JPH0632369B2 - Circuit board coating equipment - Google Patents

Description

The present invention relates to a circuit board coating apparatus for forming a resin coating film of silicon or the like on the surface of a circuit board such as a hybrid IC.

[Prior Art] Conventionally, this type of coating is performed by immersing parts other than the terminals of the circuit board in the resin liquid in the resin tank to deposit the resin liquid on the substrate surface, and then drying the resin liquid with a heater. All of these operations are performed manually by the operator.

[Problems to be Solved by the Invention] However, a resin liquid having a very high viscosity may be used for the coating depending on the type of the circuit board, and such a resin may be used for a hybrid IC or the like in which elements are densely mounted. When using, the air bubbles may be mixed between the elements, or the thickness of the resin tank may not be formed uniformly. Furthermore, if the viscosity of the resin liquid is high, the liquid surface after the circuit board is lifted from the resin tank becomes uneven, and the height of the adhered surface may change when the next circuit board is dipped. As described above, when a resin liquid having a high viscosity is used, it is difficult to manufacture a high quality product, and there is a problem that the quality of the product varies.

On the other hand, since the above method is a manual work, not only the production efficiency is poor when a large number of circuit boards are processed, but also the degree of adhesion of the resin liquid and the degree of drying of the resin liquid are different, similar to the above. There is also a problem that product quality varies.
As a method of eliminating the unevenness of the resin liquid surface, it has been conventionally proposed to apply vibration to at least one of the circuit board side and the resin tank side. However, with this method, the surface of the resin cannot be surely smoothed in a short time when the resin has large irregularities or a high viscosity.

The object of the present invention is to perform a high-quality and uniform coating operation automatically with high production efficiency, and even if the resin has large irregularities, the surface of the resin can be reliably treated in a short time. Another object of the present invention is to provide a circuit board coating device capable of smoothing.

[Means for Solving the Problem] The present invention provides a holding means for holding a circuit board, a resin tank for storing a resin liquid and arranged below the holding means, and a resin surface in the resin tank. A squeegee that reciprocates on this surface for smoothing, and a drive means for moving the holding means and the resin tank closer to and away from each other so as to immerse the circuit board held by the holding means in the resin in the resin tank. In the coating device for a circuit board, the gist of the coating device for a circuit board is that, on one side of the lower portion of the squeegee, a curved surface portion that is in sliding contact with the surface of the resin when the squeegee moves back is formed. is there.

[Operation] In the present invention, the circuit board held by the holding means is dipped in the resin in the resin tank by the driving means, and the resin is applied to the surface of the board. Further, the circuit board is carried to the drying means by the carrying means, and the resin on the surface of the board is dried by the drying means. When the circuit board is pulled up from the resin in the resin tank, irregularities are formed on the surface of the resin, but when the squeegee moves forward, only the lower tip slides on the resin surface, The convex part due to drooling is mainly scraped off. Then, when the squeegee moves back, the lower curved surface portion is brought into sliding contact with the surface of the resin, and the resin is surely smoothed. All of the above work is done smoothly by the machine,
All circuit boards are processed under the same conditions.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the coating apparatus according to the present embodiment includes a deposition apparatus 1 for depositing a silicon resin on a hybrid IC 55 as a circuit board, and a heater as a drying unit for drying the deposited resin. 2 and the supplied hybrid IC 55 from the deposition apparatus 1 to the operator via the heater 2 as a conveyor 3 as a conveyor.
It consists of

As shown in FIGS. 2 and 3, a resin tank 5 is installed on a base 4 as a second vibration applying means of the deposition apparatus 1, and a silicone resin is stored in the resin tank 5. There is. Base 4
A vibrator is installed in the inside so that the resin tank 5 can be vibrated.

