JPS6351543B2 - - Google Patents
Info
- Publication number
- JPS6351543B2 JPS6351543B2 JP57216160A JP21616082A JPS6351543B2 JP S6351543 B2 JPS6351543 B2 JP S6351543B2 JP 57216160 A JP57216160 A JP 57216160A JP 21616082 A JP21616082 A JP 21616082A JP S6351543 B2 JPS6351543 B2 JP S6351543B2
- Authority
- JP
- Japan
- Prior art keywords
- head
- lead pin
- hole
- solder
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、Agろう付きリードピンの製造方法
に係り、詳しくは集積回路用の釘状のリードピン
の頭部にAgろうを半球状に取付ける方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a lead pin with Ag solder, and more particularly to a method of attaching Ag solder in a hemispherical shape to the head of a nail-shaped lead pin for an integrated circuit.
従来、釘状のリードピンの頭部へAgろうを取
付けるには、第１図に示す如くカーボン治具１の
ストレートのピン穴２内に扁平な頭部３を有する
釘状のリードピン４を挿入し、このリードピン４
の頭部３の上面にデイスク状のAgろう５を載せ、
カーボン治具１を電気炉中入れて加熱し、Agろ
う５を溶融して頭部３に接合する方法と、予め所
要形状に成形したAgろうを釘状のリードピンの
頭部へかしめるか或いは抵抗溶接により取付ける
方法とがある。 Conventionally, in order to attach an Ag solder to the head of a nail-shaped lead pin, a nail-shaped lead pin 4 having a flat head 3 is inserted into a straight pin hole 2 of a carbon jig 1 as shown in Fig. 1. , this lead pin 4
A disc-shaped Ag solder 5 is placed on the top surface of the head 3 of
The carbon jig 1 is placed in an electric furnace and heated, and the Ag solder 5 is melted and joined to the head 3. Alternatively, the Ag solder preformed into the desired shape is caulked to the head of a nail-shaped lead pin. There is a method of attaching by resistance welding.
ところで、前者の方法は、Agろう５の濡れ性
に起因する広がりにより頭部３ばかりではなく、
首下の部分までAgろう５がまわるものが生じる。
従つて、出来上つたAgろう５付リードピン４の
中には、第２図に示す不良品と第３図に示す良品
とが混入することになり、第２図に示す不良の
Agろう５付リードピン４を基板にろう付けして
集積回路用パツケージを組立てると、リードピン
４の位置がずれることになる。この為、第３図に
示すリードピン４の頭部３に半球状にAgろうが
取付けられたAgろう付リードピンが要望されて
いたが、これのみを作る方法が無い為、前記の方
法で作られたAgろう５付リードピン４の中から
第２図に示す形状の不良品を選別により取り除く
方法で対応してきた。 By the way, in the former method, due to the spread caused by the wettability of Ag wax 5, not only the head 3 but also
There are cases where the Ag wax 5 goes around the lower part of the neck.
Therefore, in the finished lead pin 4 with Ag solder 5, the defective product shown in FIG. 2 and the good product shown in FIG. 3 will be mixed, and the defective product shown in FIG.
When an integrated circuit package is assembled by brazing the lead pin 4 with Ag solder 5 to the board, the position of the lead pin 4 will shift. For this reason, there was a demand for an Ag brazed lead pin in which a hemispherical Ag solder was attached to the head 3 of the lead pin 4 shown in Fig. 3, but since there was no way to make only this, it was made using the method described above. This has been dealt with by sorting out defective products with the shape shown in FIG. 2 from among the lead pins 4 with Ag solder 5.
また後者の方法は、予めAgろうを所定の半球
状に成形しておくこと、ならびにリードピンの頭
部に個々にAgろうを取付けることなどにより、
Agろう付リードピンの生産性が甚だ悪い為、全
く実施されていない。 In the latter method, the Ag solder is formed into a predetermined hemispherical shape in advance, and the Ag solder is individually attached to the head of the lead pin.
Because the productivity of Ag brazing lead pins is extremely poor, it is not implemented at all.
本発明は上記諸事情に鑑みなされたものであ
り、釘状のリードピンの頭部上面にのみ半球状の
Agろうを有するAgろう付リードピンを作る方法
を提供せんとするものである。 The present invention was made in view of the above circumstances, and has a hemispherical shape only on the top surface of the head of the nail-shaped lead pin.
It is an object of the present invention to provide a method for making an Ag brazed lead pin having Ag brazing.
