が高い事による作業環境の劣悪
さ及びフエノール樹脂、ヘキサメチレンテトラミ
ンの熱分解臭気による作業環境の汚染も著しく、
これらの大幅な改善が望まれていた。
また、250℃近辺で、耐火性粒状骨材にフエノ
ールレゾール樹脂やフラン分の少ないフエノール
又は尿素／ホルマリン変性フラン樹脂等の酸硬化
性樹脂と、塩化アンモニウム、シユウ酸等の硬化
触媒を混じた混合物を加熱硬化する、所謂ホツト
ボツクス法がある。これは硬化時間もシエルモー
ド法よりは短く、温度による歪、寸法精度や熱的
作業環境の面でも改善されるが、更に硬化時間の
短縮、鋳型の物性向上、作業環境の改善が望まれ
ている。
また最近、耐火性粒状骨材に、酸硬化性樹脂及
び弱塩基と低級脂肪族スルホン酸または芳香族ス
ルホン酸の少なくとも１種の塩を添加し、約150
〜200℃で加熱硬化せしめる、所謂ウオームボツ
クス法がある。これは従来工法の欠点を大幅に改
善することができ現在注目されている。スルホン
酸塩としては、一般的にトルエンスルホン酸塩及
びキシレンスルホン酸塩が主に用いられており、
水溶液あるいは水−アルコール溶液に使用するケ
ースがほとんどである。しかし、低温時、特に冬
場等はスルホン酸塩の結晶が析出し、ポンプがつ
まるなど作業性に問題があつた。
〔問題点を解決するための手段〕
本発明者らは上記の問題点を解決すべく鋭意研
究の結果、特定の溶媒を硬化剤に添加することに
より、低温時の結晶析出を防止できることを見い
出し、本発明に到達した。
即ち、本発明は、耐火性粒状骨材と酸硬化性樹
脂との混合物を硬化させるための硬化剤組成物で
あつて、有機スルホン酸の銅、鉄、アルミニウム
又は亜鉛塩をメタノール、エタノール、イソプロ
ピルアルコールの少なくとも一種と水とのアルコ
ール−水系溶媒に溶解した溶液に、更に多価アル
コール、アルコキシエタノール、エーテルエステ
ル、酢酸エステルよりなる群から選ばれた少なく
とも一種の化合物を添加してなることを特徴とす
る加熱硬化鋳型用硬化剤組成物を提供するもので
ある。
本発明において用いられる有機スルホン酸とし
ては、メタンスルホン酸等の低級アルキルスルホ
ン酸、ベンゼンスルホン酸、フエノールスルホン
酸、トルエンスルホン酸、キシレンスルホン酸等
の芳香族スルホン酸が挙げられる。
本発明において用いられる多価アルコールとし
てはエチレングリコール、ジエチレングリコー
ル、ポリエチレングリコール等、アルコキシエタ
ノールとしてはメトキシエタノール等、エーテル
エステルとしてはセロソルブアセテート等、酢酸
エステルとしては酢酸エチル等が挙げられる。
本発明の硬化剤組成物中の各成分の配合割合
は、有機スルホン酸塩(A)10〜60重量％、アルコー
ル−水系溶媒(B)20〜85重量％、多価アルコール、
アルコキシエタノール、エーテルエステル、酢酸
エステルよりなる群から選ばれた少なくとも一種
の化合物(C)５〜20重量％が好ましく、更に好まし
くは(A)15〜50重量％、(B)35〜80重量％、(C)５〜15
重量％である。
本発明の硬化剤組成物は上記必須成分の他に澱
粉、コーンスターチ、グルコール、デキストリン
等の糖類およびその誘導体等を含有してもよく、
特に制限するものではない。
本発明における耐火性粒状骨材としては石英質
を主成分とする硅砂の他、ジルコン砂、クロマイ
ト砂、オリビン砂等が使用されるが、特に限定さ
れるものではない。
本発明における酸硬化性樹脂としては、フルフ
リルアルコール、フルフリルアルコール／ホルマ
リン、尿素／ホルマリン、フエノール類／ホルマ
リン、メラミン／ホルマリンの少なくとも一種の
共縮合または縮合物乃至はフルフリルアルコール
との混合物が主成分であるものが使用される。こ
の酸硬化性樹脂にロジン、リグニン等の天然の樹
脂、アクリル樹脂、酢酸ビニル樹脂、石油樹脂、
エポキシ樹脂、ブチラール樹脂、ウレタン樹脂、
ポリエステ等の合成樹脂やシランカツプリング
剤、界面活性剤、溶剤等を含有していてもよく、
本発明を制限するものではない。
〔実施例〕
以下、実施例をもつて本発明の詳細を説明する
が、本発明はこれら実施例のみに限定されるもの
ではない。
実施例１〜７、比較例１〜２
表−１に示す本発明に係わる溶剤、有機スルホ
ン酸塩を含有するアルコール−水（４：１重量
比）混合溶液をからなる硬化剤を調製し、その低
温時のスルホン酸塩の結晶の析出を観察した。
尚、放置温度は−10℃である。
結果を表−１に示す。
