JPH0757420B2 - Manufacturing method of lead pin with silver solder - Google Patents
Manufacturing method of lead pin with silver solderInfo
- Publication number
- JPH0757420B2 JPH0757420B2 JP1028257A JP2825789A JPH0757420B2 JP H0757420 B2 JPH0757420 B2 JP H0757420B2 JP 1028257 A JP1028257 A JP 1028257A JP 2825789 A JP2825789 A JP 2825789A JP H0757420 B2 JPH0757420 B2 JP H0757420B2
- Authority
- JP
- Japan
- Prior art keywords
- head
- lead pin
- hole
- jig
- silver brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910000679 solder Inorganic materials 0.000 title description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 50
- 229910052709 silver Inorganic materials 0.000 claims description 50
- 239000004332 silver Substances 0.000 claims description 50
- 238000005219 brazing Methods 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、銀ろう付きリードピンの製造方法の改良に係
わり、更に詳しくは電子部品に取付ける拡径した頭部を
有するリードピンの該頭部に銀ろうを半球状に設ける方
法に関する。Description: TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing a lead pin with silver brazing, and more specifically, to a head portion of a lead pin having an enlarged head portion to be attached to an electronic component. The present invention relates to a method of providing a silver solder in a hemispherical shape.
従来、この種のリードピンの製造方法は、特公昭63−51
543号公報(第5図にその実施例を示す。)にて開示さ
れる如く、偏平な頭部a′を有する釘状のリードピンa
を、その頭部の直径より小さく脚部a″より大きい直径
で脚部の長さより深い下穴b′と頭部の直径より大きい
直径で頭部の高さと同等若しくはそれより深い上穴b″
とからなるリベット状の穴bを有するカーボン治具cの
前記リベット状の穴に挿入して吊垂し、次に上穴b″内
の頭部a′の上面に銀ろうチップdを載せ、次いでカー
ボン治具cを炉中に入れて加熱し、銀ろうチップを溶融
して頭部上面に接合する方法が提供されている。しか
し、前記下穴と上穴とが段状に形成されているため、微
細な該下穴(0.7mmφ)に細いリードピン(0.45mmφ)
の脚部を挿入する作業が難しく、特に大量生産する場合
の自動化において、脚部が上穴の下面に衝突して折れ曲
がる恐れがあるので、精度の高い位置設定が要求され、
製造装置の高精度化に伴いコスト高になり、一方前記脚
部を下穴に挿入し易いように多少余裕を持たせて大きく
設定した場合には、該脚部が下穴に対して偏心した状態
に吊垂されることが頻繁に生じ、その結果溶融した銀ろ
うが頭部の側面に流れ込み当初の目的を達成できない恐
れがある。また、該リードピンの頭部は線材の端部を潰
して成形するので、その直径には製品毎に許容範囲内の
寸法バラツキが必然的に生じ、そのため前記上穴の直径
はそのバラツキを吸収し得る程度の余裕を持たせて大き
く設定しなければならず、その結果製品によっては頭部
の周囲と上穴の内面間に大きな間隙が生じて、溶融した
銀ろうがその間隙に流れ込み、頭部の周囲に銀ろうが付
着した不良品ができる恐れがあった。更に、リードピン
の頭部の直径は前記下穴の直径より十分大きくなければ
ならないといった制約もあり、処理できるリードピンの
形状が限られていた。Conventionally, this type of lead pin manufacturing method has been disclosed in Japanese Patent Publication No. 63-51.
As disclosed in Japanese Patent No. 543 (the embodiment is shown in FIG. 5), a nail-shaped lead pin a having a flat head a '.
A prepared hole b ′ having a diameter smaller than the diameter of the head and larger than the leg a ″ and deeper than the length of the leg, and an upper hole b ″ having a diameter larger than the diameter of the head and equal to or deeper than the height of the head.