本発明によるAgろう付リードピンの製造方法
は、第４図に示す如く扁平な頭部３を有するリー
ドピン４をその頭部３の直径より小さく脚部６の
直径よりも大きい直径で脚部６の長さより深い下
穴７と頭部３の直径より大きい直径で頭部３の高
さと同等若しくはそれより深い上穴８とから成る
リベツト状の穴９を有するカーボン治具１０の前
記リベツト状の穴９に挿入して吊垂し、次に上穴
８内の頭部３の上面にAgろうチツプ５′を載せ、
次いでカーボン治具１０を電気炉中に入れて加熱
しAgろうチツプ５′を溶融してリードピン４の頭
部３の上面に接合することを特徴とするものであ
る。 The method for manufacturing an Ag brazed lead pin according to the present invention involves using a lead pin 4 having a flat head 3 as shown in FIG. The rivet-shaped hole of the carbon jig 10 has a rivet-shaped hole 9 consisting of a pilot hole 7 deeper than the length and an upper hole 8 with a diameter larger than the diameter of the head 3 and deeper than or equal to the height of the head 3. 9 and hang it up, then place the Ag soldering chip 5' on the top surface of the head 3 in the upper hole 8,
The carbon jig 10 is then placed in an electric furnace and heated to melt the Ag brazing chip 5' and bond it to the upper surface of the head 3 of the lead pin 4.
このように本発明のAgろう付きリードピンの
製造方法に於いては、カーボン治具１０のリベツ
ト状の穴９に、釘状のリードピン４を挿入吊垂す
るので、リードピン４の頭部３は上面のみ露出
し、外周面はカーボン治具１０の上穴８の内周面
に被われ、頭部３の下面はリードピン４の自重に
より上穴８の底面、即ち段部８ａに密着する。一
方Agろうは金属表面との濡れは良いが、カーボ
ンに対しては全く濡れない。従つて、リードピン
４の頭部３の上面にAgろうチツプ５′を載せて、
電気炉中で加熱溶融しても広がりが極めて少く、
頭部３の下面にまわり込むことは無く、頭部３の
上面にとどまり、半球状にまとまつて固化し、
Agろう５付リードピン４が得られる。 In this way, in the method for manufacturing the Ag brazed lead pin of the present invention, the nail-shaped lead pin 4 is inserted into the rivet-shaped hole 9 of the carbon jig 10 and suspended, so that the head 3 of the lead pin 4 is attached to the upper surface. The outer peripheral surface is covered with the inner peripheral surface of the upper hole 8 of the carbon jig 10, and the lower surface of the head 3 is brought into close contact with the bottom surface of the upper hole 8, that is, the stepped portion 8a, due to the weight of the lead pin 4. On the other hand, Ag wax has good wettability with metal surfaces, but does not wet carbon at all. Therefore, place the Ag solder chip 5' on the top surface of the head 3 of the lead pin 4,
Even when heated and melted in an electric furnace, it spreads very little.
It does not wrap around the bottom surface of the head 3, but stays on the top surface of the head 3, gathers into a hemispherical shape, and solidifies.
A lead pin 4 with Ag solder 5 is obtained.
次に本発明のAgろう付きリードピンの製造方
法の具体的な実施例について説明する。第４図に
示す頭部３の直径0.8mm、厚さ0.2mm、脚部６の直
径0.45mm、長さ６mmのFe−Ni42重量％より成る
釘状のリードピン４を直径0.7mm、深さ８mmの下
穴７と直径1.1mm、深さ１mmの上穴８とから成る
リベツト状の穴９を200個縦横3.0mm間隔に200個
穿設した長さ70mm、幅35mm、厚さ９mmのカーボン
治具１０の前記各リベツト状の穴９に挿入して吊
垂し、次に上穴８内の頭部３の上面に直径0.4mm、
長さ0.4mmのAg−Cu28重量％より成るAgろうチ
ツプ５′を載せ、次いでN2ガス雰囲気中の電気炉
にて800℃に加熱しAgろうチツプ５′を溶融し、
１分後冷却した処、各リベツト状の穴９内のリー
ドピン４の頭部３の上面にAgろうが半球状に接
合され、完全な金属光沢を示していた。そしてこ
の製造方法を20回繰返し行つた処、前記と全く同
様の結果を得、頭部３の外周面や下面にAgろう
がまわり込むものは皆無であつた。 Next, a specific example of the method for manufacturing an Ag brazed lead pin of the present invention will be described. A nail-shaped lead pin 4 made of 42% Fe-Ni by weight with a head 3 having a diameter of 0.8 mm and a thickness of 0.2 mm and a leg portion 6 having a diameter of 0.45 mm and a length of 6 mm as shown in FIG. A carbon jig with a length of 70 mm, a width of 35 mm, and a thickness of 9 mm, in which 200 rivet-like holes 9, consisting of a pilot hole 7 and an upper hole 8 of 1.1 mm in diameter and 1 mm in depth, are drilled at 3.0 mm intervals vertically and horizontally. The tool 10 is inserted into each of the rivet-shaped holes 9 and suspended, and then a diameter of 0.4 mm is placed on the upper surface of the head 3 in the upper hole 8.
