JPH079965B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an EPROM-embedded microcomputer-mounted hybrid integrated circuit device in which a chip-type EPROM-embedded microcomputer is mounted on an integrated circuit substrate.

(B) Conventional technology EP with an ultraviolet irradiation window that can erase the stored information that has already been written by irradiating it with ultraviolet rays and rewrite it
Microcomputer elements with a built-in ROM are preferably used in various electronic devices. This EPROM built-in microcomputer is currently used together with a control or drive integrated circuit.
Most of them are mounted on a printed wiring board. For various electronic devices that are required to be small and lightweight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board, and after the required wiring is performed, this The IC chip including the wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

The conventional EPROM built-in microcomputer mounting structure will be described with reference to FIG. 12, which shows a conventional EPROM.
FIG. 1 is a perspective view with a partial cross section of a built-in microcomputer, which shows a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like having a conductive wiring pattern (41) formed on a main surface. ) Microcomputer with built-in EPROM (4
4) is installed. The EPROM built-in microcomputer (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) by an external lead (48) or a low melting point glass material. There is.
Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed in glass is adhered onto the low melting point glass material or the ceramic base material (47). An EPROM built-in microcomputer chip (51) is mounted on the element mounting portion (50), and the electrodes of the chip (51) and the external lead-outs (48) are connected by a thin metal wire (52). This cap (46) is EPRO placed on the header (45) by low melting glass
The built-in microcomputer chip (51) is sealed. In this way, a microcomputer chip (5
Microcomputer with built-in EPROM (1) sealed
The external lead-out lead (48) is inserted into the through hole (43) of the insulating substrate (42) and fixed by soldering.
The through hole (43) is routed by the conductive wiring pattern (41) as required, and the male connector terminal portion (55) provided at the end of the insulating substrate is transferred to a female connector (not shown). Connected with.

Now, in the conventional mounting structure of the microcomputer element with built-in EPROM, the package outer shape is much larger than that of the microcomputer chip (51) with built-in EPROM, and the plane occupancy ratio is also three-dimensional, that is, the height is the number of chips. It is doubled, which is extremely disadvantageous for thinning. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM-embedded microcomputer device is once assembled in a package prior to mounting on an insulating substrate.

Although the cerdip package type microcomputer device with a built-in EPROM has been described here, the above-mentioned problems also occur in the resin-sealed package.

In order to solve such a problem, the mounting structure shown in FIG. 13 has already been used.

The EPROM built-in microcomputer mounting structure shown in FIG. 13 will be described below.

On the insulating substrate (60) such as a glass / epoxy resin plate with the conductive wiring pattern (60b) formed on the main surface (60a), the chip mounting area () for mounting the EPROM built-in microcomputer chip (61) 60c), and the wiring pattern (60b) is routed from the vicinity of this area on the main surface (60a) and connected to a male connector terminal portion (not shown). A microcomputer chip (61) with a built-in EPROM is mounted in the area (60c), and the surface electrode of the chip (61) and the wiring pattern (60b) are formed by a thin metal wire (6).
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon.

It is already known as a well-known technique to mount the EPROM-embedded microcomputer chip directly on the substrate as described above.

(C) Problem to be Solved by the Invention Needless to say, in the structure for mounting the microcomputer with built-in EPROM shown in FIG. 13, the chip of the microcomputer with built-in EPROM is die-bonded onto the printed circuit board, resulting in miniaturization. Absent. However, the miniaturization referred to here is only miniaturization of the EPROM built-in microcomputer itself. That is, although not clearly shown in FIG. 13, since the peripheral circuit elements fixed to the periphery of the EPROM built-in microcomputer are composed of electronic components such as discretes, a printout mounted with the EPROM built-in microcomputer is provided. When the entire system as an integrated circuit for a board is viewed, it cannot be downsized at all, and there is a problem that the printed board is upsized as usual, that is, the entire system is upsized.

