JPH0632370B2 - Circuit board coating equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a circuit board coating apparatus for forming a resin film such as silicon on the surface of a circuit board such as a hybrid IC.

[Conventional technology]

Conventionally, in this type of coating, parts other than the terminals of the circuit board are dipped in the resin solution in the resin tank to deposit the resin solution on the surface of the board, and then the resin solution is dried by a heater.

[Problems to be Solved by the Invention]

As a device for performing the coating work, a device having the following configuration can be considered. That is, a jig member for fixing the circuit board, a holding means for holding the jig member at the time of resin immersion, a resin tank for storing the resin liquid and arranged below the holding means, and a holding means for holding the holding means on the holding means. In order to immerse the circuit board of the jig member into the resin in the resin tank, the holding means and the resin tank are moved toward and away from each other, and the holding means and the conveying means are moved forward and backward, and gripped. The coating device is provided with a gripping unit that delivers the jig member to the holding unit by opening and closing the claw.

According to this apparatus, first, when the jig member is transferred by the conveying means, the holding means moves forward and the jig member is held by the closing operation of the holding claw. Next, the holding means is retracted, and the jig member is held by the holding means by the opening operation of the holding claw. After that, the holding means is lowered by the driving means, and the circuit board is immersed in the resin in the resin tank. As a result, resin is applied to the surface of the circuit board.

However, in the configuration of the above-mentioned apparatus provided with the gripping claws that open and close, there is a problem in accuracy when gripping the jig member on the conveying means, and the position when the jig member is held by the holding means is different. There were variations in each jig member. Therefore, there is a drawback in that the height of the adhered surface changes. Therefore, even if this apparatus is used, it is difficult to manufacture a high quality product, and there is a problem that the quality of the product varies.

An object of the present invention is to provide a circuit board coating apparatus which can surely improve the accuracy of gripping a circuit board on a transfer means and can perform a high quality and uniform coating operation. Especially.

[Means for Solving the Problems]

The present invention relates to a jig member for fixing a circuit board, a holding means for holding the jig member at the time of resin immersion, a resin tank for storing a resin liquid and arranged below the holding means, and the holding means. In order to immerse the circuit board of the jig member held by the resin in the resin tank, the holding means and the resin tank are moved toward and away from each other, and the holding means and the conveying means are moved forward and backward. A part of the jig member to be gripped by the gripping claw, in a coating device for a circuit board, which includes gripping means for delivering the jig member to the holding means by opening and closing the gripping claw. The gist of the invention is a coating device for a circuit board, characterized in that a guide member for guiding the inside of the grip claw is provided in the grip means.

[Work]

In the present invention, when the jig member is transferred by the conveying means, the holding means moves forward and the guide member guides a part of the jig member into the holding claw. Therefore, the guide member is accurately grasped by the grasping claw. Next, the gripping means retracts, and the jig member is securely held at the predetermined position of the holding means by the opening operation of the gripping claws. After that, the holding means is lowered by the driving means, and the circuit board is immersed in the resin in the resin tank. As a result, the resin is deposited on the surface of the circuit board at a constant height.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the coating apparatus of the present embodiment includes a deposition apparatus 1 for depositing a silicone resin on a hybrid IC 55 as a circuit board, a heater 2 for drying the deposited resin, and a supply. Hybrid IC55
It is composed of a conveyer 3 for carrying from the deposition apparatus 1 to the worker via the heater 2.

As shown in FIGS. 2 and 3, a resin tank 5 is installed on a base 4 as a vibration applying means of the deposition apparatus 1, and a silicone resin is stored in the resin tank 5. A vibrator is incorporated in the base 4 so that the resin layer 5 can be vibrated.

A frame 6 is installed at the rear of the base 4, a cylinder 7 as a driving means is provided at the upper part of the frame 6, and a rod 7a thereof is directed downward. A head slider 9 is fixed to the rod 7a of the cylinder 7, and the head slider 9 is vertically guided along a pair of guide rails 8. A support plate 10 that supports the motor 13 is fixed to the lower surface of the head slider 9.
A vibration plate 12 is supported by a pair of vibration plate shafts 11 provided on the head slider 9 so as to be vertically movable, and the vibration plate 12 has an eccentric shaft 14 rotatably driven by an output shaft of the motor 13. Is rotatably supported. The diaphragm 12 is adapted to vibrate in the vertical direction while being guided by the diaphragm shaft 11 as the eccentric shaft 14 rotates.

