JPH0691138B2 - Jig for inspection device of integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] In order to perform an intermediate inspection of a wafer of a high-density integrated circuit, the present invention brings a conductive pattern into contact with a conductive pattern of the wafer, Depending on the connected inspection machine,
The present invention relates to an integrated circuit inspection device jig for inspecting a wafer of this integrated circuit.

[Conventional technology]

Conventionally, in an inspection device used for intermediate inspection of a wafer of an integrated circuit, a probe card provided with a pin called a probe needle that contacts the conductive pattern of the wafer in order to connect the conductive pattern of the wafer to the inspection machine. An inspection jig referred to as was used.

In this probe card, the tip of the probe needle is projected into the window of the center of the substrate on which the circuit pattern is printed radially toward the window of the center, and the probe needle is arranged radially from the center. The base end is connected to the circuit pattern of the substrate.

The probe needle of this probe card was pressed from above the wafer, the tip of the probe needle was brought into contact with the circuit pattern of the wafer, the conductive pattern of the wafer was connected to the inspection machine, and the intermediate inspection of the wafer was performed. .

[Problems to be Solved by the Invention]

By the way, in the above-mentioned inspection, a large number of integrated circuits are formed on one wafer, whereas an inspection jig is used alone or about two. That is,
Since the probe needles are arranged in the radial direction with respect to the probe card, a plurality of probe cards cannot be opposed to a small wafer, and only two probes can be used.

Then, in order to inspect a wafer on which a large number of integrated circuits are formed, after the inspection of one integrated circuit is completed, the probe card is moved to the pattern of the next adjacent integrated circuit, and the inspection is performed. When the inspection is completed, the inspection is sequentially carried out such that the next integrated circuit is moved to. Therefore, it takes a few seconds to inspect one integrated circuit, but it takes a lot of time to move the probe card to the adjacent integrated circuit after the inspection of one integrated circuit is completed. However, there was a problem that the inspection time as a whole became long and the work efficiency was poor. In addition, the tips of the probe needles of the probe card must be made extremely sensitive, and must have a minute gap so that they do not contact each other. There is also a problem that various problems such as scrutiny, maintenance, etc. occur, and such a precise probe needle becomes expensive and becomes expensive as a whole.

The present invention is intended to solve the above-described problems, and an object of the present invention is to make a plurality of integrated circuits compatible with one wafer at the same time by making the jig itself smaller. It is an object of the present invention to provide a jig for an inspection device of an integrated circuit, which can reduce the inspection time because the inspection can be performed, and the jig can be manufactured and maintained easily and at a low cost.

[Means for Solving the Problems]

The present invention relates to means for an integrated circuit inspection device jig for achieving the above-mentioned object, in which a number of conductive pins that come into contact with a conductive pattern of the integrated circuit are erected innumerably with their tips protruding downward. And an insulating support piece having flexibility such that it can cope with slightly above and below the conductive pin such as rubber, and an electrode with a spacing wider than the spacing between the conductive pins. The formed connector part, the connecting means for connecting the conductive pin and the electrode, and the supporting piece surrounding the connecting means and filled between the supporting piece and the connector plate, and the supporting piece by the upper and lower sides of the conductive pin. The object is achieved by a jig for an inspection device of an integrated circuit, which is provided with a flexible grid conversion material capable of coping with vertical undulations.

Embodiment of the Invention Next, a first embodiment of the present invention will be described with reference to FIG.

Reference numeral 1 denotes a conductive pin, which is provided on a supporting piece 2 such as rubber and has a lower portion 1a
Is planted by projecting the same length as its diameter.

Since the conductive pins 1 have the same pitch as the conductive pattern A1 of the wafer A to which the bonding wire connecting the circuit of the wafer and the terminal of the integrated circuit is connected, the diameter of the conductive pin 1 is about 50 to 100 microns. Now, the wafer A is planted according to the pitch of the conductive pattern A1.

The lower end of the conductive pin 1 is in contact with the conductive pattern A1 of the wafer A.

The support piece 2 has the lower end of the conductive pin 1 on the wafer A.
When pressure is applied from above in order to make contact with the conductive pattern, even if the conductive pattern of the wafer A is slightly warped vertically, the lower end of all the conductive pins 1 can be bent to such a degree that it can be bent. Have been sexed.

Reference numeral 3 is a connector pin, which is erected on the connector plate 4 at an interval such that a connecting means such as winding a lead wire 6 for connecting to an inspection machine can be taken.

The upper portion 1b of the conductive pin 1 is projected from the upper surface of the support piece 2 by an appropriate length, and the upper portion 1b is bent and connected to the connector pin 3.