Also, in the mounting structure shown in FIG. 12, as in FIG. 13, circuits around the EPROM built-in microcomputer, that is, L
Since circuit elements such as SI and IC are composed of electronic components such as discretes, the printed circuit board becomes large, that is, the entire system becomes large, and the light, thin, short, and small EP required by users.
There is a big problem that it is not possible to provide an integrated circuit equipped with a microcomputer with built-in ROM.

Furthermore, in the EPROM built-in microcomputer mounting structure shown in FIGS. 12 and 13, as described above, the entire system becomes large and the conductive patterns for connecting the EPROM built-in microcomputer and its peripheral circuit elements to each other are exposed. Therefore, there is a problem that reliability is lowered.

Further, in the EPROM built-in microcomputer mounting structure shown in FIG. 12 and FIG. 13, the EPROM built-in microcomputer and the peripheral circuit elements such as IC and LSI are exposed, so that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle. There is a problem of reduced workability.

(D) Means for Solving the Problems The present invention has been made in view of the above-described problems, and has an EPROM built-in microcomputer chip mounted on one substrate and connected to the EPROM built-in microcomputer chip. Peripheral circuit elements are mounted on each board, and all peripheral circuit elements are hermetically sealed in the sealed space formed by the case material and both boards. Only the EPROM built-in microcomputer chip is surrounded by the case material. It has a structure provided on one of the substrates protruding from a predetermined position.

Therefore, a hybrid integrated circuit equipped with a microcomputer chip with built-in EPROM can be extremely miniaturized.

(E) Function As described above, according to the present invention, since the microcomputer chip with the built-in EPROM is connected to one of the substrates extended to the periphery of the case material, the mounting position of the microcomputer chip with the built-in EPROM can be changed to the case material. Since it can be set arbitrarily in the periphery, it is efficient considering the electrical connection between the EPROM built-in microcomputer chip and the most related circuit elements.
It is possible to connect the EPROM and the circuit element most closely related thereto, and it is possible to eliminate the need for a signal line, that is, a wiring line for a conductive path.

Furthermore, as described above, the most closely related circuit element can be placed around the adjacent substrate of the microcomputer chip with built-in EPROM, and the data line for exchanging data between the microcomputer chip with built-in EPROM and the circuit element can be used for the shortest distance or the minimum distance. It is possible to realize high-density mounting by minimizing the loss of mounting density due to routing of data lines.

Further, in the present invention, all elements other than the EPROM built-in microcomputer chip are housed in a chip-like shape and are housed in the sealed space formed by the case material and the substrate, so that a hybrid integrated circuit device that is compact and easy to handle is provided. Can be provided.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described below in detail with reference to the embodiments shown in FIGS. 1 to 10.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in the field of a wide range of inverter motors such as an inverter air conditioner.

As shown in FIGS. 1 and 2, this hybrid integrated circuit device (1) has two integrated circuit boards (2) and (3) and a desired one formed on the integrated circuit boards (2) and (3). A micro computer chip (6) with a built-in EPROM connected to a conductive path (4) in a shape and a conductive path (4) on a protruding substrate (2a) extending from one substrate (2) and protruding from a case material (5) ) (Hereinafter referred to as an EP microcomputer chip) and its peripheral circuit element (8) supplied with data from the EPROM built-in microcomputer chip (6) and connected to the conductive path (4) on one substrate (2), It comprises a case member (5) which is integrated with both substrates (2) and (3) and exposes the protruding substrate (2a).

Both integrated circuit boards (2) and (3) are hard boards made of ceramics, glass epoxy, metal or the like. In this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 3, an aluminum oxide film (9) (almite layer) is formed on the surface of the substrates (2) and (3) by well-known anodic oxidation, and the aluminum oxide film (9) (alumite layer) is formed on one main surface side of the aluminum oxide film (9).
A flexible insulating resin layer (10) made of polyimide or the like having a thickness of about 70 μm is attached. Furthermore, a copper foil (11) having a thickness of 10 to 70 μm is adhered to the insulating resin layer (10) at the same time as the insulating resin layer (10) by means such as a roller or a hot press. By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (4).
Is formed. Since the thinness of the conductive path (4) by screen printing is 0.5 mm, when it is necessary to use a very fine wiring pattern, it is possible to use about 2 by the well-known photo-etching technique.
It is possible to form ultrafine conductive paths (4) up to μ.

