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JPH0750044B2 - Method for creating calibration curve in X-ray spectroscopic analysis - Google Patents
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JPH0750044B2 - Method for creating calibration curve in X-ray spectroscopic analysis - Google Patents

Method for creating calibration curve in X-ray spectroscopic analysis

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Publication number
JPH0750044B2
JPH0750044B2 JP63045287A JP4528788A JPH0750044B2 JP H0750044 B2 JPH0750044 B2 JP H0750044B2 JP 63045287 A JP63045287 A JP 63045287A JP 4528788 A JP4528788 A JP 4528788A JP H0750044 B2 JPH0750044 B2 JP H0750044B2
Authority
JP
Japan
Prior art keywords
sample
calculation
ray
calibration curve
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63045287A
Other languages
Japanese (ja)
Other versions
JPH01219550A (en
Inventor
由佳 竹内
秀人 古味
武 荒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP63045287A priority Critical patent/JPH0750044B2/en
Publication of JPH01219550A publication Critical patent/JPH01219550A/en
Publication of JPH0750044B2 publication Critical patent/JPH0750044B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はX線分光法による定量分析を行う場合の検量線
作成方法に関する。
TECHNICAL FIELD The present invention relates to a method for preparing a calibration curve when performing quantitative analysis by X-ray spectroscopy.

(従来の技術) 定量分析を行う場合通常は、定量しようとする元素の濃
度既知の幾つかの標準試料を用いて検量線を作成する
か、定量しようとする元素の純物質に対するX線強度と
被測定試料における目的元素のX線強度との比に補正演
算を施すか何れかの方法が用いられている。
(Prior art) When performing quantitative analysis Usually, a calibration curve is prepared using several standard samples of known concentration of the element to be quantified, or X-ray intensity of pure element of the element to be quantified A method of performing a correction calculation on the ratio of the X-ray intensity of the target element in the sample to be measured is used.

(発明が解決しようとする課題) 上述した検量線法は濃度の異る幾つかの標準試料を用意
しなければならないが、標準試料の作成は困難な場合が
多い。また薄層試料においては励起用電子線の透過割合
が増加しX線発生量が低下するので、薄膜の標準試料を
作らねばならないが、これは塊状の標準試料を作るより
困難である。純物質とのX線強度比に補正演算を施す方
法は共存元素の影響を逐次近似によって算定して行くも
ので計算が大へん面倒である。
(Problems to be Solved by the Invention) In the calibration curve method described above, some standard samples having different concentrations must be prepared, but it is often difficult to prepare standard samples. Further, in the thin layer sample, the transmission rate of the exciting electron beam increases and the X-ray generation amount decreases, so that a thin film standard sample has to be prepared, but this is more difficult than the case of forming a block standard sample. The method of performing a correction calculation on the X-ray intensity ratio with a pure substance is one in which the effect of coexisting elements is calculated by successive approximation, and the calculation is very troublesome.

本発明は標準試料を用いないで検量線を作成する方法を
提供しようとするもので、これによって上述した従来方
法の問題点は解消される。
The present invention intends to provide a method for preparing a calibration curve without using a standard sample, which solves the above-mentioned problems of the conventional method.

(課題を解決するための手段) 定量しようとする元素の濃度既知の仮想試料について、
電子を入射させたときその電子が試料内を試料構成原子
との衝突を繰返しながら移動してエネルギーを失って行
く過程を多数の電子について確率演算に基づくシミュレ
ーション法によって追跡し、定量目的の元素の特性X線
が放射される確率を試料面からの深さの関数として求め
その関数を試料表面から被測定試料の厚さと等しい深さ
まで積分する演算を定量しようとする元素の複数種類の
濃度の場合について行い、上記積分結果とそれに対応す
る目的元素濃度とによって検量線を作成するようにし
た。
(Means for solving the problem) For a virtual sample whose concentration of the element to be quantified is known,
When an electron is injected, the process of the electron moving in the sample repeatedly repeating collisions with sample constituent atoms and losing energy is followed by a simulation method based on stochastic calculation for many electrons, and In the case of multiple concentrations of elements for which the probability that characteristic X-rays are radiated is calculated as a function of the depth from the sample surface and the function for integrating the function from the sample surface to a depth equal to the thickness of the sample to be measured is quantified Then, a calibration curve was created based on the above integration result and the corresponding target element concentration.

