JPH0748537B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a microcomputer-incorporated hybrid integrated circuit device in which a resin-sealed microcomputer is mounted on an integrated circuit substrate.

(B) Conventional Technology A microcomputer in which stored information already written in a mask ROM is built in is favorably used in various electronic devices. Most of the microcomputers are currently mounted on a printed wiring board together with control or driving integrated circuits. For various electronic devices that are required to be small and lightweight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board, and after the required wiring is performed, this The IC chip including the wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

The mounting structure of such a conventional microcomputer will be described with reference to FIG. 18. FIG. 18 is a perspective view having a partial cross section of the conventional microcomputer, in which a conductive wiring pattern (41) is formed on the main surface. A microcomputer (44) incorporated in a sardip type package is mounted in a through hole (43) of an insulating substrate (42) made of glass, epoxy resin or the like. The microcomputer (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) with an external lead (48) or a low melting point glass material. Further, in this header (45), a material mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed into glass is adhered onto the low melting point glass material or the ceramic base material (47). A microcomputer chip (51) is mounted on the element mounting part (50), and the electrodes of the chip (51) and the external lead-outs (48) are connected by a thin metal wire (52). This Cap (46)
Seals the microcomputer chip (51) placed in the header (45) with a low melting point glass. The microcomputer (44) thus sealed with the microcomputer chip (51) is fixed by soldering by inserting the external lead (48) into the through hole (43) of the insulating substrate (42). The through hole (43) is routed as required by the conductive wiring pattern (41), and a male connector terminal (55) provided at the end of the insulating substrate is connected to a female connector (not shown). To be done.

By the way, such a conventional mounting structure of a microcomputer element has an extremely large package outer shape as compared with the microcomputer chip (51), and has a three-dimensional, that is, a height several times as high as the chip height as well as a plane occupation ratio. It is extremely disadvantageous to Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the microcomputer device is once assembled in a package prior to mounting on the insulating substrate.

Here, the cerdip package type microcomputer element has been described, but the above-mentioned problems also occur in the resin-sealed package.

In order to solve such a problem, the mounting structure shown in FIG. 19 has already been used.

The microcomputer mounting structure shown in FIG. 19 will be described below.

A chip mounting area (60c) for mounting a microcomputer chip (61) on an insulating substrate (60) such as a glass / epoxy resin plate having a conductive wiring pattern (60b) formed on the main surface (60a). And has the wiring pattern (60b)
Is routed from the vicinity of this area on the main surface (60a) and connected to a male connector terminal portion (not shown). In the area (60c), a microcomputer chip (6
1) is mounted, and the surface electrode of the chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is the tip (61).
This chip (61) is wired to the wiring pattern (60b) on which the chip (61) is mounted in order to connect to the substrate.

It is already known as a well-known technique to mount a microcomputer chip directly on a substrate as described above.

As shown in FIG. 17, by mounting various microcomputers, for example, three kinds of microcomputers on the above-described printed circuit board integrated circuit on which the microcomputer is mounted shown in FIGS. 18 and 19, (A), (B),
In order to realize the printed circuit board integrated circuit having the different rising waveforms of the motors of (C), as a matter of course, the data for the rising waveforms of (A), (B), and (C) are incorporated. It was necessary to use three printed circuit boards corresponding to each of the three types of microcomputers using a microcomputer, and to separately integrate the printed circuit boards on the printed circuit board.

Here, FIG. 17 shows the pattern of the control method of the rotation speed at the start-up when controlling the rotation of the motor,
(A) gives a large number of rotations in the initial stage, and then obtains a stable rotated rotation, (B) shows one that rotates slowly in the initial stage, then increases the number of rotations greatly and then stabilizes, (C)
Is to gradually increase the rotation speed and stabilize it.

(C) Problems to be Solved by the Invention It goes without saying that the microcomputer mounting structure shown in FIG. 19 is miniaturized because the microcomputer chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the microcomputer itself. That is, although it is not clear from FIG. 19, the peripheral circuit elements fixed to the periphery of the microcomputer are composed of electronic components such as discretes, so that the integrated circuit for a printed circuit board on which the microcomputer is mounted is integrated. When looking at the entire system as a circuit, there is a problem that the size of the printed circuit board is not as small as it is and the size of the entire system becomes large as usual. Furthermore, as described above in the microcomputer mounting structure shown in FIG. 19, when mounting (mounting) three types of microcomputers, it is almost impossible to use one printed circuit board as a common purpose. Three printed circuit boards corresponding to three types of microcomputers are required, and each development must be carried out separately, resulting in a large loss of development time and a number of problems such as high cost.

Furthermore, in the mounting structure shown in FIG. 19, since it is almost impossible to remove the microcomputer chip that controls the inverter motor as described above, the standard of the motor controlled by the microcomputer is higher than the preset standard. There is a problem that vibration due to uneven rotation of the motor occurs when there is a slight deviation.

