JPH06338671A - Manufacture of printed board - Google Patents

Abstract

PURPOSE:To enable blank layout effectively without generating slugs. CONSTITUTION:In a punching method wherein a printed board 1 having a part of the same external form as the adjacent wiring board is punched from a printed board material member 2, blank layout is performed in the manner in which contours of parts 1a,...1a where the external forms of adjacent printed boards 1,...1 coincide with each other become common, and different form parts 1b,...1b where the external forms do not coincide with each other are previously cut out by press working or cutting-off working. Then the parts 1a,...1a where the external forms coincide with each other are continuously cut and separated over a plurality of printed boards 1,...1. Thereby slugs 6 are generated only in the different form parts 1b, so that useless material is reduced, manufacturing cost is lowered, and manufacture is enabled by using simple tools.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board manufacturing method. More specifically, the present invention provides a method for punching a large number of printed circuit boards from a large-sized printed circuit board material, in which a printed circuit board having a portion whose outer shape matches with an adjacent printed circuit board, particularly on a flexible base film. The present invention relates to an improvement in planing in a method for manufacturing a flexible printed circuit board (FPC) having a copper foil pattern.

[0002]

2. Description of the Related Art Conventionally, a small printed circuit board is, for example,
One large printed circuit board material 10 as shown in FIG.
, 101 are laid out so that a large number of printed circuit boards 101, ..., 101 are provided with clearances C ₁ , C ₂ , C ₃ as appropriate so that they are punched out.

According to this conventional manufacturing method, a printed circuit board material 102 in which a large number of copper foil patterns (wiring circuits) are formed on a single strip-shaped base film is to be manufactured. A printed circuit board having a substantially rectangular outer shape is formed by punching with a punch of a punch having a contour cutting line in which a substantially square outer shape portion 101a of 101 and a non-rectangular shape portion 101b are continuous, and a die. 101 is manufactured.

[0004]

However, in such a conventional method of manufacturing a printed circuit board, since the press is performed by the mold, the intervals C _{1 to} C for punching are provided around the printed circuit board 101 to some extent. ₃ must be secured, and a large area of punch residue 103 remains on the printed board material 102. Therefore, there is a problem that the material removal from the printed circuit board material 102 is inefficient and the material is wasted.

Further, since it is a full-form press punching process, there is a problem that a tool having a complicated shape corresponding to the contour shape of the printed circuit board is required.

It is an object of the present invention to provide a method for manufacturing a printed circuit board, which is efficient and efficient for removing a board from a printed circuit board material and does not require a tool having a complicated shape.

[0007]

In order to solve such an object, the present invention is a method of punching a large number of printed circuit boards from a printed circuit board material so that adjacent printed circuit boards have common portions where the contours match. Then, the irregularly shaped portions that do not match are cut in advance by press working or cut-off processing, and then the matching or common outer shape portions are cut and separated.

[0008]

Therefore, the plurality of cut printed boards are separated without any scraps between them.
Then, if the contour of the irregularly shaped portion that does not match the shape is cut off by the cut-off processing or the press processing prior to that, the common contour portion is cut and the cutting line and the irregularly shaped portion that pass through the common contour portion at the same time. The printed circuit board material between the cut and the contour along the contour becomes a scrap and is separated from the printed circuit board.

[0009]

EXAMPLES A method of manufacturing a printed circuit board according to the present invention will be described below with reference to the examples shown in FIGS. In addition, in this embodiment, F based on a flexible resin film as a base material
The method of the present invention is applied to a PC.

First, the printed circuit board material 1 will be described. As shown in FIG. 3C, the FPC as the printed circuit board material 2 is formed by forming a conductor pattern 9 with a copper foil 2a or the like on a base film 2b made of a polyimide resin or the like. For example, a pattern resist is printed on the copper foil 2a on the base film 2b having the structure shown in FIG.
The desired conductor pattern 9 is formed. Then, a reinforcing plate 10 made of polyethylene resin or the like is adhered to the back surface side of the base film 2b, if necessary. In this way, the printed board 1 is obtained from the printed board material 2 in which a large number of conductor patterns 9 are formed on one base film 2b as follows.

1 and 2 show a first embodiment of a method of manufacturing a printed circuit board according to the present invention.

In this embodiment, irregularly shaped portions where the shapes of adjacent printed circuit boards do not match each other are cut in advance by a cut-off process. First, as shown in FIG. 1, plate cutting is set on the printed circuit board material 2 so that the portions of the adjacent printed circuit boards 1 having the same shape, that is, the rectangular portions 1a in the embodiment have the same outline.