Inserted into the rivet-shaped hole of the carbon jig c having the rivet-shaped hole b consisting of and suspended, and then placing the silver brazing tip d on the upper surface of the head a ′ in the upper hole b ″. Next, there is provided a method in which the carbon jig c is put in a furnace and heated to melt the silver brazing chips and bond them to the upper surface of the head, but the prepared hole and the prepared hole are formed in a stepped shape. Has a fine lead pin (0.45 mmφ) in the minute pilot hole (0.7 mmφ)
It is difficult to insert the legs of the robot, and especially in the case of automation in mass production, the legs may collide with the lower surface of the upper hole and bend, so highly accurate position setting is required,
When the manufacturing equipment becomes more accurate, the cost becomes higher. On the other hand, when the leg is set large with some allowance so that it can be easily inserted into the pilot hole, the leg is eccentric to the pilot hole. Frequent hanging in the state may result in molten silver wax flowing into the sides of the head and failing to achieve its original purpose. In addition, since the head of the lead pin is formed by crushing the end of the wire rod, the diameter of the lead pin inevitably has a dimensional variation within the allowable range for each product, and therefore the diameter of the upper hole absorbs the variation. It must be set large with a margin to obtain, and as a result, depending on the product, a large gap is created between the periphery of the head and the inner surface of the upper hole, and the molten silver wax flows into the gap and the head There was a risk of defective products with silver solder around the area. Furthermore, there is a restriction that the diameter of the head of the lead pin must be sufficiently larger than the diameter of the prepared hole, and the shape of the lead pin that can be processed is limited.
本発明は前述の状況に鑑み、解決しようとするところ
は、リードピンを治具に簡単にしかもガタつきやズレが
なく装着できるとともに、頭部の直径に許容範囲内の寸
法バラツキがあっても、該頭部の周囲を密嵌状態で支持
し、頭部上面に載置した銀ろう片を溶融した場合に該頭
部側面から下面への銀ろうの流れ込みを防止して良品率
を高めることができ、更に大量生産における自動化に対
応できる銀ろう付きリードピンの製造方法を提供する点
にある。In view of the above situation, the present invention is to solve the problem in that the lead pin can be easily attached to the jig without rattling or deviation, and the head diameter has dimensional variation within an allowable range. It is possible to improve the non-defective rate by supporting the periphery of the head in a tightly fitted state and preventing the flow of the silver solder from the side surface of the head to the lower surface when the silver solder piece placed on the upper surface of the head is melted. Another object of the present invention is to provide a method of manufacturing lead pins with silver brazing which can be used and can be automated in mass production.
本発明は、前述の課題解決の為に、円板状の拡径した頭
部と円柱状の脚部を有するリードピンを、該頭部の直径
より大きい内径の上部開口縁と該脚部の直径に略等しい
内径の内孔を連続させたテーパー孔と該テーパー孔の下
方に該内孔に同軸となして連続させた平行な支持孔を垂
直に有し且つ前記リードピンの長さよりテーパー孔の深
さを浅く設定してなる治具の前記テーパー孔に脚部から
挿入し、頭部を該テーパー孔の上部に密嵌状態となして
吊支するとともに、脚部を支持孔に嵌合し、次に前記頭
部の上面に銀ろう片を載置し、そして前記リードピンの
頭部及び銀ろう片を加熱し、該銀ろう片を溶融して頭部
上面に接合してなる銀ろう付きリードピンの製造方法を
構成した。In order to solve the above-mentioned problems, the present invention provides a lead pin having a disk-shaped enlarged head and a columnar leg, and an upper opening edge having an inner diameter larger than the diameter of the head and the diameter of the leg. Has a tapered hole formed by connecting an inner hole having an inner diameter substantially equal to that of the tapered hole, and a parallel support hole formed vertically below the tapered hole and coaxially connected to the inner hole. The depth of the tapered hole is larger than the length of the lead pin. Inserted from the leg into the tapered hole of the jig that is shallowly set, the head is tightly fitted to the upper part of the tapered hole and suspended, and the leg is fitted into the support hole, Next, a silver brazing piece is placed on the upper surface of the head, and the head of the lead pin and the silver brazing piece are heated, and the silver brazing piece is melted and joined to the upper surface of the head. The manufacturing method of
また、前記治具のテーパー孔及び支持孔にリードピンを
挿入し、該リードピンの頭部上面に銀ろう片を載置した
状態で、該治具を加熱炉中を通して又は該治具の上面を
バーナーの炎又は熱風にて加熱するようになした。Further, with the lead pin inserted into the tapered hole and the support hole of the jig and the silver brazing piece placed on the upper surface of the head of the lead pin, the jig is passed through a heating furnace or the upper surface of the jig is burned. It came to heat with the flame or hot air.