(作用) 加速された電子が試料に入射すると第4図に示すように
その電子は試料を構成している電子と衝突して反撥さ
ら、又別の原子に衝突すると云う過程を繰返し試料内に
不規則な軌跡を画きながら進行し、その間に次第にエネ
ルギーを失って行く。このように衝突を繰返して進行し
て行く電子の試料内での軌跡は確率的に決まるもので、
コンピュータによりシミュレーションすることができ
る。このようなシミュレーションの方法はモンテカルロ
シミュレーション法と呼ばれるものである。上述したシ
ミュレーションを多数回行うと、試料面から或る深さの
所で電子が定量しようとする目的の元素の特性X線を放
射させる確率が求められる。このようにして求められた
X線放射確率Piと試料面からの深さとの関係は第3図の
ようになる。この図で深さOからtまでの確率の積分は
厚さtの試料の目的元素の特性X線放射強度に比例して
いる。他方目的元素の濃度は予め仮定しているから、仮
定した濃度と特性X線の放射強度との関係が求められた
ことになり、検量線を作成することができる。
(Action) When an accelerated electron is incident on the sample, as shown in Fig. 4, the electron collides with the electron that constitutes the sample, repels it, and collides with another atom. It progresses while drawing an irregular trajectory, and gradually loses energy during that time. In this way, the trajectories of the electrons in the sample that proceed with repeated collisions are determined stochastically.
It can be simulated by a computer. Such a simulation method is called a Monte Carlo simulation method. When the above-mentioned simulation is performed a large number of times, the probability that electrons emit a characteristic X-ray of the target element to be quantified at a certain depth from the sample surface is obtained. The relationship between the X-ray emission probability Pi thus obtained and the depth from the sample surface is as shown in FIG. In this figure, the integral of the probability from the depth O to t is proportional to the characteristic X-ray emission intensity of the target element of the sample having the thickness t. On the other hand, since the concentration of the target element is assumed in advance, the relationship between the assumed concentration and the radiation intensity of the characteristic X-ray has been obtained, and the calibration curve can be created.

以上の方法は仮想試料についての理論的計算で実際に目
的元素の色々な濃度の濃度既知の試料を必要としない。
また試料表面から任意深さまでの部分でのX線発生確率
を計算しているので、薄膜試料に対しても適用可能な結
果が得られるものである。
The above method is a theoretical calculation for a virtual sample and does not actually require samples of known concentrations with various concentrations of the target element.
Moreover, since the X-ray generation probability is calculated in the portion from the sample surface to an arbitrary depth, the result applicable to the thin film sample can be obtained.