Then, the rectangular portion 1a and the rectangular portion 1a of the adjacent printed circuit boards 1, ..., 1 on the printed circuit board material 2 are adjacent to each other.
Deformed portion 1 whose shape does not match the contact point of 1 and the rectangular portion 1a
At the corner where the contact point with b is located, holes 3, ...
3 is punched with a press or the like. This interference prevention hole 3,
, 3 are for preventing interference when cutting the outer shapes of the adjacent printed circuit boards 1 ,.

Subsequently, the irregularly shaped portion 1b of the printed circuit board 1 located between the interference preventing holes 3, ..., 3 is cut off. For example, as shown in FIG. 2, this parting process is performed by the printed board material 2 mounted on the die 7.
It is performed so that the cutting edge 8 having a knife edge is abutted on the. The punching of the holes 3 for preventing interference may be performed after the cut-off process.

After that, a plurality of adjoined planed printed circuit boards 1, ..., 1 have a rectangular outer shape portion 1a ,.
The printed circuit board material 2 is continuously cut along a strip-shaped cutting line 5, ..., 5 passing through with a rotary round blade or the like to cut out a large number of printed circuit boards 1 ,.
At this time, the printed circuit board material between the rectangular cutting lines 5, ..., 5 passing through the substantially rectangular outer shape parts 1a ,. ..., separated from 1 and each printed circuit board 1,
..., 1 are also separated from each other. In this cutting, the punching-off blade, the rotary round blade, etc. pass through the punched interference prevention hole 3 as it is.

According to such an embodiment, since the rectangular portions 1a, ..., 1a of the adjacent printed circuit boards 1 ,.
No other scrap 6 is formed between the rectangular outer shape portions 1a, and another printed circuit board 1 adjacent to the irregular shape portion 1b is formed.
The scraps 6 are generated only between the rectangular outer shape portion 1a. Therefore, scraps can be reduced, and material removal from the printed circuit board material 2 becomes efficient. Further, since the scraps to be cut out together with the printed circuit board 1 become a band in a bug-eaten state and do not remain on the printed circuit board material 2 side, and all are separated into a chip shape, the post-processing of the scraps is performed. Will be easier.

Further, according to such an embodiment, the square portion 1 is different from the conventional die stamping process using a press.
A tool having a complicated cutting line composed of a and the irregularly shaped portion 1b is unnecessary, and a simple tool can be used for processing.

Further, the manufacturing cost can be reduced because the efficiency of material removal is improved, the post-processing of the scraps is facilitated, and complicated die production is not required.

FIG. 4 shows a second embodiment. In this embodiment, the irregularly shaped portion 1b is formed by the contour of a hole punched out in advance by press working.

According to this embodiment, printed circuit board material 2
Small holes 11 used for mounting elements on the conductor pattern 9 of
..., when punching 11 with a press or the like, each printed circuit board 1,
The irregular shaped portions 1b of 1 are punched at the same time by press working. At this time, in order to prevent the separation failure due to the deviation between the punching of the irregularly shaped portion 1b by the press working and the rectangular cutout of the rectangular portion 1a, the rectangular cut 5 passing through the rectangular outer shape portion 1a of the printed circuit board 1 is used. Punching to obtain the contour of the irregularly shaped portion 1b is performed by forming a hole 12 that bites into the side of another printed circuit board that is slightly adjacent.

Thereafter, similar to the first embodiment, the rectangular portions 1a, ..., Of a number of adjacent printed circuit boards 1 ,.
A strip-shaped cut line passing through 1a (shown by a chain line in FIG. 4) 5
1. The printed circuit board material 2 is cut along or is continuously cut by a rotary round blade or the like, and a large number of printed circuit boards 1, ..., 1 are sequentially cut into strips.

It should be noted that the board cutting of the printed circuit board 1 in this embodiment is carried out so that the printed circuit boards 1, ..., 1 are upside down every other row in the longitudinal direction of the printed circuit board material 2 (horizontal direction in the drawing). , Punching holes 12, 12 for forming the differently shaped portions 1b of the left and right printed circuit boards 1, 1 are provided so as to be punched at a time. Further, in this case, it is possible to prevent the punching of the printed circuit board 1 from interfering with another adjacent printed circuit board 1.

In the case of this embodiment, since the step / work of cutting the irregularly shaped portion 1b in advance is carried out at the same time as the work of punching the small hole 11 for mounting the electronic component or the like on the conductor pattern 9, it is substantially effective. It does not increase the number of processes.