A frame 6 is installed at the rear of the base 4, a cylinder 7 as a driving means is provided at the upper part of the frame 6, and a rod 7a thereof is directed downward. A head slider 9 is fixed to the rod 7a of the cylinder 7, and the head slider 9 is vertically guided along a pair of guide rails 8. A support plate 10 that supports a motor 13 as a first vibration applying unit is fixed to the lower surface of the head slider 9. Further, a diaphragm 12 is supported by a pair of diaphragm shafts 11 provided on the head slider 9 so as to be vertically movable, and the motor 12 is mounted on the diaphragm 12.
An eccentric shaft 14 rotatably driven by the output shaft of is rotatably supported. The diaphragm 12 is adapted to vibrate in the vertical direction while being guided by the diaphragm shaft 11 as the eccentric shaft 14 rotates.

An offset plate 15 as a holding means is fixed to the lower side of the vibrating plate 12, and knock pins 15a for positioning a jig plate 16 to which the hybrid IC 55 is fixed are provided on both left and right front surfaces of the plate 15. ing. A fixed lever 17 is rotatably supported by a shaft 18 on the front surface of the offset plate 15, and an operation rod 19 rotatably connected to an upper end of the lever 17 is rotatably supported by a pair of guide members 20. Is slidably supported on. A compression spring 21 is interposed between the flange portion 19a formed on the operation rod 19 and one guide member 20, and the spring 21 always moves the operation rod 19 in a specific direction (rightward in FIG. 2). By urging the fixed lever 17 into an upright posture,
The lower end is brought into contact with the stopper 22.

The hybrid IC 55 of the jig plate 16 fixed to the offset plate 15 by the lower end of the fixing lever 17 is located above the resin tank 5 as shown in FIG. 5 when the rod 7a of the cylinder 7 is in the retracted state. As shown in FIG. 2, when the rod 7a of the cylinder 7 is in the projecting state, the silicon in the resin tank 5 is immersed to a predetermined position in the figure. Further, when the hybrid IC 55 is at the upper position, one end of the operation rod 19 has a cylinder 23 supported by a support member (not shown).
It faces the rod 23a. And
When the rod 23a of the cylinder 23 protrudes, the operating rod 19 moves leftward against the biasing force of the compression spring 21 and tilts the fixing lever 17, thereby allowing the jig plate 16 to be detached forward. It has become.

As shown in FIGS. 3 and 4, a pair of left and right guide rails 24 are supported by the frame 6 behind the resin tank 5, and a squeegee slider 25 moves in the left and right directions on the guide rails 24. It is provided so that it can be done. The squeegee slider 25 is connected to a chain 27 that moves left and right by a pair of sprockets 26,
A motor 28 that is repeatedly rotated reciprocates in the left-right direction.

A flexible communication pipe 5a from an unillustrated resin liquid automatic supply device is connected to the resin tank 5. And
The resin liquid is automatically supplied through the communicating pipe 5a by the timer means provided in the automatic supply device at predetermined time intervals (in this embodiment, every time the dipping process of one jig plate 16 is completed). It is like this.

A squeegee shaft 29 rotatably supported by the squeegee slider 25 has a squeegee 30 fixed to the front end thereof and a reversing plate 31 fixed to the rear end thereof. Slider 25
The spring 32 is connected to the hooking portion 25a. Therefore, the reversal plate 31 has the spring 3
The squeegee slider 25 is urged to rotate in both left and right directions by the stopper 2 and tilted right and left by a predetermined angle by a stopper (not shown).

And, in normal times, the squeegee slider 25
At the same time, the squeegee 30 is positioned on the left side as shown by the phantom line in FIG. 4, and the lower portion of the reversing plate 31 comes into contact with the stopper 6b provided on the side of the frame 6, so that the squeegee 30 tilts to the left. ing. When the squeegee slider 25 moves to the right side from this state, the frame 6
The lower part of the reversing plate 31 comes into contact with the stopper 6a provided on the right side of the squeegee 30 to tilt the squeegee 30 to the right. Further, when the squeegee 30 moves to the left side, the squeegee 3
0 comes into contact with the above-mentioned left stopper 6b and tilts to the left again.

