JPH0646525B2 - Manufacturing method of electronic material ceramics - Google Patents

Description

The present invention relates to a method for producing an electronic material ceramic that can be used as a porcelain capacitor or a porcelain substrate having such a capacitor built therein.

[Prior Art] Conventionally, an electronic circuit substrate is configured to include only a conductor circuit, a conductor circuit and a resistor, or a conductor circuit and a resistor and a limited range of capacitors, and other functional parts are separated as elements. And then mounted on the substrate.

That is, for example, in the conventional porcelain substrate, the substrate having the conductor and the resistor built therein is the center, and the capacitor is mounted by soldering as a chip component or the like. Therefore, there is a limit to downsizing the electronic circuit. One example is shown in FIG. 61 is a porcelain substrate, 62 is a conductor circuit, 63 is a resistor,
64 is a chip capacitor.

For example, regarding a dielectric ceramic obtained by converting a semiconductor ceramic into a dielectric, an attempt has recently been made to incorporate a plurality of capacitors in the substrate by changing the dielectric constant in the same ceramic substrate. . That is, as shown in FIG. 11, portions 71 and 73 having a high dielectric constant ε ₁ and a low dielectric constant ε ₂
This is an attempt to form a plurality of capacitors on the same substrate by separating the parts 72 of FIG. However, conventionally, it is very difficult to form different dielectric parts in the same substrate, and it is obvious that, for example, considering the complexity of manufacturing a monolithic ceramic capacitor, a substrate containing a plurality of capacitors Is currently not realized or put into practical use. It is also an important technical problem to keep the high-dielectric-constant portions 71 and 73 sufficiently separated from each other as device functional portions so that they do not affect each other in the limited structure space. Was becoming.

[Object and Summary of Invention]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the conventional problems and to provide a method for producing an electronic material ceramic capable of defining a dielectric as a functional part in a sufficiently separated state.

The above-mentioned object is to form a communicating hole in a molded body containing a dielectric or a precursor thereof, and to form a portion having a different dielectric constant by filling the communicating hole with a substance having a different dielectric constant from that of the molded body. This is achieved by the method for producing an electronic material ceramic according to the present invention.

[Specific Description and Examples of Invention]

In the present invention, the above-mentioned molded article refers to, for example, a green compact (a powdered solid of a raw material such as a metal oxide), a fired body or a sintered body (porcelain, etc.), and the electronic material of the present invention. A dielectric that constitutes ceramics or a precursor for forming a dielectric (for example, the above-mentioned powdered solid or a solid composed of semiconductor porcelain or semiconductor particles obtained by primary firing when synthesizing a high dielectric). Etc.) are included.

A feature of the method of the present invention is to form a communication hole in the molded body, fill the communication hole with a substance having a different dielectric constant, and form a portion having a different dielectric constant through a process such as firing, if necessary. It is in. Therefore, by providing a single or a plurality of communication holes in the molded body, for example, by filling a low dielectric constant material,
It is possible to separate two or more portions to be made to have a high dielectric constant around the void to define two or more high-dielectric portions separated from each other.

The communicating hole means a communicating hole having openings in different surface layer portions of the molded product, and the shape of the hole is appropriately selected as desired. For example, columnar holes or the like having openings on both main surfaces of the plate-shaped molded body can be exemplified.

As one example, a porcelain substrate composed of a grain boundary insulating type high dielectric material is usually made of, for example, BaTiO ₃ , SrTiO ₃ , M.
gTiO ₃ , (Ba, Sr) (Ti, Sn) O ₃ composite oxide (including solid solution), (Ba, Sr) TiO ₃ composite oxide (including solid solution), (Mg, Sr, Ca) Ti
O ₃ -based complex oxide (including solid solution), (Sr, Pb) T
iO ₃ -based complex oxide (including solid solution), (SrCa) T
iO ₃ -based composite oxide (including solid solution), Fe ₂ O ₃ , Z
In addition to La, Dy, Nd, Y, Nb, Ta, Er, Gd, H as a component necessary for forming a semiconductor in a dielectric component such as nO.
After adding and mixing oxides such as o and Ce, a powder compact is obtained and is primarily fired to be a semiconductor, and then a metal or metal oxide (eg Cu, CuO, Mn) is formed on the surface of the fired body.
O ₂ , Tl ₂ O ₃ , PbO, P ₂ O ₅ , Bi ₂ O ₃ , N
b ₂ O, ZnO, etc.) and then subjected to secondary firing to form a grain boundary insulating layer. When carrying out the present invention in this example, first, the desired compacted body, a fired body after primary firing, a fired body in which a metal or a metal oxide is applied to the surface, or a fired body after secondary firing is desired. A communication hole having a desired shape is provided in the area. The number of communication holes is appropriately determined according to the number of dielectrics to be defined. The following method may be mentioned as a method of providing the communication hole.