更に、治具に装着したリードピンの頭部上面に銀ろう片
を載置する前に、少なくとも前記治具の上部を予備加熱
するようになした。Further, at least the upper part of the jig is preheated before the silver brazing piece is placed on the upper surface of the head of the lead pin attached to the jig.
以上の如き内容からなる本発明の銀ろう付きリードピン
の製造方法は、治具に垂直に設けたテーパー孔の上部開
口縁にリードピンの脚部から挿入すると、該テーパー孔
の深さより長いリードピンは脚部下端部は該テーパー孔
の内面に案内されながらテーパー孔の下方に連続形成し
た平行な支持孔に嵌合するとともに、頭部の直径と一致
した内径を有するテーパー孔の所定高さ部位で密嵌状態
となして吊支され、即ちリードピンはテーパー孔及び支
持孔に対して同軸状に略垂直に支持され、この状態で頭
部の上面に載置した銀ろう片を溶融すると、該銀ろうは
頭部周縁に広がるが、頭部周囲に密接したテーパー孔内
面により、該銀ろうの頭部側面から下面への流れ込みを
確実に規制するのである。According to the method for manufacturing a lead pin with silver brazing of the present invention having the above contents, when the lead pin leg portion is inserted into the upper opening edge of the tapered hole provided perpendicularly to the jig, the lead pin longer than the depth of the tapered hole is a leg. The lower end of the part fits into a parallel support hole continuously formed below the tapered hole while being guided by the inner surface of the tapered hole, and at the predetermined height portion of the tapered hole having an inner diameter matching the diameter of the head part. The lead pin is suspended in the fitted state, that is, the lead pin is coaxially and substantially vertically supported with respect to the tapered hole and the support hole, and in this state, when the silver brazing piece placed on the upper surface of the head is melted, the silver brazing piece is melted. Although it spreads to the periphery of the head, the inner surface of the tapered hole that is in close contact with the periphery of the head reliably regulates the inflow of the silver solder from the side surface of the head to the lower surface.
また、治具のテーパー孔及び支持孔にリードピンを装着
した状態で、該治具の上部を予備加熱することにより、
比熱の異なるリードピンの頭部と銀ろう片を略同一温度
に昇温させて、その接合をより完全に行うのである。Also, by preheating the upper part of the jig with the lead pins attached to the tapered hole and the support hole of the jig,
The heads of the lead pins and the silver brazing pieces having different specific heats are heated to substantially the same temperature to complete the joining.
次に添付図面に示した実施例に基づき更に本発明の詳細
を説明する。Next, the details of the present invention will be described based on the embodiments shown in the accompanying drawings.
第1図は本発明の代表的実施例を示し、図中1はリード
ンピン、2は治具、3は銀ろう片をそれぞれ示してい
る。FIG. 1 shows a typical embodiment of the present invention, in which 1 is a lead pin, 2 is a jig, and 3 is a silver brazing piece.
リードピン1は、ドラムに巻付けた長尺線材を伸長して
その一端を軸方向に圧縮して潰し、円板状の拡径した頭
部4を形成するとともに、所定長さに切断して脚部5を
形成したものである。従って、前記頭部4の直径には必
然的に許容範囲内において寸法バラツキが生じるが、脚
部5の直径は精度よく寸法が揃っている。本実施例で用
いたリードピン1の寸法は、前記頭部4の直径が0.7mm
φ、その厚みが0.2mm、また脚部5の直径が0.6mmφ、そ
の長さが4.5mmのものであるが、半導体集積回路等のデ
バイスの大きさ、即ち集積度に応じて各種の寸法のもの
が存在し、近年の高集積化に伴いその寸法は更に小さく
なる傾向にあり、本発明の有用性が特に強調される。本
発明は、頭部4の直径が脚部5の直径より大きなもので
あれば、どのような寸法のリードピン1にも適用できる
ものである。また、リードピン1の材質は、Fe−Ni合金
がよく使用されるが、特に限定されるものではなく、後
述の銀ろうの融点より高い融点をもつ材質が使用される
のは当然である。The lead pin 1 extends a long wire wound around a drum and compresses one end in the axial direction to crush it to form a disk-shaped expanded head 4 and cut it to a predetermined length to form a leg. The part 5 is formed. Therefore, the diameter of the head portion 4 inevitably varies within the allowable range, but the diameters of the leg portions 5 are accurately aligned. The size of the lead pin 1 used in this embodiment is such that the diameter of the head 4 is 0.7 mm.