【表】[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a curing agent composition for molds that is used when manufacturing molds in a heat-curing manufacturing method and that prevents crystal precipitation of sulfonate salts at low temperatures. It is about things. [Prior art and its problems] Conventionally, the method of manufacturing heat-curing molds involves coating fire-resistant granular aggregate with phenol novolak resin.
Approximately 300℃ using hexamethylenetetramine as a catalyst
There is a so-called shell molding method that heats and hardens the material nearby. This heat curing method is simple in terms of equipment;
Currently, it is the most commonly used method for manufacturing heat-cured molds due to its ease of use.
However, since the curing time is long and the curing temperature is high, there is a lot of distortion in the mold and the mold, necessitating deburring of the mold, and the dimensional accuracy is insufficient. Furthermore, the working environment is poor due to the high curing temperature, and the working environment is significantly contaminated by the odor of thermal decomposition of phenol resin and hexamethylenetetramine.
Significant improvements in these areas have been desired. In addition, at around 250℃, a mixture of fire-resistant granular aggregate mixed with acid-curing resins such as phenol resol resin or phenol or urea/formalin-modified furan resin with a low furan content, and a curing catalyst such as ammonium chloride or oxalic acid. There is a so-called hot-boxing method in which the material is heated and cured. This method also has a shorter curing time than the shell mode method, and improves distortion due to temperature, dimensional accuracy, and thermal working environment, but it is desired to further shorten the curing time, improve the physical properties of the mold, and improve the working environment. There is. Recently, an acid-curing resin and at least one salt of a weak base and a lower aliphatic sulfonic acid or an aromatic sulfonic acid have been added to fire-resistant granular aggregate.
There is a so-called warm box method that heats and cures at ~200°C. This method is currently attracting attention as it can significantly improve the drawbacks of conventional methods. Generally, toluene sulfonate and xylene sulfonate are mainly used as sulfonate.
