JPH0650746B2 - Bonding resin surface adjustment device in resin bonding equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for adjusting a bonding resin surface in a resin bonding apparatus, and more specifically, a plurality of types of semiconductor chips having different sizes are mounted on a substrate such as a ceramic resin. The present invention relates to an improvement of a die bonding resin bonding apparatus for adjusting the height of a bonding resin surface according to the type of a semiconductor chip.

[Conventional technology]

A schematic structure of this type of resin bonding apparatus according to a conventional example is shown in FIGS.

That is, in each of these drawings, reference numeral 1 denotes a substrate on which a semiconductor chip is mounted, here, a substrate made of ceramic or the like for die-bonding a plurality of types of semiconductor chips having different sizes to each other. This is a bonding stage that can be controlled to move in the front, back, left, and right directions.

In addition, 3 is a resin for bonding such as silver epoxy, 4
Is a stamp plate which receives the bonding resin 3, 5 is a stamp table which pivotally supports the stamp plate 4, and is rotated at a predetermined speed by a rotating mechanism 5a, and 6 is extended in the horizontal direction. An intermediate lever is one pivot lever pivotably supported on the stamp base 5 and its tip end faces the stamp tray 4, and 7 is attached to the tip end of the adjust lever 6. Stamped plate 4
It is a squeegee that comes into contact with the upper surface of the bonding resin 3 inside and constantly scrapes the resin surface to a horizontal surface of an adjusted height.

Further, 8 is a height adjusting mechanism that is vertically mounted on the extension of the stamp base 5, and in this case, the height that is projected upward by the manual operation and rotation of the adjusting knob 8a. The setting pin 8b can be moved up and down. The lower end of the adjusting lever 6 is brought into contact with the upper end surface of the height setting pin 8b by the elastic force of the spring 9 to eliminate the play of the adjusting lever 6.

Further, 10 is a stamp pin having a tip shape corresponding to the chip size, 11 is a plurality of stamp pins 10 (10a, 10b) for each chip size are mounted radially at equal angular intervals, and a rotating mechanism 12 is used. Then, a rotating member 13 which can be freely rotated in correspondence with each mounting angle is provided so that the rotating member 11 can be controlled and moved in the vertical direction shown by the arrow, and the substrate 1 side and the stamp tray 4 side can be moved. The stamp head is configured to be capable of reciprocating control movement as indicated by an arrow.

In the case of this conventional configuration, however, the adjustment lever 6, the squeegee 7, and the height adjusting mechanism 8 which are made up of one set are used, and first, the adjusting knob 8a of the height adjusting mechanism 8 is operated to adjust the height. By adjusting the upper protruding height of the setting pin 8b, the horizontal position of the squeegee 7 is set to a predetermined level, and the rotating mechanism 12 of the stamp head 13 is operated to rotate the rotating member 11. Operate, select the stamp pin, here the stamp pin 10a according to the chip size at that time.

That is, by these operations, in the former case, the surface of the bonding resin 3 in the rotating stamp dish 4 is scraped by the squeegee 7, so that
The entire surface is kept corresponding to the set height position, that is, the entire surface of the bonding resin in contact with one squeegee 7 in the plate 4 is supplied while maintaining a constant thickness, In the latter case, the selected stamp pin 10a is located below.

Then, in this state, first, the stamp head 13 is controlled and driven to move the stamp head 13 up and down and to move up and down. At this time, the lower end of the stamp pin 10a selected corresponding to the chip size is placed inside the stamp plate 4. Then, the surface of the bonding resin 3 having a predetermined thickness is brought into contact with the surface of the bonding resin 3, and only a required amount of the resin 3 is attached to the tip of the pin and taken out.

Then, the stamp head 13 is moved from the stamp plate 4 side to the bonding stage 2 side and is similarly moved up and down to apply the required amount of the bonding resin 3 attached to the lower end of the stamp pin 10a to the bonding stage 2. A predetermined position on the mounted substrate 1, that is, a chip bonding position at that time is transferred and applied.

Subsequently, the stamp head 13 switches the previously selected stamp pin 10a to, for example, the stamp pin 10b corresponding to the next mounting chip size, and also moves the bonding stage 2 to the next mounting position. Then, the standby operation and the above operation are repeated in sequence, and the application operation of the resin 3 onto the substrate 1 is continuously performed for each operation.

