JPH0622992B2 - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH0622992B2 JPH0622992B2 JP63325015A JP32501588A JPH0622992B2 JP H0622992 B2 JPH0622992 B2 JP H0622992B2 JP 63325015 A JP63325015 A JP 63325015A JP 32501588 A JP32501588 A JP 32501588A JP H0622992 B2 JPH0622992 B2 JP H0622992B2
- Authority
- JP
- Japan
- Prior art keywords
- glass fiber
- layer
- woven fabric
- laminated
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、寸法安定性及び電気特性に優れた電気絶縁用
の積層板に関し、特に、高周波領域での使用に適した積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated plate for electrical insulation having excellent dimensional stability and electrical characteristics, and more particularly to a laminated plate suitable for use in a high frequency region.
従来の技術 従来より、Ｅガラスによるガラス繊維織布基材エポキシ
樹脂あるいはポリイミド樹脂を含浸、乾燥して得たプリ
プレグを所定枚数重ね合わせ、これを加熱加圧成形した
積層板が製造されている。これらの誘電率は 4.3〜 5.0
と大きいため、プリント配線板の基板としての用途では
静電容量が大き過ぎ、高周波数を取り扱うプリント配線
板には不適であった。高周波領域に適するプリント配線
板には、誘電率や誘電正接の低いものが要求され、これ
らの要求に対して、ガラス繊維織布基材に誘電率の低い
熱可塑性樹脂（ポリテトラフルオロエチレンあるいはポ
リフェニレンオキサイド）を含浸、乾燥して得たプリプ
レグを加熱加圧成形した積層板が使用されている。しか
し、これらの積層板は、製造工程が非常に複雑で、はん
だ付け加工での寸法安定性が悪くかつ、価格的にも非常
に高価である。2. Description of the Related Art Conventionally, a laminated plate is manufactured in which a predetermined number of prepregs obtained by impregnating a glass fiber woven fabric base material epoxy resin or polyimide resin with E glass and drying the prepregs are laminated by heat and pressure. Their dielectric constant is 4.3 to 5.0
Therefore, the capacitance of the printed wiring board is too large for use as a substrate of the printed wiring board, and it is unsuitable for a printed wiring board that handles high frequencies. A printed wiring board suitable for a high frequency region is required to have a low dielectric constant and a low dielectric loss tangent. To meet these requirements, a glass fiber woven base material is made of a thermoplastic resin (polytetrafluoroethylene or polyphenylene A laminated plate is used in which a prepreg obtained by impregnating with (oxide) and drying is heat-pressed. However, these laminated plates have a very complicated manufacturing process, have poor dimensional stability during soldering, and are very expensive in price.
一方、電子チューナー用の基板に、無機充填材の含有量
を少なくした安価なＣＥＭ-3材（コンポジットエポキシ
樹脂積層板）が多用されているが、１ＧＨｚ以上の周波
数を取り扱う場合は、プリント配線板に起因する静電容
量が問題となる。On the other hand, an inexpensive CEM-3 material (composite epoxy resin laminated board) containing a small amount of an inorganic filler is often used as a substrate for an electronic tuner, but when handling a frequency of 1 GHz or more, a printed wiring board is used. Capacitance due to is a problem.
発明が解決しようとする課題 上記のように、種々の特性を満足し、高周波領域での使
用に適した積層板は、未だ提案されていない。本発明
は、静電容量が低く寸法収縮も小さく、また機械加工性
の優れた積層板を提供することを目的とする。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above, a laminated plate satisfying various characteristics and suitable for use in a high frequency region has not been proposed yet. An object of the present invention is to provide a laminate having a low capacitance, a small dimensional shrinkage, and excellent machinability.
課題を解決するための手段 上記目的を達成するために、本発明は、熱硬化性樹脂積
層板として基材の構成を次のようにしたものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a thermosetting resin laminated plate having the following base material configuration.