As shown in FIGS. 4 and 5, a cylinder 33 is installed at the rear of the frame 6 and has a rod 33a directed upward.
Is connected to a lever 36 of a shaft 35 that is rotatably supported by a support seat 34 of the frame 6, and a pair of levers 37 fixed to both ends of the shaft 35 includes guides provided on the frame 6. Rear ends of a pair of rods 39 that can slide in the front-rear direction are connected by the portions 38, respectively. Both rods 39 are located on both sides of the vibrating plate 12, and a gripping block 40 is fixed to each front end thereof. A pair of gripping claws 41 are respectively provided on both blocks 40 so as to project toward the front, and a guide plate 42 having a recess at the tip thereof is provided so as to project.

Then, as shown in FIG. 5, when the rod 33a of the cylinder 33 in the retracted state is projected, both levers 36 and 37 are rotated as shown by the arrows, and both rods 39 are pushed forward to move the grip block 40. When the rod 33a of the cylinder 33 is retracted again in the front position, both gripping blocks 40 move rearward to the rear position.

Further, the grip claw 41 is configured to be capable of gripping both ends of the jig plate 16 by switching between an open state and a closed state by a cylinder in the grip block 40.

Note that the grip block 40 is normally on standby at the rear position, and the grip claws 41 are open.

On the other hand, as shown in FIGS. 1 and 5, the conveyor 3 is composed of first and second conveyors 43 and 44, and the first conveyor 43 is installed in front of the deposition apparatus 1. The conveyor 43 is provided with a pair of chains 43a arranged in parallel, and both chains 43a are guided annularly in the coating apparatus by a large number of sprockets 45. A portion of the chain 43a in front of the attached device 1 runs vertically from the upper side to the lower side, and the same portion is used as a delivery section 46. The chain 4
Recessed holding metal fittings 47 are attached to 3a at predetermined intervals, and the concave portions of the metal fittings 47 can hook both ends of the jig plate 16 arranged so as to be bridged between both chains 43a. In addition, a portion corresponding to the upper side of the first conveyor 43 of the coating apparatus is open, and the same portion is used as a work supply unit 48.

Below both chains 43a of the first conveyor 43,
A bar-shaped guide rail 49 is installed in each case, and the delivery section 46 side of the rail 49 has an arc shape along the flow of the chain 43a.

As shown in FIGS. 1 and 8, the second conveyor 44 is installed on the lower front side of the first conveyor 43.
The rear end of 4 is located below the front end of the guide rail 49. This second conveyor 44 is also the first conveyor 43
Similarly, a pair of chains 44a arranged in parallel are provided, and all the links are fitted with holding fittings 50 having concave ends. The front end of the second conveyor 44 is a work recovery unit 51 for recovering the processed jig plate 16, and the front side of the second conveyor 44 is provided with a jig plate that has not been recovered due to some mistake. It serves as a housing portion 52 for temporarily housing.

Sensors 53 are provided in the work collecting section 51 and the accommodating section 51, respectively, and both sensors 53 detect that the jig plate 16 is conveyed by the second conveyor 44 and reaches the respective positions. ing. And
When the sensor 53 of the work collecting unit 51 detects that the jig plate 16 reaches this position, the light 54 is detected.
Is blinked, and a buzzer (not shown) is operated in the sensor 53 of the housing portion 52.

The heater 2 is installed between both chains 44a of the second conveyor 44, and is adapted to dry and cure the silicon resin of the hybrid IC 55 conveyed by the same conveyor 44.

Next, the case where the hybrid IC 55 is coated by the coating apparatus configured as described above will be described.

As shown in FIG. 5, a large number of unprocessed hybrid ICs 55 are attached to the lower edge of the jig plate 16 with the terminals upward, and the operator inserts the jig plate 16 through the work supply unit 51. Holding metal fittings 50 for the first conveyor 43
Put it on top. Since the first conveyor 43 moves with the distance between the holding fittings 43 as one stroke, the worker supplies a new jig plate 16 to the conveyor 43 every time the conveyor 43 moves. When the first jig plate 16 reaches the delivery section 46 and the first conveyor 43 enters the inching stop state, as shown in FIG. 7A, both gripping blocks 40 waiting at the rear position. Is switched to the front position by the cylinder 33, and each gripping claw 4
1 is closed and both ends of the jig plate 16 are gripped.
At this time, the guide plate 42 serves to guide the grip claw 41 so that the grip claw 41 can accurately grip the jig plate 16.