That is, not only the motor used for the inverter, but a certain standard is set in advance when manufacturing the motor,
Actually, when a motor is manufactured, an error slightly occurs with respect to the set standard and the motor is manufactured. Due to this subtle error, the normal output signal output from the inverter eventually becomes a defective signal, and there is a problem that the rotation of the motor cannot be kept constant. Therefore, in the structure shown in FIG. 19, since the microcomputer cannot be removed as described above, an error occurs in the motor itself. In addition, since the entire unit is replaced when exchanging, there is a problem that the cost is increased both in terms of cost and work.

Further, in the mounting structure shown in FIG. 18, since it is possible to attach and detach from the printed circuit board in terms of detaching the above-mentioned microcomputer, it is comparatively easy in that the above-mentioned different type of microcomputer can be exchanged. You can do it. However, in the mounting structure shown in FIG. 19 as well as in FIG. 18, the peripheral circuit of the microcomputer,
In other words, since circuit elements such as LSI and IC are composed of electronic components such as discretes, the printed circuit board becomes larger, that is, the entire system becomes larger, and the light, thin, short, and small integrated microcomputer-equipped circuit required by the user is provided. There is a big problem that cannot be done.

Further, in the mounting structure shown in FIG. 18 and FIG. 19, since the peripheral circuit of the microcomputer to be fixed and mounted is fixed on one large printed circuit board, the circuit structure or the electronic components corresponding to the electronic equipment to be used are fixed. The printed circuit board equipped with the microcomputer can only be used for one electronic device. That is, in the case of the one used for controlling the motor of the inverter air conditioner, the peripheral circuit on the printed circuit board constitutes the peripheral circuit related to the inverter air conditioner, so that it can be used only for the air conditioner for the inverter, and the electronic device in other fields, such as the sewing machine, the laundry, etc. There is a problem that it cannot be used for machines and blowers.

Furthermore, in the microcomputer mounting structure shown in FIG. 18 and FIG. 19, the entire system becomes large as described above, and the conductive pattern for connecting the microcomputer and its peripheral circuit elements to each other is exposed. There is a problem that it deteriorates.

Furthermore, in the microcomputer mounting structure shown in FIGS. 18 and 19, the microcomputer and its surrounding ICs and LSIs are used.
Since the circuit elements such as are exposed, there is a problem that unevenness occurs on the upper surface of the substrate and it is difficult to handle and the workability is reduced.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and a resin-sealed microcomputer is mounted on one of two substrates and the other substrate is mounted. Alternatively, the circuit elements around it that are connected to all other microcomputers are mounted on one board, and all the circuit elements around it are hermetically sealed by the case material and the two boards, and only the microcomputer is installed. Has a structure exposed by a recess provided in the peripheral end portion of the other substrate.

Therefore, it is possible to miniaturize a hybrid integrated circuit equipped with a microcomputer, to effectively mount circuit elements on two substrates, and to provide a hybrid integrated circuit device with a built-in microcomputer in which the microcomputer can be freely inserted and removed. You can

(E) Action As described above, according to the present invention, since the micro computer is connected to the conductive path on the other substrate which is exposed by the recess, the recess is provided at the predetermined position on one of the two substrates. Since the mounting position of the computer can be set arbitrarily,
Considering the electrical connection with the built-in peripheral circuit, the microcomputer and the most related circuit element can be efficiently connected, and the signal line, that is, the lead line of the conductive path can be eliminated. Furthermore, peripheral circuit elements that are most closely related to each other can be arranged in adjacent positions of the microcomputer,
The data line for exchanging data between the microcomputer and the peripheral circuit element can be realized with the shortest distance or the shortest distance, and the loss of the mounting density due to the routing of the data line can be suppressed to the minimum. Can be implemented.

Further, in the present invention, all the elements other than the microcomputer are mounted in a chip shape on one of the two substrates and are housed in the sealed space formed by the case material and the substrate, so that the size can be reduced. Moreover, it is possible to provide a hybrid integrated circuit device having excellent handleability.

Further, in the present invention, only the microcomputer is exposed by the recess provided on the peripheral edge of one of the substrates, and the microcomputer can be easily attached and detached.
A variety of microcomputers can be selected and mounted on one integrated circuit.

(F) Embodiment A hybrid integrated circuit device of the present invention will be described in detail below with reference to an embodiment shown in FIGS. 1 to 17.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in the field of a wide range of inverter motors such as an inverter air conditioner.

This hybrid integrated circuit device (1) is formed on two integrated circuit boards (2) and (3) and two integrated circuit boards (2) and (3) as shown in FIGS. A conductive path (5) having a desired shape, a microcomputer (6) connected to the conductive path (5) (hereinafter referred to as a microcomputer), and a microcomputer (6)
A peripheral circuit element (6) which is supplied with a control output signal from the same and is connected to the conductive path (5) on the substrates (2) and (3),
It is composed of a recess (4) provided at a predetermined position on the peripheral edge of one substrate (2) and a case member (7) for fixing and integrating the two substrates (2) and (3). There is.

