JPH07105622B2 - Electronic component mounting device - Google Patents

Description

The present invention relates to a mounting device for electronic components.

B) Conventional technology In recent years, automation of mounting electronic components on a printed circuit board has been progressing, and various automatic mounting apparatuses related to this have been developed. For example, as in JP-A-60-12799, a large number of suction nozzles are provided around the rotary type index table to pick up components at a predetermined suction position and intermittently rotate the index table to convey it to a mounting position on a board. It is shown that a component is placed at a desired substrate position by moving an XY table on which the substrate is placed. In such a mounting apparatus, its operation is usually program-controlled, but when electronic components are mounted by repeating a plurality of the same arrangements of components on one board, the formation direction of the normal arrangements should be the same direction. Is common.

Here, the array is an array formed by the mounted electronic component group on the substrate, and is determined by the type of the component, the relative position between the components, and the mutual orientation.

C) Problems to be solved by the invention However, since increasing the number of arrangements of the same type of components formed on the printed circuit board reduces the number of times of transferring the board and saves the time, the mounting table can be saved. It is advantageous that the size of the printed circuit board to be mounted is large, and it is preferable to match the maximum size and shape that can be mounted on the mounting table. On the other hand, the printed circuit board to be mounted on the mounting table is usually prepared by cutting a vertical and horizontal size original plate of a predetermined standard, and the original plate is divided into equal parts so as not to be wasted. If you make it as large as possible so that it can be placed on a table, its vertical and horizontal sizes will be roughly fixed.

In addition, if the dimension of the substrate in the direction orthogonal to the transport direction is not changed as much as possible, it is not necessary to change the width of the guide for guiding the transport each time the substrate is changed. Further, if the width in the carrying direction is the same, it is not necessary to change the mechanism for positioning the substrate.

In addition, some restrictions may occur in the electronic component mounting line, which may restrict the shape and size of the printed circuit board.

Further, there are cases where the substrate size and shape are determined in several stages for standardization.

In this way, there may be restrictions on the size of the entire printed circuit board, but the arrangement of parts in which a plurality of identical parts should be formed is not always the same in size and shape, and there are various types. is there.

In such a case, when forming an array of a plurality of the same parts, if they are all directed in the same direction, even if there is an array that may be able to efficiently use the entire substrate surface by chance, depending on the array, only in the same direction, There is a disadvantage that a large blank area where components are not mounted is generated and the entire surface of the printed circuit board cannot be used efficiently.

Further, in such a case, if the array is formed by changing the direction, it may be possible to eliminate the blank space on the restricted printed circuit board surface. However, in order to do so, a plurality of identical arrays are formed. There is a drawback in that it takes time and effort to create the mounting data, because it is necessary to create the mounting data with the entire board as one array instead of the method of creating the component mounting data.

D) Means for Solving the Problems For this reason, the present invention is an array of a plurality of types of electronic components mounted on one printed circuit board supported by a mounting table via suction nozzles, and the same array. In an electronic component mounting apparatus for mounting so that a plurality of electronic components are formed, an array storage unit that stores mounting data relating to the position and type of each electronic component on the board within the predetermined array, and An array position storage unit that stores in which direction the position is provided; a unit that performs relative alignment between the placement table and the suction nozzle to mount the electronic component at a predetermined position on the substrate; Control means for controlling the means for performing the alignment so as to mount the electronic component according to the arrangement of the arrangement storage portion toward the substrate position stored in the arrangement position storage portion and in the same stored direction; It has.

(E) Operation The direction of a plurality of arrays of electronic components mounted on one printed circuit board can be arbitrarily set by external setting.

F) Embodiment FIG. 2 is a perspective view of a main part showing an electronic component mounting apparatus of the present invention, in which (2), (2), ... Are chip-shaped electronic components (1).
(1) ... are stored electronic component storage bands (tapes), which are wound around tape reels (3) (3). (4) (4) ... These are tape reels (3) (3)
Is a sending unit for sending the electronic component storage bands (2) (2). (11) are these tape reels (3)
(3) ... and the feeding units (4), (4) ... are arranged, (T) is a turntable capable of intermittent rotation, and (5), (5) ... are the outer periphery of the turntable (T). Shows the suction nozzle installed on the tape transfer table (1
The electronic component (5) is sucked from the electronic component storage band (2) selected according to the movement state of 1) and is transported by rotation of the turntable (T). (6) is a positioning device for correcting the displacement in XY direction and the rotation angle of the component (1) sucked by the suction nozzle (5), and (9) is a mounting table on which the printed circuit board (10) is arranged. The XY table is shown, and the pulse motors (7) and (8) can freely move in the horizontal direction. That is, the adsorbed electronic component (1)
The positioning device (6) corrects the attracted state by intermittent rotation of the turntable (T), and then is transported to the XY table (9), and the printed circuit board (10) on the XY table (9) is transported. ) Mounted on. Then, the mounting position to be mounted on the substrate (10) is adjusted by moving the XY table (9) horizontally.