On the other hand, along with this, the squeegee 30 moves from the left side to the right side, reverses, moves to the left side, and returns to the original position. When the squeegee 30 moves to the right side, the tip of the squeegee 30 contacts only the convex portion due to the drool of the silicone resin, and when the squeegee 30 moves to the left side, the tip and the curved surface of the squeegee 30 are The liquid surface of the silicone resin is brought into sliding contact to smooth the liquid surface.

Further, as shown in FIG. 7 (b), the grip block 40
While retreating by the cylinder 33, the jig plate 16 gripped is positioned by the knock pin 15a with respect to the offset plate 15 and superposed. Then, as shown in FIG. 7 (c), the grip block 40 includes the grip claws 4.
1 is opened and further retracted to return to the rear position shown in FIG. On the other hand, the jig plate 16 is fixed to the offset plate 15 by the fixing lever 17, and at the same time, the eccentric shaft 14 is rotated by the motor 13 to vibrate the offset plate 15. The offset plate 15 descends by the cylinder 7 while vibrating, and the hybrid IC 55 is dipped in the silicone resin in the resin tank 5. The resin bath 5 is constantly vibrated by the vibrator during the operation of the coating apparatus.

Further, the offset plate 15 rises to the upper position after a predetermined time elapses, and the hybrid IC 55 is lifted from the silicone resin. Then, as shown in FIG. 7 (c), the grip block 40 is advanced from the rear position while being guided by the guide plate 42, and the grip claw 41 is closed as shown in FIG. 7 (b). Both ends of the jig plate 16 are gripped. At the same time, the fixing lever 17 is tilted by the cylinder 23 to release the fixing of the jig plate 16, and as shown in FIG. 7 (a), the grip block 40 is further advanced to the front position and held again. Both ends of the jig plate 16 are housed in the recesses of the metal fitting 47. The jig plate 16 moves the delivery portion 46 downwards as the first conveyor 43 moves, and as shown by the phantom line in FIG. 5, the concave portion of the holding metal fitting 47 and the guide rail 49.
It is sandwiched between and and is prevented from falling, and is moved forward while being guided by the guide rail 49.

On the other hand, the squeegee 30 repeats the same operation as described above,
As the hybrid IC 55 in the silicon resin is lifted up, the unevenness formed on the surface of the resin is corrected smoothly.

Then, as shown in FIG. 8, the jig plate 16 is dropped at the terminal end of the guide rail 49 to the holding metal fitting 50 of the second conveyor 44 waiting below the jig rail 16 and conveyed to the conveyor 44. The silicon resin adhered to the hybrid IC 55 is dried and solidified by the heater 2. Further, the jig plate 16 has the work collecting section 51.
At the same time, the sensor 53 is operated to instruct the operator to collect the light with the light 54, and the jig plate 16 that has not been collected nevertheless is accommodated in the accommodating portion 52 and activates the sensor 53 to activate the buzzer. And instruct the worker to collect again.

It should be noted that, although the above description has focused on one jig plate 16, in reality, a large number of jig plates 16 are conveyed to the first and second conveyors 43 and 44 in the coating apparatus, and The hybrid IC 55 is sequentially coated with silicon resin and dried.

Thus, in the coating apparatus of this embodiment,
Not only does the resin tank 5 accumulating silicon resin always vibrate by the vibrator in the base 4, but also the hybrid I
Since C55 vibrates together with the offset plate 15 and is immersed in the silicon resin, the bubbles generated on the surface of the hybrid IC 55 can be removed by these vibrations. Further, these vibrations allow the silicon resin to be uniformly applied to the surface of the hybrid IC 55 to form a resin layer having a uniform thickness.