すなわち、第２図に示すように、中心層をガラス繊維不
織布の層１とし、その両側にそれぞれガラス繊維織布の
層２、有機繊維不織布の層３をこの順に配置し、表面が
有機繊維不織布の層３になるように構成する、 また、図３に示すように、中心層をガラス繊維不織布の
層１とし、その両側にそれぞれガラス繊維織布の層２、
ガラス繊維不織布の層４をこの順に配置し、表面がガラ
ス繊維不織布の層４になるように構成する。そして、前
記表面のガラス繊維不織布の層４の樹脂含有量を５０重
量％以上とするものである。That is, as shown in FIG. 2, the center layer is a glass fiber nonwoven fabric layer 1, and a glass fiber woven fabric layer 2 and an organic fiber nonwoven fabric layer 3 are arranged on both sides thereof in this order, and the surface is an organic fiber nonwoven fabric. In addition, as shown in FIG. 3, the central layer is the layer 1 of the glass fiber nonwoven fabric, and the glass fiber woven layer 2 is provided on both sides of the layer 1.
The glass fiber nonwoven fabric layer 4 is arranged in this order so that the surface is the glass fiber nonwoven fabric layer 4. Then, the resin content of the layer 4 of the glass fiber nonwoven fabric on the surface is set to 50% by weight or more.
上記積層板は、少なくとも一方の表面に金属箔５を一体
化したものであってもよい。The laminated plate may be one in which the metal foil 5 is integrated on at least one surface.
作用 高周波の信号は、プリント配線板の回路表面を伝送する
ため、回路下の絶縁層の材質に大きく影響を受ける。そ
のため、回路に最も近い絶縁層に、Ｅガラスよりはるか
に誘電率の小さい有機繊維不織布を使用することによ
り、誘電率の低い積層板とすることができる。そして、
中心層よりも表面に近い位置にガラス繊維織布の層を配
置することにより、寸法収縮を抑制し機械的強度を保持
させることができ、中心層にガラス繊維不織布の層を配
置することで、機械加工性も良好なものとなっている。Action High-frequency signals are transmitted on the circuit surface of the printed wiring board, and are thus greatly affected by the material of the insulating layer below the circuit. Therefore, by using an organic fiber non-woven fabric having a much smaller dielectric constant than E glass for the insulating layer closest to the circuit, a laminated plate having a low dielectric constant can be obtained. And
By arranging the glass fiber woven layer at a position closer to the surface than the central layer, it is possible to suppress dimensional shrinkage and maintain mechanical strength, and by arranging the glass fiber nonwoven layer in the central layer, The machinability is also good.
また、表面にガラス繊維不織布の層を配置する場合は、
その樹脂含有量を50重量％以上とすることにより、誘電
率の高いガラス繊維の影響を排除することができる。樹
脂含有量が少ないと、誘電率が十分に低くならず、静電
容量も小さくならない。Also, when placing a layer of glass fiber nonwoven on the surface,
By setting the resin content to 50% by weight or more, the influence of glass fiber having a high dielectric constant can be eliminated. When the resin content is low, the dielectric constant does not become sufficiently low and the capacitance does not decrease.
実施例 本発明に使用する熱硬化性樹脂は、ポリブタジェン、エ
ポキシ樹脂、フェノール樹脂、メラミン樹脂、ジアリル
フタレート樹脂、ケイ素樹脂などの通常使用されている
もので限定しないが、特にポリブタジエンもしくは変性
ポリブタジエンなどの誘電率及び誘電正接が低いものが
望ましい。積層板を難燃化するためにブロム化合物や三
酸化アンチモン、五酸化アンチモン、リン化合物、水酸
化アルミニウム、水酸化マグネシウムなどの難燃剤を使
用しても良い。さらに、充填機として、誘電率が低い微
小中空球などを併用してもよい。Examples The thermosetting resin used in the present invention is not limited to those commonly used such as polybutadiene, epoxy resin, phenol resin, melamine resin, diallyl phthalate resin, and silicon resin, but especially polybutadiene or modified polybutadiene. A material having a low dielectric constant and a low dielectric loss tangent is desirable. A flame retardant such as a bromine compound, antimony trioxide, antimony pentoxide, a phosphorus compound, aluminum hydroxide or magnesium hydroxide may be used to make the laminate flame-retardant. Further, as the filling machine, fine hollow spheres having a low dielectric constant may be used in combination.