Molded body before primary firing ○ Molding using core, ○ Punching, ○ Laser processing, Molded body after primary firing (semiconductor porcelain) ○ Sandblasting, ○ Ultrasonic machining, ○ Electric discharge machining, ○ Grinding (diamond tool etc.), ○ Etching (Lead resist, hydrofluoric acid treatment) Formed after secondary firing (dielectric porcelain) ○ Sand blasting, ○ Laser processing, ○ Ultrasonic processing, ○ Grinding ○ Etching Then, in the communication holes provided in this way, For example, after filling a material with a low dielectric constant and then performing a step for obtaining a porcelain substrate or a third firing that is performed as necessary,
A porcelain substrate having a plurality of high-dielectric portions defined is obtained. The high permittivity portions defined may have the same or different dielectric constants. Examples of the method of making the different materials include a method of changing the type of coating additive. Incidentally, as the low dielectric constant material used to obtain the porcelain substrate in this example, the melting point is often low is still further than ceramic body, for example _{PbSiO 3, BSiO 3, LiSiO 3} ,
Various crystallized glasses are suitable.

Alternatively, as the substance to be filled in the communication holes, it is possible to select powders in which the types and amounts of the above-mentioned dielectric components and components necessary for semiconductor formation are appropriately changed to make the dielectric constants different.

A plurality of capacitors can be built in the thus obtained porcelain substrate by providing conductor portions (electrodes, lead portions, etc.) on the surface of each high dielectric portion. Furthermore, a conductor portion, a resistor or an insulator portion (for example, formed by an ordinary thin film or thick film forming method) is formed inside or around the porcelain substrate to provide many functional portions. It can be a substrate.

Hereinafter, the present invention will be described in more detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

Embodiment 1 FIG. 1 shows a manufacturing process of a porcelain substrate which is an embodiment of the present invention. In this example, as shown in FIG. 2 (a), the communicating hole 2 was formed in the molded body 1 during press molding. Next, in the same process as when manufacturing a normal porcelain capacitor, BaT
iO ₃ -Dy ₂ O ₃ -SiO ₂ based dielectric ceramic was formed. That is, the molded body is subjected to primary firing in a predetermined atmosphere, then an additive such as CuO is applied, and secondarily fired in an oxidizing atmosphere to obtain a dielectric ceramic substrate. After filling the communicating holes of the dielectric ceramic substrate with, for example, PbSiO ₃ powder 3 as shown in FIG. 2 (b), the third firing (9
00 ° C., 60 minutes). Further, a C, R built-in substrate was obtained by forming predetermined conductor portions, resistor portions, and insulator portions on the porcelain substrate.

Embodiment 2 FIG. 3 shows another manufacturing process of a porcelain substrate which is an embodiment of the present invention. In this example, a molded body 21 having a desired shape was obtained by molding (Fig. 4 (a)), and a communication hole 23 was formed by laser irradiation in a porcelain substrate 22 which was made into a semiconductor by primary firing (Fig. 4 (b)). )). Next, an additive was applied and secondary firing was performed to obtain a dielectric ceramic substrate. The communicating holes of the porcelain substrate were filled with, for example, PbSiO ₃ powder 24 as shown in FIG. 4 (c). Next, tertiary firing is performed. Further, a C, R built-in substrate was obtained by forming predetermined conductor portions, resistor portions, and insulator portions on this substrate.

Embodiment 3 FIG. 5 shows another manufacturing process of a porcelain substrate which is an embodiment of the present invention. In this example, a molded body 31 having a desired shape is obtained by molding (FIG. 6A), an additive is applied to the porcelain substrate semiconductorized by primary firing, and then secondary firing is performed to perform the dielectric porcelain substrate 32. Got A communication hole 33 is formed in this porcelain substrate by machining using a diamond tool (6th
(B)), for example, PbSiO ₃ powder 3 in its communication hole
4 was filled as shown in FIG. 6 (c). Next, third firing was performed. By forming a predetermined conductor portion, resistor portion, and insulator portion on the substrate, a C / R built-in substrate can be obtained.