A part of the peripheral edge of one substrate (2) is formed so as to protrude from the peripheral edge of the other substrate (3), and the protruding substrate (2a) is projected at a predetermined position on the conductive path (4). Is connected to a microcomputer chip (4) with a built-in EPROM, and a plurality of peripheral circuits including the most closely related circuit elements to which data is supplied from the microcomputer chip (6) with a built-in EPROM on one substrate (2) in the vicinity thereof. A circuit element (8) is mounted and connected to the conductive path (4). Further, circuit elements necessary for circuit operation are mounted on the other substrate (3). The conductive path (4) is formed to extend over substantially the entire surfaces of both substrates (2) and (3), and the leading end of the conductive path (4) extending to the peripheral ends of both substrates (2) and (3) is a lead. A sticking pad is formed,
External lead terminals (12, 13) are fixed to the pad. The external leads (12) (13) are bent and formed at a substantially right angle for mounting on the mounting substrate. Further, since the conductive paths (4) formed on both the substrates (2) and (3) are formed on the flexible resin layer (10), the two substrates (2) and (3) are cleaved. Both substrates (2) and (3) that are patterned can be connected at predetermined positions and arbitrarily.

As is well known, the EP microcomputer chip (6) is mainly composed of a program processor (CPU), a program memory such as RAM, EPROM,
It is an element that combines a peripheral device with an input / output interface. Since the EP microcomputer chip (6) is commercially available, the description of the EP microcomputer chip (6) is omitted here.

The IC, transistor, and peripheral circuit element (8) supplied by selecting the program data from the EP microcomputer chip (6)
Chip resistors, chip capacitors, etc. are attached to the desired conductive paths (4) in a chip state by soldering or a brazing material such as Ag paste, and the circuit element (8) is bonded to the nearby conductive paths (4) by bonding. There is. Further, a carbon resistor by screen printing and a nickel-plated resistor by nickel plating are formed as resistive elements between the conductive paths (4).

On the other hand, the case material (5) is made of a thermoplastic resin as an insulating member, and as shown in FIG. 4, both the substrates (2) and (3).
It is formed in a frame shape so that a sealed space is formed when it is fixed. The peripheral edge of the frame-shaped case material (5) is arranged substantially at the peripheral edges of both substrates (2) and (3), and the adhesive sealant (J sheet: product name) is used for the substrate (2). (3)
It is firmly fixed and integrated with. As a result, the substrate (2)
A predetermined sealed space portion (14) is formed between (3) and the case material (5). Further, one side of the case member (5) is formed in an arc shape so that the film resin layer (10) can be easily bent when both substrates (2) and (3) are arranged.

The case material (5) and the two substrates (2) and (3) are fixed to each other by the adhesive sheet as described above, and the two substrates (2) and (3) connected by the film resin layer (10) form a case. The material (5) is fixed so as to sandwich it and the mounted circuit elements (8) face each other. At this time, both substrates (2)
The film resin layer (10) connecting (3) is abutted against the arcuate portion provided on the case member (5) and bent, so that the conductive path (4) at the bent portion is bent at the time of bending. There is no fear of cutting. After the case material (5) and the two substrates (2) and (3) are integrated, the resin layer (10) of the connecting portion is exposed, so in this embodiment, the connecting portion exposed by the lid (20). Shall be completely sealed. The lid (20) is the case material (5).
It is formed of the same material as, and is adhered by means such as the above-mentioned adhesive sheet.

In the present embodiment, a part of one peripheral edge of one substrate (2) is projected from the case material (5) to expose the protruding substrate (2a), and the protruding substrate (2a) is mounted with the EP microcomputer chip (6). It is formed so that it can be placed. The protruding substrate (2a) is formed on four sides of one substrate (2) or four of the other substrate (3).
It can be provided at any position on the side, and its position is determined by the relationship between the EP microcomputer chip (6) and the circuit element (8) which is most closely related.