Further, in the coating apparatus of the present embodiment, the unevenness generated after taking out the hybrid IC 55 from the resin tank is smoothed by the reciprocating movement of the squeegee 30. That is, when the squeegee 30 is moved forward, only the lower end is in sliding contact with the surface of the silicone resin, and the convex portion due to the drooling of the liquid surface of the resin is mainly scraped off. Then, when the squeegee 30 is moved back, the lower curved surface portion and the tip end are brought into sliding contact with the surface of the silicon resin, and the resin is surely smoothed.

Therefore, unlike the conventional method of applying vibration to the resin tank,
Even if the silicon resin has large irregularities or has a high viscosity, the surface can be surely smoothed in a short time. Therefore, in any case,
Due to the unevenness of the silicon resin, the height of the adhered surface of the resin adhered to the hybrid IC 55 does not vary.

Furthermore, in the coating apparatus of the present embodiment, since a large number of hybrid ICs 55 can be efficiently subjected to the series of steps from the deposition of the silicon resin to the drying, high production efficiency can be realized. Further, since all the processes are always performed by the machine under the same conditions, there is no quality variation.

In the coating apparatus of this embodiment, all of the motor 13 as the first vibration applying means for vibrating the hybrid IC 55 and the base 4 as the second vibration applying means for vibrating the resin tank 5 are all provided. However, the coating apparatus may be embodied as a coating apparatus including only one of them.

Further, in the coating apparatus of this embodiment, the silicon resin is applied to the hybrid IC 55 as the circuit board, but any circuit board may be used as long as the resin needs to be applied. The resin is not limited to the silicone resin.

Further, in the coating apparatus of the present embodiment, the conveying means is the pair of first and second conveyors 43, 44 provided with a chain, but an integral conveyor may be used, or a roller conveyor may be applied instead. May be.

On the other hand, in the coating apparatus of this embodiment, the heater 2 is used as the drying means for drying the silicone resin, but it may be, for example, a blower for blowing warm air.

[Effects of the Invention] As described in detail above, according to the circuit board coating apparatus of the present invention, it is possible to automatically perform a high-quality and uniform coating operation at a high production rate. Play. Then, according to the device of the present invention, even when the unevenness of the resin is large or the viscosity is high,
There is also an excellent effect that the surface can be surely smoothed in a short time.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the entire coating apparatus, FIG. 2 is a front view of the deposition apparatus, FIG. 3 is a side view showing the deposition apparatus and the delivery section of the first conveyor, and FIG. 4 is the deposition apparatus. FIG. 5 is a partial front view showing the movement of the squeegee, FIG. 5 is a partial side view showing the relationship between the gripping claw of the adherend and the holding metal fitting of the first conveyor, and FIG. 6 is fixed to the jig plate. Partial front view showing the hybrid IC, FIGS. 7 (a) to (c) are explanatory views showing the order of delivering the jig plates from the attachment device by the gripping claw to the first conveyor, and FIG. 8 is the jig. It is explanatory drawing which shows the movement of a plate from a 1st conveyor to a 2nd conveyor. 2 is a heater as a drying means, 3 is a conveyor as a conveying means, 4 is a base as a second vibration applying means, 5 is a resin tank, 7 is a cylinder as a driving means, and 13 is a first vibration applying means. Is a motor, 15 is an offset plate as a holding means, 30 is a squeegee, and 55 is a hybrid IC as a circuit board.

 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-60-195989 (JP, A) JP-A-60-165789 (JP, A) JP-A 64-59924 (JP, A) JP-A 63- 41031 (JP, A) Actually open Sho 57-94903 (JP, U)

Claims (1)

[Claims] 1. A holding means (1) for holding a circuit board (55).
5), a resin tank (5) disposed below the holding means (15) for accumulating the resin liquid, and a surface of the resin in the resin tank (5) to smooth the surface. In order to immerse the reciprocating squeegee (30) and the circuit board (55) held by the holding means (15) in the resin in the resin tank (5), the holding means (15)
A circuit board coating apparatus comprising: a driving means (7) for moving the resin tank (5) closer to and away from the resin tank (5), the squeegee (3) being provided on one side below the squeegee (30).
The circuit board coating apparatus is characterized in that a curved surface portion is formed in sliding contact with the surface of the resin at the time of the backward movement of 0).