An offset plate 15 as a holding means is fixed to the lower side of the vibrating plate 12, and knock pins 15a for positioning a jig plate 16 to which the hybrid IC 55 is fixed are provided on both left and right front surfaces of the plate 15. ing. A fixed lever 17 is rotatably supported by a shaft 18 on the front surface of the offset plate 15, and an operation rod 19 rotatably connected to an upper end of the lever 17 is rotatably supported by a pair of guide members 20. Is slidably supported on. A compression spring 21 is interposed between the flange portion 19a formed on the operation rod 19 and one guide member 20, and the spring 21 always moves the operation rod 19 in a specific direction (rightward in FIG. 2). By urging the fixed lever 17 into an upright posture,
The lower end is brought into contact with the stopper 22.

The hybrid IC 55 of the jig plate 16 fixed to the offset plate 15 by the lower end of the fixing lever 17 is located above the resin tank 5 as shown in FIG. 5 when the rod 7a of the cylinder 7 is in the closed state. When the cylinder 7 is positioned and the rod 7a of the cylinder 7 is in the projecting state, as shown in FIG. 2, the silicon resin in the resin tank 5 is immersed to a predetermined position. Further, when the hybrid IC 55 is at the upper position, one end of the operation rod 19 has a cylinder 23 supported by a support member (not shown).
It faces the rod 23a. And
When the rod 23a of the cylinder 23 protrudes, the operating rod 19 moves leftward against the biasing force of the compression spring 21 and tilts the fixing lever 17, thereby allowing the jig plate 16 to be detached forward. It has become.

As shown in FIGS. 3 and 4, a pair of left and right guide rails 24 are supported by the frame 6 behind the resin tank 5, and a squeegee slider 25 moves in the left and right directions on the guide rails 24. It is provided so that it can be done. The squeegee slider 25 is connected to a chain 27 that moves left and right by a pair of sprockets 26,
A motor 28 that repeats rotation reciprocates in the left-right direction.

A flexible communication pipe 5a from an unillustrated resin liquid automatic supply device is connected to the resin tank 5. And
The resin liquid is automatically supplied through the communicating pipe 5a by the timer means provided in the automatic supply device at predetermined time intervals (in this embodiment, every time the dipping process of one jig plate 16 is completed). It is like this.

A squeegee shaft 29 rotatably supported by the squeegee slider 25 has a squeegee 30 fixed to the front end thereof and a reversing plate 31 fixed to the rear end thereof. Slider 25
The spring 32 is connected to the hooking portion 25a. Therefore, the reversal plate 31 has the spring 3
The squeegee slider 25 is urged to rotate in both the left and right directions by the stopper 2 and is inclined to the right and left by a predetermined angle by a stopper (not shown).

And, in normal times, the squeegee slider 25
At the same time, the squeegee 30 is located on the left side as shown in phantom in FIG. 4, and the lower portion of the reversing plate 31 comes into contact with the stopper 6b provided on the frame 6 side, so that the squeegee 30 tilts to the left. There is. When the squeegee slider 25 moves to the right from this state, the lower portion of the reversing plate 31 contacts the stopper 6a provided on the right side of the frame 6 to tilt the squeegee 30 to the right. Further, when the squeegee 30 moves to the left side, the squeegee 3
0 comes into contact with the above-mentioned left stopper 6b and tilts to the left again.