(実施例) 第1図は本発明の一実施例における検量作成動作のフロ
ーチャートである。被測定試料は厚さtの薄膜でそれを
構成している元素は1からnまでのn種である。これら
の元素の色々な濃度の組合せをもつK種の試料を想定し
これら各試料毎の元素の濃度(重量%)をCk1,Ck2…Ckn
としてシミュレーションを開始する。こゝで添字のkは
試料番号である。試料厚さt,試料を構成している各元素
の原子の電子に対する散乱断面積,イオン化断面積,各
試料毎の各元素の濃度Cki,電子の初期エネルギーEo,終
末エネルギーE′,シミュレーションを行う回数No等を
コンピュータに入力する(イ)。シミュレーションは例
えば1000から20000個の電子について行う。具体的には
一個の電子を試料に入射させたときの電子の軌跡の追跡
演算を行い、これをNo回繰り返すのである。(イ)のス
テップでシミュレーション演算に必要なデータおよびパ
ラメータの入力を終ったら、試料番号k=1とし
(ロ)、演算回数N=1とし(ハ)、試料に入射させた
電子の追跡演算を行う(ニ)。この演算は電子が先の試
料内原子との衝突から次に試料内の原子と衝突する迄の
過程の計算で、先の衝突において、電子がどの方向に反
撥されるかその方向を確率的に決め、次にどの元素の原
子と衝突をするかを下記(1)式により各構成元素の原子
の散乱断面積および各元素の濃度に関係させて確率的に
決定し、下記(2)式により電子の試料内での平均自由行
程だけ電子が進行して、上記確率的に決定された原子に
衝突するものとし、この過程におけるエネルギーの損耗
を下記(3)式によって算定すると云う演算で 但し、Piは電子が元素iの原子に衝突する確率で、piは こゝにAiは元素iの原子量、σiは元素iの原子の電子
に対する散乱断面積で、衝突する電子のエネルギーE
と、試料を構成している各元素の原子番号ziによって決
まり、 但しβiはスクリーニングパラメータで、 である。
(Embodiment) FIG. 1 is a flowchart of a calibration preparation operation in an embodiment of the present invention. The sample to be measured is a thin film having a thickness t, and the elements constituting the thin film are n kinds from 1 to n. Assuming K type samples having various combinations of the concentrations of these elements, the concentrations (% by weight) of the elements of each of these samples are Ck1, Ck2 ... Ckn
To start the simulation. Here, the subscript k is the sample number. Sample thickness t, scattering cross section for atoms of each element composing the sample, ionization cross section, concentration Cki of each element for each sample, initial energy Eo of electrons, final energy E ', and simulation Input the number of times into the computer (a). The simulation is performed on, for example, 1000 to 20000 electrons. Specifically, the tracking calculation of the trajectory of the electron when one electron is made incident on the sample is performed, and this is repeated No times. After inputting the data and parameters required for the simulation calculation in step (a), the sample number k = 1 (b), the number of calculations N = 1 (c), and the tracking calculation of the electrons injected into the sample is performed. Do (D). This calculation is a calculation of the process from the collision of the electron with the atom in the sample to the collision with the atom in the sample next. In the previous collision, the direction in which the electron is repulsed is stochastically determined. Then, which atom of the element to collide with is probabilistically determined by the formula (1) below in relation to the scattering cross section of each constituent element atom and the concentration of each element, and by the formula (2) below. It is assumed that the electrons travel only the mean free path in the sample and collide with the stochastically determined atoms, and the energy loss in this process is calculated by the following equation (3). Where Pi is the probability that an electron collides with an atom of element i, and pi is Here, Ai is the atomic weight of the element i, σi is the scattering cross section of the atom of the element i with respect to the electron, and the energy E of the colliding electron is
And the atomic number zi of each element that makes up the sample, Where βi is a screening parameter, Is.

平均自由行程LはÅ単位で 電子が物質内を進行して行くときのエネルギーの損耗は
単位飛距離当り、 但しは試料内の各元素の組成比(重量%)を加味した
原子番号の平均値で z=ΣCizi但しΣCi=1 で表わされる。同様にしては試料内元素の平均原子
量、ρは試料密度である。
The mean free path L is in units of Å The loss of energy as the electrons travel in the material is per unit flight distance, However, is the average value of the atomic number in consideration of the composition ratio (% by weight) of each element in the sample. Z = ΣCizi However, ΣCi = 1. Similarly, the average atomic weight of the element in the sample and ρ are the sample densities.

上式の単位はKeV/ÅでJiは元素iのイオン化ポテンシャ
ル(eV)である。
The unit of the above equation is KeV / Å and Ji is the ionization potential (eV) of element i.

追跡計算が終わったら、その演算における前後の衝突の
間の電子の試料表面からの深さ方向の進行距離を前回ま
での深さ方向進行距離に加算して現在の電子の試料面か
らの深さ位置dを計算(ホ)する。この実施例では次の
(ヘ)のステップで、上記過程で後の衝突における元素
iの特性X線放射確率を計算し、その結果をメモリに入
力する。特性X線の放射確率は電子のエネルギーをE、
元素iの特性X線放射のための励起エネルギーをEiとす
ると、vi=E/Eiに関係し、次式で与えられるφiに比例
する。
When the tracking calculation is completed, the current depth of the electron from the sample surface is calculated by adding the depth-wise travel distance of the electron from the sample surface during the front-back collision in the calculation to the previous depth-direction travel distance. The position d is calculated (e). In this embodiment, in the next step (f), the characteristic X-ray emission probability of the element i in the later collision in the above process is calculated, and the result is input to the memory. The radiation probability of characteristic X-rays is the energy of the electron E,
Letting Ei be the excitation energy for the characteristic X-ray emission of the element i, it is related to vi = E / Ei and is proportional to φi given by the following equation.