φ, its thickness is 0.2 mm, and the leg 5 has a diameter of 0.6 mm φ and its length is 4.5 mm, but various dimensions are available depending on the size of the device such as a semiconductor integrated circuit, that is, the degree of integration. However, the size thereof tends to become smaller with the recent high integration, and the usefulness of the present invention is particularly emphasized. The present invention can be applied to the lead pin 1 having any size as long as the diameter of the head 4 is larger than the diameter of the leg 5. Further, the material of the lead pin 1 is often Fe—Ni alloy, but is not particularly limited and it is natural that a material having a melting point higher than the melting point of silver brazing material described later is used.
治具2は、上面6に前記リードピン1の頭部4の直径よ
り大きい内径の上部開口縁7を開設し、該開口縁7と前
記リードピン1の脚部5の直径に略等しい内径の内孔8
を連続させたテーパー孔9と該テーパー孔9の下方に該
内孔8に同軸となして連続させた平行な支持孔10を垂直
に上下貫通させて穿設し、これを縦横に多数形成したも
のである。そして、前記リードピン1の長さL1よりテー
パー孔9の深さL2を浅く設定し、また本実施例では支持
孔10の深さL3はリードピン1の脚部5を挿入した場合に
下方へ突出しないように設定している。これは脚部5が
治具2の下方へ突出している場合、該治具2を取り扱う
際に該脚部5の突出部に不意に触れて、治具2に装着さ
れたリードピン1が移動又は抜け落ちるのを防止するた
めである。また、第2図に示す如く前記テーパー孔9の
傾斜角度αは、前記頭部4の外周面上縁とテーパー孔9
の内面11に銀ろうが流れ込み得る間隙を生じさせない程
度に小さく設定してあり、本実施例では0度52分5秒の
微小角度に設定している。尚、前記テーパー孔9を直線
状の単純な形状にした場合には、該頭部の直径及び脚部
5の長さに応じてその角度は略決定されるが、該頭部4
が密嵌する部分のテーパー孔9の角度を最適に設定し、
支持孔10との間を異なる角度に設定することも可能であ
る。そして、該治具2の材質は、銀ろうに対して濡れ性
の全くないカーボンが適しているが、その他にステンレ
スやモリブデン等が使用できる。The jig 2 has an upper opening edge 7 having an inner diameter larger than the diameter of the head portion 4 of the lead pin 1 on the upper surface 6, and an inner hole having an inner diameter substantially equal to the diameter of the opening edge 7 and the leg portion 5 of the lead pin 1. 8
A continuous tapered hole 9 and a parallel support hole 10 which is continuous and coaxial with the inner hole 8 below the tapered hole 9 are vertically penetrated vertically to form a large number of them. It is a thing. Further, the depth L 2 of the tapered hole 9 is set to be shallower than the length L 1 of the lead pin 1, and in this embodiment, the depth L 3 of the support hole 10 is set lower when the leg portion 5 of the lead pin 1 is inserted. It is set so that it does not stick out. This is because when the leg portion 5 projects below the jig 2, the lead pin 1 mounted on the jig 2 moves or touches the projecting portion of the leg portion 5 unexpectedly when handling the jig 2. This is to prevent falling off. Further, as shown in FIG. 2, the inclination angle α of the taper hole 9 is set such that the upper edge of the outer peripheral surface of the head 4 and the taper hole 9 are different from each other.
The inner surface 11 is set to a small size so as not to create a gap into which silver brazing can flow, and in this embodiment, it is set to a minute angle of 0 degrees 52 minutes 5 seconds. When the taper hole 9 has a straight and simple shape, the angle is substantially determined according to the diameter of the head and the length of the leg 5, but the head 4
The angle of the tapered hole 9 in the part where
It is also possible to set different angles with the support holes 10. The jig 2 is preferably made of carbon, which has no wettability with silver solder, but stainless steel, molybdenum, or the like can be used.
銀ろう片3は、Ag−Cu28重量%の線材を前記リードピン
1の頭部4の面積に応じて適宜長さに切断したもので、
その合金比率及び形状は特に限定されるものではない。The silver brazing piece 3 is obtained by cutting a wire material of Ag-Cu 28 wt% into an appropriate length according to the area of the head 4 of the lead pin 1.