As shown in FIGS. 4 and 5, a cylinder 33 is installed at the rear of the frame 6 and has a rod 33a directed upward.
Is connected to a lever 36 of a shaft 35 that is rotatably supported by a support seat 34 of the frame 6, and a pair of levers 37 fixed to both ends of the shaft 35 includes guides provided on the frame 6. Rear ends of a pair of rods 39 that can slide in the front-rear direction are connected by the portions 38, respectively. Both rods 39 are located on both sides of the vibrating plate 12, and a gripping block 40 is fixed to each front end thereof. A pair of gripping claws 41 are respectively provided on both blocks 40 so as to project toward the front, and a guide plate 42 having a recess at the tip thereof is provided so as to project.

Then, as shown in FIG. 5, when the rod 33a of the cylinder 33 in the closed state projects, both levers 36 and 37 rotate as indicated by the arrows, pushing both rods 39 forward to move the grip block 40. When the rod 33a of the cylinder 33 is closed again in the front position, both gripping blocks 40 move rearward to the rear position.

Further, the grip claw 41 is configured to be capable of gripping both ends of the jig plate 16 by switching between an open state and a closed state by a cylinder in the grip block 40.

Note that the grip block 40 is normally on standby at the rear position, and the grip claws 41 are open.

On the other hand, as shown in FIGS. 1 and 5, the conveyor 3 is composed of first and second conveyors 43 and 44, and the first conveyor 43 is installed in front of the deposition apparatus 1. The conveyor 43 is provided with a pair of chains 43a arranged in parallel, and both chains 43a are guided annularly in the coating apparatus by a large number of sprockets 45. A portion of the chain 43a in front of the attached device 1 runs vertically from the upper side to the lower side, and the same portion is used as a delivery section 46. The chain 4
3a has concave holding metal fittings 47 mounted at predetermined intervals, and the concave portions of the metal fittings 47 can hook both ends of the jig plate 16 arranged so as to bridge between both chains 43a. There is. In addition, a portion corresponding to the upper side of the first conveyor 43 of the coating apparatus is open, and the same portion is used as a work supply unit 48.

Below both chains 43a of the first conveyor 43,
A bar-shaped guide rail 49 is installed in each case, and the delivery section 46 side of the rail 49 has an arc shape along the flow of the chain 43a.

As shown in FIGS. 1 and 8, the second conveyor 44 is arranged on the lower front side of the first conveyor 43.
The rear end of 4 is located below the front end of the guide rail 49. This second conveyor 44 is also the first conveyor 43
Similarly, a pair of chains 44a arranged in parallel are provided, and all the links are fitted with holding fittings 50 having concave ends. The front end of the second conveyor 44 is a work recovery unit 51 for recovering the processed jig plate 16, and the second conveyor 4
On the front side of 4, there is an accommodating portion 52 for temporarily accommodating a jig plate that has not been recovered due to some mistake.

Sensors 53 are provided in the work collecting section 51 and the accommodating section 52, respectively, and both sensors 53 detect that the jig plate 16 is conveyed by the second conveyor 44 and reaches the respective positions. ing. And
When the sensor 53 of the work collecting unit 51 detects that the jig plate 16 reaches this position, the light 5 is detected.
4 is made to blink, and in the sensor 53 of the accommodating portion 52, a buzzer (not shown) is operated.

The heater 2 is installed between both chains 44a of the second conveyor 44, and is adapted to dry and cure the silicon resin of the hybrid IC 55 conveyed by the same conveyor 44.

Next, the case where the hybrid IC 55 is coated with the coating device configured as described above will be described.

As shown in FIG. 5, a large number of unprocessed hybrid ICs 55 are attached to the lower edge of the jig plate 16 with the terminals upward, and the operator inserts the jig plate 16 through the work supply unit 51. Holding metal fittings 50 for the first conveyor 43
Put it on top. Since the first conveyor 43 moves with the distance between the holding fittings 43 as one stroke, the worker supplies a new jig plate 16 to the conveyor 43 every time the conveyor 43 moves. When the first jig plate 16 reaches the delivery section 46 and the first conveyor 43 enters the inching stop state, as shown in FIG. 7A, both gripping blocks 40 waiting at the rear position. Is switched to the front position by the cylinder 33, and each gripping claw 4
1 is closed and both ends of the jig plate 16 are gripped.
At this time, the guide plate 42 plays a role of guiding both ends of the jig plate 16 into the grip claw 41 so that the grip claw 41 can accurately grip the jig plate 16.

