JPH0657870B2 - Equipment for preventing evaporation from adhering to non-evaporated surfaces in physical vapor deposition equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a physical vapor deposition treatment (hereinafter referred to as PVD) on one surface of a strip.
That is, the present invention relates to a device for preventing deposition of evaporative substances on a non-evaporated surface of a band-shaped material and for advantageously collecting ineffective evaporative substances.

PVD includes a vacuum deposition method, a sputtering method, an ion plating method, and the like, and all belong to a dry process for forming a film.

(Prior Art) Among PVD, for example, in vacuum vapor deposition, basically, a vapor deposition chamber for performing vapor deposition, an exhaust device for maintaining a vacuum inside thereof, an evaporation source for containing a substance to be vapor deposited, and vapor deposition It is generally performed using a heating device for heating and evaporating a substance.

By the way, when vacuum-depositing a strip continuously, an industrially or economically important issue is how much the substance to be vapor-deposited (hereinafter referred to as “evaporate”) can be deposited on the strip. is there.

When vapor deposition is applied to the surface of the band-shaped material, the vaporized material also wraps around on the non-deposited surface side of the back surface and mainly adheres to the edge of the band-shaped material, forming an unnecessary partial coating film on the back surface. If the quality is adversely affected, or if the back surface is subsequently vapor-deposited, the film thickness on the back surface becomes uneven.

On the other hand, ineffective vapor that does not contribute to film formation may also be dispersed in the vapor deposition chamber, and this ineffective vapor may be deposited in the evaporation chamber. It takes a lot of effort to remove the accumulated evaporation material, and in an extreme case, it also adversely affects the operation of a driving part (for example, a belt-shaped material conveying device) in the deposition chamber.

Therefore, for the purpose of improving the vapor deposition efficiency, techniques for improving the shape of the evaporation source, the relative position between the vaporized material and the material to be treated, or introducing a shield in the vapor deposition chamber have been proposed.

However, for example, if the evaporation source is installed at an extremely short distance with respect to the material to be processed having a large vapor deposition area, the vapor deposition efficiency is increased, but the uniformity of the coating, which is the most important characteristic during vapor deposition, is impaired. As described above, since there is an appropriate relative position between the vaporized material and the material to be treated to obtain a desired coating property, it is generally impossible to freely change their arrangement.

As one of the solutions to this problem, Japanese Patent Laid-Open No. 57-158379 discloses a technique of providing a shield in the tank to prevent the evaporated material from scattering in unnecessary directions such as the wall of the vacuum tank. is there.

There is also a method disclosed in JP-A-58-133375, in which a vapor deposition efficiency is increased by providing a guide that comes into contact with a material to be processed.

However, neither document describes the prevention of the entrainment of evaporative substances on the non-evaporated surface and the automatic effective recovery of ineffective evaporative substances.

(Problems to be solved by the invention) Therefore, it is an object of the present invention to provide an apparatus capable of preventing deposition of vaporized substances on a non-vapor-deposited surface during vapor deposition of strips and also collecting ineffective vaporized substances. It is the purpose of the invention.

(Means for Solving the Problems) The present invention relates to a physical vapor deposition treatment facility for continuously forming evaporation material on the surface of a belt-like material introduced into a vapor deposition chamber, wherein at least the evaporation material of the belt-like material is provided. Because of the formation area,
An endless belt that is sufficiently wider than the band-like material that moves in close contact with the back surface of the band-shaped material and substantially covers all the evaporation area of the vaporized material, and collects the vaporized material adhering to the front and back surfaces of the endless belt. It is a device for preventing evaporation from adhering to a non-deposited surface in a physical vapor deposition equipment equipped with a scraper.

Now, the back surface adhesion preventing device according to the present invention is shown in FIGS.