As the two integrated circuit boards (2) and (3), hard boards made of ceramics, glass epoxy, metal, or the like are used, and in this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) (alumite layer) is formed on the surfaces of the two substrates (2) and (3) by well-known anodic oxidation, and 10 to 70 μm is formed on one main surface side thereof. An insulating resin layer (10) such as thick epoxy or polyimide is attached. Furthermore, on the insulating resin layer (10)
A copper foil (11) having a thickness of 10 to 70 μm is attached at the same time as the insulating resin layer (10) by means such as a roller or a hot press. By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility. In this embodiment, it is also possible to connect the respective substrates (2) and (3) by using a film, and to independently connect the respective substrates (2) and (3) without using the film, and to connect the substrates later by metal leads. Is.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (5).
Is formed. Here, the thickness of the conductive path (5) by screen printing is limited to 0.5 mm, so when a very fine wiring pattern is required, it is about 2 by the well-known photo-etching technique.
It is possible to form ultrafine conductive paths (5) up to μ.

Although the conductive path (5) formed on one substrate (2) is not shown, a thick conductive path for a large signal power system is formed, and a thin conductive path for a small signal is formed on the other substrate (3). The road is formed.

A conductive path (5) on the other substrate (3) is mounted with a microcomputer (6) and a plurality of circuit elements (8) to which data is supplied from the microcomputer (6), and one substrate (2) And the conductive path (5) on the other substrate (3)
The peripheral circuit element (8) is mounted on the. Further, the conductive paths (5) are extended to one side edge of the both substrates (2) and (3) or the peripheral edge portions of the opposite side edges, and external lead terminals (12) and (13) are provided.
A plurality of pads for fixing the are formed. External lead terminals (12, 13) are fixed to the pads by soldering. Further, since the conductive paths (5) formed on both the substrates (2) and (3) are formed on the flexible resin layer (10), the two substrates (2) and (3) are cleaved. Both substrates (2) and (3) that are patterned can be connected at predetermined positions and arbitrarily.

As is well known, the microcomputer (6) is an element that combines a program memory (RAM), a ROM, and a peripheral device with an input / output interface centering on a program processor (CPU).

The structure of a general microcomputer (6) is a DIP (dual in line) type as shown in FIGS. 5 and 6, and is roughly classified into a resin mold type package type and a ceramics type package type. As long as it is a DIP type microcomputer (6), either resin mold type or ceramic type package may be used. Since such a DIP type microcomputer is already known, detailed description thereof will be omitted. The type of the microcomputer (6) is basically arbitrary, for example, ceramic type or resin mold type.
It can be used in LCC type, PLCC type or QIP type packages. Each type of LROM and PLCC EPROM device has a structure in which electrodes for connection are provided on four sides of the bottom surface. As shown in FIGS. 7 and 8, the QIP type package has lead terminals (4a) led out from the four sides and bent downward at a substantially right angle.

In the present invention, the package of the microcomputer (6) is DIP type, LC
Although it is possible to use a microcomputer having any of C-type, PLCC-type and QIP-type packages, in the present embodiment, the microcomputer (6) using the QIP-type package was used to request a small system. An example shall be described.

The microcomputer (6) used in this embodiment will be described using a mask ROM type microcomputer in which predetermined program data (ROM) is masked.

On the other hand, in the present invention, the recess (4) is provided at a predetermined position on the peripheral edge of one of the two substrates (2) and (3). The two substrates (2) and (3) are fixed to each other by a predetermined distance by a case member (7) described later. At this time, a plurality of conductive members to which a socket (16) for mounting a microcomputer (6) is connected on the other substrate (3) exposed by the recess (4) provided on the peripheral edge of one substrate (2). The road (5) is extended. The recess (4) has substantially the same shape as the outer shape of the microcomputer (6), and is formed slightly larger than the microcomputer (6) in order to facilitate the insertion and removal of the microcomputer (6).

It is assumed that the two substrates (2) and (3) used in this embodiment have substantially the same size. Also,
The present invention can be easily implemented even if the sizes are different. On the respective boards (2) and (3), the circuit elements (8) around the microcomputer (6) such as ICs, transistors, chip resistors and chip capacitors are chip parts and are soldered onto the desired conductive paths (5). Alternatively, the circuit element (8) is attached by a brazing material such as Ag base, and is bonded to the conductive path (5) in the vicinity. Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

The case member (7) is made of a thermoplastic resin as an insulating member, and as shown in FIG. 3, the two substrates (2) and (3) are separated from each other by a predetermined distance to form a sealed space. Has been formed. The case material (7) is in contact with the periphery of the recess (4) provided on the peripheral edge of the one substrate (2) and the periphery of the surface of the other substrate (3) exposed by the recess (4). A frame body (18) having a constant thickness is provided. The frame body (18) is formed so as to be recessed along the recess (4) provided on the one substrate (2). Further, one side of the case member (7) is formed in an arc shape so that the film resin layer (10) can be easily bent when both substrates (2) and (3) are arranged.