On the other hand, along with this, the squeegee 30 moves from the left side to the right side, reverses, moves to the left side, and returns to the original position. When the squeegee 30 moves to the right side, the tip of the squeegee 30 contacts only the convex portion due to the drool of the silicone resin, and when the squeegee 30 moves to the left side, the tip and the curved surface of the squeegee 30 are The liquid surface of the silicone resin is brought into sliding contact to smooth the liquid surface.

Further, as shown in FIG. 7 (b), the grip block 40
While retreating by the cylinder 33, the jig plate 16 gripped is positioned by the knock pin 15a with respect to the offset plate 15 and superposed. Then, as shown in FIG. 7 (c), the grip block 40 includes the grip claws 4.
1 is opened and further retracted to return to the rear position shown in FIG.

On the other hand, the jig plate 16 is fixed to the offset plate 15 by the fixing lever 17, and at the same time, the eccentric shaft 14 is rotated by the motor 13 to vibrate the offset plate 15. The offset plate 15 descends by the cylinder 7 while vibrating, and the hybrid IC 55
Is immersed in the silicone resin in the resin tank 5. The resin bath 5 is constantly vibrated by a vibrator installed in the base 4 during the operation of the coating apparatus.

Further, the offset plate 15 rises to the upper position after a predetermined time elapses, and the hybrid IC 55 is lifted from the silicone resin. Then, as shown in FIG. 7 (c), the grip block 40 is advanced from the rear position while being guided by the guide plate 42, and the grip claw 41 is closed as shown in FIG. 7 (b). Both ends of the jig plate 16 are gripped. At the same time, the fixing lever 17 is tilted by the cylinder 23 to release the fixing of the jig plate 16, and as shown in FIG. 7 (a), the grip block 40 is further advanced to the front position and held again. Both ends of the jig plate 16 are housed in the recesses of the metal fitting 47. The jig plate 16 moves the delivery portion 46 downwards as the first conveyor 43 moves, and as shown by the phantom line in FIG. 5, the concave portion of the holding metal fitting 47 and the guide rail 49.
It is sandwiched between and and is prevented from falling, and is moved forward while being guided by the guide rail 49.

On the other hand, the squeegee 30 repeats the same operation as described above,
When the hybrid IC 55 in the silicon resin is pulled up, the unevenness formed on the surface of the resin is smoothed.

Then, as shown in FIG. 8, the jig plate 16 is dropped to the terminal end of the guide rail 49, the holding metal fitting 50 of the second conveyor 44 waiting below the guide rail 49, and while being conveyed to the conveyor 44, The silicone resin adhered to the hybrid IC 55 is dried and solidified by the heater 2.
Further, the jig plate 16 reaches the work collecting section 51 and activates the sensor 53 thereof to activate the light 54.
Instructing the operator to collect the jig plate 16 that has not been recovered yet is accommodated in the accommodating portion 52 and the sensor 53 is activated to instruct the operator to recover again with the buzzer.

Although the above description has focused on one jig plate 16, in reality, a large number of jig plates 16 are conveyed to the first and second conveyors 43 and 44 in the coating device, and The hybrid IC 55 is sequentially coated with silicon resin and dried.

As described above, according to the coating apparatus of the present embodiment including the guide plate 42, the accuracy in gripping both ends of the jig plate 16 hooked on the holding metal fittings 47 of the first conveyor 40 is surely improved. be able to.

Therefore, even if the jig plate 16 is held by the offset plate 15 by retracting and holding the grip claw 41, the position of the jig plate 16 does not vary among the jig plates 16. Therefore, in the present device, unlike the conventional device which does not have the guide plate 42, there is no inconvenience that the height of the adhered surface changes. Therefore, by using this device, it is possible to easily manufacture a high-quality product with little variation. In addition, in the coating apparatus of the present embodiment, not only the resin tank 5 accumulating the silicone resin is constantly vibrated by the vibrator in the base 4, but also the hybrid IC
Since the 55 is vibrated together with the offset plate 15 and immersed in the silicone resin, the hybrid IC 5
The bubbles generated on the surface of No. 5 can be removed by these vibrations. Furthermore, these vibrations cause silicon resin to be evenly applied to the surface of the hybrid IC 55,
It is possible to form a resin tank having a uniform thickness.