The alloy ratio and shape are not particularly limited.
しかして、前記リードピン1の頭部4の上面に銀ろうを
半球状に接合形成するのであるが、それには先ず前記治
具2のテーパー孔9の上部開口縁7にリードピン1の脚
部5から挿入し、その先端部をテーパー孔9の下方に連
続形成した支持孔10に嵌合するとともに、該頭部4の直
径に対応したテーパー孔9の内面11に密嵌状態で略垂直
に吊支して装着し、この際該頭部4の上面とテーパー孔
9の開口縁7の内面11とで所定深さの凹所が形成され、
次にこの状態で前記頭部4の上面に所定量に切断した銀
ろう片3を載置し、そして該治具2を電気炉等の加熱炉
中に入れ又は加熱炉中を通過させて、前記銀ろう片3を
溶融して頭部4に接合し、この際銀ろうは表面張力によ
り中央部が膨らんだ半球状に頭部4上面の全面に広がる
が、銀ろうの表面張力と該銀ろうに対して濡れ性の少な
い治具2のテーパー孔9の内面により頭部4側面への流
れ込みは規制され、真に頭部4上面のみに銀ろうを溶融
接合するものである。それから冷却した後、前記支持孔
10に下方から挿入した押棒によりリードピン1の上方に
取り出し、第3図に示したように頭部4の上面に半球状
の銀ろう3′を設けた銀ろう付きリードピン1が製造さ
れる。ここで、図示しないが前記押棒は板状の治具に前
記支持孔10と対応する間隔で同一高さに設定して多数突
設したものであり、前記治具2の下面に重ね合わせた場
合にその押棒が支持孔10に挿入されるようになしてい
る。尚、製造装置の自動化において、リードピン1を装
着した治具2を加熱炉中に入れる場合よりも、該治具2
の上面6をバーナーの炎又は熱風にて加熱する方がより
効率がよい場合があり、その加熱手段は適宜採用される
ものとする。Then, silver brazing solder is formed on the upper surface of the head portion 4 of the lead pin 1 in a hemispherical shape. First, from the leg portion 5 of the lead pin 1 to the upper opening edge 7 of the tapered hole 9 of the jig 2. It is inserted and fitted into a support hole 10 formed continuously below the tapered hole 9 and suspended vertically in a tight fit state on the inner surface 11 of the tapered hole 9 corresponding to the diameter of the head 4. Then, the upper surface of the head 4 and the inner surface 11 of the opening edge 7 of the tapered hole 9 form a recess having a predetermined depth.
Next, in this state, the silver brazing piece 3 cut into a predetermined amount is placed on the upper surface of the head 4, and the jig 2 is put in or passed through a heating furnace such as an electric furnace. The silver brazing piece 3 is melted and bonded to the head portion 4. At this time, the silver brazing material spreads in a hemispherical shape having a bulged central portion on the entire upper surface of the head portion 4 due to surface tension. The inner surface of the tapered hole 9 of the jig 2 having a low wettability with respect to the brazing restricts the inflow to the side surface of the head 4, and the silver brazing is truly melt-bonded only to the upper surface of the head 4. Then after cooling, the support holes
The lead pin 1 is taken out above the lead pin 1 by a push rod inserted from below into the lead pin 1, and the lead pin 1 with silver brazing in which a hemispherical silver braze 3'is provided on the upper surface of the head 4 is manufactured as shown in FIG. Here, although not shown, the push bar is a plate-shaped jig provided with a large number of protrusions at the same height as the support holes 10 and at the same height. The push rod is inserted into the support hole 10. In the automation of the manufacturing apparatus, the jig 2 having the lead pin 1 mounted thereon is more preferable than the case where the jig 2 is placed in a heating furnace.
In some cases, it may be more efficient to heat the upper surface 6 of the above with a burner flame or hot air, and the heating means shall be adopted appropriately.