On the protruding substrate (2a) extending from one substrate (2) exposed from the case material (5), a plurality of conductive paths (4) for ultrasonic bonding connection with the electrodes of the EP microcomputer chip (6) are formed. One end is extendedly formed, and the EP microcomputer chip (6) is fixedly mounted on the tip of the conductive path (4). The other end of the conductive path (4) to which the EP microcomputer chip (6) is fixed is EP
It is efficiently routed in the vicinity of the circuit element (8) which is most closely related to the microcomputer chip (6) and electrically connected to the circuit element (8) in a chip shape by a bonding wire.

Here, the positional relationship between the EP microcomputer chip (6) and the circuit element (8) which is most closely related will be described. Since the EP microcomputer chip (6) and the chip-shaped circuit element (8) are connected via a large number of conductive paths (4), the conductive paths (4)
The circuit elements (8) most closely related to the EP microcomputer chip (6) are arranged so as to be adjacent to each other or as close to each other as possible in order to shorten the routing. Therefore, the conductive path (4) between the EP microcomputer chip (6) and the circuit element (8) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. The EP microcomputer chip (6) and the chip-shaped circuit element (8) arranged in the vicinity of or adjacent to the EP microcomputer chip (6) are bonded and connected by a wire line to the tip end of the conductive path (4) extending in the vicinity thereof. It is electrically connected to the microcomputer chip (6).

As is apparent from FIGS. 1 and 2, the EP microcomputer chip is mounted on a protruding substrate (2a) extending from one substrate (2) and protruding from the case material (5). More specifically, on the protruding substrate (2a), the EP microcomputer chip (6) and its EP
A wire wire that connects the EP microcomputer chip (6) and the nearby conductive path (4) will be mounted.

Furthermore, one or more layers of resin are coated on the protruding substrate (2a),
The EP microcomputer chip (6) and the wire wire are completely covered by the resin layer. The first layer resin that is directly coated on the EP microcomputer chip (6) needs to transmit ultraviolet rays when erasing the data of the EP microcomputer chip (6), so the ultraviolet transparent resin (21a) is used. To be The ultraviolet-transparent resin (21a) is not limited as long as it is a non-aromatic resin, and for example, methyl silicon rubber or silicon gel is used.

In this embodiment, the second resin layer (21b) is filled on the first resin layer (21a). Unlike the first layer, the second resin layer is made of a UV impermeable resin (21b) that blocks UV rays in order to prevent erroneous erasing of the EP microcomputer chip (6). The resin layer (21b) is not limited as long as it is a resin containing an aromatic ring (benzene ring), and for example, an epoxy resin or a polyimide resin is used.

Therefore, only the EP microcomputer chip (6) is mounted on the protruding substrate (2a) and covered with two layers of resin, and the other circuit elements (8) include both substrates (2) (3) and the case material (5). It will be arranged in the sealed space (14) formed by.

As described above, the peripheral circuit element (8) connected to the EP microcomputer chip (6) is arranged in the sealed space (14) formed by both substrates (2) and (3) and the case material (5). It is set to do. That is, all elements such as chip-shaped electronic components and resistance elements such as printing resistors and plating resistors are provided in the sealing space (14).

In this embodiment, when the data of the EP microcomputer chip (6) is erased, the ultraviolet ray opaque resin (21b) is peeled off and the ultraviolet rays are irradiated, and when the data is rewritten, the ultraviolet rays of the EP microcomputer chip (6) are transmitted. The conductive resin (21a) is also peeled off and a terminal such as a probe is brought into contact with the conductive path (4) in the vicinity of the bonding, and data is written by the writing device. At this time, when removing the ultraviolet transparent resin (21a),
In a), the wire is not cut because the adhesive strength is not so strong.

A specific example of a hybrid integrated circuit device for an inverter for driving a motor according to the present invention will be shown below.

An inverter for driving a motor generally makes an arbitrary AC power supply from a DC power supply and arbitrarily controls the rotation speed of a three-phase motor, for example. That is, a DC power supply obtained by rectifying a commercial AC power supply using a rectifier circuit is used as a power supply. The input DC power supply is called an inverter main circuit, and chopping is performed under a predetermined control signal using a switching element having a three-phase bridge structure to output a pseudo AC to a load. By changing the control signal, the output AC voltage and frequency can be made variable, and the rotation speed and torque of the motor can be adjusted variably.