本発明に使用する有機繊維不織布は、ポリパラフェニレ
ンテレフタラミド、ポリメタフェニレンイソフタラミ
ド、ポリパラフェニレン3,4′ジフェニルエーテル・テ
レフタラミドなどを繊維化したアラミド繊維、ポリエス
テル繊維、ナイロン繊維、ポリテトラフルオロエチレン
系繊維などを湿式もしくは乾式法で不織布した物である
が、好ましくは、有機繊維の融点が、260℃以上ある事が
良い。The organic fiber non-woven fabric used in the present invention includes polyparaphenylene terephthalamide, polymetaphenylene isophthalamide, polyparaphenylene 3,4 ′ diphenyl ether terephthalamide, and the like aramid fiber, polyester fiber, nylon fiber, polytetra fiber. It is a non-woven fabric made of fluoroethylene fiber or the like by a wet or dry method. Preferably, the melting point of the organic fiber is 260 ° C. or higher.
本発明に使用するガラス繊維織布は、電気絶縁用に通常
使用されているもので特に限定しない。一般にはＥガラ
ス、Ｄガラスを使用したヤーンを平織りしたものであ
る。ガラス繊維不織布についても、Ｅガラス、Ｄガラス
を使用した電気絶縁用に通常使用されているもので特に
限定しない。不織布にするためのバインダーとしては、
エポキシ樹脂、ポバール、アクリロニトリル、パルプな
どが使用されている。The glass fiber woven fabric used in the present invention is not particularly limited and is usually used for electrical insulation. Generally, it is a plain woven yarn of E glass and D glass. The glass fiber non-woven fabric is not particularly limited as it is usually used for electrical insulation using E glass and D glass. As a binder for making non-woven fabric,
Epoxy resin, poval, acrylonitrile, pulp, etc. are used.
本発明に使用する金属箔は、銅箔、ニッケル箔、アルミ
箔などであるが特に限定しない。The metal foil used in the present invention is a copper foil, a nickel foil, an aluminum foil or the like, but is not particularly limited.
本発明の実施例を比較例と共に詳細に説明する。Examples of the present invention will be described in detail together with comparative examples.
実施例１ Ep−1001（油化シェル製エポキシ樹脂、エポキシ当量50
0）100gにジシアンジアミド３ｇ、触媒として２−エチ
ル４−メチルイミダゾールを0.2g溶かし、均一配合ワニ
スを得た。Example 1 Ep-1001 (Epoxy resin made by Yuka Shell, epoxy equivalent 50
0) 3 g of dicyandiamide and 0.2 g of 2-ethyl-4-methylimidazole as a catalyst were dissolved in 100 g to obtain a uniformly mixed varnish.
この均一配合ワニスをアラミド繊維不織布（坪量41
ｇ）、ガラス繊維織布（坪量206g）、ガラス繊維不織布
（坪量75ｇ）にそれぞれ含浸、乾燥させ、樹脂量がそれ
ぞれ70重量％、40％重量、82重量％のプリプレグシート
を得た。This uniform varnish was mixed with aramid fiber non-woven fabric (basis weight 41
g), a glass fiber woven fabric (basis weight 206 g) and a glass fiber nonwoven fabric (basis weight 75 g) were impregnated and dried to obtain prepreg sheets having resin amounts of 70% by weight, 40% by weight and 82% by weight, respectively.
上記プリプレグシートを、アラミド繊維不織布１枚、ガ
ラス繊維織布１枚、ガラス繊維不織布４枚、ガラス繊維
織布１枚、アラミド繊維不織布１枚の順に重ね合わせ、
その上下に銅箔（厚さ35μｍ）をのせ、170℃40kg／cm2
で90分間積層成形し銅張積層板を得た。The above prepreg sheets are superposed in the order of 1 aramid fiber nonwoven fabric, 1 glass fiber woven fabric, 4 glass fiber nonwoven fabrics, 1 glass fiber woven fabric, 1 aramid fiber nonwoven fabric,
Put copper foil (thickness 35μm) on the top and bottom, 170 ℃ 40kg / cm 2
Was laminated for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率を、次のように求め
た。銅張積層板の基準穴間の寸法（常態）を基に、全面
エッチング、Ｅ−0.5/150 処理後の寸法を測定し、次式
で求める。The dimensional change rate of the obtained copper-clad laminate was determined as follows. Based on the dimension (normal state) between the reference holes of the copper-clad laminate, measure the dimension after the entire surface etching and E-0.5 / 150 treatment, and calculate by the following formula.