また、前記リードピン1と銀ろう片3の材質の相違によ
り比熱の違い及び該リードピン1と治具2が接触してい
ることによる熱伝導により、該リードピン1の頭部4と
銀ろう片3の昇温に差が生じるので、リードピン1を治
具2に装着した状態で少なくとも治具2の上部を予備加
熱し、その後頭部4に銀ろう片3を載置し、再び加熱し
て該頭部4と銀ろう片3を略同一温度まで昇温させて溶
融接合すれば、より強固に接合することが可能である。Further, due to the difference in specific heat due to the difference in material between the lead pin 1 and the silver brazing piece 3 and heat conduction due to the contact between the lead pin 1 and the jig 2, the head 4 of the lead pin 1 and the silver brazing piece 3 are Since there is a difference in temperature rise, at least the upper part of the jig 2 is preheated with the lead pin 1 mounted on the jig 2, and then the silver brazing piece 3 is placed on the head 4 and heated again to heat the head. It is possible to bond more firmly by raising the temperature of the silver brazing piece 4 and the silver brazing piece 3 to substantially the same temperature and performing the melt bonding.
更に、他の実施例として第4図に示したものは、前記治
具2を支持孔10の中間適所で上治具2aと下治具2bに分割
した以外は、前述の実施例と同一のものであり、前記リ
ードピン1をテーパー孔9及び支持孔10に挿入した場合
に、脚部5の下端部が下治具2bの支持孔10に位置するよ
うに分割箇所を設定し、リードピン1の頭部4上面に銀
ろう3′を接合した後、上治具2aと下治具2bを分離し
て、上治具2aから下方に突出した脚部5を押し上げるこ
とにより押棒を使用することなく容易にリードピン1を
治具2から取り出せるようになしたものである。尚、上
治具2aから下方に突出した脚部5に製造工程中に不意に
接触する恐れがなければ、下治具2bは省略することも可
能である。Further, as another embodiment, the one shown in FIG. 4 is the same as the above-mentioned embodiment except that the jig 2 is divided into an upper jig 2a and a lower jig 2b at an appropriate position in the middle of the support hole 10. When the lead pin 1 is inserted into the taper hole 9 and the support hole 10, the divided portion is set so that the lower end of the leg 5 is located in the support hole 10 of the lower jig 2b. After joining the silver solder 3'on the upper surface of the head 4, the upper jig 2a and the lower jig 2b are separated, and the leg portion 5 projecting downward from the upper jig 2a is pushed up so that the push rod is not used. The lead pin 1 can be easily taken out from the jig 2. The lower jig 2b can be omitted if there is no fear that the leg portion 5 protruding downward from the upper jig 2a is inadvertently contacted during the manufacturing process.
以上にしてなる本発明の銀ろう付きリードピンの製造方
法によれば、円板状の拡径した頭部と円柱状の脚部を有
するリードピンを、該頭部の直径より大きい内径の上部
開口縁と該脚部の直径に略等しい内径の内孔を連続させ
たテーパー孔と該テーパー孔の下方に該内孔に同軸とな
して連続させた平行な支持孔を垂直に有し且つ前記リー
ドピンの長さよりテーパー孔の深さを浅く設定してなる
治具の前記テーパー孔に脚部から挿入し、頭部を該テー
パー孔の上部に密嵌状態となして吊支するとともに、脚
部を支持孔に嵌合し、次に前記頭部の上面に銀ろう片を
載置し、そして前記リードピンの頭部及び銀ろう片を加
熱し、該銀ろう片を溶融して頭部上面に接合してなるの
で、リードピンの脚部をテーパー孔の上部開口縁から挿
入するだけで、該脚部は該テーパー孔の内面に案内され
て支持孔に嵌合するとともに、頭部をテーパー孔の内面
に密嵌状態となして吊支することができ、しかも頭部の
直径に許容範囲内の寸法バラツキがあっても常に一定の
支持状態となすことが可能であり、またその状態ではテ
ーパー孔及び支持孔と同軸に自動的に位置設定すること
ができ、そして頭部の外周面上縁にテーパー孔の内面が
近接しているので、該頭部上面に載置した銀ろう片を溶
融させても、該頭部の側面から下面へ銀ろうが流れ込む
ことがなく、製品の良品率を高めることができるととも
に、頭部上面に常に同一形状の半球状に銀ろうを接合で
きるのである。また、テーパー孔の開口縁の内径は、リ
ードピンの脚部の直径より十分大きく設定することが可
能なので、リードピンをテーパー孔に挿入する際の位置
決定に高精度が要求されず、自動化において製造構造の
コスト低減及びテーパー孔へのリードピンの挿入作業時
間の短縮が図れ、従って銀ろう付きリードピンのコスト
上昇を抑制することができる。According to the method for manufacturing a lead pin with silver brazing of the present invention as described above, a lead pin having a disk-shaped expanded head and a columnar leg is provided with an upper opening edge having an inner diameter larger than the diameter of the head. And a tapered hole in which an inner hole having an inner diameter substantially equal to the diameter of the leg portion is continuous, and a parallel support hole which is continuous and coaxial with the inner hole is formed below the tapered hole, and the lead pin is provided. Insert the leg into the taper hole of the jig with the depth of the taper hole set to be shallower than the length, and suspend the head from the upper part of the taper hole in a tightly fitted state and support the leg. Fit into the hole, then place the silver solder piece on the top surface of the head, and heat the lead pin head and the silver solder piece to melt the silver solder piece and bond it to the top surface of the head. Therefore, simply