このφiを第2図のメモリマップに示すように、メモリ
内でk番目の試料の元素iのエリヤにおいて試料面から
の深さdに対応するアドレス内のデータに加算して同ア
ドレスに格納する。次に電子エネルギーEがE<E′か
否かチェックされる(ト)。E′は電子の終末エネルギ
ーで今の場合試料中の何れの元素の原子もイオン化でき
ない限界エネルギーに設定しておけばよい。このチェッ
クがNOの場合、電子の試料面からの深さdがd<o(表
面から飛び出す)か否かチェック(チ)、次にd>t
(試料を透過)か否かチェック(リ)し、全てNOであれ
ば動作は(ニ)に戻り、(ト)(チ)(リ)の何れかの
ステップがNOになる迄同じ動作が繰返される。
As shown in the memory map of FIG. 2, this φi is added to the data in the address corresponding to the depth d from the sample surface in the area of the element i of the k-th sample in the memory and stored at the same address. . Next, it is checked whether the electron energy E is E <E '(G). E'is the terminal energy of the electron, and in this case, it should be set to the limit energy at which the atom of any element in the sample cannot be ionized. If this check is NO, it is checked whether the depth d of electrons from the sample surface is d <o (jumps out from the surface) (h), and then d> t
Check (re) whether it is (transmitting sample), if all are NO, the operation returns to (D), and the same operation is repeated until any step of (G), (H) and (D) becomes NO. Be done.