The motor driving inverter will be briefly described based on the block diagram shown in FIG.

FIG. 5 is a block diagram when a motor driving inverter is mounted on the integrated circuit boards (2) and (3).

The motor drive inverter chops the rectifier circuit (21) that inputs AC power and converts it to DC, and the DC power output from the rectifier circuit (21) at specified intervals to supply pseudo AC to the load (motor). Inverter main circuit (22)
And an EPROM built-in microcomputer (6) for supplying an output signal for chopping the inverter main circuit (22) at predetermined intervals and an output signal for operating the other device.
(Hereinafter referred to as an EP microcomputer chip), a buffer (23) for amplifying an output signal output from the EP microcomputer chip (6) as desired, and a base amplifier (25) having a different potential for the signal amplified by the buffer (23). ) To the first interface (24) and the first interface (2
4) A base amplifier (25) that amplifies and supplies the signal transmitted from the inverter to the inverter main circuit (22), and a rectifier circuit (21)
The current supplied from the inverter to the inverter main circuit (22) is detected, and the heat generation of the inverter main circuit (22) is detected.
Circuit (26) that protects the inverter main circuit (22) and peripheral circuits by feeding back a specified signal to the EP microcomputer chip (6) through the interface (24)
A second interface (27) for inputting and outputting signals having different potentials to the microcomputer (6), and an output buffer (28) for amplifying the output signal output from the EP microcomputer chip (6) to supply it to an external device. ) And is composed of. The respective configurations described above will be briefly described below.

First, the rectifier circuit is composed of a well-known diode bridge circuit, and is for converting commercial alternating current into direct current. In this embodiment, the rectifier circuit is composed of chip parts on the substrate, but when the rectifier circuit is externally attached, it may occur depending on the purpose of use, but the present invention does not cause any problems.

Next, as shown in FIG. 6, the inverter main circuit (22) has two switching elements (22a) connected in series (transistor, MOSFET, IGBT, etc.) connected in parallel (bridge connection). In this embodiment, a transistor element will be used for description. The explanation is continued below.
A flywheel diode is connected between the collector and emitter of each transistor of the main circuit (22), and output terminals (U, V, W) for connecting each series-connected transistor and a load. ) Is provided. Also,
(22b) is an input terminal for input.

Next, as the EP microcomputer chip (6), for example, an IC chip of LM8051P (manufactured by Sanyo) is used.

FIG. 7 is a block diagram showing the basic configuration of the microcomputer,
A CPU (4a) that fetches and executes instructions, a memory section (4b) that stores predetermined program data, and an I / O port section (4) that inputs and outputs data to and from external devices.
It is composed of c). Since the EP microcomputer chip (6) itself has nothing new, it will not be described in detail here. The EP microcomputer chip (6) controls the inverter main circuit (22) and desired external devices.

Next, as the buffer (23), an IC chip such as LC4049B (manufactured by Sanyo) is used. The buffer (23) amplifies an output signal from the EP microcomputer chip (6) in a predetermined manner.

Next, the first interface (24) is composed of multiple photocouplers, for example, an IC such as PC817 (made by Sharp).
It is composed of chips. As described above, the first interface (24) optically transmits the output signal output from the buffer (23) to the base amplifier (25).

Then, as shown in FIG. 8, the base amplifier (25) receives a signal input terminal (25a) to which the signal output from the first interface (24) is input and a signal input from the input terminal (25a). First and third transistors (Tr ₁ ) (Tr ₃ ) that are supplied and turned on and off, and a third transistor (Tr ₃ )
The first transistor (Tr ₁ ) to which the collector and the base of the are connected, and the second transistor (Tr ₂ ) connected between the minus line, the resistor and the diode connected between the power supply lines, and the diode in parallel. It consists of a capacitor connected to. Also, the first and second
An output terminal (25b) is provided for connecting the transistors and the base and emitter of each transistor of the inverter main circuit. For example, when an ON signal is input to the signal input terminal (25a) of the base amplifier (25), the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are turned on, and the second transistor (Tr ₂₎ ) Turns off. Then, a desired current is supplied from the power supply V _D to the base of the inverter main circuit (22) via the first transistor (Tr ₁ ) and the control resistor R ₁ .
Further, when the signal is OFF, the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are OFF, and the second transistor (Tr ₂ ) is ON. Then, the power supply made up of the diode and capacitor accelerates the turning off of the inverter main circuit (22).