A semiconductor chip is bonded in a separate step on the substrate 1 on which the required amount of the bonding resin 3 has been transferred and applied in this manner.

[Problems to be solved by the invention]

However, in the case of the conventional apparatus configured as described above, one set of the adjusting lever 6, the squeegee 7, and the height adjusting mechanism 8 are used, and the stamp with which the squeegee 7 makes contact Even if the surface of the bonding resin 3 in the dish 4 is always kept at a constant thickness,
Depending on the target chip size, inevitably stamp pin 10
Since the tip size and shape of the resin are different, when either of them is selected and changed, the amount of resin attached to the tip, and thus the resin transferred and applied onto the substrate 1, is caused by the viscosity of the bonding resin 3 itself. If the coating amount is too large, the resin will spread to the surface of the chip when the semiconductor chip is mounted, and if the coating amount is small, the bonding strength will be insufficient. There was a problem that it caused.

The present invention has been made in order to solve such a conventional problem, and an object thereof is to provide a stamp pin having a different tip size and shape, which are selected according to the chip size. It is an object of the present invention to provide a bonding resin surface adjusting device in a resin bonding device of this type, which is capable of constantly applying a constant amount and thickness of resin onto a substrate.

[Means for solving problems]

In order to achieve the above object, a bonding resin surface adjusting device in a resin bonding device according to the present invention comprises:
A stamp pan that receives and rotates a bonding resin for resin die-bonding multiple types of semiconductor chips of different sizes onto a substrate such as ceramics, and the stamp pan is provided with a distance from the rotary shaft in the radial direction from the rotary shaft. A plurality of squeegees that are arranged differently and set the thickness of the resin by scraping the resin surface in the stamp dish, and the required resin thickness corresponding to each type of semiconductor chip, A height adjustment mechanism that can individually adjust and set the height position of each squeegee, and the required amount corresponding to each type of semiconductor chip from each resin surface scraped by the squeegee adjusted and set by this height adjustment mechanism And a plurality of stamp pins arranged so as to be switchable and selectable.

[Work]

That is, according to the present invention, a plurality of squeegees are arranged on the stamp pan that receives and rotates the bonding resin at different radial distances from the rotary shaft. A plurality of stamp pins are arranged so that the position can be adjusted and set individually by the height adjustment mechanism, and the required amount of bonding resin can be switched and selected according to the type of semiconductor chip from each resin surface scraped by the squeegee. Since it is taken out separately by using, the bonding resin surface inside the stamp dish can be set to the resin thickness that matches the tip size and shape of each stamp pin corresponding to each type of semiconductor chip. The required amount of bonding resin can be taken out separately for each stamp pin that is selectively switched from the surface.

〔Example〕

An embodiment of an apparatus for adjusting a bonding resin surface in a resin bonding apparatus according to the present invention will be described in detail below with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing the schematic configuration of the apparatus of this embodiment, and FIG.
The figure is a cross-sectional explanatory view of the stamp plate portion of the same as above. In the apparatus of the embodiment shown in FIGS. 1 and 2, the same reference numerals as those of the apparatus of the prior art shown in FIGS. 3 and 4 represent the same or corresponding portions. .

In the apparatus of this embodiment, a plurality of sets of the adjusting levers 6, the squeegee 7, and the height adjusting mechanism 8 in the above-mentioned conventional example, and two sets of adjusting levers 15
6, the squeegee 17,18, and the height adjusting mechanism 19,20, and the combination of the springs 21,22 are used to operate the adjusting knobs 19a, 20a of the height adjusting mechanisms 19, 20 respectively to set the height. Pin 19b, 2
By adjusting the upper protruding height of 0b, each squeegee
The height positions 17 and 18 in the horizontal direction, and thus the bonding resin 3 can be set on the resin surfaces 3a and 3b having different thicknesses, respectively.

Therefore, in this embodiment, the same operation as in the above-mentioned conventional structure is performed, but in the case of this embodiment, the horizontal height position of the squeegees 17 and 18 is set to the stamp pin 10 for each set. In accordance with the tip size and shape of 10b, 10b, respectively, it is adjusted and set as predetermined, that is, for the stamp pin 10a, so as to obtain a resin surface 3a of a thickness corresponding to this, For another stamp pin 10b, to obtain a resin surface 3b having a thickness corresponding to this,
By adjusting and setting each, the following effects can be obtained.