The distance between the support piece 2 and the connector plate 4 is kept at about 1/2 to 1 inch, and the grid conversion material 5 is filled in the space between the support piece 2 and the connector plate 4 so as to surround the upper portion 1b of the conductive pin 1. .

This grid converting material 5 transmits the pressure when the pressure is applied to the connector plate 4 from above so as to bring the lower end of the conductive pin 1 into contact with the conductive pattern A1 of the wafer A, and at the same time, the conductive property is reduced. It has such a flexibility that it can absorb the undulations of the support piece 2 caused by some ups and downs of the pin 1.

Therefore, if the lead wire 6 from the inspection machine is connected to the connector pin 3 and pressure is applied from above the connector plate 4, due to the flexibility of the support piece 1, the conductive pin in the state shown in FIG. As shown in FIG. 3, the support piece 2 is curved so that the lower ends of all the conductive pins 1 are attached to the wafer A.
All of the conductive patterns A1 can be brought into contact with each other.

Next, a second embodiment of the present invention will be described with reference to FIG.

This embodiment is different from the previous embodiment in that the flat plate electrode 7 is directly provided on the upper surface of the grid material 5 without providing the connector plate 4.
Is formed, and the upper portion 1b of the conductive pin 1 is connected to the same as in the previous embodiment.

Then, a connector pin 8 at the tip of a lead wire from the inspection machine is soldered to the flat electrode 7, or a connecting pin is soldered to the flat electrode 7, and the lead wire from the inspection machine is wound around this. The flat panel electrode 7 is connected to the inspection machine by such means.

The other parts of this embodiment are the same as the previous embodiment.

Further, a third embodiment of the present invention will be described with reference to FIG.

In this embodiment, the conductive pin 1 does not protrude above the support piece 2 and is connected to the conductive pin 1 on the upper surface of the support piece 2 and is slightly smaller than the conductive pin 1. A large flat electrode 9 is formed.

The connector pin 3 and the connector plate 4 are formed in the same manner as in the first embodiment, and the connector pin 3 and the planar electrode 9 are formed.
And are connected by a bonding wire 10.

Between the support piece 2 and the connector plate 4, as in the first embodiment, the bonding wire 10 is surrounded and the grid conversion material 5 is filled therein. It functions similarly to the embodiment.

In addition, in the present invention, the connector portion for connecting the inspection machine and the conductive pin 1 can use various methods other than the means shown in the above embodiment.

〔The invention's effect〕

According to the present invention, as described above, the conductive pin is insulated and supported by the support piece, and only protrudes to the lower surface of the support piece by the diameter of the support piece, and the conductive pin and the conductive portion are connected. The parts that connect to the pins are also insulated by the grid conversion material, so there is no risk of short-circuiting between the conductive pins,
Moreover, since miniaturization is possible, a plurality of integrated circuits can be inspected at the same time by allowing a plurality of wafers to be associated with each other. Therefore, the inspection time can be shortened and the material of the conductive pins, Since the difficulty of monitoring and maintenance of the short circuit is eliminated and it is easy to plant on the support piece,
It can be offered at a low price.

In addition, the pitch of the conductive pins does not change, and even if the conductive pins of the conductive pins are slightly warped up and down, the flexibility of the support piece allows the tips of the conductive pins to move up and down. However, since the tips of all the conductive pins can be brought into contact with the conductive pattern of the wafer, the set time can be shortened, and the inspection efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a side view in which the conductive pins and the wafer are separated, and FIG. 3 is a side view in the same contact state, and FIG. Is a perspective view of an essential part of the second embodiment, and FIG. 5 is a perspective view of an essential part of the third embodiment. 1 ... Conductive pin, 2 ... Supporting piece, 3 ... Connector pin, 4 ... Connector plate, 5 ... Grid material, 7,9 ...
… Plane electrode, 10… Bonding wire, A… Wafer, A1… Conductive pattern.

Claims (1)

[Claims] 1. An infinite number of conductive pins that come into contact with a conductive pattern of an integrated circuit are erected upright so as to project on the lower surface, and are slightly above and below the conductive pins such as rubber. Insulating support piece that is flexible enough to support,
A connector part in which electrodes are formed with a spacing wider than the spacing between the conductive pins, a connecting means for connecting the conductive pins and the electrodes, and a support piece and a connector part surrounding the connecting means. And a flexible grid conversion material which is filled between the conductive pin and the up and down undulation of the support piece due to the up and down of the conductive pin, and a jig for an integrated circuit inspection device.