Embodiment 4 FIG. 7 shows another manufacturing process of a porcelain substrate which is an embodiment of the present invention. In this embodiment, the communication holes 42,
A molded body 41 having 42 was obtained (FIG. 8 (a)). The communication holes 42, 42 are formed, for example, by placing a metal core in a mold and filling the raw material. The same material as in Example 1 was filled in the filling portion of the molded body, and Ba was filled in the communication hole.
TiO ₃ —MgTiO ₃ —Dy ₂ O ₃ —SiO ₂ system (B
The composition ratio of ATiO ₃ and MgTiO ₃ (weight) 70: 3
0 mg), and then primary firing (1400 ° C.,
4 _{hours, N 2: H 2 = 95} : 5 in the gas atmosphere) by a semiconductor of the addition agent _(MnO 2 250 mg) coated after secondary firing (1300 ° C., the dielectric ceramic substrate subjected to 2 hours) (Figure 8 ( b)) was obtained. A predetermined conductor portion on the substrate,
By forming the resistor part and the insulator part, C,
An R built-in substrate can be obtained.

Incidentally, FIG. 9 shows an example of the porcelain substrate of the present invention obtained by the steps as shown in the above embodiment. 9 (a) and 9 (b) are a plan view and a sectional view, respectively, of the porcelain substrate, in which 51 is a high dielectric portion and 52 is a low dielectric portion.
Further, FIG. 9 (c) shows a conductor portion 53 and a resistor portion 5 as well.
4 and a porcelain substrate on which an insulator part 55 is formed.

〔The invention's effect〕

According to the method for producing an electronic material ceramic of the present invention, it is possible to produce an electronic material ceramic capable of defining a plurality of dielectric materials having different dielectric constants. Therefore, the electronic circuit substrate of the present invention configured by using this electronic material ceramic can contain a plurality of capacitors of various capacities, and various functional parts such as conductors, resistors and insulators can be incorporated in the substrate. By forming it, it becomes a substrate for electronic circuits, which has many functional parts and is small in size and inexpensive. Further, in this way, the degree of freedom in designing capacitors, resistors, etc. in the substrate can be greatly improved.

[Brief description of drawings]

FIG. 1 is a process explanatory view for explaining a manufacturing process of a porcelain substrate which is an embodiment of the present invention, and FIG. 2 (a) is a cross section of a press-formed body in which a communication hole is formed at this time. Figure,
(B) shows a cross-sectional view of a porcelain substrate having communication holes filled with substances having different dielectric constants. FIG. 3 is a process explanatory view for explaining another manufacturing process of the porcelain substrate which is one embodiment of the present invention, and FIG. 4 (a) is a molded body at this time,
(B) is a sectional view of a semiconductor porcelain substrate having communication holes formed therein, and (c) is a porcelain substrate having communication holes filled with substances having different dielectric constants. FIG. 5 is a process explanatory view for explaining still another manufacturing process of the porcelain substrate which is one embodiment of the present invention. FIG. 6A is a molded product at this time, and FIG. A dielectric ceramic substrate having communication holes formed therein, and (c) is a cross-sectional view of each of the dielectric ceramic substrates having communication holes filled with substances having different dielectric constants. FIG. 7 is a process explanatory view for explaining still another manufacturing process of the porcelain substrate which is one embodiment of the present invention, and FIG. 8 (a) is a molded body at this time, b) shows respective sectional views of the dielectric ceramics. 9A is a plan view of a porcelain substrate which is one embodiment of the present invention, FIG. 9B is a sectional view taken along line AA in FIG. 9A, and FIG.
FIG. 4 is a cross-sectional view of a porcelain substrate with built-in R and C in which functional parts such as conductors, resistors, and insulators are further formed on this porcelain substrate. FIG. 10 is a sectional view of a conventional porcelain substrate. FIG. 11 is a cross-sectional view of a porcelain substrate having a plurality of high-dielectric-constant portions according to a conventionally attempted method. 1, 21, 31 ... molded body, 2, 23, 32, 41 ... dielectric porcelain, 3, 24, 33, 42 ... low dielectric constant material, 22 ... semiconductor porcelain, 43 ... conductor, 44 ... … Resistors, 45… Insulators.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location H05K 1/03 B 7011-4E

Claims (2)

[Claims] 1. A communicating hole is formed in a molded body containing a dielectric or a precursor thereof, and a substance having a different dielectric constant from that of the molded body is filled in the communicating hole to form a portion having a different dielectric constant. A method for producing an electronic material ceramic, characterized by: 2. The high dielectric portion around the communication hole is separated from each other by filling the communication hole with a substance having a low dielectric constant to reduce the dielectric constant. Electronic material manufacturing method of ceramics.