JPH0774969B2 - Electronic component mounting device - Google Patents

Description

The present invention relates to an electronic component mounting apparatus.

B) Conventional technology In recent years, automation of mounting electronic components on a printed circuit board has been progressing, and various automatic mounting apparatuses related to this have been developed. For example, as in Japanese Patent Laid-Open No. 60-12799, a large number of suction nozzles are provided around the rotary index table to pick up components at a predetermined suction position, and the index table is intermittently rotated to be transported to the component mounting position on the board. Then, by moving the XY table on which the substrate is placed, the component is placed at a desired substrate position. In such a mounting apparatus, its operation is usually program-controlled, but when a plurality of identical arrangements of components are repeated on one substrate to mount electronic components, the same mounting operation is repeated.

Here, the array is an array formed by the mounted electronic component group on the substrate, and is determined by the type of the part, the relative position of the components, and the mutual orientation.

(C) Problems to be Solved by the Invention However, in such a mounting apparatus, among a plurality of identical arrays formed on one board, the last component mounting position of a certain array and the next array are arranged. There was a problem that the initial component mounting positions were greatly separated and it took time to move the XY table.

(D) Means for Solving the Problems In the present invention, therefore, an electronic component is mounted by mounting an electronic component sucked by a suction nozzle on a single substrate supported by a mounting table in a plurality of identical arrangements. In the apparatus, a mounting data storage unit that stores mounting data regarding a type of each electronic component in the predetermined array, a mounting position on the board, and a mounting order, and a position on the board where the array is formed are stored. An array position storage unit, and a sequence designating unit that designates whether to form the array in a sequence in which components are mounted in the mounting sequence or in a reverse sequence in which components are mounted in a reverse sequence of the mounting sequence, Positioning means for performing relative positioning between the mounting table and the suction nozzles for mounting the electronic component at a predetermined position on the substrate, and controlling the positioning means to cause the array position storage section to store the electronic parts. A control means for mounting the electronic component on the stored board position based on the mounting data in the mounting data storage unit according to either the forward sequence or the reverse sequence designated by the sequence designating unit is provided.

(E) Action The control means controls the alignment means to change the mounting position in the mounting data storage unit to the board position stored in the array position storage unit according to either the forward sequence or the reverse sequence designated by the sequence designating unit. Based on this, electronic parts are mounted.

F) Embodiment FIG. 2 is a perspective view of a main part showing an electronic component mounting apparatus of the present invention, in which (2), (2), ... Are chip-shaped electronic components (1).
(1) ... are stored electronic component storage bands (tapes), which are wound around tape reels (3) (3). (4) (4) ... These are tape reels (3) (3)
Is a sending unit for sending the electronic component storage bands (2) (2). (11) are these tape reels (3)
(3) ... and the feeding units (4), (4) ... are arranged, (T) is a tentable capable of intermittent rotation, and (5), (5) ... are the outer periphery of the turntable (T). Showing the suction nozzle installed in the table moving table (1
The electronic component (5) is sucked from the electronic component storage band (2) selected according to the movement state of 1) and is transported by rotation of the turntable (T). (6) is a positioning device for correcting the displacement in XY direction and the rotation angle of the component (1) sucked by the suction nozzle (5), and (9) is a mounting table on which the printed circuit board (10) is arranged. The table of FIG. 7 is shown, and horizontal movement is freely performed by pulse motors (7) and (8). That is, the adsorbed electronic component (1)
The positioning device (6) corrects the suction state by the intermittent rotation of the turntable (T), and then is transported onto the XY table (9), and the printed circuit board (10) on the XY table (9). ) Mounted on. Then, the mounting position to be mounted on the substrate (10) is adjusted by moving the XY table (9) horizontally.

FIG. 1 is a block diagram showing a control section of such an electronic component mounting apparatus, in which (12) is a component supply for moving the tape moving table (11) and for feeding the feeding units (4) (4). A drive unit, (13) an XY table drive unit that drives the pulse motors (7) and (8) of the XY table (9), and (14) a positioning drive unit that drives the positioning device (6),
(15) is a nozzle drive unit that controls the intermittent rotation operation of the turntable (T) and the suction operation of the suction nozzles (5), (5), and (16) is the setting of the printed circuit board on the XY table (9). And a board transfer section for discharging, (17) is an external terminal for connecting to a personal computer, a keyboard, etc., and these parts supply driving section (12) to external terminal (17) are central processing units (hereinafter, CPU). Control) (18). (19) indicates a memory unit connected to the CPU (18), and as shown in FIG. 3, the mounting number (step NO), the XY coordinate of the component mounting position, the component mounting direction, the component type (component data), etc. NC data consisting of mount data as mounting data given as the component mounting information of the above, and offset data indicating the position and direction on the printed circuit board forming a pattern as an array by the mount data and the component mounting sequence of the pattern. Is remembered. Here, F indicates the end and repeat pattern of the mount data, P indicates the forward sequence, Q indicates the reverse sequence, and E indicates the end of all data. Further, the memory section (19) is provided with a step counter indicating an instruction address of mount data, an offset counter indicating an instruction address of offset data, a reverse sequence flag area for setting a reverse sequence flag and an end flag area for setting an end flag. Has been.