insert the leg of the lead pin from the upper opening edge of the tapered hole, The portion is guided by the inner surface of the tapered hole and fits into the support hole, and the head can be suspended and tightly fitted on the inner surface of the tapered hole, and the diameter of the head is within the allowable range. Even if there is a dimensional variation, it is possible to maintain a constant support state at all times, and in that state, it can be automatically positioned coaxially with the tapered hole and the support hole, and at the upper edge of the outer peripheral surface of the head. Since the inner surfaces of the tapered holes are close to each other, even if the silver brazing piece placed on the upper surface of the head is melted, the silver brazing material does not flow from the side surface of the head to the lower surface, and the good product rate is improved. In addition, it is possible to always join the silver brazing material to the upper surface of the head in a hemispherical shape having the same shape. Further, since the inner diameter of the opening edge of the tapered hole can be set to be sufficiently larger than the diameter of the leg portion of the lead pin, high accuracy is not required for position determination when inserting the lead pin into the tapered hole, and automation of manufacturing structure It is possible to reduce the cost and the work time for inserting the lead pin into the tapered hole, and thus to suppress the cost increase of the lead pin with silver brazing.
また、治具にリードピンを装着した状態で、少なくとも
該治具の上部を予備加熱することにより、その後に頭部
上面に載置する銀ろう片と該頭部を略同時に略同一温度
に昇温させることができ、該頭部と銀ろうとの接合をよ
り強固に行うことができる。Further, by preheating at least the upper portion of the jig with the lead pin attached to the jig, the silver brazing piece to be subsequently placed on the upper surface of the head and the head are heated to substantially the same temperature at substantially the same time. Therefore, the head and the silver solder can be joined more firmly.
第1図は本発明の代表的実施例を示す部分縦断側面図、
第2図はその要部の拡大断面図、第3図は本発明により
製造した銀ろう付きリードピンの側面図、第4図は他の
実施例を示す部分縦断側面図、第5図は従来例を示す部
分縦断側面図である。 1:リードピン、2:治具、3:銀ろう片、4:頭部、5:脚部、
6:上面、7:開口縁、8:内孔、9:テーパー孔、10:支持
孔、11:内面。FIG. 1 is a partial vertical sectional side view showing a typical embodiment of the present invention,
FIG. 2 is an enlarged cross-sectional view of the main part, FIG. 3 is a side view of a lead pin with silver brazing produced according to the present invention, FIG. 4 is a partial vertical side view showing another embodiment, and FIG. 5 is a conventional example. FIG. 1: lead pin, 2: jig, 3: silver brazing piece, 4: head, 5: leg,
6: Top surface, 7: Opening edge, 8: Inner hole, 9: Tapered hole, 10: Support hole, 11: Inner surface.
Claims (4)
するリードピンを、該頭部の直径より大きい内径の上部
開口縁と該脚部の直径に略等しい内径の内孔を連続させ
たテーパー孔と該テーパー孔の下方に該内孔に同軸とな
して連続させた平行な支持孔を垂直に有し且つ前記リー
ドピンの長さよりテーパー孔の深さを浅く設定してなる
治具の前記テーパー孔に脚部から挿入し、頭部を該テー
パー孔の上部に密嵌状態となして吊支するとともに、脚
部を支持孔に嵌合し、次に前記頭部の上面に銀ろう片を
載置し、そして前記リードピンの頭部及び銀ろう片を加
熱し、該銀ろう片を溶融して頭部上面に接合してなるこ
とを特徴とする銀ろう付きリードピンの製造方法。1. A lead pin having a disk-shaped expanded head portion and a columnar leg portion is provided with an upper opening edge having an inner diameter larger than the diameter of the head portion and an inner hole having an inner diameter substantially equal to the diameter of the leg portion. Has a continuous tapered hole and a parallel support hole which is continuous and coaxial with the inner hole below the tapered hole, and the depth of the tapered hole is set to be shallower than the length of the lead pin. The jig is inserted into the tapered hole from the leg, and the head is suspended from the upper part of the tapered hole in a tightly fitted state, and the leg is fitted into the support hole. A silver brazing piece is placed on the head, and the head of the lead pin and the silver brazing piece are heated, and the silver brazing piece is melted and joined to the upper surface of the head. Method.