The case material (7) and the two substrates (2) and (3) are fixed to each other by an adhesive sheet, and the case material (7) is connected to both the substrates (2) and (3) by the film resin layer (10). They are fixed so that the mounted circuit elements face each other so as to sandwich them. At this time, the film resin layer (10) connecting the two substrates (2) and (3) is abutted against the arcuate portion provided on the case member (7) and bent, so that the conductivity of the bent portion is reduced. There is no risk of the road (5) being cut when it is bent. After the case material (7) and both substrates (2) and (3) are integrated, the resin layer (10) of the connecting portion is exposed. Therefore, in this embodiment, the connecting portion exposed by the lid (20) is removed. It shall be completely sealed. The lid body (20) is made of the same material as the case material (7), and is adhered by a predetermined means such as the above-mentioned adhesive sheet.

One end of a plurality of conductive paths (5) fixedly connected to the electrodes of the socket (16) is provided on the other substrate (3) exposed by the recess (4) provided on the peripheral edge side of the one substrate (2). The socket (16) into which the microcomputer (6) is inserted is fixed to the tip of the conductive path (5) formed. The other end of the conductive path (5) to which the socket (16) is fixed is efficiently routed in the vicinity of the circuit element (8) which is most closely related, and electrically connected to the chip-shaped IC, LSI by a bonding wire. .

Here, the positional relationship between the microcomputer (6) and the most closely related circuit element (8) arranged adjacently will be described. FIG. 9 is an enlarged view of a main part when the microcomputer (6) and the circuit element (8) related to the microcomputer (6) are arranged on the other substrate (3). As shown in FIG. 9, it is connected to a plurality of circuit elements (8) such as LSIs and ICs through a large number of conductive paths (5), so that the conductive paths (5) can be shortened. The microcomputer (6) and the circuit element (8) most related to the microcomputer (6) are respectively
They are arranged so that they are adjacent to each other or as close to each other as possible. Therefore, the conductive path (5) between the microcomputer (6) and the circuit element (8) related to the microcomputer (6) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. As shown in FIG. 9, the microcomputer (6) and a plurality of chip-shaped circuit elements (8) arranged in the vicinity of or adjacent to the microcomputer (6) are connected to the conductive path (5) extending in the vicinity of the circuit element (8). The tip portion and the wire wire are connected by bonding to electrically connect to the microcomputer (6).

By the way, the microcomputer (6) is inserted into the socket (16) and mounted on the other substrate (3), and only the upper surface of the microcomputer (6) is exposed to the outside. At this time, it is preferable that the upper surface of the microcomputer (6) and the upper surface of the other substrate (2) substantially coincide with each other. As a result,
Only the microcomputer (6) is exposed and the other circuit elements (8) around it are formed by the two substrates (2) and (3) and the case material (7) and are arranged in the sealed space (21). Will be.

As described above, the peripheral circuit element (8) connected to the microcomputer (6) includes two substrates (2) and (3) and a case material (7).
It is set so as to be placed in the sealed space portion (21) formed by. That is, all elements such as chip-shaped electronic parts and resistance elements such as printing resistors and plating resistors are sealed space parts (14).
It is provided inside.

By the way, the sealing material (22) for sealing is adhered on the recess (4) of the one substrate (2) where the microcomputer (6) is exposed, so that the microcomputer (6) is completely sealed.

When the microcomputer (6) is replaced in this embodiment,
With the hybrid integrated circuit itself attached (fixedly connected) to the mounting substrate, the microcomputer (6) is detached from the hybrid integrated circuit,
It can be easily replaced by inserting a microcomputer (6) containing another ROM.

A specific example of a hybrid integrated circuit device for an inverter for driving a motor according to the present invention will be shown below.

An inverter for driving a motor generally makes an arbitrary AC power supply from a DC power supply and arbitrarily controls the rotation speed of a three-phase motor, for example. That is, a DC power supply obtained by rectifying a commercial AC power supply using a rectifier circuit is used as a power supply. The input DC power source is called an inverter main circuit, and chopping is performed under a predetermined control signal using a switch element having a three-phase bridge structure to output a pseudo AC to a load. By changing the control signal, the output AC voltage and frequency can be varied, and the rotation speed and torque of the motor can be variably adjusted.

The motor drive inverter will be briefly described with reference to the block diagram shown in FIG.

FIG. 10 is a block diagram when a motor driving inverter is mounted on the integrated circuit boards (2) and (3).

The motor drive inverter chops the rectifier circuit (21) that inputs AC power and converts it to DC, and the DC power output from the rectifier circuit (21) at specified intervals to supply pseudo AC to the load (motor). Inverter main circuit (22)
And a microcomputer (6) (hereinafter referred to as a microcomputer) which supplies an output signal for chopping the inverter main circuit (22) at a predetermined interval and an output signal for operating the other device, and is output from the microcomputer (6). A buffer (23) for amplifying the output signal as desired and a buffer (2
3) A signal amplified by the first interface (24) for transmitting the signal amplified by the base amplifier (25) having a different potential and a signal transmitted from the first interface (24) are amplified to the inverter main circuit (22). Supplied from the base amplifier (25) and the rectifier circuit (21) to the inverter main circuit (22)
The first interface (24) by detecting the current supplied to the inverter and detecting the heat generation of the inverter main circuit (22).
A protection circuit (26) for feeding back a predetermined signal to the microcomputer (6) through the microcomputer to protect the inverter main circuit (22) and peripheral circuits, and a second circuit for inputting and outputting signals having different potentials to the microcomputer (6). It is composed of an interface (27) and an output buffer (28) for amplifying the output signal output from the microcomputer (6) to supply it to an external device. The respective configurations described above will be briefly described below.