Next, as shown in FIG. 9, the protection circuit (26) is provided in the vicinity of the inverter main circuit (22) and is provided with a temperature detecting section (such as a diode for detecting a temperature rise due to heat generation of the inverter main circuit (22) ( 26a), a current detection section (26b) composed of a resistor for detecting a current supplied from the rectification circuit (21) to the inverter main circuit (22), and a reference voltage section (26c) forming an internal reference voltage. , The respective detectors (26a) (26
a voltage comparison unit (26d) that compares the output signal from b) with the signal output from the reference voltage unit (26c);
It is composed of a control signal output section (26e) for feeding back the signal from d) to the EP microcomputer chip (6).

Next, the second interface (27) is composed of a plurality of photocouplers like the first interface (24), and is a signal input / output from the EP microcomputer chip (6) and the input / output terminals S ₀ and S _1. Is transmitted to the EP microcomputer chip (6).

Finally the output buffer (28) is LC as well as the buffer (23).
An IC chip such as 4049B (manufactured by Sanyo) is used, which amplifies the signal from the EP microcomputer chip (6) and outputs the signal to the output terminals PO ₀ and PO ₉ .

The operation of the motor driving inverter will be briefly described below.

When commercial AC is input from the terminal (21X), it is converted to DC by the rectifier circuit (21) as described above. The converted direct current is supplied to the inverter main circuit (22). The output terminals (U, V, W) of the inverter main circuit (22) are connected to a load (motor) and supply a desired current to the load.

When a predetermined control or command signal is input from the input / output terminals S ₀ and S ₁ , the digital input terminals D _{0 to} D ₅ , and the analog input terminals A _{0 to} A ₈ , the EP microcomputer chip (6) will It operates based on the input signal. That is, a control signal for executing a predetermined process based on the program data in the memory stored in the EP microcomputer chip (6) is output based on the input signal. The control signal is amplified by the buffer (23) and supplied to the base amplifier (25) via the first interface (24).

The signal supplied to the base amplifier (25) is supplied to the base of each transistor element of the inverter main circuit (22), and each transistor element of the inverter main circuit (22) is turned on and off to chop the direct current to generate a pseudo alternating current. Is formed and AC is supplied to the load through the output terminals (U, V, W) to rotate the load at a predetermined rotation speed.

That is, a predetermined program in the EP microcomputer chip (6)
Based on the data, the inverter main circuit (22) chops the direct current and converts it to alternating current. Further, another power supply is constantly applied to the base amplifier (25) via the V _{D1 to} V _D4 terminals.

If the program data in the EP microcomputer chip (6) described above is converted, that is, if it is converted to another microcomputer, the EP
The rotation can be controlled according to the program data stored in the microcomputer chip.

The signals output from the output terminals PO _{0 to} PO ₉ are output based on the result of the predetermined signal processing performed by the EP microcomputer chip (6) based on the input command input to the EP microcomputer chip (6). . The output signals output from the output terminals PO _{0 to} PO ₉ control external equipment or devices. For example, in the case of an inverter air conditioner, an electromagnetic relay, a valve for adjusting the refrigerant, etc. are controlled in a predetermined manner in response to a temperature change in the room.