A third embodiment is shown in FIGS. 5 and 6. In this embodiment, the punched holes 12 for forming the contour of the irregularly shaped portion 1b are set so as not to bite into another adjacent printed circuit board 1. The conductor pattern 9 is omitted in this drawing.

For example, as shown in FIG. 5, the irregular shaped portion 1
In the vicinity 13 where the contour of b and the rectangular outer shape portion 1a intersect, the punching hole 12 bites into the adjacent printed circuit board 1 side, but in the other portion, the position is drawn inward from the strip-shaped cutting line 5. It is provided so that the punched hole 12 has an edge.

In the case shown in FIG. 6, the punched hole 1
After 2 is completely formed inside the cutting line 5, or before that, holes 3 for preventing interference are provided in the vicinity 13 where the contour of the irregular shape portion 1b and the rectangular outer shape portion 1a intersect. There is. In this case, the printed circuit board material 2 between the punched hole 12 and the cutting line 5 is separated as a cutting scrap when the printed circuit boards 1, ..., 1 are cut out along the cutting line 5.

In the above embodiment, the printed circuit board having a rectangular shape is described, but the present invention is not limited to the rectangular shape, and it suffices that there is at least a part where the shapes match. .

[0028]

As is apparent from the above description, according to the method of manufacturing a printed circuit board of the present invention, the adjacent printed circuit boards are cut so that the contours of the portions where the contour shapes match each other are common, and the contour shapes match. After cutting the irregular shape part by pressing or cut-off processing in advance, the outer shape part that matches the shape is cut and separated, so only a scrap is generated in the irregular shape part,
The amount of scraps is greatly reduced, the efficiency of material removal is improved, there is no waste, and the manufacturing cost is reduced.

Further, since the scraps formed together with the printed circuit board have a chip shape, post-processing of the scraps is facilitated.

Further, according to the manufacturing method of the present invention, it is not necessary to use a tool of a full shape, a tool having a simple shape is sufficient, and a large number can be simultaneously processed.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a planing of a first embodiment of a method for manufacturing a printed circuit board according to the present invention, in which (A) is a plan view,
(B) is a plan view of the separated printed circuit board, and (C) is a plan view of a scrap.

FIG. 2 is an explanatory diagram of cut-off processing.

FIG. 3 is a diagram illustrating a manufacturing process of a printed circuit board material (FPC), in which (A) is a cross-sectional view before forming a conductor pattern;
(B) is a plan view of the FPC after the conductor pattern is formed, (C)
FIG. 4 is a cross-sectional view of an FPC to which a reinforcing plate is attached.

4A and 4B are views for explaining a planing according to a second embodiment of the present invention, FIG. 4A is a plan view, and FIG. 4B is a plan view of a separated printed circuit board.

5A and 5B are views for explaining a planing according to a third embodiment of the present invention, FIG. 5A is a plan view, and FIG. 5B is a plan view of a separated printed circuit board.

FIG. 6 is a plan view showing a modification example of the embodiment of FIG.

7A and 7B are views for explaining plate cutting by a conventional method for processing a printed circuit board, FIG. 7A is a plan view, and FIG. 7B is a plan view of a punched printed circuit board.

[Explanation of symbols]

1 printed circuit board 1a square outer shape portion 1b irregular shaped portion 2 printed circuit board material 4 cut of irregular shaped portion pre-filled by cut-off processing 5 strip-shaped cutting line passing through the rectangular outer shape portion 6 punched waste 12 stamped beforehand by press working A punched hole in the removed irregular shape

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[Procedure amendment]

[Submission date] February 8, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

According to this conventional manufacturing method, a large number of copper foil patterns are formed on a single strip-shaped base film.
Against the printed circuit board material 102 forming the down (wiring circuit) with a cutting line of the contour shape of a generally rectangular outer shape portion 101a and the irregularly shaped portion 101b except the square is continuously printed circuit board 101 to be manufactured The printed board 101 having a substantially rectangular outer shape is manufactured by punching with a press of a die including a punch and a die.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

Further, according to the production method of the present invention may be used total mold tool, but it is also possible to process a large number simultaneously with a tool having a simple shape without the use of it.

[Procedure 3]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

Claims (1)

[Claims] 1. In a method of punching a large number of printed circuit boards from a printed circuit board material, the adjacent printed circuit boards are plate-cut so that the contours of the portions having the same outer shape are common, and the irregularly shaped portions which do not have the same outer shape are previously formed. A method for manufacturing a printed circuit board, which comprises cutting by press processing or cut-off processing, and then cutting and separating a portion having the same outer shape.