FIG. 1 is a block diagram showing a control section of such an electronic component mounting apparatus, in which (12) is a component supply for moving the tape moving table (11) and for feeding the feeding units (4) (4). A drive unit, (13) an XY table drive unit that drives the pulse motors (7) and (8) of the XY table (9), and (14) a positioning drive unit that drives the positioning device (6),
(15) is a nozzle drive unit that controls the intermittent rotation operation of the turntable (T) and the suction operation of the suction nozzles (5), (5), and (16) is the setting of the printed circuit board on the XY table (9). And a board transfer section for discharging, (17) is an external terminal for connecting to a personal computer, a keyboard, etc., and these parts supply driving section (12) to external terminal (17) are central processing units (hereinafter, CPU). Control) (18). Reference numeral (19) denotes a memory unit connected to the CPU (18), and as shown in FIG. 3, mounting number (step No.), XY coordinates of component mounting position, component mounting direction, component type (component data), etc. NC data consisting of mount data given as the component mounting information of, and offset data indicating the position and direction on the printed circuit board forming this pattern and the component mounting sequence of the component mounting operation for forming the pattern are stored. Has been done. The component mounting position of the mount data indicates a mounting pattern, that is, a mounting position in the array. The arrangement of the electronic component group mounted on the printed circuit board (10) according to the mount data in the NC data is the mounting pattern, and even if the predetermined mounting pattern is formed at a position shifted with respect to the printed circuit board (10), it is the same. This is a mounting pattern, and the same mounting pattern is formed on the substrate (10) even if the entire mounting pattern is changed in direction, that is, rotated. The offset data gives the position and direction of the mounting pattern to be formed on the printed circuit board (10), and the reference position on the circuit board (10) is stored as to which position to form the mounting pattern. It is a thing.

Further, even if the order of mounting the electronic components (1) is changed, the same mounting pattern as the arrangement of the components (1) is formed, and the same mounting pattern is formed even if the component mounting sequence is different. Is what is done.

Here, F indicates the end of mount data and a repeating pattern in which the same mounting pattern is formed in plural, P indicates a forward sequence, Q indicates a reverse sequence, and E indicates the end of all data. Further, the memory section (19) is provided with a step counter indicating an instruction address of mount data, an offset counter indicating an instruction address of offset data, a reverse sequence flag area for setting a reverse sequence flag and an end flag area for setting an end flag. Has been.

Next, the operation of such an electronic component mounting apparatus will be described with reference to the flowchart of FIG. First, after resetting all flags, set the offset counter to 0.
To After that, it is determined whether the first offset command whose mounting number (step No.) is M124 is P (forward sequence). If it is a forward sequence, the step counter is set to 0 to clear the reverse sequence flag, and the reverse sequence is performed. If there is, the step counter is set to a value obtained by adding 1 to the mounting number of mount data (which is M123), and the reverse sequence flag is set. Then, in the case of the forward sequence, the component of the corresponding mount data is mounted at a predetermined position while incrementing the step counter one by one. On the other hand, in the reverse sequence, the corresponding mount data component is mounted at a predetermined position while the step counter is decremented one by one.

In addition, the component device one by one uses the XY coordinate position and the θ rotation direction of the offset data designated by the offset counter as a reference, and the XY coordinate position and the mounting direction data represented by the mounting position data of the mount data designated by the step counter. An operation of mounting the component represented by the component data in the θ rotation direction represented by is performed. That is, the moving base (11) is moved according to the component data to cause the suction nozzle (5) to selectively suck the component (1), and according to the mounting direction data,
The positioning device (6) positions and sets the direction of the component (1), and operates the XY table (9) according to the mounting position data to move the component mounting position of the printed circuit board (10) to the suction nozzle (5). ) Move it directly below to mount the parts.