When performing the above-mentioned inverter operation, the inverter system, that is, the temperature on the boards (2) and (3) is designed to be less than or equal to the maximum rated temperature, but the system itself does not operate under an abnormal environment (high temperature). When used in high humidity, or when heat radiation is not performed normally, the temperature of the inverter main circuit (22) and surroundings may rise abnormally, which may damage the system or set. The abnormal temperature is detected by the temperature detecting section (26a) of the protection circuit (26) to stop the operation of the inverter and suppress the heat generation of the inverter to protect the set or the system. Also, a load is connected to the inverter main circuit (22), but a short circuit due to an abnormality in the wiring inside the load, a short circuit in the output terminals (U, V, W), or an EP microcomputer chip (6) due to external noise If the series elements of the inverter main circuit (22) are turned on at the same time due to the malfunction of, an abnormally large current will flow into the inverter main circuit (22). Even in this case, the current detection section in the protection circuit (26) (26b) stops the operation immediately after detecting the large current and protects it.

By performing the above-described operation, the operation of the motor drive inverter is performed, and the rotation control of the load (motor) and the operation of the external device are controlled in a predetermined manner to normally operate the control of the inverter air conditioner or the like.

FIG. 10 is a plan view showing a case where the motor driving inverter circuit shown in FIG. 5 is mounted on one substrate (2) of the present embodiment, and the reference numerals of the mounted circuit elements are shown in FIG. The same reference numerals as those shown in the block diagram of FIG. Since the conductive path connecting the plurality of circuit elements is complicated, it is indicated by an arrow.

As shown in FIG. 11, a plurality of fixing pads (4a) to which external lead terminals (12) are fixed are provided at the opposing peripheral ends of one substrate (2). A plurality of circuit elements (8) are provided in the position of the sealing space (14) on the conductive path (4) extending from the fixing pad (4a), and an EP microcomputer chip (6) is provided on the protruding substrate (2a). Is fixed. A plurality of circuit elements other than the EP microcomputer chip (6) are fixed on the one substrate (2), (25) is a base amplifier, (23) is a buffer, and (24) is a first interface. , (27) is a second interface, (28) is an output buffer, and (26) is a protection circuit. The other substrate (3) has a plurality of conductive paths (5) extending from the one substrate (2) through a film resin layer (10) such as polyimide, and is provided on the other substrate (3). The inverter main circuit (22) and the rectifier circuit (21) are provided with some circuits necessary for the inverter or optional circuits.

As is clear from FIG. 10, the EP microcomputer chip (6) is mounted in a position adjacent to the vicinity (here, a buffer and an output buffer) of the circuit element most closely related to the EP microcomputer chip (6).

By arranging the circuit element (8) that is most related to the EP microcomputer chip (6) in the vicinity of the EP microcomputer chip (6), the distance between the wiring lines of the conductive path (4) that connects the two is the shortest and the smallest. Can be arranged and formed, and as a result, other mounting patterns can be effectively used and high-density mounting can be performed. At this time, the EP microcomputer chip (6) is exposed from the case material (5) and provided on the protruding substrate (2a) provided at an arbitrary peripheral end portion of the one substrate (2). The area surrounded by the alternate long and short dash line shows the area where the case material (5) is fixed with an adhesive sheet.

FIG. 11 is a plan view of a finished product of the hybrid integrated circuit device for the modem when the case material (5) is fixed on the one substrate (2) shown in FIG. The EP microcomputer chip (6) is resin-coated on the protruding substrate (2a) at the peripheral edge. That is, all the elements other than the EP microcomputer chip (6) are sealed in the sealing space (14) formed by the case material (5) and the substrates (2) and (3).

According to the present invention, the protruding substrate (2a) is provided at a desired position on the one substrate (2), and the EP microcomputer chip (6) is connected to the conductive path (4) on the protruding substrate (2a). , All other circuit elements (8) are arranged in the sealed space (14) formed by both the substrates (2) and (3) and the case material (5), so that the hybrid integrated circuit and the EP microcomputer are integrated. The integrated device can be provided in extremely small size.