以上のようにして(ト)(チ)(リ)の何れかのステッ
プがYESになるとそこで一個の電子についての追跡演算
が終わり、NをN+1とし(ル)、新しいNがN>Noか
否かチェック(オ)し、Noなら動作は(ハ)のステップ
に戻って次の電子について上述した演算が行われる。か
くして例えば1000回の演算が行われるとN>Noとなって
(オ)のステップがYESとなり一つの試料についてのモ
ンテカルロシミュレーション演算が完了したことになる
ので、次の(ワ)のステップでk+1を新しいkとし、
そのkがk>Kか否かチェック(カ)し、NOなら動作は
(ロ)のステップに戻り、次の試料についてモンテカル
ロシミュレーション演算が行われる。このようにして、
k>Kとなったら想定した全試料についてのモンテカル
ロシミュレーションが終る。こゝまでの動作でメモリ内
には各試料につき各元素毎に試料表面からの深さに対す
る特性X線放射強度のヒストグラムが形成されているの
で、最後(ヨ)のステップで上記メモリ内に形成された
各試料毎の各元素の特性X線放射強度ヒストグラムを試
料面からの深さによるX線の吸収補正を行って夫々積分
する。これは厚さtの種々な組成の試料の各元素の特性
X線放射強度の相互比率を示す相対値で、このようにし
て計算された一つの試料の一つの特性X線の相対強度と
上記試料と同じ組成をもつ実際の一つの試料による上記
特性X線の実測強度との比が求まれば、他試料,他元素
についても夫々の特性X線の相対強度に上記比を掛ける
ことで、夫々の相対強度を実測強度に換算することがで
きる。例えば今定量目的の元素iの濃度が上記した仮想
試料のi番目とk番目の濃度CjiとCkiとの中間濃度Ci′
であるような試料が標準として入手できたとする。元素
iの濃度とその特性X線の上記計算上の相対強度との関
係を与える検量線は上述したシミュレーションの計算に
よって求められているので、濃度Ci′のときの特性X線
の計算上の相対強度I(Ci′)が求められる。他方上記
標準試料の元素iの特性X線の実測強度をIo(Ci′)と
すると、計算値と実測値との換算比率Aが決められる。
上述計算によって求められた特性X線の相対強度にこの
換算比率を掛けて、濃度毎にブロットすれば求める検量
線が得られる。標準試料としては定量しようとする元素
の濃度100%の試料を用い濃度100%の試料についても上
述したシミュレーションを行ってその元素の特性X線の
相対強度を計算しておくのが試料入手の面からも前述し
たシミュレーションの演算が簡単になると云う面からも
便利である。元素によっては純品が入手し難い場合があ
るが、上記したAは近似的にはシミュレーション計算に
用いられた仮想試料内の他元素間でも適用できるので、
上記Aを求めるための試料内の元素は必ずしも被測定試
料において定量しようとする元素である必要はなく、標
準試料としては被測定試料を構成している他元素の濃度
既知のものを用いてもよい。また上例では試料を構成し
ている元素全部について特性X線放射強度を計算してい
るが、(ヘ)のステップは定量しようとする元素だけに
ついて行っておけばよい(但し、シミュレーション演算
そのものは試料構成元素全てのパラメータが必要であ
る。) 第5図は本発明方法を金−銅合金に適用した場合の計算
値と実測値との一致程度を示すグラフで、縦軸は金或は
銅100%の場合のX線程度の計算値,実測値を夫々1と
して他濃度の場合のX線強度の計算値,実測値を表して
おり、両者の一致は良好である。
As described above, when any of the steps (g), (h), and (g) becomes YES, the tracking calculation for one electron ends there, N is set to N + 1 (l), and the new N is N> No. If it is No, the operation returns to the step (C), and the above-mentioned calculation is performed for the next electron. Thus, for example, when 1000 times of calculations are performed, N> No, the step (e) becomes YES, and the Monte Carlo simulation calculation for one sample is completed. Therefore, k + 1 is set in the next step (wa). New k
It is checked whether or not k is k> K (f), and if NO, the operation returns to the step (b), and the Monte Carlo simulation calculation is performed on the next sample. In this way
When k> K, the Monte Carlo simulation for all assumed samples ends. By the operations up to this point, the histogram of the characteristic X-ray emission intensity with respect to the depth from the sample surface is formed for each element in the memory in the memory, so it is formed in the memory in the last (Y) step. The characteristic X-ray emission intensity histogram of each element for each sample is subjected to X-ray absorption correction according to the depth from the sample surface and integrated. This is a relative value indicating the mutual ratio of the characteristic X-ray radiant intensities of each element of samples of various compositions with thickness t, and the relative intensity of one characteristic X-ray of one sample thus calculated and the above If the ratio to the actually measured intensity of the characteristic X-ray by one actual sample having the same composition as the sample is obtained, by multiplying the relative intensity of the respective characteristic X-rays of other samples and other elements by the above ratio, It is possible to convert each relative intensity into an actually measured intensity. For example, the concentration of the element i for quantitative determination is the intermediate concentration Ci ′ between the i-th and k-th concentrations Cji and Cki of the virtual sample described above.
Suppose that a sample such as is available as a standard. Since the calibration curve that gives the relationship between the concentration of the element i and the relative intensity of the characteristic X-ray in the above calculation is obtained by the calculation of the simulation described above, the relative calculation in the characteristic X-ray at the concentration Ci ′ is calculated. The intensity I (Ci ') is determined. On the other hand, if the measured intensity of the characteristic X-ray of the element i of the standard sample is Io (Ci '), the conversion ratio A between the calculated value and the measured value is determined.
The calibration curve to be obtained can be obtained by multiplying the relative intensity of the characteristic X-ray obtained by the above calculation by this conversion ratio and blotting for each concentration. As a standard sample, a sample with a concentration of 100% of the element to be quantified is used, and the above-mentioned simulation is performed for a sample with a concentration of 100% to calculate the relative intensity of the characteristic X-ray of the element. It is also convenient from the standpoint that the calculation of the simulation described above becomes simple. Depending on the element, it may be difficult to obtain a pure product, but the above-mentioned A is approximately applicable to other elements in the virtual sample used for the simulation calculation.
The element in the sample for obtaining the above A does not necessarily have to be the element to be quantified in the sample to be measured, and the standard sample may be one having a known concentration of other elements constituting the sample to be measured. Good. Also, in the above example, the characteristic X-ray emission intensity is calculated for all the elements that make up the sample, but the step (f) may be performed only for the element to be quantified (however, the simulation calculation itself All parameters of sample constituent elements are required.) FIG. 5 is a graph showing the degree of agreement between the calculated value and the measured value when the method of the present invention is applied to a gold-copper alloy, and the vertical axis is gold or copper. The calculated value and the measured value of the X-ray level at 100% are set to 1 respectively, and the calculated value and the measured value of the X-ray intensity at other concentrations are shown, and the agreement between them is good.

