JPH0582243B2 - - Google Patents
Info
- Publication number
- JPH0582243B2 JPH0582243B2 JP62100507A JP10050787A JPH0582243B2 JP H0582243 B2 JPH0582243 B2 JP H0582243B2 JP 62100507 A JP62100507 A JP 62100507A JP 10050787 A JP10050787 A JP 10050787A JP H0582243 B2 JPH0582243 B2 JP H0582243B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- processing
- processing liquid
- ejector
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Filtration Of Liquid (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体製造工程に於ける半導体基板
の浸漬処理に関するものであり、特に処理液の循
環過に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to immersion treatment of a semiconductor substrate in a semiconductor manufacturing process, and particularly relates to circulation of a treatment liquid.
従来、この種の半導体基板（以後、ウエハーと
称する）を浸漬処理する処理液の循環過方法
は、ポンプの揚程を利用する方法が一般的となつ
ていた。
Conventionally, as a method for circulating a processing liquid for immersion processing of this type of semiconductor substrate (hereinafter referred to as a wafer), a method that utilizes the lift of a pump has become common.
第３図は、従来の処理液の循環過に於いて、
一般的に用いられている処理液のフローの一例で
ある。これは外槽７に溜まつた処理液をポンプ１
５により、フイルター１１を通過させることによ
り、内槽９に送り込み、更に内槽９から外槽７に
オバーフローさせるという処理液の循環過方式
である。 Figure 3 shows that in the conventional processing liquid circulation process,
This is an example of the flow of a commonly used treatment liquid. This pump pumps the processing liquid accumulated in the outer tank 7.
5, the processing liquid is passed through a filter 11 to be fed into an inner tank 9, and then overflowed from the inner tank 9 to an outer tank 7.
上述した従来の処理液循環過方法は、ポンプ
を使用しているため、ポンプ内部に処理液と接
し、かつ処理液を送り出すために動作する部分が
あり、その動作する部分の耐熱性、耐久性、耐薬
品性に依存するという欠点がある。また、動作す
る部分から廃塵するという欠点がある。
The conventional processing liquid circulation method described above uses a pump, so there is a part inside the pump that comes into contact with the processing liquid and operates to send out the processing liquid, and the heat resistance and durability of the operating part are limited. However, it has the disadvantage of being dependent on chemical resistance. Another disadvantage is that dust is generated from the operating parts.
上述した従来の処理液循環過方法に対し、本
発明は、ベルヌーイの定理を応用し処理液を処理
液と反応しない気体の流速の力により、フイルタ
ーを通過させ、更に循環させるに充分な揚程を得
るという内容を有する。 In contrast to the conventional treatment liquid circulation method described above, the present invention applies Bernoulli's theorem to pass the treatment liquid through a filter by the force of the flow velocity of a gas that does not react with the treatment liquid, and generates a sufficient head for further circulation. It has the content of obtaining.
本発明の処理液循環濾過方法は、処理槽、フイ
ルター、上記フイルターと前記処理槽との間に設
けられたエジエクタ、及び上記エジエクタと前記
処理槽との間に設けられ排気口を有するバツフア
槽を備え、前記エジエクタに処理液と反応しない
気体を供給することにより上記処理液の循環濾過
を行うことを特徴とする。
The processing liquid circulation filtration method of the present invention includes a processing tank, a filter, an ejector provided between the filter and the processing tank, and a buffer tank provided between the ejector and the processing tank and having an exhaust port. The treatment liquid is circulated and filtered by supplying a gas that does not react with the treatment liquid to the ejector.
本発明の他の処理液循環濾過方法は、処理槽、
フイルター、及び上記フイルターと前記処理槽と
の間に設けられたエジエクタを備え、上記エジエ
クタに処理液と反応しない気体を供給することに
よつて上記処理液の循環濾過を行うとともに前記
エジエクタに送り込まれた上記気体をも上記処理
槽に送り込んで上記処理液をバブリングすること
を特徴とする。 Another treatment liquid circulation filtration method of the present invention includes a treatment tank,
A filter is provided, and an ejector is provided between the filter and the processing tank, and by supplying a gas that does not react with the processing liquid to the ejector, the processing liquid is circulated and filtered, and the processing liquid is fed into the ejector. The above-mentioned gas is also sent into the processing tank to bubble the processing liquid.