In most cases, it is used in aqueous solutions or water-alcohol solutions. However, at low temperatures, especially in winter, sulfonate crystals precipitate, causing problems in workability, such as clogging of the pump. [Means for Solving the Problems] As a result of intensive research to solve the above problems, the present inventors discovered that crystal precipitation at low temperatures can be prevented by adding a specific solvent to the curing agent. , arrived at the present invention. That is, the present invention provides a curing agent composition for curing a mixture of a fire-resistant granular aggregate and an acid-curable resin, wherein a copper, iron, aluminum, or zinc salt of an organic sulfonic acid is mixed with methanol, ethanol, or isopropyl. It is characterized by adding at least one compound selected from the group consisting of polyhydric alcohols, alkoxyethanols, ether esters, and acetic esters to a solution of at least one alcohol and water dissolved in an alcohol-water solvent. The present invention provides a curing agent composition for heat-curing molds. Examples of the organic sulfonic acids used in the present invention include lower alkyl sulfonic acids such as methanesulfonic acid, and aromatic sulfonic acids such as benzenesulfonic acid, phenolsulfonic acid, toluenesulfonic acid, and xylene sulfonic acid. Examples of the polyhydric alcohol used in the present invention include ethylene glycol, diethylene glycol, and polyethylene glycol; examples of the alkoxyethanol include methoxyethanol; examples of the ether ester include cellosolve acetate; and examples of the acetate ester include ethyl acetate. The blending ratio of each component in the curing agent composition of the present invention is: organic sulfonate (A) 10 to 60% by weight, alcohol-aqueous solvent (B) 20 to 85% by weight, polyhydric alcohol,
At least one compound selected from the group consisting of alkoxyethanol, ether ester, and acetate ester (C) is preferably 5 to 20% by weight, more preferably (A) 15 to 50% by weight, and (B) 35 to 80% by weight. ,(C)5～15
Weight%. The curing agent composition of the present invention may contain starch, corn starch, glycol, saccharides such as dextrin, derivatives thereof, etc. in addition to the above-mentioned essential components.
There is no particular restriction. The refractory granular aggregate used in the present invention includes silica sand containing quartz as a main component, zircon sand, chromite sand, olivine sand, etc., but is not particularly limited. The acid-curable resin in the present invention includes at least one co-condensation or condensate of furfuryl alcohol, furfuryl alcohol/formalin, urea/formalin, phenols/formalin, and melamine/formalin, or a mixture with furfuryl alcohol. The main ingredient is used. This acid-curable resin includes natural resins such as rosin and lignin, acrylic resin, vinyl acetate resin, petroleum resin,
Epoxy resin, butyral resin, urethane resin,
It may contain synthetic resins such as polyester, silane coupling agents, surfactants, solvents, etc.
This is not intended to limit the invention. [Examples] Hereinafter, the present invention will be explained in detail with reference to Examples, but the present invention is not limited to these Examples. Examples 1 to 7, Comparative Examples 1 to 2 A curing agent consisting of a mixed solution of alcohol and water (4:1 weight ratio) containing a solvent and an organic sulfonate according to the present invention shown in Table 1 was prepared, The precipitation of sulfonate crystals at low temperatures was observed.
Incidentally, the storage temperature was -10°C. The results are shown in Table-1. 【table】
Claims (1)
硬化させるための硬化剤組成物であつて、有機ス
ルホン酸の銅、鉄、アルミニウム又は亜鉛塩をメ
タノール、エタノール、イソプロピルアルコール
の少なくとも一種と水とのアルコール−水系溶媒
に溶解した溶液に、更に多価アルコール、アルコ
キシエタノール、エーテルエステル、酢酸エステ
ルよりなる群から選ばれた少なくとも一種の化合
物を添加してなることを特徴とする加熱硬化鋳型
用硬化剤組成物。1 A curing agent composition for curing a mixture of fire-resistant granular aggregate and acid-curable resin, which comprises copper, iron, aluminum or zinc salts of organic sulfonic acids and at least one of methanol, ethanol and isopropyl alcohol. A heat-curing mold formed by further adding at least one compound selected from the group consisting of polyhydric alcohols, alkoxyethanols, ether esters, and acetic esters to a solution dissolved in an alcohol-aqueous solvent with water. curing agent composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18474687A JPS6431544A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18474687A JPS6431544A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6431544A JPS6431544A (en) | 1989-02-01 |
| JPH0573498B2 true JPH0573498B2 (en) | 1993-10-14 |
Family
ID=16158618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18474687A Granted JPS6431544A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6431544A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3615771B2 (en) | 1998-06-22 | 2005-02-02 | 三菱電機株式会社 | Disk unit |
-
1987
- 1987-07-24 JP JP18474687A patent/JPS6431544A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6431544A (en) | 1989-02-01 |
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