(発明の効果) 本発明によれば、多種の濃度既知の標準試料を用意しな
くても検量線を作ることができ、また任意厚さの試料に
対応する検量線を作ることができるので、薄膜試料につ
いても容易にX線分光法による定量分析ができる。
(Effect of the Invention) According to the present invention, a calibration curve can be prepared without preparing various standard samples of known concentrations, and a calibration curve corresponding to a sample having an arbitrary thickness can be prepared. A thin film sample can also be easily quantitatively analyzed by X-ray spectroscopy.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例を示すフローチャート、第2
図は同実施例におけるメモリの一部構成を示すメモリマ
ップ、第3図は本発明方法により求められる試料の表面
からの深さとその深さにおける特性X線放射確率との関
係のグラフ、第4図は試料内に入射した電子の軌跡を示
す図、第5図は本発明方法による計算値と実測値との比
較図である。
FIG. 1 is a flow chart showing an embodiment of the present invention,
FIG. 4 is a memory map showing a partial structure of the memory in the same embodiment, FIG. 3 is a graph showing the relationship between the depth from the surface of the sample and the characteristic X-ray emission probability at that depth obtained by the method of the present invention, FIG. FIG. 5 is a diagram showing the trajectory of electrons incident on the sample, and FIG. 5 is a comparison diagram of calculated values and measured values by the method of the present invention.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】定量しようとする元素の濃度を決めた仮想
試料について、電子を入射させたときその電子が試料内
を試料構成原子との衝突を繰返しながら移動してエネル
ギーを失って行く過程を多数の電子について確率演算に
基くシミュレーション法によって追跡し、入射電子が試
料表面から指定深さまで進行する間に定量目的の元素の
特性X線が放射される確率を求める演算を上記元素の複
数種類の濃度の場合について行い、上記確率とそれに対
応する上記目的元素濃度とによって検量線を作成するこ
とを特徴とするX線分光分析における検量線作成方法。
1. A process in which a virtual sample, in which the concentration of an element to be quantified is determined, moves when an electron is made incident on the virtual sample while repeatedly colliding with atoms constituting the sample to lose energy. A large number of electrons are traced by a simulation method based on a probability calculation, and a calculation for obtaining the probability that characteristic X-rays of an element to be quantified are emitted while the incident electrons progress from the sample surface to a specified depth A method for preparing a calibration curve in X-ray spectroscopic analysis, which is carried out for the case of concentration, and creates a calibration curve by the above probability and the corresponding concentration of the target element.
JP63045287A 1988-02-27 1988-02-27 Method for creating calibration curve in X-ray spectroscopic analysis Expired - Lifetime JPH0750044B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63045287A JPH0750044B2 (en) 1988-02-27 1988-02-27 Method for creating calibration curve in X-ray spectroscopic analysis

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Application Number Priority Date Filing Date Title
JP63045287A JPH0750044B2 (en) 1988-02-27 1988-02-27 Method for creating calibration curve in X-ray spectroscopic analysis

Publications (2)

Publication Number Publication Date
JPH01219550A JPH01219550A (en) 1989-09-01
JPH0750044B2 true JPH0750044B2 (en) 1995-05-31

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Country Link
JP (1) JPH0750044B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2884623B2 (en) * 1989-09-30 1999-04-19 株式会社島津製作所 X-ray spectroscopy method
US6787773B1 (en) * 2000-06-07 2004-09-07 Kla-Tencor Corporation Film thickness measurement using electron-beam induced x-ray microanalysis

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JPH01219550A (en) 1989-09-01

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