In this way, when the mounting of one pattern is completed, the contents of the next offset command are checked, and if the sequence is the same as described above, component mounting is performed sequentially while incrementing the step count, and if it is the reverse sequence, the step counter is set. Parts are sequentially mounted while counting down.
When the mounting operation is repeated and the last component mounting pattern is completed, the end command (E) is detected and the mounting operation is completed.

In the present embodiment, the relative positioning of the suction nozzle (5) and the printed circuit board (10) is performed by moving the XY table (9), but the present invention is not limited to this, and the printed circuit board is fixed and the suction nozzle is flat. It may be moved in any direction, or both may be moved.

In such a mounting apparatus, for example, when the electronic components are mounted for two patterns on the substrate in the same mounting pattern as shown in FIG. 5 in the forward sequence, the NC data is as shown in FIG. Further, when mounting the two-pattern electronic components of the forward sequence and the reverse sequence with the same mounting pattern on the board as shown in FIG. 7, the NC data is as shown in FIG. Further, as shown in FIG. 9, the same mounting pattern is used for four of a forward sequence, a forward sequence, a forward sequence, and a reverse sequence.
When mounting the electronic parts of the pattern, the NC data is as shown in Fig. 10.

In addition to this, for example, when some of a plurality of identical mounting patterns are mounted with their orientations changed as shown in FIG. 11, the direction data θ of the corresponding offset data is set to a desired angle as shown in FIG. Therefore, a predetermined inclination can be given.

The above-mentioned rewriting of NC data is performed by a keyboard (not shown) connected to an external terminal or a personal computer.

G) Effects of the Invention As described above, the electronic component mounting apparatus according to the present invention is applicable to a plurality of identical printed circuit boards or an array of parts to be formed even when there are restrictions on the shape and size of the printed circuit board. The arrangement direction can be set arbitrarily and the components can be mounted, the margins where components are not mounted can be minimized, and the substrate surface can be effectively used. Also, even if the direction of the array is arbitrarily set in this way, only one piece of mounting data for the array is created and stored in the array storage unit.
In addition, since the entire mounting data can be created only by designating and storing the position and direction of forming the array, the time and effort of creating the data are reduced as compared with the case of creating one mounting data for the entire board. .

[Brief description of drawings]

FIG. 1 is a block diagram of a control unit of the electronic component mounting apparatus of the present invention, and FIG. 2 is a perspective view of a main part of the electronic component mounting apparatus of the present invention.
FIG. 3 is a state schematic diagram showing the setting state of NC data, FIG. 4 is a flow chart showing the operation of the present invention, FIG. 5, FIG. 7, FIG.
FIG. 11 is a schematic diagram showing a mounting state and a mounting sequence example of components on a board, and FIGS. 6, 8, 10, and 12 are schematic diagrams showing an example of setting NC data. . (1) (1) ... Electronic component, (2) (2) ... Electronic component storage band, (3) (3) ... Tape reel, (4) (4) ... Delivery unit, (5) (5) ... Adsorption Nozzle, (6) ... Positioning device, (7) (8) ... Pulse motor, (9) ... XY table, (10) ... Printed circuit board, (11) ... Tape moving table,
(12) ... Parts supply drive unit, (13) ... XY table drive unit,
(14) ... Positioning drive, (15) ... Nozzle drive, (1
6) ... Board transfer part, (17) ... External terminal, (18) ...
Central processing unit, (19) ... memory section, (T) ... turntable.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 62-203731 (JP, A) JP 62-113495 (JP, A) JP 61-76236 (JP, A)

Claims (1)

[Claims] 1. An electronic component which is mounted on a single printed circuit board supported by a mounting table via suction nozzles so that a plurality of identical electronic components are mounted. In the mounting device, an array storage unit that stores mounting data relating to the position and type of each electronic component on the board in the predetermined array, and a position and direction of the board on which the array is provided are stored. An array position storage unit, means for performing relative alignment between the placement table and the suction nozzle for mounting the electronic component at a predetermined position on the substrate, and means for performing this alignment by controlling the array. An electronic component mounting apparatus comprising: a control unit configured to mount an electronic component according to the arrangement of the arrangement storage unit toward the substrate position stored in the position storage unit and in the same stored direction.