(G) Effects of the Invention As described above in detail, according to the present invention, first, the protruding substrate (2a) is provided on an arbitrary peripheral edge of the one substrate (2), and the protruding substrate (2a) is provided. Since the EP microcomputer chip (6) is connected to the upper conductive path (4), there is an advantage that it can be arbitrarily selected around the mounting position of the EP microcomputer chip (6). Therefore, in consideration of the electrical connection with the most closely related circuit element built in, the EP microcomputer chip (6) and the most closely related circuit element (8) can be efficiently connected, and the routing of the data line can be eliminated. More specifically, the circuit element (8) most closely related to the EP microcomputer chip (6) can be arranged at a position adjacent to each other, and as a result, the data between the EP microcomputer chip (6) and the circuit element (8) most closely related can be stored. The data lines to be exchanged can be realized with the shortest distance or the layout that is the easiest to design, and the loss of mounting density due to the routing of the data lines can be minimized.

Secondly, the protruding substrate (2
Since the EP microcomputer chip (6) is arranged in a), there is an advantage that it can be handled as an integrated small hybrid integrated circuit device. Further, by improving the mounting density of the microcomputer and its peripheral circuit elements to be incorporated on both integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated.

Thirdly, by using a metal substrate as both the integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, which can contribute to further improvement of the mounting density. Moreover, by using the copper foil (11) as the conductive path (4),
The resistance value of the conductive path (4) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or greater than that of the printed circuit board.

Fourthly, the peripheral circuit element (8) connected to the EP microcomputer chip (6) is a case material (5) and both integrated circuit boards (2).
Since it is incorporated in the sealing space (14) formed by (3) in a die shape or a chip shape, it occupies a much smaller area than a resin-molded one such as a conventional printed circuit board, and the mounting density is reduced. It has the advantage that it can be greatly improved.

Fifthly, by substantially matching the peripheral edges of the case material (5) and both integrated circuit boards (2) and (3), almost the entire surfaces of both integrated circuit boards (2) and (3) are sealed. ), And an extremely compact hybrid integrated circuit device can be realized in combination with an improvement in packaging density.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a sectional view showing a substrate used in this embodiment, FIG. 4 is a perspective view showing a case member used in this embodiment, and FIG. 5 is a motor drive inverter used in this embodiment. 6 is a circuit diagram showing the main circuit of the inverter shown in FIG. 5, FIG. 7 is a block diagram showing a microcomputer of the inverter shown in FIG. 5, and FIG. 8 is FIG. FIG. 9 is a circuit diagram showing a base amplifier of the inverter shown in FIG. 9, FIG. 9 is a block diagram showing a protection circuit of the inverter shown in FIG. 5, and FIG. 10 is a block diagram showing the block diagram shown in FIG. A plan view, FIG. 11 is a plan view when a case member is fixed on the substrate shown in FIG. 10, and FIGS. 12 and 13 are perspective views showing a conventional microcomputer mounting structure. (1) ... Hybrid integrated circuit device, (2) (3) ... Integrated circuit board, (2a) ... Projection substrate, (4) ... Conductive path, (6) ... EP microcomputer chip, (8) ... Circuit element, ( 5) ... Case material,
(21a) ... UV transparent resin, (21b) ... UV impermeable resin.

Claims (6)

[Claims] 1. Two integrated circuit substrates arranged to face each other, a conductive path having a desired pattern formed on the main surfaces of the substrate facing each other, and desired program data connected to the conductive path. A microcomputer chip with a built-in EPROM, a peripheral circuit element to which the data of the microcomputer chip with a built-in EPROM is supplied and which is connected to a conductive path on the substrate, and a case member integrated with the substrate. , The microcomputer chip is fixed to the conductive path on the one substrate protruding from the case member, and the EP
The electrodes of the microcomputer chip with built-in ROM and the desired conductive paths are connected with a bonding wire, and the microcomputer chip with the built-in EPROM and the bonding wire are sealed with a resin, and the sealed space is formed by the both substrates and the case. A hybrid integrated circuit device in which the peripheral circuit element is arranged. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 4. A chip resistor and a chip capacitor are used as the peripheral circuit element.
A hybrid integrated circuit device as described. 5. The hybrid integrated circuit device according to claim 1, wherein a peripheral edge portion of the case material is substantially aligned with peripheral edge portions of the both substrates. 6. The hybrid integrated circuit device according to claim 1, wherein a resin that transmits ultraviolet rays is used as a coating resin for the microcomputer chip incorporating the EPROM.