また、積層板の静電容量を、銅張積層板を第１図に示す
櫛形パターンに加工して200MHzで測定した。 Further, the capacitance of the laminate was measured at 200 MHz by processing the copper clad laminate into the comb pattern shown in FIG.
これらの結果を第１表に示す。The results are shown in Table 1.
比較例１ 実施例１で作製したプリプレグシートを用い、アラミド
繊維不繊布１枚、ガラス繊維不繊布６枚、アラミド繊維
不織布１枚の順に重ね合わせ、その上下に銅箔（厚さ35
μｍ）をのせ、170℃、40kg/cm2で90分間積層成形し銅張
積層板を得た。Comparative Example 1 Using the prepreg sheet produced in Example 1, one aramid fiber non-woven fabric, six glass fiber non-woven fabrics, and one aramid fiber non-woven fabric were overlaid in this order, and copper foil (thickness 35
μm), and laminated and molded at 170 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これらの結果を第１表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
比較列２ 実施例１で作製したプリプレグシートを用い、ガラス繊
維織布１枚、アラミド繊維不織布１枚、ガラス繊維不織
布４枚、アラミド繊維不織布１枚、ガラス繊維織布１枚
の順に重ね合わせ、その上下に銅箔（厚さ35μｍ）をの
せ、170℃、40kg／cm2で90分間積層成形し銅張積層板を
得た。Comparative row 2 Using the prepreg sheet produced in Example 1, one glass fiber woven fabric, one aramid fiber nonwoven fabric, four glass fiber nonwoven fabrics, one aramid fiber nonwoven fabric, and one glass fiber woven fabric were overlaid in this order. Copper foils (thickness: 35 μm) were placed on the upper and lower sides, and laminated and molded at 170 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これらの結果を第１表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
比較例３ 実施例１で作製したプリプリグシートを用い、アラミド
繊維不織布１枚、ガラス繊維織布６枚、アラミド繊維不
織布１枚の順に重ね合わせ、その上下に銅箔（厚さ35μ
ｍ）をのせ、170℃、40kg／cm2で９０分間積層成形し銅
張積層板を得た。Comparative Example 3 Using the prepreg sheet prepared in Example 1, one aramid fiber nonwoven fabric, six glass fiber woven fabrics, and one aramid fiber nonwoven fabric were overlaid in this order, and copper foil (thickness 35 μm
m) was placed and laminated and molded at 170 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これらの結果を第１表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
比較例４ 実施例１で作製したプリプレグシートを用い、ガラス繊
維織布１枚、ガラス繊維不織布６枚、ガラス繊維織布１
枚の順に重ね合わせ、その上下に銅箔（厚さ35μｍ）を
のせ、170℃、40kg／cm2で90分間積層成形し銅張積層板
を得た。Comparative Example 4 Using the prepreg sheet produced in Example 1, 1 piece of glass fiber woven cloth, 6 pieces of glass fiber nonwoven cloth, 1 piece of glass fiber woven cloth
The sheets were superposed in this order, copper foil (thickness: 35 μm) was placed on the top and bottom of the sheets, and laminated and molded at 170 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これらの結果を第１表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
実施例２ Ep−1001（油化シェル製：エポキシ当量500）100gにジ
シアンジアミド３ｇ、触媒として２−エチル４−メチル
イミダゾールを0.2g溶かし、均一配合ワニスを得た。 Example 2 3 g of dicyandiamide and 0.2 g of 2-ethyl-4-methylimidazole as a catalyst were dissolved in 100 g of Ep-1001 (manufactured by Yuka Shell Co., Ltd .: epoxy equivalent: 500) to obtain a uniformly mixed varnish.
実施例１で使用したワニスをガラス繊維織布（坪量206
g）、ガラス繊維不織布（坪量75ｇ）にそれぞれ含浸、
乾燥させ樹脂量がそれぞれ40重量％、88重量％のプリプ
レグシートを得た。The varnish used in Example 1 was made of glass fiber woven cloth (basis weight 206
g), impregnated into a glass fiber non-woven fabric (grammage 75 g),
After drying, prepreg sheets having resin amounts of 40% by weight and 88% by weight were obtained.