That is, in this case, the rotating mechanism 12 of the stamp head 13 is operated to rotate the rotating member 11, and the stamp pin, which corresponds to the chip size at that time, is the stamp pin 10a.
When is selected, when the stamp head 13 is operated, the stamp pin 10a is moved onto the resin surface 3a of the corresponding thickness in the stamp pan 4 and then is operated up and down. The required amount of bonding resin 3 suitable for 10a can be taken out by adhering it to the tip portion, and when the stamp pin 10b is selected, the required amount of bonding resin 3b is also suitable for this stamp pin 10b from the resin surface 3b. The resin 3 can be taken out. In other words, the resin surfaces 3a and 3b adjusted and set to different thicknesses can be used properly as intended by the different stamp pins 10a and 10b, and as a result, In this case, a required amount of the bonding resin 3 suitable for the tip size and shape of each stamp pin 10a, 10b can be taken out and transfer-coated on a predetermined position on the substrate 1.

In the configuration of the embodiment, two sets of adjusting levers 15,16, squeegees 17,18, and height adjusting mechanisms 19,20,
In addition, the combination of springs 21 and 22 is used by arranging them in parallel with each other for convenience of adjustment operation, but if necessary, more than one multiple sets may be combined and used. Also, it is needless to say that similar arrangements and effects can be obtained even if the sets are not necessarily arranged in parallel.

〔The invention's effect〕

As described in detail above, according to the present invention, a plurality of squeegees are arranged on a stamp plate that receives and rotates a bonding resin, at different radial distances from the rotation axis. The height position of each squeegee is individually adjusted and set by the height adjustment mechanism, and the required amount of bonding resin is switched and selected from each resin surface scraped by the squeegee according to each type of semiconductor chip. Since the stamp pins are taken out separately by multiple stamp pins, the height position of the squeegee can be adjusted individually, and the bonding resin surface in the stamp tray can be adjusted to the tip size and shape of each stamp pin. It can be set to a different thickness, and also, the resin surface of each of these different thicknesses is properly used for each stamp pin that is selectively switched, Since the required amount of bonding resin can be taken out separately from the resin surface by each of these stamp pins, as a result, the bonding resin can be transferred and applied on the substrate in proper amount and the constitution is It has excellent features such as being relatively simple and easy to implement.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a resin bonding apparatus to which an embodiment of a bonding resin surface adjusting apparatus according to the present invention is applied, and FIG. 2 is a sectional explanatory view of a stamp plate portion of the same, and a third embodiment. FIG. 4 is a perspective view showing a schematic configuration of the same resin bonding device as the conventional device, and FIG. 4 is a cross-sectional explanatory view of the stamp plate portion of the same. 1 ... Substrate, 2 ... Bonding stage, 3 ... Bonding resin, 3a, 3b ... Resin surface (resin surface with different thickness), 4 ... Stamp plate, 5 ... Stamp base, 5a ...
Rotating mechanism, 10, (10a, 10b) …… Stamp pin, 11 …… Rotating member, 12 …… Rotating mechanism, 13 …… Stamp head, 15,16
...... Adjustment lever, 17,18 ...... Squeegee, 19,20 ...... Height adjustment mechanism, 19a, 20a ...... Adjustment knob, 19b, 20b ...... Height setting pin.

Claims (1)

[Claims] 1. A stamp plate which receives and rotates a bonding resin for resin die-bonding a plurality of types of semiconductor chips of different sizes onto a substrate such as ceramics, and a stamp plate which is rotated in the radial direction from the rotation axis of the stamp plate. A plurality of squeegees arranged at different distances from the axis to set the resin thickness by scraping the resin surface in the stamp dish, and the required resin thickness corresponding to each type of the semiconductor chip. The height adjustment mechanism capable of individually adjusting and setting the height position of the squeegee, and the type of the semiconductor chip from each resin surface scraped by the squeegee adjusted and set by the height adjustment mechanism. A resin bonder equipped with a plurality of stamping pins arranged so that a required amount of bonding resin can be separately taken out corresponding to each of them and switched and selected. Adjustment apparatus of the bonding resin surface in ring device.