First, the rectifier circuit is composed of a well-known diode bridge circuit, and is for converting commercial alternating current into direct current. In this embodiment, the rectifier circuit is composed of chip parts on the substrate, but when the rectifier circuit is externally attached, it may occur depending on the purpose of use, but the present invention does not cause any problems.

Next, as shown in FIG. 11, the inverter main circuit (22) has two switching elements (22a) connected in series (transistor, MOSFET, IGBT, etc.) connected in parallel (bridge connection). In this embodiment, a transistor element will be used for description. The explanation is continued below.
A flywheel diode is connected between the collector and emitter of each transistor of the main circuit (22), and output terminals (U, V, W) for connecting each series-connected transistor and a load. ) Is provided. Also,
(22b) is an input terminal for input.

Next, the microcomputer (6) is, for example, the LM8051P (made by Sanyo) IC
A chip is used.

Figure 12 is a block diagram showing the basic configuration of the microcomputer.
A CPU (4a) that fetches and executes instructions, a memory unit (4b) that stores predetermined program data, and an I / O port unit (4c) that inputs and outputs data to and from external devices.
It consists of Since the microcomputer (6) itself has nothing new, it will not be described in detail here. Inverter main circuit (2
2) and the desired external device is controlled.

Next, as the buffer (23), an IC chip such as LC4049B (manufactured by Sanyo) is used. The buffer (23) amplifies an output signal from the microcomputer (6) in a predetermined manner.

Next, the first interface (24) is composed of multiple photocouplers, for example, an IC such as PC817 (made by Sharp).
It is composed of chips. As described above, the first interface (24) optically transmits the output signal output from the buffer (23) to the base amplifier (25).

Next, as shown in FIG. 13, the base amplifier (25) receives a signal input terminal (25a) to which the signal output from the first interface (24) is input and a signal input from the input terminal (25a). First and third transistors (Tr ₁ ) (Tr ₃ ) that are supplied and turned on and off, and a third transistor (Tr ₁ )
The first transistor (Tr ₁ ) to which the collector and the base of the are connected, and the second transistor (Tr ₂ ) connected between the minus line, the resistor and the diode connected between the power supply lines, and the diode in parallel. It consists of a capacitor connected to. Also, the first and second
An output terminal (25b) is provided for connecting the transistors and the base and emitter of each transistor of the inverter main circuit. For example, when an ON signal is input to the signal input terminal (25a) of the base amplifier (25), the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are turned on, and the second transistor (Tr ₂₎ ) Turns off. Then, a desired current is supplied from the power supply (V _D ) to the base of the inverter main circuit (22) via the first transistor (Tr ₁ ) and the control resistor R ₁ . Further, when the signal is OFF, the first transistor (Tr ₁ ) and the third transistor (Tr ₁ ) are OFF, and the second transistor (Tr ₂ ) is ON. Then, the power supply made up of the diode and capacitor accelerates the turning off of the inverter main circuit (22).

Next, as shown in FIG. 14, the protection circuit (26) is provided in the vicinity of the inverter main circuit (22) and includes a temperature detecting section (diode or the like) configured to detect a temperature rise due to heat generation of the inverter main circuit (22). 26a), a current detection section (26b) composed of a resistor for detecting a current supplied from the rectification circuit (21) to the inverter main circuit (22), and a reference voltage section (26c) forming an internal reference voltage. , The respective detectors (26a) (26
a voltage comparison unit (26d) that compares the output signal from b) with the signal output from the reference voltage unit (26c);
The control signal output section (26e) is provided to feed back the signal from d) to the microcomputer (6).

Next, the first interface (27) is composed of a plurality of photocouplers like the first interface (24), and the signals input / output from the microcomputer (6) and the input terminals (S ₀ , S ₁ ) are transferred to the microcomputer ( It is transmitted to 6).

Finally the output buffer (28) is LC as well as the buffer (23).
An IC chip such as 4049B (manufactured by Sanyo) is used to amplify the signal from the microcomputer (6) and output terminal (PO
_It outputs a signal to _{0 to} PO ₉ .

The operation of the motor drive inverter will be briefly described below.

When commercial AC is input from the terminal (21a), it is converted to DC by the rectifier circuit (21) as described above. The converted direct current is supplied to the inverter main circuit (22). The output terminals (U, V, W) of the inverter main circuit (22) are connected to a load (motor) and supply a desired current to the load.