Next, the operation of such an electronic component mounting apparatus will be described with reference to the flowchart of FIG. First, after resetting all flags, set the offset counter to 0.
To After that, it is determined whether or not the first offset command whose mounting number (step NO) is M124 is P (forward sequence), and if it is a forward sequence, the step counter is set to 0.
The reverse sequence flag is cleared and the reverse sequence flag is set by setting the step counter to a value obtained by adding 1 to the mount number (M123) of the mount data in the case of the reverse sequence. Then, in the case of the forward sequence, the component of the corresponding mount data is mounted at a predetermined position while incrementing the step counter one by one. On the other hand, in the case of reverse sequence, the step counter is set to 1.
The parts of the corresponding mount data are mounted in predetermined positions while being lowered one by one.

Note that the mounting of each component one by one is based on the XY coordinate position of the offset data designated by the offset counter and the θ rotation direction, and the XY coordinate position and mounting direction represented by the mounting position data of the mount data designated by the step counter. An operation of mounting the component represented by the component data in the θ rotation direction represented by the data is performed. That is, the moving base (11) is moved according to the component data to cause the suction nozzle (5) to selectively suck the component (1), and the positioning device (6) moves the component (1) onto the component (1) according to the mounting direction data. Direction is set together with positioning, and depending on the mounting position data, the above
The XY table (9) is operated to move the component mounting position of the printed circuit board (10) directly below the suction nozzle (5) to mount the component.

In this way, when the mounting of one pattern is completed, the contents of the next offset command are checked, and if the sequence is the same as described above, component mounting is performed sequentially while incrementing the step count, and if it is the reverse sequence, the step counter is set. Parts are sequentially mounted while counting down.
When the mounting operation is repeated and the last component mounting pattern is completed, the end command (E) is detected and the mounting operation is completed.

In the present embodiment, the relative positioning of the suction nozzle (5) and the printed circuit board (10) is performed by moving the XY table (9), but the present invention is not limited to this, and the printed circuit board is fixed and the suction nozzle is flat. It may be moved in any direction, or both may be moved.

In such a mounting apparatus, for example, when the electronic components are mounted for two patterns on the substrate in the same mounting pattern as shown in FIG. 5 in the forward sequence, the NC data is as shown in FIG. Further, when mounting the two-pattern electronic components of the forward sequence and the reverse sequence with the same mounting pattern on the board as shown in FIG. 7, the NC data is as shown in FIG. Further, as shown in FIG. 9, the same mounting pattern is used for the following four steps: forward sequence, forward sequence, forward sequence, and reverse sequence
When mounting the electronic parts of the pattern, the NC data is as shown in Fig. 10.

In addition to this, for example, when some of a plurality of identical mounting patterns are mounted with their orientations changed as shown in FIG. 11, the direction data θ of the corresponding offset data is set to a desired angle as shown in FIG. Therefore, a predetermined inclination can be given.

The above-mentioned rewriting of NC data is performed by a keyboard (not shown) connected to an external terminal or a personal computer.

(G) Effect of the Invention As described above, according to the present invention, when mounting a plurality of components in the same arrangement on a single substrate,
The order of component mounting in each array can be changed, the efficiency of component mounting can be improved by improving the efficiency of the alignment of the alignment means, and data can be set in the attachment data storage unit and the array position storage unit. The above-mentioned efficient operation can be performed only by setting the order specification in the sequence specification section, and when setting the electronic parts to be mounted on one board for the same operation by inputting all the mounting order. Compared to this, less data creation is required.

[Brief description of drawings]

FIG. 1 is a block diagram of a control unit of the electronic component mounting apparatus of the present invention, and FIG. 2 is a perspective view of a main part of the electronic component mounting apparatus of the present invention.
FIG. 3 is a state schematic diagram showing the setting state of NC data, FIG. 4 is a flow chart showing the operation of the present invention, FIG. 5, FIG. 7, FIG.
FIG. 11 is a schematic diagram showing a mounting state and a mounting sequence example of components on a board, and FIGS. 6, 8, 10, and 12 are schematic diagrams showing an example of setting NC data. . (1) (1) ... electronic parts, (2) (2) ... electronic parts storage band, (3) (3) ... tape reel, (4) (4)
…… Sending unit, (5) (5) …… Suction nozzle,
(6) …… Positioning device, (7) (8) …… Pulse motor, (9) …… XY table, (10) …… Printed circuit board,
(11) …… Tape moving table, (12) …… Parts supply drive unit,
(13) …… XY table drive part, (14) …… Positioning drive part, (15) …… Nozzle drive part, (16) …… Board transfer part,
(17) …… External terminal, (18) …… Central processing unit,
(19) …… Memory section, (T) …… Turntable.

 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-59-177608 (JP, A) JP-A-62-133503 (JP, A) JP-A-59-108105 (JP, A)

Claims (1)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component adsorbed by a suction nozzle on a single substrate supported by a mounting table in a plurality of identical arrays, wherein each of the electronic components is mounted in the predetermined array. A mounting data storage unit that stores device data regarding types of electronic components, mounting positions on a board, and mounting order;
An array position storage unit that stores at which position on the board the array is formed, and whether the array is formed in the order sequence of mounting the components in the mounting order or in the reverse order of the mounting order. A sequence designating unit that designates whether to form in a reverse sequence, a positioning unit that relatively positions the mounting table and the suction nozzle to mount the electronic component at a predetermined position on the substrate, and the positioning unit. The electronic parts are mounted on the board positions stored in the array position storage unit according to the mounting data stored in the mounting data storage unit according to either the forward sequence or the reverse sequence designated by the sequence designating unit by controlling the means. An electronic component mounting device provided with a control means for tightening.