次に、本発明について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例の処理液のフロ
図である。気体流量制御バルブ１は、バルブの開
度により供給する気体の流量を制御するものであ
り、流量計２は、その気体の流量を測定するもの
である。また、レギユレータ３は、その気体の圧
力を制御するものであり、エアーラインフイルタ
ー４は、気体の清浄度を高めるものである。循環
用バルブ５は、気体をエジエクタ６に供給するも
のであり、エジエクタ６は、外槽７に溜まつた処
理液をバツフア槽８に転送するものである。バツ
フア槽８は、内槽９より高い位置に配置し、かつ
バツフア槽に溜まつた処理液を内槽８に落差で供
給可能な配管と排気口１０を設けたものであり、
フイルター１１は、処理液を過するものであ
る。 FIG. 1 is a flowchart of a processing solution according to a first embodiment of the present invention. The gas flow rate control valve 1 controls the flow rate of gas to be supplied depending on the opening degree of the valve, and the flow meter 2 measures the flow rate of the gas. Further, the regulator 3 controls the pressure of the gas, and the airline filter 4 increases the cleanliness of the gas. The circulation valve 5 supplies gas to the ejector 6, and the ejector 6 transfers the processing liquid accumulated in the outer tank 7 to the buffer tank 8. The buffer tank 8 is arranged at a higher position than the inner tank 9, and is equipped with piping and an exhaust port 10 that can supply the processing liquid accumulated in the buffer tank to the inner tank 8 by a vertical difference.
The filter 11 is for passing the processing liquid.
次に本発明が提供する処理液循環過方法につ
いて説明する。循環用バルブ５を開にすることに
より、気体流量制御バルブ１とレギユレータ３で
設定した流量・圧力の気体が、エアーラインフイ
ルター４により過されてエジエクタ６に供給さ
れ、それにより外槽７に溜まつた処理液をフイル
ター１１に通過させ、過された処理液と気体を
同時にバツフア槽８に送り込み、バツフア槽８に
於いて、気体は排気口１０から排気され、処理液
は落差で内槽９に供給され、内槽９からオーバー
フローした処理液は外槽に溜まるという処理液循
環過状態に於いてウエハー１２を収納したキヤ
リア１３を内槽９に投入し、浸漬処理するもので
ある。 Next, the processing liquid circulation method provided by the present invention will be explained. By opening the circulation valve 5, the gas at the flow rate and pressure set by the gas flow control valve 1 and regulator 3 is passed through the airline filter 4 and supplied to the ejector 6, thereby causing the gas to accumulate in the outer tank 7. The processing liquid is passed through the filter 11, and the filtered processing liquid and gas are simultaneously sent to the buffer tank 8. In the buffer tank 8, the gas is exhausted from the exhaust port 10, and the processing liquid is passed through the inner tank 9 by a head. The carrier 13 containing the wafer 12 is put into the inner tank 9 and subjected to immersion processing in a state in which the processing liquid is circulated, and the processing liquid overflows from the inner tank 9 and accumulates in the outer tank.
第２図は本発明の第２の実施例の縦断面図であ
る。第２図において、第１図と同じ機能のところ
は同じ符号で示している。整流板１４は、エジエ
クタ６により送り込まれた処理液と気体のうち、
気体が内槽９全体に均一にバブリングされるよう
に内槽９底部に配設したものである。この実施例
に於いては、内槽に処理液と気体を同時に送り込
むため、内槽内の処理液を攪拌し、よどみなくす
る効果がある。 FIG. 2 is a longitudinal sectional view of a second embodiment of the invention. In FIG. 2, the same functions as in FIG. 1 are indicated by the same symbols. Of the processing liquid and gas sent by the ejector 6, the current plate 14
It is arranged at the bottom of the inner tank 9 so that gas is bubbled uniformly throughout the inner tank 9. In this embodiment, the processing liquid and gas are fed into the inner tank at the same time, which has the effect of stirring the processing liquid in the inner tank and preventing stagnation.