When a predetermined control or command signal is input from the input / output terminals (S ₀ , S ₁ , digital input terminals (D _{0 to} D ₅ , analog input terminals A _{0 to} A ₈ ), the microcomputer (6) It operates according to an input signal, that is, it outputs a control signal for executing a predetermined process based on program data in a memory stored in the microcomputer (6) based on the input signal. The signal is amplified by the buffer (23) and supplied to the base amplifier (25) via the first interface (24).

The signal supplied to the base amplifier (25) is supplied to the base of each transistor element of the inverter main circuit (22), and each transistor element of the inverter main circuit (22) is turned on and off to chop the direct current to generate a pseudo alternating current. Is formed and AC is supplied to the load through the output terminals (U, V, W) to rotate the load at a predetermined rotation speed.

That is, DC is chopped by the inverter main circuit (22) based on predetermined program data in the microcomputer (6) and converted into AC. Also, bass amplifier (25)
A separate power supply is always applied to the V _{D1 to} V _D4 terminals.

If the program data in the microcomputer (6) described above is converted, that is, if it is converted into another microcomputer, it is possible to control the rotation according to the program data contained in the microcomputer.

The signals output from the output terminals PO _{0 to} PO ₉ are microcomputer (6)
The microcomputer (6) outputs a signal based on the result of predetermined signal processing based on the input command input to the. The output signals output from the output terminals PO _{0 to} PO ₉ control external equipment or devices. For example, in the case of an inverter air conditioner, an electromagnetic relay, a valve for adjusting the refrigerant, etc. are controlled in a predetermined manner in response to a temperature change in the room.

When performing the above-mentioned inverter operation, the inverter system, that is, the temperature on the boards (2) and (3) is designed to be less than or equal to the maximum rated temperature, but the system itself does not operate under an abnormal environment (high temperature). When used in high humidity, or when heat radiation is not performed normally, the temperature of the inverter main circuit (22) and surroundings may rise abnormally, which may damage the system or set. The abnormal temperature is detected by the temperature detecting section (26a) of the protection circuit (26) to stop the operation of the inverter and suppress the heat generation of the inverter to protect the set or the system. Also, a load is connected to the inverter main circuit (22), but a short circuit due to an abnormality in the wiring inside the load, a short circuit in the output terminals (U, V, W), or a malfunction of the microcomputer (6) due to external noise The serially connected elements of the inverter main circuit (22) turn on simultaneously
If this happens, an abnormally large current flows into the inverter main circuit (22), but even in this case, the current detection unit (26b) in the protection circuit (26) detects the large current and immediately stops the operation for protection. To do.

By performing the above-described operation, the operation of the motor drive inverter is performed, and the rotation control of the load (motor) and the operation of the external device are controlled in a predetermined manner to normally operate the control of the inverter air conditioner or the like.

FIG. 15 is a plan view showing a case where the motor driving inverter circuit shown in FIG. 10 is mounted on the other substrate (3) of this embodiment, and the reference numerals of the respective circuit elements mounted are those shown in FIG. The same reference numerals as those shown in the block diagram of FIG. Since the conductive path connecting the plurality of circuit elements is complicated, it is indicated by an arrow.

As shown in FIG. 15, a plurality of fixing pads (3a) to which external lead terminals (13) are fixed are provided on the opposite peripheral edges of the other substrate (3). A socket (16) for mounting a plurality of circuit elements and a microcomputer (6) is fixed at a predetermined position on a conductive path (5) extending from the fixing pad (3a). A plurality of circuit elements other than the microcomputer (6) are fixed on the other board (3). (21) is a rectifier circuit, (25) is a base amplifier, (23) is a buffer, (24)
Is a first interface, (27) is a second interface, (28) is an output buffer, and (26) is a protection circuit. In addition, a plurality of conductive paths (5) are extended from the substrate (3) through a film resin layer (10) such as polyimide on one substrate (2), and the inverter main circuit is provided on the substrate (2). Some circuits necessary for the inverter such as (22) or optional circuits are arranged.

As is clear from FIG. 15, the vicinity of the circuit element most closely related to the microcomputer (6) (here, buffer and output buffer)
A socket (16) on which a microcomputer (6) is mounted is fixed at a position adjacent to. Further, the area surrounded by the one-dot chain line indicates that the case material (7) is fixed by the adhesive sheet.

FIG. 16 is a plan view of a completed hybrid integrated circuit device for an inverter when one substrate (2) is fixed to the other substrate (3) shown in FIG. 15 via a case material (7). And
Only the upper surface of the microcomputer (6) disposed in the recess (4) is exposed from the upper surface of the one substrate (2). That is, all the elements other than the microcomputer (6) are sealed in the sealed space (21) formed by the case material (7) and the two substrates (2) and (3), and the microcomputer (6) Since only the upper surface of the microcomputer (6) is exposed, the microcomputer (6) can be freely inserted and removed as needed.