上記プリプレグシートを、ガラス繊維不織布１枚、ガラ
ス繊維織布１枚、ガラス繊維不織布４枚、ガラス繊維織
布１枚、ガラス繊維不織布１枚の順に重ね合わせ、その
上下に銅箔（厚さ35μｍ）をのせ、170 ℃、40kg／cm2
で90分間積層成形し銅張積層板を得た。The above prepreg sheets were laminated in the order of 1 glass fiber non-woven fabric, 1 glass fiber woven fabric, 4 glass fiber non-woven fabric, 1 glass fiber woven fabric, 1 glass fiber non-woven fabric, and copper foil (thickness: 35 μm) above and below it. ), 170 ℃, 40kg / cm 2
Was laminated for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電要領を、実施例
１と同様に測定した。これらの結果を第２表に示す。The dimensional change rate and the electrostatic procedure of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 2.
比較例５ 実施例１で作製した均一配合ワニスを実施例２のガラス
繊維不織布に含浸、乾燥させ樹脂量42重量％のプリプレ
グシートを得た。このプリプレグシートと実施例２で作
製したガラス繊維織布プリプレグシートを用い、ガラス
繊維不織布１枚、ガラス繊維織布１枚、ガラス繊維不織
布５枚、ガラス繊維織布１枚、ガラス繊維不織布１枚の
順に重ね合わせ、その上下に銅箔（厚さ35μｍ）をの
せ、170℃、40kg／cm2で90分間積層成形し銅張積層板を
得た。Comparative Example 5 The glass fiber nonwoven fabric of Example 2 was impregnated with the uniformly compounded varnish produced in Example 1 and dried to obtain a prepreg sheet having a resin amount of 42% by weight. Using this prepreg sheet and the glass fiber woven prepreg sheet produced in Example 2, one glass fiber nonwoven fabric, one glass fiber woven fabric, five glass fiber nonwoven fabrics, one glass fiber woven fabric, one glass fiber nonwoven fabric Were laminated in this order, copper foil (thickness: 35 μm) was placed on the top and bottom of the laminate, and laminated and molded at 170 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。この結果を第２表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 2.
比較例６ 実施例２で作製したプリプレグシートのガラス繊維不織
布８枚を重ね合わせ、その上下に銅箔（厚さ35μｍ）を
のせ、170℃、40kg／cm2で90分間積層成形し銅張積層板
を得た。Comparative Example 6 Eight glass fiber non-woven fabrics of the prepreg sheet produced in Example 2 were superposed, copper foil (thickness 35 μm) was placed on the upper and lower sides thereof, and laminated at 170 ° C. for 40 minutes at 40 kg / cm 2 to form a copper clad laminate. I got a plate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これら結果を第２表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 2.
比較例７ 実施例２で作製したプリプレグシートを、ガラス繊維織
布１枚、ガラス繊維不織布６枚、ガラス繊維織布１枚の
順に重ね合わせ、その上下に銅箔（厚さ35μｍ）をの
せ、170℃、40kg／cm2で90分間積層成形し銅張積層板を
得た。Comparative Example 7 The prepreg sheet produced in Example 2 was laminated in the order of 1 piece of glass fiber woven cloth, 6 pieces of glass fiber nonwoven cloth, and 1 piece of glass fiber woven cloth, and copper foil (thickness 35 μm) was placed on the upper and lower sides thereof, A copper clad laminate was obtained by laminating and molding at 170 ° C. and 40 kg / cm 2 for 90 minutes.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これら結果を第２表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 2.
比較例８ 実施例２で作製したプリプレグシートを、ガラス繊維不
織布１枚、ガラス繊維織布６枚、ガラス繊維不織布１枚
の順に重ね合わせ、その上下に銅箔（厚さ35μｍ）をの
せ、170℃、40kg／cm2で90分間積層成形し銅張積層板を
得た。Comparative Example 8 The prepreg sheet produced in Example 2 was laminated in the order of 1 piece of glass fiber nonwoven fabric, 6 pieces of glass fiber woven cloth, and 1 piece of glass fiber nonwoven fabric, and copper foil (thickness 35 μm) was placed on the upper and lower sides thereof, and 170 Laminating was performed at 40 ° C. and 40 kg / cm 2 for 90 minutes to obtain a copper clad laminate.
得られた銅張積層板の寸法変化率、静電容量を、実施例
１と同様に測定した。これら結果を第２表に示す。The dimensional change rate and the capacitance of the obtained copper clad laminate were measured in the same manner as in Example 1. The results are shown in Table 2.