以上説明したように本発明は、処理液を転送す
るのに、流体力学を応用したため、処理液と接
し、かつ動作する部分がなくなり、高温の処理液
の循環過、または、長時間の循環過が可能と
なり、また発塵もなくなるという効果がある。
As explained above, since the present invention applies fluid mechanics to transfer the processing liquid, there are no parts that come into contact with the processing liquid and move, and the process of circulating high-temperature processing liquid or long-term circulation is avoided. This also has the effect of eliminating dust generation.
第１図は本発明の第１の実施例の配管系統図、
第２図は本発明の第２の実施例の配管系統図、第
３図は従来の処理液循環過の一般的配管系統図
である。
１……気体流量制御バルブ、２……流量計、３
……レギユレータ、４……エアーラインフイルタ
ー、５……循環用バルブ、６……エジエクタ、７
……外槽、８……バツフア槽、９……内槽、１０
……排気口、１１……フイルター、１２……ウエ
ハー、１３……キヤリア、１４……整流板、１５
……ポンプ。
FIG. 1 is a piping system diagram of the first embodiment of the present invention,
FIG. 2 is a piping system diagram of a second embodiment of the present invention, and FIG. 3 is a general piping system diagram for conventional treatment liquid circulation. 1... Gas flow control valve, 2... Flow meter, 3
... Regulator, 4 ... Air line filter, 5 ... Circulation valve, 6 ... Ejector, 7
...Outer tank, 8...Battle tank, 9...Inner tank, 10
...exhaust port, 11 ... filter, 12 ... wafer, 13 ... carrier, 14 ... rectifier plate, 15
……pump.
Claims (1)
処理槽との間に設けられたエジエクタ、及び前記
エジエクタと前記処理槽との間に設けられ排気口
を有するバツフア槽を備え、前記エジエクタに処
理液と反応しない気体を供給することにより前記
処理液の循環濾過を行うことを特徴とする処理液
循環濾過方法。 ２ 処理槽、フイルター、及び前記フイルターと
前記処理槽との間に設けられたエジエクタを備
え、前記エジエクタに処理液と反応しない気体を
供給することによつて前記処理液の循環濾過を行
うとともに前記エジエクタに送り込まれた前記気
体をも前記処理槽に送り込んで前記処理槽の中の
前記処理液をバブリングすることを特徴とする処
理液循環濾過方法。[Scope of Claims] 1. A treatment tank, a filter, an ejector provided between the filter and the processing tank, and a buffer tank provided between the ejector and the processing tank and having an exhaust port, A process liquid circulation filtration method, characterized in that the process liquid is circulated and filtered by supplying a gas that does not react with the process liquid to an ejector. 2. A processing tank, a filter, and an ejector provided between the filter and the processing tank, and supplying a gas that does not react with the processing liquid to the ejector to perform circulation filtration of the processing liquid and A processing liquid circulation filtration method characterized in that the gas sent into the ejector is also sent into the processing tank to bubble the processing liquid in the processing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100507A JPS63264115A (en) | 1987-04-22 | 1987-04-22 | Method for circulating and filtering processing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100507A JPS63264115A (en) | 1987-04-22 | 1987-04-22 | Method for circulating and filtering processing solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63264115A JPS63264115A (en) | 1988-11-01 |
| JPH0582243B2 true JPH0582243B2 (en) | 1993-11-18 |
Family
ID=14275860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62100507A Granted JPS63264115A (en) | 1987-04-22 | 1987-04-22 | Method for circulating and filtering processing solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63264115A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11610789B2 (en) | 2020-03-05 | 2023-03-21 | Kioxia Corporation | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04321216A (en) * | 1991-01-16 | 1992-11-11 | Nec Yamagata Ltd | Spin coater |
-
1987
- 1987-04-22 JP JP62100507A patent/JPS63264115A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11610789B2 (en) | 2020-03-05 | 2023-03-21 | Kioxia Corporation | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63264115A (en) | 1988-11-01 |
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