ピンを挿入し、該リードピンの頭部上面に銀ろう片を載
置した状態で、該治具を加熱炉中を通してなる特許請求
の範囲第1項記載の銀ろう付きリードピンの製造方法。2. A jig is inserted into a tapered hole and a support hole of the jig, and the jig is passed through a heating furnace with a silver brazing piece placed on the upper surface of the head of the lead pin. A method for producing a lead pin with silver brazing as set forth in claim 1.
ピンを挿入し、該リードピンの頭部上面に銀ろう片を載
置した状態で、該治具の上面をバーナーの炎又は熱風に
て加熱してなる特許請求の範囲第1項記載の銀ろう付き
リードピンの製造方法。3. A lead pin is inserted into the tapered hole and the support hole of the jig, and a silver brazing piece is placed on the upper surface of the head of the lead pin, and the upper surface of the jig is exposed to burner flame or hot air. The method for producing a lead pin with silver brazing according to claim 1, which is formed by heating.
するリードピンを、該頭部の直径より大きい内径の上部
開口縁と該脚部の直径に略等しい内径の内孔を連続させ
たテーパー孔と該テーパー孔の下方に該内孔に同軸とな
して連続した平行な支持孔を垂直に有し且つ前記リード
ピンの長さよりテーパー孔の深さを浅く設定してなる治
具の前記テーパー孔に脚部から挿入し、頭部を該テーパ
ー孔の上部に密嵌状態となして吊支するとともに、脚部
を支持孔に嵌合し、その状態で少なくとも前記治具の上
部を予備加熱し、次に前記頭部の上面に銀ろう片を載置
し、そして前記リードピンの頭部及び銀ろう片を加熱
し、該銀ろう片を溶融して頭部上面に接合してなること
を特徴とする銀ろう付きリードピンの製造方法。4. A lead pin having a disk-shaped expanded head portion and a columnar leg portion is provided with an upper opening edge having an inner diameter larger than the diameter of the head portion and an inner hole having an inner diameter substantially equal to the diameter of the leg portion. Has a continuous tapered hole and a continuous parallel support hole vertically below the tapered hole and coaxial with the inner hole, and the depth of the tapered hole is set to be shallower than the length of the lead pin. Inserted from the leg into the tapered hole of the tool and suspending the head from the upper part of the tapered hole in a tightly fitted state, and fitting the leg into the support hole, and at least in the state of the jig. Preheating the upper part, then placing a silver brazing piece on the upper surface of the head, and heating the head of the lead pin and the silver brazing piece, melting the silver brazing piece to bond it to the upper surface of the head. A method of manufacturing a lead pin with silver brazing, which comprises:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1028257A JPH0757420B2 (en) | 1989-02-06 | 1989-02-06 | Manufacturing method of lead pin with silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1028257A JPH0757420B2 (en) | 1989-02-06 | 1989-02-06 | Manufacturing method of lead pin with silver solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02207966A JPH02207966A (en) | 1990-08-17 |
| JPH0757420B2 true JPH0757420B2 (en) | 1995-06-21 |
Family
ID=12243516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1028257A Expired - Lifetime JPH0757420B2 (en) | 1989-02-06 | 1989-02-06 | Manufacturing method of lead pin with silver solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0757420B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119897546B (en) * | 2025-03-31 | 2025-06-17 | 四川明泰微电子科技股份有限公司 | Power module PIN needle welding set |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0826590B2 (en) * | 1986-08-20 | 1996-03-13 | 清水建設株式会社 | Seismic isolation device manufacturing method |
-
1989
- 1989-02-06 JP JP1028257A patent/JPH0757420B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02207966A (en) | 1990-08-17 |
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