JPH07120744B2 - IC package - Google Patents

Description

TECHNICAL FIELD The present invention relates to an IC package, and more particularly to an IC package in which a plurality of IC pellets are mounted in one package.

[Conventional technology]

In recent years, high-speed processing and large-volume data processing are being demanded in microprocessors, and along with this, parallel processing of CPUs is desired. Moreover, even though the CPU has become more sophisticated and the chip size has become extremely large, a memory management controller with higher functionality,
On-chip integration of cache controllers, etc., and on-chip integration of peripheral ICs are desired, and along with this, there is a problem that IC devices must have an on-chip self-test function, increasing the chip size. Wafer defect problems and diffusion yield problems are increasing. Furthermore, high-speed parallel processing of CPUs for artificial intelligence in the future is also desired.

However, it is unrealistic to put all the desired functions on one chip, and there is a possibility that even the customer does not want to include the desired functions. However, high-performance compounding on one chip has great advantages such as elimination of signal external wiring delay between IC devices and dramatic reduction of the occupied area on the system board substrate.

Super integration, 3D IC, etc. can be considered as one chip direction, but there are problems such as the above-mentioned increase in chip area in super integration.
Three-dimensional ICs have major problems such as the flattening technology of the surface of the lower layer.

As a means for solving the above problems, there is a means for mounting a plurality of IC pellets in one package.

Conventionally, as an IC package in which a plurality of chips are mounted in one package, pellets are arranged in a plane and the pads of each pellet are electrically connected by a bonding wire.
One that mounts each pellet on one package, one that mounts a plurality of chips with solder bumps on a silicon substrate with Al wiring with a silicon-on-silicon structure, and then mount the silicon substrate on the package. there were.

[Problems to be solved by the invention]

In the above-mentioned conventional IC package, the pellets are simply arranged in a plane, so the area efficiency on the plane is poor, and the advantage of having multiple pellets in the same package cannot be fully utilized. There is a drawback that.

[Means for solving problems]

The IC package of the present invention has a box-shaped outer peripheral portion having a hollow portion, and a plurality of connection terminal structures provided so as to vertically project from the inner wall of the outer peripheral portion in an eaves shape at arbitrary lengths. A window-shaped hole is provided at least in the central portion of the plane perpendicular to the inner wall of the connection terminal structure, and each of the plurality of IC pellets has a pad portion electrically connected to the terminal portion provided in the connection terminal structure. It is characterized by being connected to and implemented.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, and a part of the outer peripheral side surface of the package 4 is cut out so that the structure can be easily seen. The cut surface which is cut out is shown by diagonal lines in FIGS. 1 to 3. The package 4 is made of a ceramic material, and the pellet 3 is placed on a flat plate-shaped protrusion 8 provided so as to protrude from the inner wall of the package 4.

FIG. 2 is a view for explaining the electrical connection between the package 4 and the pellet 3 of FIG. 1, and the package 4 is provided with the printed wiring 2. First, bumps 6 are attached to the pads 7 on the pellets 3, and the front and back of the pellets 3 are reversed from the state shown in FIG. 2 so that the printed wirings 2 on the steps of the package 4 and the bumps 6 can be electrically connected. Pellet 3
Are arranged on the stage of the package 4.

To mount a plurality of pellets 3 as shown in FIG. 1,
After arranging the pellets 3 in the package 4, the bumps 6 attached to the pads 7 of the pellets 3 and the printed wirings 2 on the projecting portions 8 of the package 4 are electrically processed by the paper phase soldering method. Connect to. The portion of the printed wiring 2 connected to the bump 6 becomes the inner pad of the IC package 4.

By the way, although not shown as another method, if the lead portion inside the package is not printed wiring like the currently used glass-sealed ceramic package but the lead wire is used, the lead wire is protruded from the step portion of the package 4. Use a jig that holds the pellets with bumps on top of them and presses the bottom surface of the pellet vertically downward, and a jig that presses the lead wire downward from the bottom to the pellet surface vertically upward. Using the part where the lead wire and the bump on the pad contact each other, heat is applied vertically downward from the lead wire while applying pressure to add the bump to melt the bump and crimp it to the lead wire for electrical connection. A method of doing it is also possible.

In the package 4 of FIG. 1, the printed wiring 2 electrically connected to each pellet 3 is taken out to the side surface 1 of the package, or the printed wirings 2 are appropriately connected to each other inside the package 4 so that the pellets 3 are electrically connected to each other. Each pad can be electrically connected, that is, routed on the package. Common to each pellet 3 or
Connect only the signal line, power supply, and GND that must be taken out of the package 4 to the IC pin 5 provided on the bottom of the package 4.

FIG. 3 is a perspective view of another embodiment of the present invention. This embodiment has a structure in which the pellets 3 are stacked in the lateral direction of the package 4 '. The pellet 3 can be mounted on the package 4 in the same manner as in the embodiment shown in FIG.

In FIGS. 1 and 3, the protruding portion 8 protruding into the package 4 can be changed in size according to the size of pellets loaded inside.

〔The invention's effect〕

As described above, according to the present invention, a plurality of IC pellets are arranged in the same IC package in a laminated structure, and the pads of the IC pellets and the inner pads of the IC package are electrically connected to each other, thereby the microprocessor. It is possible to deal with higher functionality such as.

That is, the present invention can avoid an increase in chip size,
In addition, the IC inside the IC package can be
The pellets can be freely selected and configured, and the occupied area on the system board substrate can be reduced.

[Brief description of drawings]

1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a partially exploded perspective view for explaining the electrical connection between the pellet 3 and the printed wiring 2 of the package 4 shown in FIG. 1, FIG. FIG. 6 is a perspective view of another embodiment of the present invention. 1 ... IC package side, 2 ... Printed wiring (inner pad), 3 ... IC pellet, 4,4 '... IC package, 5 ... IC pin, 6 ... Bump, 7 ... Pad, 8 ...
... protrusion 8.

Claims (1)

[Claims] 1. A plurality of connecting terminal structures comprising a box-shaped outer peripheral portion having a hollow portion and a flat plate-shaped protruding portion provided so as to vertically project from an inner wall of the outer peripheral portion by an arbitrary length. And at least a window-shaped hole is provided in a plane central portion perpendicular to the inner wall of the connection terminal structure, and each of a plurality of IC pellets has a pad portion provided on the connection terminal structure. An IC package characterized by being electrically connected to and mounted on.