That is, in this embodiment, as shown in FIGS. 15 and 16, only all peripheral circuits necessary for inverter control are formed on the two substrates (2) and (3). That is,
Only the peripheral circuits required for inverter control are formed on the boards (2) and (3), so that the mask ROM type microcomputer (6) inserted in the socket (16) can be replaced to replace the two boards. It becomes possible to instantaneously mount different microcomputers (6) on one hybrid integrated circuit device constituted by.

More specifically, it is assumed that the microcomputer (6) having the motor rising waveform (A) shown in FIG. 17 is already inserted in the socket (16). When the motor is rotated with the waveform of (B) in this hybrid integrated circuit device, if the microcomputer (6) for (B) is inserted, different rising waveforms in the same hybrid integrated circuit device, that is, the number of rotations of the motor is arbitrary. It can be changed instantly. Also, of course,
Similarly, the microcomputer (6) having the waveform of (C) is replaced.

As described above, in this embodiment, the minimum peripheral circuits required for inverter control are formed on the two substrates (2) and (3).
Two microcomputer boards (2) can be attached and detached (replaced) with different microcomputers (6) via sockets (16).
One hybrid integrated circuit device having (3) can implement a microcomputer with different data. As a result, high density 1
With one hybrid integrated circuit device, a device having different motor rising waveforms can be instantly realized.

The microcomputer (6) of the hybrid integrated circuit device of the motor drive inverter described in detail above is changed or driven in accordance with the diversification of product specifications, such as the destination, OEM, and in-house sales. It is possible to easily cope with a case where a problem such as uneven rotation occurs due to a subtle design error of the motor itself. That is, the microcomputer (6)
Other circuit configurations were designed in advance to accommodate various specifications changes.However, if a hybrid integrated circuit is designed based on the specifications of a specific user or a specific motor, the specifications may change due to errors of other users or the motor itself. In the past, it was necessary to re-examine the design of the hybrid integrated circuit itself when there is a case where it does not match.

However, in the hybrid integrated circuit device of the present invention, the microcomputer (6) is mounted on the other substrate (3) via the socket (16) and the surface thereof is a recess provided on one circumferential edge of the one substrate (2). Since (4) is in an exposed state, the microcomputer (6) can be detached, so that the user can select and mount the microcomputer on the side of the user or after mounting, and one hybrid integrated circuit device can be used for mounting various microcomputers. An integrated circuit device can be realized.

According to the present invention, the recess (4) is provided at a desired position on the peripheral edge of one substrate (2), and the conductive path (5) is formed on the other substrate (3) exposed by the recess (4). ) To socket (16)
Connect the microcomputer (6) via the two boards (2)
Sealed space (21) formed by (3) and case material (7)
By fixing the peripheral circuit element (8) to the integrated circuit device (8), a device in which the hybrid integrated circuit device and the microcomputer are integrated can be formed and the microcomputer can be easily inserted and removed as necessary.

Therefore, one hybrid integrated circuit device can be used to freely attach and detach a different type or the same type of microcomputer (6) prepared in advance. For example, as shown in FIG. 17, each data of rising waveforms A, B, C of different motors can be obtained. Each microcomputer has (6)
Can be realized without developing a single hybrid integrated circuit device, and the merit thereof is great.

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, the recess (4) is provided at a desired position on the peripheral edge of the one substrate (2), and exposed by the recess (4). Since the microcomputer (6) is connected to the conductive path (5) on the other substrate (3), the placement position of the microcomputer (6) can be arbitrarily set. Therefore, it is possible to arrange the circuit element most closely related to the adjacent position of the microcomputer (6), and as a result, the data line for exchanging data between the microcomputer (6) and the circuit element can be arranged with the shortest distance or the layout which is the easiest to design. This can be realized, and the loss of mounting density due to the routing of data lines can be suppressed to a minimum. Further, since it is formed of two substrates (2) and (3), it is possible to provide a high-density and small-sized hybrid integrated circuit device.

Secondly, since the microcomputer (6) is arranged in the recess (4) provided on the peripheral side of one substrate (2), the commercially available mold type microcomputer (6) is used. It has an advantage that it can be handled as an integrated small-sized hybrid integrated circuit device. Further, by improving the packaging density of the peripheral circuit elements to be incorporated on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated and one miniaturized microcomputer ( It is possible to realize a hybrid integrated circuit device in which 6) is detachably incorporated.

Third, the other integrated circuit board (3) with respect to the recess (4)
By providing the socket (16) on the upper side, in the mounting structure shown in FIG. 19, only the printed circuit board integrated circuit having only the function of the microcomputer initially mounted could be realized, but in the present invention, the microcomputer to be inserted into the socket (16) is provided. (6) can be replaced, and different or the same type of microcomputer (6) can be mounted in one hybrid integrated circuit device. As a result, 1
One hybrid integrated circuit device can instantaneously provide different control devices.