An Ag solder chip 5' having a length of 0.4 mm and made of Ag-Cu28% by weight was mounted, and then heated to 800°C in an electric furnace in an N 2 gas atmosphere to melt the Ag solder chip 5'.
After cooling for 1 minute, the Ag wax was hemispherically bonded to the top surface of the head 3 of the lead pin 4 in each rivet-shaped hole 9, exhibiting a perfect metallic luster. When this manufacturing method was repeated 20 times, the results were exactly the same as above, and there was no Ag solder wrapped around the outer peripheral surface or lower surface of the head 3.
以上の説明で判るように本発明のAgろう付リ
ードピンの製造方法によれば、釘状のリードピン
の頭部の外周面や下面にAgろうをまわり込ませ
ることなく、頭部上面にのみAgろうを半球状に
接合したAgろう付きリードピンを容易且つ確実
に得ることができるので、従来のAgろう付きリ
ードピンの製造方法にとつて代わることのできる
画期的なものと云える。 As can be seen from the above explanation, according to the method for manufacturing Ag brazed lead pins of the present invention, Ag solder is not wrapped around the outer peripheral surface or lower surface of the head of the nail-shaped lead pin, but only on the upper surface of the head. Since it is possible to easily and reliably obtain an Ag brazed lead pin in which hemispherical hemispheres are joined, it can be said to be an epoch-making method that can replace the conventional manufacturing method of Ag brazed lead pins.
第１図は従来のAgろう付きリードピンの製造
方法を示す図、第２図はAgろう付きリードピン
の不良品を示す図、第３図はAgろう付きリード
ピンの良品を示す図、第４図は本発明によるAg
ろう付きリードピンの製造方法を示す図である。
３……頭部、４……リードピン、５′……Agろ
うチツプ、６……脚部、７……下穴、８……上
穴、９……リベツト状の穴、１０……カーボン治
具。
Figure 1 is a diagram showing the conventional manufacturing method of Ag brazed lead pins, Figure 2 is a diagram showing defective Ag brazed lead pins, Figure 3 is a diagram showing good Ag brazed lead pins, and Figure 4 is a diagram showing a non-defective Ag brazed lead pin. Ag according to the invention
It is a figure which shows the manufacturing method of a lead pin with brazing. 3...Head, 4...Lead pin, 5'...Ag brazing chip, 6...Legs, 7...Bottom hole, 8...Top hole, 9...Rivet-like hole, 10...Carbon fixing Ingredients.
Claims (1)
の頭部の直径より小さく脚部の直径より大い直径
で脚部の長さより深い下穴と頭部の直径より大き
い直径で頭部の高さと同等若しくはそれより深い
上穴とから成るリベツト状の穴を有するカーボン
治具の前記リベツト状の穴に挿入して吊垂し、次
に上穴内の頭部の上面にAgろうチツプを載せ、
次いでカーボン治具を炉中に入れて加熱し、Ag
ろうチツプを溶融して頭部上面に接合することを
特徴とするAgろう付きリードピンの製造方法。1. A nail-shaped lead pin with a flat head is inserted into a pilot hole with a diameter smaller than the diameter of the head and larger than the diameter of the leg and deeper than the length of the leg, and a hole with a diameter larger than the diameter of the head and the height of the head. Insert the carbon jig into the rivet-like hole and suspend it, and then place an Ag brazing chip on the upper surface of the head inside the upper hole.
Next, the carbon jig is placed in a furnace and heated to form Ag
A method for producing an Ag brazed lead pin characterized by melting a solder chip and joining it to the upper surface of the head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57216160A JPS59105346A (en) | 1982-12-08 | 1982-12-08 | Manufacture of silver brazed lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57216160A JPS59105346A (en) | 1982-12-08 | 1982-12-08 | Manufacture of silver brazed lead pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59105346A JPS59105346A (en) | 1984-06-18 |
| JPS6351543B2 true JPS6351543B2 (en) | 1988-10-14 |
Family
ID=16684231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57216160A Granted JPS59105346A (en) | 1982-12-08 | 1982-12-08 | Manufacture of silver brazed lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59105346A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146014A (en) * | 1984-08-10 | 1986-03-06 | 東海カーボン株式会社 | Welding support stand |
| JPS63101167U (en) * | 1986-12-18 | 1988-07-01 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946164A (en) * | 1972-09-12 | 1974-05-02 | ||
| JPS5736379B2 (en) * | 1974-10-02 | 1982-08-03 | ||
| JPS5944948B2 (en) * | 1977-12-09 | 1984-11-02 | 株式会社日立製作所 | brazing method |
| JPS56119664A (en) * | 1980-02-27 | 1981-09-19 | Nec Home Electronics Ltd | Brazing method |
| JPS56131066A (en) * | 1980-03-19 | 1981-10-14 | Toshiba Corp | Silver-alloy brazing |
-
1982
- 1982-12-08 JP JP57216160A patent/JPS59105346A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59105346A (en) | 1984-06-18 |
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