In the figure, 1 is a vapor deposition chamber, and 2 is an evaporation source provided on the inner bottom portion of the vapor deposition chamber 1, in which vaporized substances such as Ti and Al are contained. The vaporized substance is vaporized by a heating device such as an electron beam gun or a high frequency heating device (not shown), and continuously coats the surface 3a of the strip 3 such as a silicon steel plate.

Reference numeral 4 denotes an endless belt for preventing the evaporation of substances from adhering to the back surface of the strip 3, which is wound around a plurality of rotatable auxiliary rolls 5a, 5b and 5c in an endless manner. Furthermore, the endless belt 4 closely moves at least in the formation area of the strip 3 and moves together with the strip 3. Therefore, when the strip 3 moves in the direction of arrow A, the endless belt 4 moves in the direction of arrow B. As shown in FIG. 2, the endless belt 4 has a width sufficiently wider than that of the belt-shaped material 3 so as to cover substantially all the evaporation area of the evaporated material.

Further, 6a and 6b are scrapers provided in contact with the front and back surfaces of the endless belt 4, and 7a and 7b are recovery boxes for evaporated materials scraped off by the scrapers. 8a and 8b are screws, and by adjusting them, the bending of the endless belt 4 is absorbed.

(Operation) As described above, when the surface of the strip 3 is subjected to the vapor deposition treatment, the endless belt 4 is closely moved on the back surface of the strip 3 so as to have a width sufficiently wider than that of the strip 3. Since the endless belt 4 is used so as to cover substantially all the evaporation area of the evaporation material, the evaporation material from the evaporation source 2 goes around to the back surface of the band-shaped material 3 and the ineffective vapor enters the evaporation chamber 1. It can be dispersed and prevented from being deposited in the evaporation chamber.

Further, even if a small amount of the evaporated material may go around to the back surface of the band-shaped material 3, the evaporated material adheres to the endless belt 4 because the endless belt 4 is in close contact with the back surface.

Then, the evaporated substances attached to the front and back surfaces of the endless belt 4 are scraped by the scrapers 6a and 6b and collected in the collection boxes 7a and 7b.

(Example) After finish annealing of a unidirectional silicon steel sheet (thickness of 0.23 mm), a coil (about 7.5 tons) obtained by removing the annealing separating agent on the surface of the steel sheet and passing the coil through a vacuum deposition treatment facility, a line speed of 30 m / min
When a TiN tension film with a thickness of 0.6 μm was formed on the surface of the steel sheet by using the evaporation deposit prevention device shown in FIGS. 1 and 2, TiN was not deposited on the back surface of the steel sheet. I couldn't find it.

(Effects of the Invention) According to the present invention, when vapor deposition treatment is performed on one surface of a band-shaped material, it is possible to prevent the evaporation material from advancing and adhering to the non-vapor deposition surface on the back surface.
In addition, ineffective vapor can be advantageously recovered, and in the case where both sides of the strip are continuously vapor-deposited one by one, in the case of vapor-side vapor deposition processing, the width-direction coating thickness due to the wraparound adhesion of the vaporized material to the back surface Can be made uniform.

[Brief description of drawings]

 FIG. 1 is an explanatory view of an evaporation deposit preventing device according to the present invention. FIG. 2 is a view taken along the line II-II in FIG. DESCRIPTION OF SYMBOLS 1 ... Vapor deposition chamber, 2 ... Evaporation source 3 ... Band, 4 ... Endless belt 5 ... Scraper, 6 ... Recovery box 7a, 7b, 7c ... Auxiliary roll

Claims (1)

[Claims] 1. A physical vapor deposition treatment facility for continuously forming evaporation material on a surface of a belt-shaped material introduced into a vapor deposition chamber, wherein the belt-shaped material is at least at an evaporation-material forming region. The endless belt, which is sufficiently wider than the belt-like material that moves closely to the back surface and covers substantially all the evaporation area of the evaporation material, and the scraper for collecting the evaporation material adhering to the front and back surfaces of the endless belt are provided. Equipment for preventing evaporation from sticking to non-evaporated surfaces in physical vapor deposition equipment.