発明の効果 上述のように、本発明に係る積層板は、表面の層を誘電
率の低い層としたことにより高周波特性に優れた積層板
となる。そして、中心層をガラス繊維不織布の層として
機械加工性を良好にでき、中心層より表面に近いところ
をガラス繊維織布の層としたことにより寸法安定性も保
持させることができる点、その工業的価値は極めて大な
るものである。 EFFECTS OF THE INVENTION As described above, the laminated plate according to the present invention is a laminated plate excellent in high frequency characteristics because the surface layer is a layer having a low dielectric constant. Further, the center layer can be made into a glass fiber nonwoven fabric layer for good machinability, and the dimensional stability can be maintained by making the portion closer to the surface than the center layer a glass fiber woven fabric. The intellectual value is extremely large.
第１図は積層板の静電容量を測定するための櫛形パター
ン回路の説明図、第２図は本発明に係る積層板の基材の
層構成を示す説明図、第３図は本発明に係る積層板の別
の基材の層構成を示す説明図である。 １はガラス繊維不織布の層、２はガラス繊維織布の層、
３は有機繊維不織布の層、４はガラス繊維不織布の層、
５は金属箔FIG. 1 is an explanatory view of a comb-shaped pattern circuit for measuring the capacitance of a laminated board, FIG. 2 is an explanatory view showing a layer structure of a base material of a laminated board according to the present invention, and FIG. It is explanatory drawing which shows the layer structure of another base material of such a laminated board. 1 is a layer of non-woven glass fiber, 2 is a layer of woven glass fiber,
3 is a layer of organic fiber non-woven fabric, 4 is a layer of glass fiber non-woven fabric,
5 is metal foil
Claims (3)
層成形した積層板において、 前記基材として中心層をガラス繊維不織布の層とし、そ
の両側にそれぞれガラス繊維織布の層、有機繊維不織布
の層をこの順に配置し、表面が有機繊維不織布の層にな
るように構成した積層板。1. A laminate obtained by laminating sheet-like base materials impregnated with a thermosetting resin, wherein a center layer is a glass fiber nonwoven fabric layer as the base material, and a glass fiber woven fabric layer and an organic layer are formed on both sides of the center layer. A laminated board in which layers of fibrous nonwoven fabric are arranged in this order, and the surface is a layer of organic fibrous nonwoven fabric.
層成形した積層板において、 前記基材として中心層をガラス繊維不織布の層とし、そ
の両側にそれぞれガラス繊維織布の層、ガラス繊維不織
布の層をこの順に配置し、表面がガラス繊維不織布の層
になるように構成し、 前記表面のガラス繊維不織布の層の樹脂含有量を５０重
量％以上とした積層板。2. A laminated plate obtained by laminating sheet-like base materials impregnated with a thermosetting resin, wherein a central layer is a glass fiber non-woven fabric layer, and a glass fiber woven fabric layer and a glass are provided on both sides thereof. A laminated board in which layers of a fiber non-woven fabric are arranged in this order so that the surface is a layer of the glass non-woven fabric, and the resin content of the layer of the glass non-woven fabric on the surface is 50% by weight or more.
する請求項１または２に記載の積層板。3. The laminated plate according to claim 1, which has a metal foil integrally formed on at least one surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325015A JPH0622992B2 (en) | 1988-12-23 | 1988-12-23 | Laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325015A JPH0622992B2 (en) | 1988-12-23 | 1988-12-23 | Laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02169249A JPH02169249A (en) | 1990-06-29 |
| JPH0622992B2 true JPH0622992B2 (en) | 1994-03-30 |
Family
ID=18172187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63325015A Expired - Fee Related JPH0622992B2 (en) | 1988-12-23 | 1988-12-23 | Laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622992B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2798186B2 (en) * | 1990-08-15 | 1998-09-17 | 松下電工株式会社 | Electric laminate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49119755U (en) * | 1973-02-09 | 1974-10-14 | ||
| JPH0229012B2 (en) * | 1982-01-23 | 1990-06-27 | Hitachi Kasei Kogyo Kk | SEKISOBAN |
-
1988
- 1988-12-23 JP JP63325015A patent/JPH0622992B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02169249A (en) | 1990-06-29 |
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