Further, in the coating apparatus of the present embodiment, since the squeegee 30 smoothens the unevenness generated on the liquid surface after the hybrid IC 55 is taken out from the resin tank 5, the uneven surface of the silicon resin adhered to the hybrid IC 55 by this unevenness. Does not vary in height.

Although the coating apparatus of this embodiment includes the motor 13 for vibrating the hybrid IC 55 and the squeegee 30 for smoothing the surface of the silicone resin, the motor 13 may be omitted or the motor 13 and the squeegee 30 may be omitted. You may embody as a coating device which omitted.

When the hybrid IC 55 is not vibrated by omitting the motor 13, the vibration of the resin tank 5 causes the hybrid IC 55 that has entered the resin liquid to come into contact with the vibrating resin liquid, so that the above-described bubble removing action is secured. In addition, when the hybrid IC 55 is taken out from the resin liquid, the thickness of the resin adhered to the surface of the IC 55 can be made uniform.

If the squeegee 30 is omitted, the resin tank 5
The vibration causes the resin liquid to flow in the tank 5 to smooth the liquid surface. However, when the viscosity of the resin is high, it takes a long time. Therefore, the squeegee 30 is preferable.

Further, in the coating apparatus of this embodiment, the silicon resin is applied to the hybrid IC 55 as the circuit board, but any circuit board may be used as long as the resin needs to be applied. The resin is not limited to the silicone resin.

〔The invention's effect〕

As described above in detail, according to the circuit board coating apparatus of the present invention, it is possible to surely improve the accuracy when gripping the circuit board on the transfer means, and thus to obtain high quality,
It also has an excellent effect that a uniform coating operation can be performed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the entire coating apparatus, FIG. 2 is a front view of the deposition apparatus, FIG. 3 is a side view showing the deposition apparatus and the delivery section of the first conveyor, and FIG. 4 is the deposition apparatus. FIG. 5 is a partial front view showing the movement of the squeegee, FIG. 5 is a partial side view showing the relationship between the gripping claws of the adherend and the holding metal fittings of the first conveyor, and FIG. 6 is a hybrid fixed to the jig plate. 7A to 7C are partial front views showing the IC, FIGS. 7A to 7C are explanatory views showing the order of delivering the jig plates from the adherend to the first conveyor by the grip claws, and FIG. It is explanatory drawing which shows the movement of a 2nd conveyor from a 1st conveyor. 4 is a base as vibration applying means, 5 is a resin tank, 7 is a cylinder as driving means, 15 is an offset plate as holding means, 16 is a jig plate as a jig member,
Reference numeral 30 is a squeegee, 40 is a transport block as a transport means, 41 is a grip claw, 42 is a guide plate as a guide member, 43 is a first conveyor as a transport means, and 55 is a hybrid IC as a circuit board.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-165789 (JP, A) JP-A-64-59924 (JP, A) JP-A-63-41031 (JP, A) Actual development Sho-63- 164222 (JP, U)

Claims (1)

[Claims] 1. A jig member (1) for fixing a circuit board (55).
6), a holding means (15) for holding the jig member (16) at the time of resin immersion, a resin tank (5) for storing a resin liquid and arranged below the holding means (15), The jig member (1) held by the holding means (15)
A driving means (7) for moving the holding means (15) and the resin tank (5) closer to and away from each other in order to immerse the circuit board (55) of 6) in the resin in the resin tank (5), and the holding means (7). 15) a gripping means (40) for advancing and retreating between the conveying means (43) and transferring the jig member (16) to the holding means (15) by opening and closing the gripping claw (41). A circuit board coating apparatus comprising: a guide member (42) for guiding a part of the jig member (16) held by the holding claw (41) into the holding claw (41). A circuit board coating apparatus, characterized in that it is provided on the gripping means (40).