By using the metal substrate as the fourth integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, and the mounting density can be further improved. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fifth, since it is possible to use the dual in-line type, LCC type or QIP type that is commercially available as a microcomputer,
There is an advantage that mounting of the microcomputer (6) on the hybrid integrated circuit device can be realized very easily. Furthermore, by making the outer shapes of the recess (4) and the microcomputer (6) the same, they can be embedded exactly in the frame body (18) of the case material (7), realizing a very clean integrated hybrid integrated circuit device with built-in microcomputer. it can.

Sixth, the peripheral circuit element (8) connected to the microcomputer (6) is a case material (7) and two integrated circuit boards (2).
Since it is incorporated in the sealing space (21) formed by (3) in the shape of a die or a chip, it occupies a much smaller area than a resin-molded one like a conventional printed circuit board, and the mounting density is reduced. It has the advantage that it can be greatly improved.

Seventh, case material (7) and two integrated circuit boards (2)
By making the peripheral edges of (3) substantially coincide with each other, it can be used as a sealing space (21) on almost the entire surface of the integrated circuit board (2) (3), and is extremely compact in combination with improved packaging density. The device can be realized.

Eighth, there is an advantage that a hybrid integrated circuit device having a flat upper surface can be realized by matching the upper surfaces of the one substrate (2) and the microcomputer (6).

Ninth, by connecting the microcomputer (6) via the socket (16), various hybrid microcomputers (6) can be instantly replaced by one hybrid integrated circuit, and a multifunctional hybrid integrated circuit device is realized. You can

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a perspective view showing a case member used in this embodiment, FIG. 4 is a sectional view of a substrate used in this embodiment, and FIGS. 5 to 8 are resin-molded microcomputers. FIG. 9 is a perspective view and a sectional view, FIG. 9 is an enlarged perspective view of an essential part showing the periphery of the microcomputer on the board, FIG. 10 is a block diagram showing a motor drive inverter used in this embodiment, and FIG. 11 is FIG. FIG. 12 is a circuit diagram showing the main circuit of the inverter shown in FIG. 12, FIG. 12 is a block diagram showing the microcomputer of the inverter shown in FIG. 10, and FIG. 13 is a circuit diagram showing the base amplifier of the inverter shown in FIG. Figure is a block diagram showing the protection circuit of the inverter shown in Figure 10, Figure 15 is a plan view of the block diagram shown in Figure 10 mounted on the other substrate, and Figure 16 is shown in Figure 15. FIG. 17 is a plan view of one of the substrates shown in FIG. FIG. 18 is a characteristic diagram showing a rising waveform of a motor, and FIGS. 18 and 19 are perspective views showing a conventional microcomputer mounting structure. (1) ... Hybrid integrated circuit device, (2) (3) ... Integrated circuit board, (5) ... Conductive path, (6) ... Microcomputer,
(8) ... Circuit element, (4) ... Dimple, (7) ... Case material, (16) ... Socket, (22) ... Sealing material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Nakamoto 2-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Koji Nagahama 2-18-2 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18 Keiyohondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 1 414, Omama, Yamada-gun, Gunma Prefecture Tokyo IC Co., Ltd.

Claims (3)

[Claims] 1. Two integrated circuit substrates arranged to face each other, a conductive path having a desired pattern formed on the main surfaces of the substrate facing each other, and desired program data connected to the conductive path. A microcomputer containing a built-in microcomputer, a peripheral circuit element supplied with a predetermined control output signal from the microcomputer and connected to a conductive path on the substrate, and a case member integrated between the substrates, A recess is provided at a desired position on one substrate, the microcomputer is arranged in the conductive path on the other substrate exposed by the recess, and the peripheral circuit is provided in a sealed space formed by the both substrates and the case. A hybrid integrated circuit device in which elements are arranged. 2. Two integrated circuit boards arranged to face each other, a conductive path having a desired pattern formed by a conductive metal foil on the main surfaces of the boards facing each other, and a desired connection to the conductive path. And an LCC type or QIP type microcomputer having program data incorporated therein and a peripheral circuit element which is supplied with a predetermined control output signal from the microcomputer and is connected to a conductive path on the substrate and the substrate. And a recess having substantially the same shape as the outer shape of the microcomputer is provided in the peripheral portion of the one substrate, and the case member is connected to the conductive path on the other substrate exposed by the recess. The microcomputer is arranged via a socket, and the peripheral circuit element is arranged in a sealed space formed by the both substrates and the case. Hybrid integrated circuit device. 3. Two integrated circuit substrates arranged to face each other, a conductive path having a desired pattern formed on the main surfaces of the substrate facing each other, and desired program data connected to the conductive path. A microcomputer containing a built-in microcomputer, a peripheral circuit element supplied with a predetermined control output signal from the microcomputer and connected to a conductive path on the substrate, and a case member integrated between the substrates, A recess having substantially the same shape as the outer shape of the microcomputer is provided in one peripheral part of one substrate, and the recess is exposed through the recess and is arranged via a socket connected to the conductive path on the other substrate. The surface of the microcomputer and the surface of the one substrate are substantially aligned with each other, and the peripheral circuit element is arranged in a sealed space formed by the both substrates and the case. And a hybrid integrated circuit device.